JP4678906B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting how.
[0002]
[Prior art]
Hereinafter, a conventional electronic component mounting machine will be described with reference to the drawings.
FIG. 7 shows a conventional electronic component mounting machine.
In FIG. 7, 1 is a mounting head having a plurality of nozzles for sucking and mounting electronic components, 2 is an X robot that drives the mounting head 1 in the X direction, and 3 and 4 are Y robots that drive the mounting head 1 in the Y direction. .
[0003]
The mounting head 1 picks up the electronic component from the cassette supply unit 5 or the tray component supply unit 6 based on NC data set in advance, and then moves onto the recognition sensor 7 on the front side or the recognition sensor 8 on the rear side. Moving. At this time, the recognition sensors 7 and 8 recognize the posture of the electronic component held by the nozzle of the mounting head 1 and calculate the correction amount from the deviation amounts in the X, Y, and θ directions based on the suction posture of the electronic component. To do. Thereafter, while taking into account the correction amounts in the X, Y, and θ directions calculated by the recognition correction, the mounting head 1 has a board table 9 on which a printed board P (see FIG. 9) on which electronic components are to be mounted is installed. The electronic component is mounted on each position of the substrate P.
[0004]
FIG. 8 shows the configuration of the mounting head 1. The mounting head 1 includes first to fourth head nozzles 11, 12, 13, and 14 having the same functions, and the nozzles 11a, 12a, 13a, and 14a of the head nozzles 11, 12, 13, and 14 are movable up and down. The electronic component mounting operation is performed depending on whether or not the suction operation is performed when moving up and down.
[0005]
FIG. 9 schematically shows a mounting operation on the substrate table 9 by a conventional electronic component mounting machine.
First, as shown in FIG. 9A, the electronic component M1 sucked by the first nozzle 11a is mounted while the electronic component to be mounted is sucked by the nozzles 11a to 14a. The mounting head 1 is moved to the position. At this time, the standby position height of each of the nozzles 11a to 14a is at a preset standby position height h1. The stand-by height h1 at this time depends on whether or not the electronic components that are attracted are actually mounted so that the adsorbed electronic components do not come into contact with the electronic components on the substrate P or the substrate P, when any electronic components are mounted. Regardless, it is assumed that an electronic component having the same maximum component height is mounted on the board P on which the electronic component having the highest component height is mounted on all types of electronic components to be mounted. Even in the case where the electronic components do not come into contact with each other, a large uniform height (specifically, assuming that the maximum component height of all types of electronic components to be mounted is L1, 2 · L1 + α (where α Is set to a small dimension to give a margin)).
[0006]
As shown in FIG. 9B, when the electronic component M1 adsorbed by the first nozzle 11a is mounted on the substrate P placed on the substrate table 9, the first nozzle 11a is again at the standby position height. Then, the mounting head 1 moves to a position where the electronic component M2 sucked by the second nozzle 12a is mounted, and, as shown in FIG. 9C, the second nozzle 12a The electronic component M2 is mounted.
[0007]
Thereafter, through the same process, the electronic components M3 and M4 adsorbed by the third nozzle 13a and the fourth nozzle 14a are respectively mounted (see FIGS. 9D to 9F).
When all the electronic components M1 to M4 adsorbed by the mounting head 1 have been mounted, the mounting head 1 again picks up the next mounting component with the nozzles 11a to 14a. After moving to the supply unit 6 and mounting electronic components on the predetermined substrate P while repeating this cycle, the production of the mounting substrate is finished.
[0008]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, in each step shown in FIGS. 9A to 9F, standby is performed at a height h1 that is uniformly set in advance, and the necessary nozzles 11a to 14a are set larger each time. Since it is lowered by the height h1, the raising / lowering distance of the nozzles 11a to 14a is increased, and the nozzle moving time required for each raising / lowering operation is one factor in increasing the production time.
[0009]
SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object thereof is to provide an electronic component mounting method that can reduce the amount and time of movement of a nozzle during a mounting operation and can contribute to shortening of production time. .
