JP2021158390A - Electronic component insertion assembly machine - Google Patents

Abstract

To improve productivity by reducing a cycle time.SOLUTION: In an electronic component insertion assembly machine mounting a clinch device, an electron component (12) supplied in a component supply device is picked-up with a mounting head, and a clinch head is moved to a lower direction of a component mounting position of a circuit board in advance to a timing when an operation the mounting head is moved to an upper direction of the component mounting position of the circuit board (14) is completed, and a back-up advanced operation which rises it to a back-up position is started. For instance, the back-up advanced operation of the clinch is started at the same time of starting a pick-up operation of the electron component of the mounting head. Thus, when the operation making the mounting head move to the upper direction of the component mounting position of the circuit board is completed, the mounting head is dropped and the clinch can be immediately performed without standbying it at the position.SELECTED DRAWING: Figure 4

Description

The present invention performs a clinch operation in which a lead of an electronic component is inserted into a through hole of a circuit board from above and the lead protruding downward from the through hole is bent, or a cut and clinch operation in which the lead is cut and bent. It is an invention relating to an electronic component through-hole assembly machine equipped with a function to perform.

As an electronic component insertion / assembling machine of this type, for example, as described in Patent Document 1 (Japanese Unexamined Patent Publication No. 60-189291), the circuit board is held in an XY table so as to be movable in the XY direction, and is also movable. The mounting head that picks up the electronic components supplied by the component supply device is arranged so as to be movable in the XYZ direction, and the clinch head that performs the clinch operation is arranged so as to be movable in the Z direction (vertical direction) below the circuit board. Then, according to the component mounting position command for each electronic component supplied, the circuit board is moved in the XY direction on the XY table to align the component mounting position of the circuit board above the clinch head, and to align the electronic component. By moving the picked-up mounting head above the component mounting position of the circuit board and lowering the mounting head, the lead of the electronic component is inserted into the through hole of the circuit board from above, and then the clinch head is raised. There is a device that performs a clinch operation.

However, in this configuration, the circuit board must be moved in the XY direction on the XY table for each component mounting position of the circuit board, and moreover, the angle correction in the θ direction (horizontal direction) of the electronic component mounted on the circuit board is performed. Since angle correction) cannot be performed, there is a drawback that the versatility is low.

Therefore, in recent years, the circuit board carried in by the conveyor is clamped and fixed at a fixed position, and both the mounting head and the clinch head are configured to be driveable in the XYZ direction and the θ direction, respectively, and the electronic components to be supplied. For each mounting position, both the mounting head and the clinch head are driven in the XYZ direction and the θ direction, respectively.

Japanese Unexamined Patent Publication No. 60-189291

In the conventional configuration, after moving the mounting head that picks up the electronic component above the component mounting position of the circuit board, the clinch head is moved below the component mounting position of the circuit board, and the clinch head is moved. After the backup operation of abutting or raising to a backup position close to the lower surface of the circuit board is completed, the mounting head is lowered and the lead of the electronic component is inserted into the through hole of the circuit board from above to insert the clinch head. It is designed to be clinched. At this time, if it is necessary to correct the angle between the mounting head and the clinch head in the θ direction, the angle correction in the θ direction is performed during the movement of each head or after the movement is stopped.

However, in this configuration, even after the operation of moving the mounting head that picks up the electronic components above the component mounting position of the circuit board is completed, the component mounting position of the circuit board is held until the backup operation of the clinch head is completed. There is a drawback that the mounting head must be kept on standby at the upper side, which increases the cycle time and reduces the productivity.

Therefore, an object to be solved by the present invention is to provide an electronic component insertion / assembly machine capable of shortening a cycle time and improving productivity.

In order to solve the above problems, the present invention picks up an electronic component supplied by a component supply device, moves it above the component mounting position of the circuit board, and lowers the lead of the electronic component to the circuit board. A mounting head that is inserted into the through hole of the A clinch head that performs a cut and clinch operation that cuts and bends the lead (the "clinch head" of the present invention is a concept that also includes a "cut and clinch head" that performs a cut and clinch operation) and the circuit board. In an electronic component insertion assembly machine provided with a clinch head drive device for driving the clinch head in the XYZ direction and the θ direction below, and a control device for controlling the operation of the mounting head drive device and the clinch head drive device. The control device picks up the electronic components supplied by the component supply device by the mounting head, and moves the mounting head above the component mounting position of the circuit board prior to the completion of the operation. It is characterized in that a backup preceding operation is started in which the clinch head is moved below the component mounting position of the circuit board and raised to the backup position on the lower surface side of the circuit board.

