JP7158536B2 - Electronic component insertion assembly machine - Google Patents

Description

According to the present invention, the lead of an electronic component is inserted from above into a through-hole of a circuit board, and the lead protruding downward from the through-hole is bent, or the cut-and-clinch action is performed to cut and bend the lead. This invention relates to an electronic component insertion assembly machine equipped with the function of

For example, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 60-189291), an electronic component insertion assembly machine of this type holds a circuit board movably in the XY directions on an XY table, A mounting head for picking up electronic components supplied by a component supply device is arranged so as to be movable in XYZ directions, and a clinch head for performing a clinch operation is arranged below the circuit board so as to be movable in Z directions (up and down directions). Then, the circuit board is moved in the XY direction by the XY table according to the component mounting position command supplied for each electronic component, and the component mounting position of the circuit board is positioned above the clinch head, and the electronic component is mounted. The pick-up mounting head is moved above the component mounting position on the circuit board, and the mounting head is lowered to insert the lead of the electronic component into the through-hole of the circuit board from above, and then the clinch head is lifted. There is also a clinch motion that is performed by pressing the

However, in this configuration, the circuit board must be moved in the XY direction by the XY table for each component mounting position on the circuit board. Angle correction) was not possible, so there was a drawback that versatility was low.

Therefore, in recent years, a circuit board brought in by a conveyor is clamped and fixed at a fixed position, and both the mounting head and the clinch head are configured to be drivable in the XYZ and θ directions, respectively, and the electronic components to be supplied are arranged. There is one in which both the mounting head and the clinch head are driven in the XYZ and θ directions, respectively, for each mounting position.

JP-A-60-189291

In the conventional configuration, the mounting head that picks up the electronic component is moved above the component mounting position on the circuit board, and then the clinch head is moved below the component mounting position on the circuit board. After completing the backup operation of lifting to a backup position in contact with or close to the lower surface of the circuit board, the mounting head is lowered to insert the lead of the electronic component into the through hole of the circuit board from above, and the clinch head is moved. I'm trying to get the clinch to work. At this time, if it is necessary to correct the angle of the mounting head and the clinch head in the .theta. direction, the angle in the .theta. direction is corrected during or after the movement of each head is stopped.

However, in this configuration, even after the operation of moving the mounting head that has picked up the electronic component above the component mounting position on the circuit board is completed, until the backup operation of the clinch head is completed, the component mounting position on the circuit board cannot be moved. The mounting head had to stand by above, which resulted in a longer cycle time and lower productivity.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component insertion assembly machine capable of shortening cycle time and improving productivity.

In order to solve the above-mentioned problems, the present invention picks up an electronic component supplied by a component supply device, moves it above a component mounting position on a circuit board, and lowers it, thereby connecting the lead of the electronic component to the circuit board. a mounting head that is inserted from above into the through hole of the circuit board; a mounting head driving device that drives the mounting head in the XYZ and θ directions; a clinch head that operates, a clinch head driving device that drives the clinch head in XYZ and θ directions below the circuit board, and a control device that controls the operations of the mounting head driving device and the clinch head driving device; wherein the control device picks up the electronic component supplied by the component supply device with the mounting head and moves the mounting head above the component mounting position on the circuit board. The first feature is that the clinch head is moved below the component mounting position of the circuit board prior to the completion of the timing, and the control device controls the electronic The clinch head is moved below the component mounting position on the circuit board prior to completion of the operation of picking up the component with the mounting head and moving the mounting head above the component mounting position on the circuit board. and start a backup advance operation to lift the circuit board to a backup position on the lower surface side of the circuit board, and if angle correction in the θ direction is necessary, correct the angle of the clinch head in the θ direction during the backup advance operation. is the second feature.

In this case, the start timing of the backup preceding operation of the clinch head may be any timing as long as it is before the operation of moving the mounting head above the component mounting position on the circuit board is completed. Although the effect of shortening the waiting time of the mounting head above the component mounting position on the circuit board can be obtained, it is preferable that the start timing of the backup preceding operation is an operation for moving the mounting head above the component mounting position on the circuit board. should be preceded by the time required from the start to the completion of the backup precedence operation, rather than the timing at which the backup precedence operation is completed. In this way, the time during which the mounting head waits above the component mounting position on the circuit board can be reduced to zero.

Alternatively, the clinch head may start the backup preceding operation at the same time when the mounting head starts picking up the electronic component. In this way, the backup preceding operation of the clinch head can be completed with sufficient time before the operation of moving the mounting head to the component mounting position on the circuit board is completed, and the electronic component can be picked up by the mounting head. The start timing of the operation can be used as it is as the start timing of the backup advance operation of the clinch head, and it is easy to determine the start timing of the backup advance operation.

