JPH0262099A - Method of mounting of electronic parts - Google Patents

Abstract

PURPOSE:To establish attraction operation without deteriorating electronic parts and/or lowering the rate of attraction by controlling in an optimum manner any pressure exerted on the electronic parts by an attraction nozzle upon attraction of the parts by making use of differences among thicknesses of the electronic parts 15. CONSTITUTION:Different thickness electronic parts 15 can be attracted under given pressure at all times by controlling the height of an attraction nozzle 14. Even when the parts 15 are very thick, there is kept a certain distance m between the tip end of the nozzle 14 and a distance f such that a focal distance f of a camera is not lower than the bottom surface of the parts 15. By controlling the height of the nozzle 14, the parts 15 of the different thicknesses can be recognized at all times at the distance f. By controlling an attraction nozzle 17 to the optimum evaluated height of the nozzle 14, the nozzle 17 can be mounted at all times on the electronic parts 19 at given pressure upon mounting of the parts 15.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting method for a mounting machine that mounts electronic components.

2. Description of the Related Art The operation of a conventional mounting machine will be described below with reference to the drawings. FIG. 6 is a perspective view of the main parts of the mounting machine.

In FIG. 5, 1 is an electronic component to be mounted.

2 vacuum-suctions electronic components using a suction nozzle; Reference numeral 3 denotes a head portion that moves up and down when picking up and mounting electronic components. 4
is an electronic component supply section, and 6 is a board.

6 exists when the camera is for parts recognition and has a parts recognition function.

The operation of the mounting machine configured as described above will be explained below. First, the head section 3 moves in the XY force direction onto the electronic component in the electronic component supply section 4 where the electronic component to be mounted next is placed, with the head section 3 raised to the upper limit in the Z direction. The head portion 3 descends to the lower limit in the Z direction, and after the suction nozzle 2 contacts the electronic component, vacuum suction is performed. The head portion 3 moves up to the upper limit in the Z direction while adsorbing the electronic component.

Next, in order to check the suction state of the electronic component or to determine the quality of the electronic component, the head section 3 moves in the XY force direction above the component recognition camera e, and starts the component recognition operation. After the component recognition operation is completed, the head section 3 moves to the component mounting position on the board 6. Then, after descending to the lower limit in the Z direction and mounting the electronic components onto the board 6, vacuum suction is stopped. The head portion 3 is raised to the upper limit in the Z direction, and the electronic component 1 is mounted on the target position on the board 5, thus completing the electronic component mounting operation.

Problems to be Solved by the Invention However, in the mounting method as described above, the lower limit height of the suction nozzle 2 is constant when picking up the electronic component, so if the electronic component is thick, the suction nozzle 2 may force the electronic component. There is a problem in that the pressure may cause cracks in electronic components, or in parts with leads, the leads may become bent or deformed. On the other hand, if the electronic parts are thin,
There is a problem in that a gap is created between the suction nozzle 2 and the electronic component, and air flows through this gap during vacuum suction, resulting in a decrease in the suction rate.

Further, during component recognition, the component recognition camera 6 is usually fixed to the mounting machine main body. That is, the camera focal length is fixed at a certain height. On the other hand, since the upper limit height in the Z direction of the head section 3 is constant, the height of the bottom surface of the electronic component deviates from the camera focal length due to the difference in the thickness of the electronic component, reducing the recognition accuracy of the electronic component, and as a result, when installing the component. There was a problem that the mounting accuracy deteriorated.

Furthermore, since the back side of the component mounting surface of the board 5 on which electronic components are mounted is supported by the mounter main body, variations in the thickness of the board 6 are caused by the suction nozzle 2 on the electronic components when mounting the components, as well as when picking up the components. The pressure applied was different.

When attaching a component with leads to a board on which cream solder is printed in advance, if the pitch between the leads is narrow, attaching with more pressure than necessary will cause the cream solder to be pushed by the leads and spread laterally, causing the next step. There were also problems such as solder touching (bridging) between leads during the soldering process using a flow furnace.

Therefore, the present invention is intended to mount electronic components with high precision and reduce the defective rate, regardless of the thickness of the component to be mounted and the thickness of the board to be mounted.

