JP4954698B2 - Surface mounter and control method of surface mounter - Google Patents

Description

  The present invention relates to a surface mounter employed for mounting electronic components on a substrate, and a control method for such a surface mounter.

  In general, a surface mounter used for mounting electronic components on a substrate includes a mounter body on which a substrate can be placed, a head unit that is movable relative to the mounter body, and a head unit. And a suction nozzle that can suck electronic components.

  As such a surface mounting machine, conventionally, an imaging means provided in a head unit is configured to recognize a mark provided on a board and accurately mount an electronic component on the board. Surface mounters are known.

For example, in Patent Document 1, by obtaining in advance a path in which the moving distance of the suction head is the minimum among paths through which the recognition camera can pass all of a plurality of marks, the movement distance and time of the head unit are obtained. A technique of a component mounting apparatus configured to be shortened is disclosed.
JP 2004-214247 A

  However, in the surface mounter technology described above, it is only the position of a plurality of marks provided on the substrate that is taken into consideration when obtaining the path of the head unit in advance, and the relationship between the mark position and the mounting position of the electronic component is determined. It was not configured to take into account. Therefore, when mounting electronic components before and after imaging the mark, the movement path of the head unit is optimized, such as depending on the mounting position of the electronic component on the board, the head unit will make a detour. In some cases, it could not be said. As a result, there has been a limit to the improvement in productivity related to mounting electronic components on the board.

  The present invention has been made in view of the above-described problems. An optimized path of the head unit is obtained in consideration of both the imaging order of the marks and the mounting order of the electronic components. It is an object of the present invention to provide a surface mounter and a method for controlling the surface mounter that can further improve the productivity of mounting electronic components on a substrate by performing recognition and mounting of electronic components.

In order to solve the above problems, a method for controlling a surface mounter according to the present invention is capable of placing a board that includes a plurality of divided blocks and each block includes a mark for position recognition. a mounting machine body, and the head unit is movable relative to the mounting machine body, provided in the head unit, the mounting of the electronic component to the substrate with the mark provided on the substrate and imaged separately at least one imaging device data that can receive necessary, provided on the head unit, the electronic component adsorbed a control method of a surface mounting machine equipped with a suction nozzle that can be implemented with respect to the substrate, while satisfying the condition that the imaging order of the mark by the imaging means precedes mounting order of electronic components of a block requiring the data based on the imaging of the mark While optimizing the mounting order of the imaging sequence and the electronic components of the mark, the optimization step of storing information relating to and a mounting order this optimized been captured sequence in the storage means, stored in said storage means based on the information relating to the mounting order as imaging sequence, see containing a component mounting step of mounting the electronic component to the substrate, the while recognizing the mark, the optimization process is, for each block, the movement of the head unit In the mounting order optimization process that optimizes the mounting order of electronic components so that the time or movement distance is shortened, and in the mounting order obtained in this mounting order optimization process, the above-mentioned marks are placed at the individual block delimiters. Based on the provisional setting step for temporarily setting the imaging order and the mounting order by inserting the imaging order and the imaging order and the mounting order obtained in the temporary setting step, In order from the electronic component, the moving time or moving distance of the head unit is compared between the case where the electronic component is mounted and the case where the subsequent imaging order mark is imaged instead of the electronic component. An imaging order raising step of raising the imaging order of the mark before the mounting order of the electronic components when the moving distance or movement time is shortened by the preceding one, and the imaging obtained in this imaging order raising step Information related to the order and the mounting order is stored in the storage means .

According to the method for controlling a surface mounter according to the present invention, an electronic device is capable of recognizing a mark while recognizing a mark based on information related to an imaging order and a mounting order that are optimized so that the moving time or moving distance of the head unit is shortened. Since the component is mounted on the substrate, the productivity related to mounting the electronic component on the substrate can be improved. In particular, since the optimization process includes a mounting order optimization process, a temporary setting process, and an imaging order advance process, the condition that the imaging order of the mark precedes the mounting order of the electronic components in the block is satisfied. However, the imaging order and the mounting order are optimized so that the moving time or moving distance of the head unit is shortened.

Here, the imaging means is provided one on the head unit, in the component mounting step, when the imaging of the marks is preferably you image the respective marks by the single image pickup means .

  In this way, since there is only one image pickup means for the head unit, it is possible to improve productivity related to mounting of electronic components with an inexpensive system.

Also, the imaging means is provided plurality of head units, the upper Symbol optimizing process, the information relating to the optimized been captured sequence, the moving distance of the head unit with respect to the imaging of the marks of the plurality of imaging means or are indicated by the information related to the selected imaging means as the moving time is shortened, in the component mounting process, the imaging respectively by selecting based rather imaging means to the information relating to the upper Symbol selected imaging means mark may be you shall.

  In this way, since the mark is imaged by the imaging means selected so that the moving distance or moving time of the head unit is shortened from among a plurality of imaging means, the moving path of the head unit is more optimized, and the electronic Productivity related to component mounting can be further improved.