In this configuration, since the backup preceding operation of raising the clinch head to the backup position is started prior to the timing when the operation of moving the mounting head above the component mounting position of the circuit board is completed, the mounting head is started. However, the time to wait above the component mounting position on the circuit board can be shortened or reduced to zero, and the cycle time can be shortened accordingly to improve productivity.

In this case, the start timing of the backup preceding operation of the clinch head may be any timing as long as the operation of moving the mounting head above the component mounting position of the circuit board is completed. Although the effect of shortening the time for the mounting head to wait above the component mounting position of the circuit board can be obtained, preferably, the start timing of the backup preceding operation is the operation of moving the mounting head above the component mounting position of the circuit board. It is preferable to precede the timing when the backup is completed by the time required from the start to the completion of the backup preceding operation. In this way, the time for the mounting head to wait above the component mounting position on the circuit board can be set to zero.

Alternatively, the clinch head may start the backup preceding operation at the same time as the mounting head starts the pick-up operation of the electronic component. In this way, the backup preceding operation of the clinch head can be completed with a margin before the operation of moving the mounting head above the component mounting position of the circuit board is completed, and the electronic components of the mounting head can be picked up. The start timing of the operation can be used as it is as the start timing of the backup preceding operation of the clinch head, and the start timing of the backup preceding operation can be easily determined.

FIG. 1 is a block diagram showing a configuration of a control system of an electronic component insertion / assembly machine according to an embodiment of the present invention. FIG. 2 is a perspective view showing the configuration of a cut and clinch device according to an embodiment of the present invention. FIG. 3 is a perspective view showing the configuration of the cut and clinch head. 4 (a) and 4 (b) are diagrams for explaining the cut and clinch operation of the cut and clinch head. FIG. 5 is a diagram for explaining the positional relationship between the mounting head, the circuit board, and the cut-and-clinch head, and the backup preceding operation.

Hereinafter, an embodiment in which the embodiment for carrying out the present invention is applied to an electronic component insertion / assembling machine equipped with a cut-and-clinching device will be described.

A component supply device 13 for supplying an electronic component 12 (see FIGS. 4 to 5) with a lead 11 is interchangeably set in the electronic component insertion / assembly machine. Further, the electronic component insertion / assembling machine includes a substrate transfer device 15 for transporting the circuit board 14 (see FIGS. 4 to 5) and a substrate clamping device for clamping the circuit board 14 carried into a predetermined position by the substrate transfer device 15. A mounting head 17 (see FIG. 5) that picks up the electronic component 12 supplied by the component supply device 13 and inserts the lead 11 of the electronic component 12 into the through hole 16 of the circuit board 14 from above, and the mounting head. A mounting head driving device 19 that drives 17 in the XYZ direction and the θ direction, and a cut-and-clinching device that performs a cut-and-clinching operation that cuts and bends a lead 11 that is inserted into a through hole 16 of a circuit board 14 and protrudes downward. 20 etc. are provided. The cut-and-clinching device 20 is a clinch device that only performs a clinch operation for bending a lead 11, and has a function of cutting the lead 11 added. Is also applicable.

Hereinafter, the configuration of the cut and clinch device 20 will be described with reference to FIGS. 2 to 4.
The cut and clinching device 20 includes a cut and clinching head 21 that performs a cut and clinching operation, an X-axis driving device 22 that drives the head 21 in the X direction (conveying direction of the circuit board 14), and the head 21 in the X direction. A Y-axis drive device 23 that drives the head 21 in the Y direction orthogonal to the horizontal direction, a Z-axis drive device 24 that drives the head 21 in the Z direction (vertical direction), and the head 21 in the θ direction (centered on the Z axis). It is composed of a θ-axis drive device 25 that drives in the direction of rotation).