Means for Solving the Problems In order to solve the above problems, in the electronic component mounting method of the present invention, the first invention provides a method for sucking electronic components of different thicknesses when sucking electronic components from a supply section. , a first step of storing the thickness of the electronic component in the control unit, and a second step of calculating the optimal suction nozzle height when suctioning the electronic component;
This electronic component suction method includes a third step of moving the suction nozzle to the optimum suction nozzle height calculated in the second step and performing a suction operation.

Further, the second invention includes the first step in the first invention, and the height of the electronic component on the camera for recognizing the electronic component in order to match the height of the electronic component with the camera focal length. Electronic component recognition consists of a second step of calculating the optimal suction nozzle height to match the focal length, and a third step of moving the suction nozzle to the optimal suction nozzle height calculated in the second step and performing component recognition. It's a method.

Furthermore, the third invention provides a first step of storing the thickness of the substrate in the control unit when mounting the sucked electronic components onto substrates having different thicknesses, and an optimum suction nozzle for mounting the sucked electronic components. This electronic component mounting method includes a second step of calculating the height, and a third step of moving the suction nozzle to the optimum suction nozzle height calculated in the second step and performing a mounting operation.

For production The effect of this technical means is as follows.

That is, according to the first invention, when the electronic components have different thicknesses, the optimal suction nozzle height is calculated from the thickness of the electronic components stored in the control unit, and when the electronic components are suctioned, the optimal suction nozzle height is , the pressure applied to electronic components by the suction nozzle can be controlled to an optimal value, preventing damage to electronic components or bending of leads.
Alternatively, problems such as deformation of the lead can be eliminated, and the adsorption rate by vacuum adsorption can be improved.

1. According to the second invention, the height of the suction nozzle is controlled so that the bottom surface of the electronic component is at the focal length of the component recognition camera based on the thickness of the electronic component stored in the control unit. , it is possible to always recognize parts with high precision and suppress variations in mounting accuracy.

Furthermore, according to the third invention, even when the thickness of the board on which the electronic component is mounted is different, the optimum suction nozzle height is calculated from the thickness of the board stored in the control unit when mounting the component,
By controlling the suction nozzle height, at a constant pressure,
This makes it possible to attach electronic components to the board, and to reduce defects such as cream solder touching (bridging).

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a flowchart showing the present invention, and the first implementation method of the present invention is a flowchart. That is, the first step is to memorize the thickness of the component, the second step is to calculate the optimal suction nozzle height for performing the suction operation, and the third step is to move to the optimal suction nozzle height and perform the suction operation.

Further, the second mounting method of the present invention follows flow B. The first step is similar to the first mounting method of the present invention, the second step is to calculate the optimum suction nozzle height when performing component recognition, and the third step is to move to the optimal suction nozzle height and perform component recognition operation. It becomes a process.

Furthermore, the third mounting method of the present invention follows flow C. The first step is to memorize the thickness of the board, the second step is to calculate the optimum height for mounting, and the third step is to perform the mounting operation.

FIG. 2 shows the final configuration for realizing the present invention, in which 9 is a control section, which is composed of 7 storage devices and 8 arithmetic units. 1
o is a motor for changing the height of the suction nozzle, and 11 is a drive unit, which is a driver for the motor 10. Reference numeral 12 denotes a motor encoder which feeds back the suction nozzle height from the amount of rotation of the motor and controls it to an optimum value.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 3 and 4. In FIG. 3, 13 is an electronic component supply section;
14 is a suction nozzle tip, and 16 is an electronic component. l
is the distance from the electronic component supply section 13 to the tip of the suction nozzle when the suction nozzle 14 is at its upper limit, and a and b are the thicknesses of the electronic component 15, respectively. In case (a), l-- is the distance from the suction nozzle 14 to the electronic component 15, and the suction nozzle 14 is lowered by the value of X in order to apply a constant appropriate pressure.

That is, the position 1-a+X becomes the optimum suction nozzle height. Similarly, in the case (b), the 1-box is the optimum suction nozzle height. By controlling the height of the suction nozzle 14 in this manner, electronic components of different thicknesses can always be suctioned at a constant pressure, and the problem of bending the leads of lead components is also eliminated.