FIG. 1 is a block diagram showing the configuration of the control system of an electronic component insertion assembly machine according to one embodiment of the present invention. FIG. 2 is a perspective view showing the construction of a cut-and-clinch device according to one embodiment of the present invention. FIG. 3 is a perspective view showing the configuration of the cut and clinch head. 4(a) and 4(b) are diagrams for explaining the cut and clinch operation of the cut and clinch head. FIG. 5 is a diagram for explaining the positional relationship among the mounting head, the circuit board, and the cut and clinch head, and the backup preceding operation.

Hereinafter, an embodiment will be described in which the form for carrying out the present invention is applied to an electronic component insertion assembly machine equipped with a cut and clinch device.

A component supply device 13 for supplying electronic components 12 with leads 11 (see FIGS. 4 and 5) is replaceably set in the electronic component insertion assembly machine. Further, the electronic component insertion assembly machine is provided with a board transfer device 15 for transferring the circuit board 14 (see FIGS. 4 and 5) and a board clamping device for clamping the circuit board 14 carried into a predetermined position by the board transfer device 15. 18, a mounting head 17 (see FIG. 5) that picks up the electronic component 12 supplied by the component supply device 13 and inserts the lead 11 of the electronic component 12 into the through hole 16 of the circuit board 14 from above; 17 in the XYZ and θ directions, and a cut and clinch device for cutting and clinching the lead 11 inserted into the through hole 16 of the circuit board 14 and protruding downward. 20, etc. are provided. The cut-and-clinch device 20 is a clinch device that performs only the clinch operation of bending the lead 11 and has a function of cutting the lead 11 added. is also applicable.

The configuration of the cut and clinch device 20 will be described below with reference to FIGS. 2 to 4. FIG.
The cut and clinch device 20 includes a cut and clinch head 21 that performs a cut and clinch operation, an X-axis driving device 22 that drives the head 21 in the X direction (conveying direction of the circuit board 14), and a head 21 that moves in the X direction. A Y-axis driving device 23 that drives in the Y direction perpendicular to the horizontal direction, a Z-axis driving device 24 that drives the head 21 in the Z direction (up and down direction), and a θ direction (about the Z axis). axis driving device 25 for driving in the rotating direction).

The cut and clinch head 21 is driven by X-axis, Y-axis, Z-axis and θ-axis driving devices 22 to 25 (cut and It is driven in the XYZ and θ directions by a clinch head driving device. The cut and clinch head 21 includes a head main body 28, a pair of first movable portions 29a and 29b held by the head main body 28 so as to be movable in the horizontal direction, and a pair of first movable portions 29a and 29b. By moving the pair of second movable portions 30a and 30b held movably in the horizontal direction and the pair of first movable portions 29a and 29b toward and away from each other, the distance between the pair of first movable portions 29a and 29b can be adjusted electronically. The gap between the pair of second movable parts 30a and 30b is adjusted by moving the pair of second movable parts 30a and 30b closer to each other and separating them from each other. A pair of second movable portion driving devices 32a, 32b and the like are provided for changing. The first movable portion driving device 31 is attached to the head body 28, and the pair of second movable portion driving devices 32a and 32b are attached to the pair of first movable portions 29a and 29b. As shown in FIG. 4, lead insertion holes 49a and 49b into which the leads 11 of the electronic component 12 are inserted are formed in the pair of first movable portions 29a and 29b, respectively. Lead insertion holes 50a and 50b into which the leads 11 of the electronic component 12 are inserted from above are formed in each of the 30b.

As shown in FIG. 2, an X-axis driving device 22 for driving the cut and clinch head 21 in the X direction drives an X-slider 34 by means of an X-axis ball screw mechanism 33 driven by an X-axis motor (not shown). It is configured to move in the X direction along the X-axis guide 35 , and the Y-axis driving device 23 is mounted on the X slider 34 .

The Y-axis drive device 23 is configured to move a Y-slider 38 in the Y-direction along a Y-axis guide 39 by a Y-axis ball screw mechanism 37 driven by a Y-axis motor (not shown). A Z-axis driving device 24 is attached to the Y slider 38 .

The Z-axis driving device 24 is configured to move a Z-slider 43 in the Z-direction along a Z-axis guide 44 by a Z-axis ball screw mechanism 42 having a Z-axis motor 41 (for example, a servomotor, etc.) as a drive source. , the θ-axis driving device 25 is attached to the Z slider 43 . The Z slider 43 holds the cut and clinch head 21 rotatably in the θ direction by the θ axis driving device 25 .

The .theta.-axis driving device 25 rotates a .theta.-axis rotary table 48 in the .theta. A head body 28 of the head 21 is attached, and the cut and clinch head 21 rotates in the .theta. direction integrally with a .theta.-axis rotary table 48.