The cut-and-clinch head 21 is a drive device 22 to 25 (cut-and-and-hand) of each of the X-axis, Y-axis, Z-axis, and θ-axis below the circuit board 14 which is carried in by the board transfer device 15 and clamped by the board clamp device 18. It is driven in the XYZ direction and the θ direction by the clinch head driving device). The cut-and-clinch head 21 is attached to the head body 28, a pair of first movable portions 29a and 29b movably held by the head body 28 in the horizontal direction, and a pair of first movable portions 29a and 29b, respectively. By bringing the pair of second movable portions 30a and 30b and the pair of first movable portions 29a and 29b held so as to be movable in the horizontal direction closer to and separated from each other, the distance between the pair of first movable portions 29a and 29b can be set electronically. The distance between the pair of second movable parts 30a and 30b is increased by bringing the pair of second movable parts 30a and 30b closer to each other and the first movable part driving device 31 which adjusts the distance between the leads 11 of the component 12 and the pair of second movable parts 30a and 30b. It is provided with a pair of second moving unit driving devices 32a, 32b and the like to be changed. The first movable portion driving device 31 is attached to the head main body 28, and the pair of second movable portion driving devices 32a and 32b are attached to the pair of first movable portions 29a and 29b. As shown in FIG. 4, each of the pair of first movable portions 29a and 29b is formed with lead insertion holes 49a and 49b into which the leads 11 of the electronic component 12 are inserted from above, and the pair of second movable portions 30a, Lead insertion holes 50a and 50b for inserting the leads 11 of the electronic component 12 from above are formed in each of the 30bs.

As shown in FIG. 2, the X-axis drive device 22 that drives the cut-and-clinch head 21 in the X direction uses an X-axis ball screw mechanism 33 that uses an X-axis motor (not shown) as a drive source to drive the X-slider 34. It is configured to move in the X direction along the X-axis guide 35, and the Y-axis drive device 23 is mounted on the X-screw 34.

The Y-axis drive device 23 is configured to move the Y slider 38 in the Y direction along the Y-axis guide 39 by a Y-axis ball screw mechanism 37 driven by a Y-axis motor (not shown). A Z-axis drive device 24 is attached to the Y slider 38.

The Z-axis drive device 24 is configured to move the Z slider 43 in the Z direction along the Z-axis guide 44 by a Z-axis ball screw mechanism 42 whose drive source is a Z-axis motor 41 (for example, a servo motor or the like). A θ-axis drive device 25 is attached to the Z slider 43. The cut-and-clinch head 21 is rotatably held in the Z slider 43 in the θ direction by the θ-axis drive device 25.

The θ-axis drive device 25 is configured to rotate the θ-axis rotation table 48 in the θ direction by a θ-axis drive mechanism 47 that uses the θ-axis motor 46 as a drive source, and cuts and clinches the θ-axis rotation table 48 on the θ-axis rotation table 48. The head body 28 of the head 21 is attached, and the cut-and-clinch head 21 rotates in the θ direction integrally with the θ-axis rotation table 48.

The operation of the electronic component insertion / assembly machine configured as described above is controlled by a control device 51 (see FIG. 1) composed of one or a plurality of computers. As shown in FIG. 1, the control device 51 of the electronic component insertion / assembly machine includes an input device 52 (input means) such as a keyboard, a mouse, and a touch panel, and a hard disk, RAM, ROM, etc. for storing various programs and data. The storage device 53 (storage means) of the above is connected to a liquid crystal display, a display device 54 such as a CRT, and the like.

The control device 51 of the electronic component insertion / assembly machine controls the operations of the component supply device 13, the substrate transfer device 15, the substrate clamp device 18, the mounting head drive device 19, the cut and clinching device 20, and the like, and electronically inserts the electronic components into the circuit board 14. The operation of mounting the component 12 is performed in the following order.

First, the substrate clamping device 18 clamps both side edges of the circuit board 14 carried into a predetermined position in the electronic component insertion / assembling machine by the substrate conveying device 15. Then, the control device 51 of the electronic component insertion / assembly machine determines the component mounting position for mounting the electronic component 12 supplied by the component supply device 13 on the circuit board 14 according to the production job (production program). Then, the cut-and-clinch head 21 standing by at a standby position away from the lower surface of the circuit board 14 is moved in the XY directions by the X-axis drive device 22 and the Y-axis drive device 23 to move the cut-and-clinch head 21. A backup preceding operation is performed in which the circuit board 14 is moved below the component mounting position and raised to a backup position on the lower surface side of the circuit board 14 (a height position in contact with or close to the lower surface of the circuit board 14). At this time, if it is necessary to correct the angle of the cut and clinch head 21 in the θ direction, the θ-axis drive device 25 corrects the angle of the cut and clinch head 21 in the θ direction during the backup preceding operation.

In parallel with this backup preceding operation, the mounting head 17 is moved to the component pickup position of the component supply device 13 by the mounting head driving device 19, and the electronic component 12 supplied by the component supply device 13 is moved by the mounting head 17. It picks up and moves the mounting head 17 above the component mounting position of the circuit board 14. At this time, if it is necessary to correct the angle of the electronic component 12 in the θ direction, the mounting head driving device 19 corrects the angle of the mounting head 17 in the θ direction while the mounting head 17 is moving, and the mounting head 17 is corrected in the θ direction. Perform angle correction.