Next, when recognizing parts, it becomes like (c), ni). 16
is the lens section of the component recognition camera, and f is the camera focal length. A certain distance m is secured between the tip of the suction nozzle 14 and the camera focal length f so that the bottom surface of the electronic component 15 does not become lower than the camera focal path Mf even when the electronic component 16 is very thick. In the case of (c), 1-f-
a is the optimum suction nozzle height. ), then d-f-
b is the optimum suction nozzle height. By controlling the height of the suction nozzle 14 in this way, electronic components of different thicknesses can always be recognized at the camera focal length, allowing highly accurate component recognition and increased mounting accuracy during mounting. will improve.

Furthermore, calculation of the optimum suction nozzle height when mounting components will be explained using FIG. 4. In FIG. 4, 11 is a suction nozzle, 18 is an electronic component to be mounted, 19 is a board, and 2o is a positioning and fixing part for the board 19 of the mounting machine main body. Also, d
is the thickness of the electronic component, C is the thickness of the board, and q is the positioning fixing part 2 between the tip of the suction nozzle 1 and the board 19 of the mounting machine main body.
It is the distance from o. The optimal suction nozzle height in this case is
q-a-C+! becomes. When installed, the suction nozzle 11 is lowered by X in order to apply a constant pressure. This is the same concept as when picking up parts. By controlling the suction nozzle 17 to the optimum suction nozzle height calculated in this way, the suction nozzle 17 can be attached to the electronic component 19 when mounting the component in any combination of electronic components with different thicknesses and substrates with different thicknesses. On the other hand, it is possible to always apply a constant pressure, and the cream solder spreads laterally, which reduces defects such as solder touch (bridging) between leads of parts with leads during the next soldering process using a glue flow lamp. be able to.

Effects of the Invention As described above, according to the electronic component mounting method of the present invention, the pressure applied by the suction nozzle to the electronic component during component suction can be optimally controlled due to the difference in the thickness of the electronic component. Adsorption operation is possible without reducing the rate. Furthermore, when recognizing parts, the parts can always be recognized using the camera focus of the parts recognition camera, leading to highly accurate mounting.

Furthermore, by taking into account differences in board thickness, the mounting pressure when mounting components can be kept constant regardless of the combination of electronic components of different thicknesses and boards of different thicknesses, making it possible to solder in a reflow oven. This reduces defects that occur after the process and greatly improves production yield.

[Brief explanation of the drawing]

Fig. 1 is a flowchart showing the control flow of an electronic component mounting method in an embodiment of the present invention, Fig. 2 is a block diagram, Fig. 3 (a) to Fig. 4), and Fig. 4 show a board and a suction nozzle. FIG. 5 is an enlarged perspective view of the main parts of the mounting machine. Name of agent: Patent attorney Shigetaka Awano and 1 other person
Figure 2 Figure 2 (Ino (b)

Claims (3)

[Claims] (1) A mounting method in which electronic components of different thicknesses are sucked from a supply unit by a suction nozzle, moved onto a board to be mounted, and the electronic components are mounted on the board, and the thickness of the electronic components is stored in the control unit. a second step of calculating the optimum suction nozzle height for suctioning the electronic component; and a second step of moving the suction nozzle to the optimum suction nozzle height calculated in the second step and executing the suction operation. An electronic component mounting method characterized by consisting of three steps. (2) Pick up electronic components of different thicknesses from the supply section using a suction nozzle, move them to the component recognition section, perform component recognition on the sucked electronic components at the component recognition section, such as checking the suction state and determining whether the components are good or bad. A mounting method in which the electronic component is moved onto a board to be mounted and the electronic component is mounted on the board, the first step being storing the thickness of the electronic component in a control unit, and adjusting the height of the electronic component to match the focal length. An electronic component mounting method characterized by comprising a second step of calculating the optimal suction nozzle height, and a third step of moving the suction nozzle to the optimal suction nozzle height calculated in the second step and performing component recognition. . (3) Pick up the electronic components from the supply section using the pick-up nozzle,
A mounting method in which the electronic component is moved onto a board with a different thickness to be mounted and the electronic component is mounted on the board, the first step being storing the thickness of the different board in a control unit, and mounting the adsorbed electronic component. An electronic device comprising: a second step of calculating the optimum suction nozzle height at the time; and a third step of moving the suction nozzle to the optimum suction nozzle height calculated in the second step and performing a mounting operation. How to install parts.