The operation of the electronic component insertion assembly machine configured as described above is controlled by a control device 51 (see FIG. 1) comprising one or a plurality of computers. As shown in FIG. 1, the control device 51 of the electronic component insertion assembly machine includes an input device 52 (input means) such as a keyboard, mouse, touch panel, etc., and a hard disk, RAM, ROM, etc. for storing various programs and data. A storage device 53 (storage means) and a display device 54 such as a liquid crystal display or a CRT are connected.

The control device 51 of the electronic component insertion assembly machine controls the operations of the component supply device 13, the substrate transfer device 15, the substrate clamp device 18, the mounting head drive device 19, the cut and clinch device 20, etc. The operation of mounting the component 12 is performed in the following order.

First, the board clamping device 18 clamps both side edges of the circuit board 14 which has been carried into a predetermined position in the electronic component insertion assembly machine by the board conveying device 15 . Then, the control device 51 of the electronic component insertion assembly machine determines the component mounting position for mounting the electronic component 12 supplied by the component supply device 13 on the circuit board 14 according to the production job (production program). Then, the cut and clinch head 21 waiting at a waiting position away from the lower surface of the circuit board 14 is moved in the XY directions by the X-axis drive device 22 and the Y-axis drive device 23, and the cut and clinch head 21 is moved. A backup preceding operation is performed in which the circuit board 14 is moved downward from the component mounting position and raised to a backup position on the lower surface side of the circuit board 14 (a height position in contact with or close to the lower surface of the circuit board 14). At this time, if it is necessary to correct the angle of the cut and clinch head 21 in the .theta. direction, the angle of the cut and clinch head 21 in the .theta. direction is corrected by the .theta.

In parallel with this backup preceding operation, the mounting head drive device 19 moves the mounting head 17 to the component pickup position of the component supply device 13 , and the electronic component 12 supplied by the component supply device 13 is picked up by the mounting head 17 . After picking up, the mounting head 17 is moved above the component mounting position of the circuit board 14 . At this time, if it is necessary to correct the angle of the electronic component 12 in the .theta. direction, the mounting head drive device 19 corrects the angle of the mounting head 17 in the .theta. angle correction.

When the operation of moving the mounting head 17 above the component mounting position on the circuit board 14 is completed, the cut and clinch head 21 has already been raised to the backup position by the backup preceding operation described above and is in a standby state. Therefore, when the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the mounting head 17 is immediately lowered to remove the two leads 11 of the electronic component 12 without waiting at that position. are inserted into the two through holes 16 of the circuit board 14 .

As a result, as shown in FIG. 4A, the two leads 11 protruding downward from the two through holes 16 of the circuit board 14 are connected to the pair of first movable parts 29a and 29b of the cut and clinch head 21. It is inserted into the lead insertion holes 49a, 49b and the lead insertion holes 50a, 50b of the pair of second movable parts 30a, 30b. In this state, as shown in FIG. 4(b), the pair of second movable parts 30a and 30b are relatively moved with respect to the pair of first movable parts 29a and 29b by the second movable part driving device 32. The ends of the two leads 11 of the electronic component 12 are cut off, and the portions of the cut leads 11 protruding from the through holes 16 are bent along the lower surface of the circuit board 14 to mount the electronic component on the circuit board 14. 12 is temporarily fixed. At this time, the direction in which the leads 11 are bent (the movement direction of the second movable portions 30a and 30b) may be either the inner direction or the outer direction.

After such a cut and clinch operation is finished and the mounting of the electronic component 12 on the circuit board 14 is completed, both the mounting head 17 and the cut and clinch head 21 are in a movable state. If the next component mounting position is determined, the electronic component 12 supplied by the component supply device 13 is immediately started to be picked up by the mounting head 17, and at the same time, the backup preceding operation of the cut and clinch head 21 is started. to start. At this time, if the mounting head 17 and the cut and clinch head 21 need to be corrected in the .theta. direction, the angles of the heads 17 and 21 are corrected while they are moving.

Thus, when the operation of moving the mounting head 17 that has picked up the electronic component 12 above the next component mounting position on the circuit board 14 is completed, the cut-and-clinch head 21 has already moved to the circuit board by the above-described backup preceding operation. 14 is raised to the backup position immediately below the next component mounting position on the circuit board 14 and is in a standby state. The mounting head 17 is immediately lowered to insert the two leads 11 of the electronic component 12 into the two through holes 16 of the circuit board 14 at the next component mounting position. After that, the cut and clinch head 21 is caused to cut and clinch to mount the electronic component 12 on the circuit board 14 . Thereafter, the series of operations described above are repeated to sequentially mount all the electronic components 12 designated by the production job on the circuit board 14 .

As described above, conventionally, after the mounting head 17 picking up the electronic component 12 has completed the operation of moving the mounting head 17 above the component mounting position on the circuit board 14, the cut and clinch head 21 is moved to the component mounting position on the circuit board 14. to start the backup operation of raising the cut and clinch head 21 to the backup position. However, until the backup operation of the cut-and-clinch head 21 is completed, the mounting head 17 must stand by above the component mounting position on the circuit board 14, which lengthens the cycle time and lowers productivity. There was a drawback.