When the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the cut-and-clinch head 21 has already risen to the backup position and is in a standby state by the backup preceding operation described above. Therefore, when the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the mounting head 17 is immediately lowered without waiting at that position, and the two leads 11 of the electronic component 12 are lowered. Is inserted into the two through holes 16 of the circuit board 14.

As a result, as shown in FIG. 4A, the two leads 11 protruding downward from the two through holes 16 of the circuit board 14 are separated from the pair of first movable portions 29a and 29b of the cut and clinch head 21. It is inserted into the lead insertion holes 50a and 50b of the second movable portions 30a and 30b paired with the lead insertion holes 49a and 49b. In this state, as shown in FIG. 4B, the pair of second movable portions 30a and 30b are moved relative to the pair of first movable portions 29a and 29b by the second movable portion driving device 32. The tip unnecessary portion of the two leads 11 of the electronic component 12 is cut, and the portion of each lead 11 after cutting that protrudes from the through hole 16 is bent along the lower surface of the circuit board 14 and the electronic component is placed on the circuit board 14. Temporarily fix 12. At this time, the direction in which the lead 11 is bent (the moving direction of the second movable portions 30a and 30b) may be either the inner direction or the outer direction.

After such a cut-and-clinch operation is completed and the mounting of the electronic component 12 on the circuit board 14 is completed, both the mounting head 17 and the cut-and-clinch head 21 are in a movable state, so that the circuit board 14 can be moved. As soon as the next component mounting position is determined, the operation of picking up the electronic component 12 supplied by the component supply device 13 by the mounting head 17 is started, and at the same time, the backup preceding operation of the cut and clinch head 21 described above is started. To start. At this time, if it is necessary to correct the angle between the mounting head 17 and the cut-and-clinch head 21 in the θ direction, the angle of the heads 17 and 21 is corrected in the θ direction while the heads 17 and 21 are moving.

As a result, when the operation of moving the mounting head 17 that picks up the electronic component 12 to the upper side of the next component mounting position of the circuit board 14 is completed, the cut-and-clinch head 21 has already been subjected to the above-mentioned backup preceding operation of the circuit board. Since it has risen to the backup position immediately below the next component mounting position of 14 and is in a standby state, when the operation of moving the mounting head 17 above the next component mounting position of the circuit board 14 is completed, that position is completed. Immediately, the mounting head 17 is lowered to insert the two leads 11 of the electronic component 12 into the two through holes 16 at the next component mounting position of the circuit board 14. After that, the cut-and-clinch head 21 is operated by the cut-and-clinch operation to mount the electronic component 12 on the circuit board 14. After that, all the electronic components 12 instructed in the production job are sequentially mounted on the circuit board 14 by repeating the series of operations described above.

As described above, conventionally, after the operation of moving the mounting head 17 that picks up the electronic component 12 above the component mounting position of the circuit board 14 is completed, the cut and clinch head 21 is moved to the component mounting position of the circuit board 14. Since the backup operation of moving the cut-and-clinch head 21 to the backup position is started, the mounting head 17 is moved above the component mounting position of the circuit board 14 after the operation is completed. However, until the backup operation of the cut-and-clinch head 21 is completed, the mounting head 17 must stand by above the component mounting position of the circuit board 14, which increases the cycle time and reduces productivity. There was a drawback of doing.

On the other hand, in the present embodiment, the operation of picking up the electronic component 12 supplied by the component supply device 13 by the mounting head 17 is started, and at the same time, the backup preceding operation of the cut and clinch head 21 is started. Therefore, when the operation of moving the mounting head 17 that picks up the electronic component 12 above the component mounting position of the circuit board 14 is completed, the cut and clinch head 21 is already in the backup position by the backup preceding operation described above. It is in a state of rising and waiting. As a result, when the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed, the mounting head 17 can be immediately lowered to perform cut and clinch without waiting at that position. The time that the mounting head 17 waits above the component mounting position of the circuit board 14 can be set to zero, and the cycle time can be shortened and the productivity can be improved accordingly.

Moreover, in this embodiment, the mounting head 17 starts the backup preceding operation at the same time as the mounting head 17 starts the pickup operation of the electronic component 12, so that the mounting head 17 is mounted on the circuit board 14. Before the operation of moving the component mounting position upward is completed, the backup preceding operation of the cut and clinch head 21 can be completed with a margin, and the start timing of the pickup operation of the electronic component 12 of the mounting head 17 is cut as it is. It can be used as the start timing of the backup preceding operation of the and clinch head 21, and has an advantage that the start timing of the backup preceding operation can be easily determined.