[0010]
[Means for Solving the Problems]
In order to solve the above problems, an electronic component mounting method of the present invention, by moving the mounting head having a vertically movable plurality of nozzles, to suck the electronic component from the component supply unit to the nozzle, the adsorbed In the electronic component mounting method for mounting the electronic component by recognizing and correcting the posture of the electronic component, and mounting the electronic component with the corrected posture at each position on the substrate by lowering the nozzle from the standby position. in addition to the substrate being mounted for mounting the electronic component which is adsorbed to the nozzle, the height of the standby position of the nozzle for the previous SL substrate, from the height of the standby position of the nozzle which is set in advance, The maximum component height of all types of electronic components to be mounted on the substrate or the nose The maximum component height in the electronic component which is adsorbed addition to reconfigure the further height plus a small size, in terms of lowering the said nozzle to the waiting position thereof reset, waiting position described above reconfigure The electronic component is mounted by lowering the nozzle from the position, and all the nozzles are positioned above the substrate when the mounting head is moved to continuously mount the electronic component on the substrate. Only when all the nozzles are located above the substrate, the mounting head is moved in the XY direction while maintaining the height of the standby position of the reset nozzle, and at least some of the nozzles are located above the substrate. If not, the mounting head is moved in the XY directions while maintaining a position higher than the height of the standby position of the reset nozzle.
[0011]
By this method, the movement amount and movement time of the nozzle during the mounting operation can be shortened, which can contribute to shortening the production time. Further, according to this method, when the nozzle is not positioned above the substrate, the mounting head is moved in the XY direction while maintaining a position higher than the height of the standby position of the reset nozzle. Can be prevented from moving and contacting outside the permitted range other than on the substrate.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Electronic component mounting method of the present invention, by moving the mounting head having a vertically movable plurality of nozzles, to suck the electronic component on the nozzle from the component supply unit, recognizes the posture of the electronic component that has been adsorbed After the correction, in the electronic component mounting method for mounting the electronic component whose posture is corrected by lowering the nozzle from the standby position at each position of the substrate, the electronic component is further mounted on the substrate on which the electronic component is already mounted. in mounting the electronic components adsorbed on the nozzle, the height of the standby position of the nozzle for the previous SL substrate, from the height of the standby position of the nozzle which is set in advance, are already mounted on the board The highest component height of all types of electronic components to be mounted on the board to the highest component height of the electronic component or the electronic component sucked by the nozzle The maximum component height to definitive addition, reconfigure the further height plus a small size, in terms of lowering the said nozzle to the waiting position thereof reset, lowering the said nozzle from the standby position above reconfigure In this case, the electronic component mounting operation is performed.
[0013]
According to this method, the height of the standby position of the nozzle on the substrate can be lowered as compared with the prior art when mounting the electronic component, so that the processing time and the rising time of the nozzle on the substrate can be shortened.
The electronic component mounting method of the present invention determines that when the instrumentation wearing electronic component the head is moved to implement in succession on the substrate, is all nozzles located above the substrate, all the nozzles If but only when located above the substrate, wherein the mounting head while keeping the height of the waiting position of the nozzles reconfigured is moved in the XY directions, in which at least a part of the nozzle is not positioned above the substrate It is characterized in that for moving said mounting head while maintaining a position higher than the height of the standby position of the nozzle to reset the XY direction.
[0014]
In this way, when the nozzle is not positioned above the substrate, for moving the mounting head while maintaining a position higher than the height of the standby position of the nozzle to reset the XY direction, the mounting head or nozzle substrate It is possible to prevent moving and contacting outside the permitted range other than the above .
[0016]
Below it will be described on the basis of the electronic component mounting apparatus and an electronic component mounting method according to an embodiment of the present invention with reference to the accompanying drawings.
(Embodiment 1)
1 and 2 show an electronic component mounting machine according to an embodiment of the present invention, and FIG. 3 schematically shows each process of the electronic component mounting method according to the embodiment of the present invention. .
[0017]
As shown in FIG. 1, the electronic component mounting machine includes a mounting head 21 having nozzles 31a to 34a (see FIG. 2) for directly mounting the electronic component by suction, and an X-axis robot that moves the mounting head 21 in the X direction. 22, Y-axis robots 23 and 24 that move the mounting head 21 in the Y direction, a cassette supply unit 25 that supplies electronic components to the mounting head 21, a tray component supply unit 26 that supplies components to the mounting head 21, Recognition sensors 27 and 28 arranged on the front side and the rear side, a substrate table 29 on which a substrate is installed, and a main controller 30 for controlling these components are provided. A storage unit (not shown) connected to the main controller 30 not only stores identification information and mounting position information of electronic components, but also includes the height of electronic components mounted on each board. Information is stored.
[0018]
FIG. 2 shows the configuration of the mounting head 21. The mounting head 21 includes first to fourth head nozzles 31, 32, 33, and 34 having the same function, and the nozzles 31 a, 32 a, 33 a, and 34 a of the head nozzles 31 to 34 are movable up and down. The presence / absence of a sucking operation is determined, and if there is a sucking operation, an electronic component mounting operation is performed.
[0019]
The main controller 30 provided inside the electronic component mounting machine performs the following control operation.