On the other hand, in this embodiment, at the same time when the mounting head 17 starts picking up the electronic component 12 supplied by the component supply device 13, the backup preceding operation of the cut and clinch head 21 is started. Therefore, when the operation of moving the mounting head 17 that has picked up the electronic component 12 above the component mounting position on the circuit board 14 is completed, the cut and clinch head 21 is already at the backup position due to the backup preceding operation described above. It has risen and is on standby. As a result, when the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the mounting head 17 can be immediately lowered to perform cut and clinch without waiting at that position. The time during which the mounting head 17 waits above the component mounting position on the circuit board 14 can be reduced to zero, and the cycle time can be reduced accordingly, thereby improving productivity.

Moreover, in this embodiment, the cut-and-clinch head 21 starts backup-preceding operation at the same time when the mounting head 17 starts picking up the electronic component 12 . The backup preceding operation of the cut and clinch head 21 can be completed with a margin before the operation of moving the component mounting position upward is completed, and the start timing of the pickup operation of the electronic component 12 of the mounting head 17 is cut as it is. There is also the advantage that it can be used as the start timing of the backup preceding operation of the and clinch head 21, and the determination of the start timing of the backup preceding operation is easy.

However, according to the present invention, the start timing of the backup preceding operation of the cut and clinch head 21 can be any timing as long as it is before the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed. It is possible to obtain the effect of shortening the waiting time of the mounting head 17 above the component mounting position of the circuit board 14. Preferably, the start timing of the backup preceding operation is set so that the mounting head 17 is placed in the circuit. It is preferable to precede the timing at which the operation of moving the substrate 14 upward from the component mounting position is completed by at least the time required from the start to the completion of the backup advance operation. In this way, the time during which the mounting head 17 waits above the component mounting position on the circuit board 14 can be reduced to zero.

The present invention is not limited to an electronic component insertion assembly machine equipped with a cut and clinch device 20 that performs cut and clinch operations, but can also be applied to an electronic component insertion assembly machine equipped with a clinch device that performs only clinch operations. be.

In addition, it goes without saying that the present invention can be implemented with various modifications such as changing the configuration of the cut and clinch device 20 as appropriate without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 11... Lead 12... Electronic component 13... Component supply apparatus 14... Circuit board 15... Board conveying apparatus 16... Through hole 17... Mounting head 18... Board clamping device 19... Mounting head driving device 20 ... cut and clinch device, 21 ... cut and clinch head, 22 ... X-axis drive device, 23 ... Y-axis drive device, 24 ... Z-axis drive device, 25 ... θ-axis drive device, 29a, 29b ... first movable part, DESCRIPTION OF SYMBOLS 30a, 30b... 2nd movable part 31... 1st movable part drive device 32... 2nd movable part drive device 41... Z-axis motor 50a, 50b... Lead insertion hole 51... Control device

Claims (3)

a mounting head that picks up an electronic component supplied by a component supply device, moves it above a component mounting position on a circuit board, and lowers it to insert the lead of the electronic component into the through hole of the circuit board from above; a mounting head driving device that drives the mounting head in XYZ and θ directions; a clinch head that is inserted into through-holes of the circuit board and performs a clinch operation to bend leads protruding downward; An electronic component insertion assembly machine comprising a clinch head driving device for driving the clinch head in XYZ and θ directions, and a control device for controlling the operation of the mounting head driving device and the clinch head driving device,
The control device picks up the electronic component supplied by the component supply device with the mounting head and moves the mounting head upward to the component mounting position on the circuit board prior to completion of the operation. An electronic component insertion assembly machine for moving a clinch head below a component mounting position on the circuit board ,
The control device picks up the electronic component supplied by the component supply device with the mounting head and moves the mounting head upward to the component mounting position on the circuit board prior to completion of the operation. When the clinch head is moved downward from the component mounting position of the circuit board and raised to the backup position on the lower surface side of the circuit board, a backup preliminary operation is started, and when angle correction in the θ direction is required, the backup preliminary operation is performed. (2) an electronic component insertion assembly machine for correcting the angle of the clinch head in the θ direction; The control device sets the start timing of the backup preceding operation of the clinch head from the start to the completion of the backup preceding operation before the timing of completing the operation of moving the mounting head above the component mounting position on the circuit board. 2. The electronic component inserting and assembling machine according to claim 1 , wherein the electronic component inserting and assembling machine precedes by a time required for assembling. 3. The electronic component insertion and assembly machine according to claim 1 , wherein the control device starts a backup preceding operation of the clinch head at the same time when the electronic component pickup operation of the mounting head is started.

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