However, in the present invention, the start timing of the backup preceding operation of the cut-and-clinch head 21 is any timing as long as the operation of moving the mounting head 17 above the component mounting position of the circuit board 14 is completed. It may be present, whereby the effect of shortening the time for the mounting head 17 to wait above the component mounting position of the circuit board 14 can be obtained, but preferably, the start timing of the backup preceding operation is the circuit of the mounting head 17. It is preferable to precede the timing of completing the operation of moving the board 14 above the component mounting position by the time required from the start to the completion of the backup preceding operation. In this way, the time for the mounting head 17 to wait above the component mounting position of the circuit board 14 can be set to zero.

The present invention is not limited to the electronic component insertion / assembling machine equipped with the cut and clinch device 20 that performs the cut and clinch operation, and can also be applied to the electronic component insertion and assembly machine equipped with the clinch device that performs only the clinch operation. be.

In addition, it goes without saying that the present invention can be implemented with various changes within a range that does not deviate from the gist, such as the configuration of the cut and clinch device 20 may be changed as appropriate.

11 ... Lead, 12 ... Electronic component, 13 ... Parts supply device, 14 ... Circuit board, 15 ... Board transfer device, 16 ... Through hole, 17 ... Mounting head, 18 ... Board clamping device, 19 ... Mounting head drive device, 20 ... Cut and clinch device, 21 ... Cut and clinch head, 22 ... X-axis drive device, 23 ... Y-axis drive device, 24 ... Z-axis drive device, 25 ... θ-axis drive device, 29a, 29b ... First movable part, 30a, 30b ... 2nd movable part, 31 ... 1st movable part drive device, 32 ... 2nd movable part drive device, 41 ... Z-axis motor, 50a, 50b ... lead insertion hole, 51 ... control device

In order to solve the above problems, the present invention picks up an electronic component supplied by a component supply device, moves it above the component mounting position of the circuit board, and lowers the lead of the electronic component to the circuit board. A mounting head that is inserted into the through hole of the and Kurinchihe' de performing operation, and the clinch head driving device for driving the clinch head below said circuit board in the XYZ directions and θ direction, and a control device for controlling the operation of the mounting head driving device and the clinch head driving device In the electronic component insertion / assembling machine provided with the above, the control device picks up the electronic component supplied by the component supply device by the mounting head and moves the mounting head above the component mounting position of the circuit board. There is characterized in that the moving ahead of the completion timing downward component mounting position of the circuit board of the clinch head.

Further, the control device precedes the timing at which the operation of picking up the electronic component supplied by the component supply device by the mounting head and moving the mounting head above the component mounting position of the circuit board is completed. When the backup preceding operation of moving the clinch head below the component mounting position of the circuit board and raising it to the backup position on the lower surface side of the circuit board is started and angle correction in the θ direction is required, the backup preceding operation is required. It is preferable to correct the angle of the clinch head in the θ direction during operation.

Claims (3)

A mounting head that inserts the lead of the electronic component into the through hole of the circuit board from above by picking up the electronic component supplied by the component supply device, moving it above the component mounting position of the circuit board, and lowering it. A clinching operation that bends a mounting head driving device that drives the mounting head in the XYZ directions and the θ direction and a lead that is inserted into a through hole of the circuit board and protrudes downward, or a cut and bend that cuts and bends the lead. A clinch head that performs a clinch operation, a clinch head drive device that drives the clinch head in the XYZ direction and the θ direction below the circuit board, and a control device that controls the operation of the mounting head drive device and the clinch head drive device. In the electronic component insertion and assembly machine equipped with
The control device picks up the electronic components supplied by the component supply device by the mounting head, and moves the mounting head above the component mounting position of the circuit board prior to the completion of the operation. An electronic component insertion / assembling machine characterized in that a backup preceding operation is started in which a clinch head is moved below a component mounting position of the circuit board and raised to a backup position on the lower surface side of the circuit board. The control device sets the start timing of the backup preceding operation of the clinch head from the start to the completion of the backup preceding operation rather than the timing at which the operation of moving the mounting head above the component mounting position of the circuit board is completed. The electronic component insertion / assembling machine according to claim 1, wherein the electronic component insertion / assembling machine is preceded by a time required for the above. The electronic component insertion / assembly machine according to claim 1 or 2, wherein the control device starts a backup preceding operation of the clinch head at the same time as starting a pickup operation of the electronic component of the mounting head.

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