When the component mounting operation starts (step S1), the mounting head 21 first moves to a component suction position corresponding to the cassette supply unit 25 or tray component supply unit 26 based on preset NC data (step S1). S2) After sucking the electronic component (step S3), the electronic component is moved onto the recognition sensor 27 on the front side or the recognition sensor 28 on the rear side (step S4). At this time, the recognition sensors 27 and 28 recognize the posture of the electronic component held by the nozzles 31a to 34a of the mounting head 21, and correct from the deviation amounts in the X, Y, and θ directions based on the suction posture of the electronic component. The amount is calculated (steps S5 and S6). Thereafter, the mounting head 21 is provided with a substrate table 29 on which a substrate P (see FIG. 4) on which electronic components are to be mounted is installed while taking into account correction amounts in the X, Y, and θ directions calculated by the recognition correction. Move upward (step S7).
[0020]
Thereafter, the substrate P on which the electronic components in the previous step is implemented in already, if the further mounting another electronic component, the best part height in a group of electronic components already mounted on the substrate P The information of L2 (referred to as the highest component height in the board) is input from the storage unit, and the lower end of the electronic component sucked by the nozzles 31a to 34a for mounting the electronic component does not reach the highest component height. The nozzle height is reset as the standby position for the nozzles 31a to 34a (step S8). Specifically, the total height h2 (= L2 + L1 + α) of the maximum component height L2 in the substrate, the maximum component height L1 of all types of electronic components to be mounted, and the minute dimension α for giving a margin. Or the sum of the maximum component height L2 in the substrate, the maximum component height L3 of the electronic components sucked by the nozzles 31a to 34a, and the minute dimension α for giving a margin. The standby position of the nozzles 31a to 34a is reset by setting h2 (= L2 + L3 + α). If no electronic component is mounted on the substrate P, the maximum component height L2 in the substrate is set to 0, or a predetermined value is set in advance.
[0021]
Then, as shown in FIG. 4 (a), all the nozzles 31a to 34a are lowered to the reset standby position (step S9), and in this state, as shown in FIGS. 4 (b) to (f), The mounting operation of each electronic component M1 to M4 is sequentially performed (step S10). When all the electronic components M1 to M4 have been mounted, the mounting head 21 moves again to the cassette supply unit 25 or the tray component supply unit 26 in order to pick up the next mounting component with the nozzles 31a to 34a. When electronic components are mounted on a predetermined substrate P while repeating this cycle, the production of the mounting substrate is finished (step S11).
[0022]
Thus, the standby position height h2 (L2 + L1 + α or L2 + L3 + α) of the nozzles 31a to 34a on the substrate P can be lowered from the conventional standby position height h1 (2.L1 + α) when the electronic components M1 to M4 are mounted. As a result, it is possible to shorten the descent time and rise time of the nozzles on the substrate, and as a result, it is possible to contribute to shortening the production time and improve the production efficiency.
(Embodiment 2)
FIG. 5 schematically shows each step of the electronic component mounting method according to the second embodiment of the present invention.
[0023]
As shown in FIG. 5, also in this electronic component mounting method, as in the above embodiment, the standby positions of the nozzles 31a to 34a are reset based on the information on the maximum component height L2 in the substrate (step S8). All the nozzles 31a to 34a are lowered to the reset standby position (step S9).
However, in this electronic component mounting method, at the stage where each electronic component is subsequently mounted (step S12), it is determined whether or not all the component mounting operations have been completed. if during wear, proceed to step S 14, it determines whether all nozzles 31A～34 a is positioned above the substrate P mounting object. Then, if all the nozzles 31a~34a is positioned above the substrate P only, while maintaining the height of the waiting position of the nozzles reconfigured to move the mounting head 21 in the XY direction (Engineering about S 15).
[0024]
On the other hand, when it is determined that at least some of the nozzles 31a to 34a are not positioned above the substrate P, the height h2 is set to a preset height h3 that is higher than the height h2 of the standby position of the reset nozzle. After the nozzles 31a to 34a are moved, the mounting head is moved in the XY direction, and then the mounting is performed while maintaining the height h3 until all the nozzles 31a to 34a are positioned above the substrate P. The head 21 is moved in the XY directions (steps S16 and S17).
[0025]
As described above, when at least some of the nozzles 31a to 34a are not positioned above the substrate P, the height of the reset standby position is prohibited and kept at a predetermined height. By moving the mounting head 21 in this manner, it is possible to prevent the mounting head 21 and the nozzles 31a to 34a from moving and contacting outside the permitted range other than on the substrate P, thereby improving the reliability. .
(Embodiment 3)
FIG. 6 schematically shows each step of the electronic component mounting method according to the third embodiment of the present invention.
[0026]
As shown in FIG. 6, also in this electronic component mounting method, as in the above embodiment, the standby positions of the nozzles 31a to 34a are reset based on the information on the maximum component height L2 in the substrate (step S8). All the nozzles 31a to 34a are lowered to the reset standby position (step S9).
Further, in this electronic component mounting method, it is determined whether or not all the component mounting operations have been completed (step S13) at the stage where each electronic component is subsequently mounted (step S12). If the mounting operation is not completed, that is, if the component is being mounted, it is confirmed that there is an instruction to move the mounting head 21 in the X and Y directions (step S18), and the reset standby nozzle height is increased. The mounting head 21 is moved in the XY direction while maintaining the thickness (step S19).
[0027]
On the other hand, when the mounting operation is completed, the process proceeds to step S20, where the nozzles 31a to 34a are moved to a height h3 set separately in advance, which is higher than the height h2 of the standby position of the reset nozzle. The head 21 is moved to finish the component mounting operation.
By this method, when it is determined that the mounting operation is not in progress, the mounting head 21 is moved in the XY direction with the nozzle raised to a height h3 higher than the height h2 of the reset standby position of the nozzle. At times other than work, the mounting head 21 and the nozzles 31a to 34a can be prevented from moving and contacting outside the permitted range other than on the substrate, and the reliability is improved.
[0028]
In the above embodiment, the case where the information on the maximum component height L2 in the substrate is input from the storage unit has been described. However, the present invention is not limited to this, and a sensor for detecting the maximum component height in the substrate is provided. Information from the lever sensor may be input.
[0029]
【The invention's effect】
According to the electronic component mounting how the present invention as described above, since the standby position of the nozzle on the substrate when the electronic component mounting can be reduced than conventionally, the fall time or rise time of the nozzle on the substrate As a result, it is possible to contribute to shortening the production time and improve the production efficiency.
[0030]
Further, at least a portion of the nozzle if not positioned above the substrate, the mounting head while maintaining a position higher than the height of the waiting position of the nozzles reconfigured by moving in the XY direction, the contact of the nozzle It is possible to increase the reliability by adding a prevention function.
[Brief description of the drawings]
FIG. 1 is a partially transparent perspective view showing a configuration of an electronic component mounting machine according to an embodiment of the present invention. FIG. 2 is a perspective view showing a configuration of a head portion of the electronic component mounting machine. The flowchart which shows each process of the electronic component mounting method concerning 1 embodiment. [FIG. 4] (a)-(f) is a figure which shows the mode of the mounting | wearing of the electronic component in the same electronic component mounting method, respectively. 5 is a flowchart showing each step of the electronic component mounting method according to the second embodiment of the present invention. FIG. 6 is a flowchart showing each step of the electronic component mounting method according to the third embodiment of the present invention. 7 is a partially transparent perspective view showing a configuration of a conventional electronic component mounting machine. FIG. 8 is a perspective view showing a configuration of a head portion of the conventional electronic component mounting machine. FIGS. 9 (a) to 9 (f) are respectively conventional. Of electronic components in the electronic component mounting method In a simplified manner shown FIG EXPLANATION OF REFERENCE NUMERALS
21 Mounting heads 31a to 34a Nozzle 22 X-axis robot 23, 24 Y-axis robot 25 Cassette supply unit 26 Tray component supply unit 30 Main controller

Claims (1)

Moving the mounting head having a vertically movable plurality of nozzles, to suck the electronic component on the nozzle from the component supply unit, after correcting recognized the posture of the electronic component that has been adsorbed, the posture is corrected In the electronic component mounting method for mounting the electronic component at each position on the substrate by lowering the nozzle from the standby position ,
In mounting the electronic components the electronic components have already been adsorbed to further the nozzle substrate being mounted, the height of the standby position of the nozzle for the previous SL board, the standby position of the nozzle which is set in advance From the height, to the highest component height in the electronic components already mounted on the substrate, in the highest component height in all types of electronic components to be mounted on the substrate or in the electronic components sucked by the nozzle By adding the highest part height, resetting it to a height with a minute dimension, lowering the nozzle to the reset standby position, and lowering the nozzle from the reset standby position While mounting electronic components,
When mounting the electronic component continuously on the substrate by moving the mounting head, it is determined that all the nozzles are located above the substrate, and only when all the nozzles are located above the substrate, When the mounting head is moved in the X and Y directions while maintaining the height of the reset nozzle standby position, and at least some of the nozzles are not positioned above the substrate, the reset nozzle standby position height is set. An electronic component mounting method for moving the mounting head in the XY directions while maintaining a position higher than the above.

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