In addition, a surface mounting machine according to the present invention for solving the above-described problems is a mounting that can mount a board that includes a plurality of divided blocks and each block includes a mark for position recognition. and machine body, and the head unit is movable relative to the mounting machine body, provided in the head unit, and at least one imaging device capable of recognizing the marks provided on the substrate, the head unit provided, a suction nozzle which can mount electronic components adsorbed to said substrate, the control method of the above (according to any one of claims 1 to 3), and the head unit, an imaging unit When, and a control device for controlling the suction nozzle, the control device, based on information relating to the mounting order as the imaging sequence, the electronic components to the substrate while recognizing the mark It is intended to mount.

  According to the surface mounter of the present invention, the electronic component is mounted on the substrate while recognizing the mark based on the information related to the imaging order and the mounting order optimized so that the moving time or moving distance of the head unit is shortened. As a result, it is possible to improve the productivity of mounting electronic components on the board.

  As described above, according to the present invention, an optimized path of the head unit is obtained in consideration of both the imaging order of the marks and the mounting order of the electronic components. Since the electronic component is mounted, productivity related to mounting of the electronic component on the substrate can be improved.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a schematic configuration of a surface mounter 1 according to an embodiment of the present invention, and FIG. 2 is a side view showing a schematic configuration of the surface mounter 1. 3A and 3B are explanatory views showing the arrangement of the mounting head 16 and the imaging means 17 and 18 of the head unit 6, wherein FIG. 3A is a perspective view and FIG. 3B is a plan view. . FIG. 4 is a plan view showing a schematic configuration of the substrate 3.

  As shown in FIG. 1, a surface mounter 1 according to an embodiment of the present invention includes a mounter body 2 on which a substrate 3 can be placed, and a head unit that is movable with respect to the mounter body 2. 6, the head unit 6 includes two imaging units 17 and 18 that can individually image the marks F <b> 11, 12 to F <b> 41 and 42 (FIG. 4) of the substrate 3, and the imaging units 17 and 18 are positioned. A mounting head 16 having a suction nozzle 16a (FIG. 2) capable of mounting an electronic component on the recognized substrate 3 is provided.

  Further, the surface mounter 1 includes a control device 19 (FIG. 5). The control device 19 is configured to mount the electronic component on the substrate 3 while recognizing the marks F11, 12 to F41, 42 based on the order in which the moving time or moving distance of the head unit 6 is shortened. 6, the imaging means 17 and 18, and the suction nozzle 16 a are controlled.

  The mounting machine body 2 includes a base 2a and component supply units 4 and 4 provided on the base 2a. On the base 2a, a conveyor 2b for board transfer is arranged, and the board 3 is It is conveyed on the conveyor 2b and stopped at a predetermined mounting work position.

  In addition, component supply units 4 and 4 are disposed on both sides of the conveyor 2b, and a plurality of tape feeders 4a are provided in these component supply units 4 and 4. Each tape feeder 4a is configured such that small chip components such as ICs, transistors, capacitors, etc. are accommodated at predetermined intervals, and the held tape is led out from the reel. Is to be taken out intermittently.

The board 3 is a printed board, and the board 3 is divided into four blocks 3a to 3d in the example shown in FIG. In order to recognize the positions and postures of the blocks 3a to 3d with respect to the base 2a by the imaging means 17 and 18, the plurality of blocks 3a to 3d are 8 in total, one at a diagonal position of each of the blocks 3a to 3d. Two block fiducial marks, that is, marks F11, 12 to F41, 42 (corresponding to marks according to the present invention) are provided.

  In addition, in each of the blocks 3a to 3d, mounting positions are set in advance so that electronic components are mounted at the mounting positions M11, 12, 13, 14, 15 to M41, 42, 43, 44, and 45, respectively. ing.

  The head unit 6 is movable across the component supply units 4, 4 and the substrate 3, and moves in the X-axis direction (direction of the conveyor 2 b) and the Y-axis direction (direction perpendicular to the X-axis on the horizontal plane). Can be done. That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servomotor 9 are disposed on the base 2 a, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the head unit support member 11 is screwed onto the ball screw shaft 8.

  The head unit support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 10 driven by an X-axis servo motor 14, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 10.

  The head unit support member 11 moves in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 moves in the X-axis direction with respect to the head unit support member 11 by the operation of the X-axis servo motor 14. It is like that.

  Further, in the head unit 6, eight mounting heads 16 each having a suction nozzle 16a for picking up components are arranged in a line in the X direction as shown in FIG.

  The mounting head 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle center axis (R-axis) with respect to the frame of the head unit 6. And a rotary driving means such as an R-axis servo motor.

  Further, the head unit 6 is provided with one image pickup means 17 and 18 each composed of an area sensor camera disposed at the outer position of each mounting head 16 in the X-axis direction with the image pickup range directed toward the base 2a. It has been. These imaging means 17 and 18 individually image the marks F11, 12 to F41 and 42 on the substrate 3, and acquire the coordinates of the marks F11, 12 to F41 and 42, which are data necessary for mounting electronic components. It is configured to be able to.

  Here, the control device 19 of the surface mounter 1 will be described. FIG. 5 is a block diagram showing a schematic configuration of the control device 19.

  As shown in FIG. 5, the control device 19 of the surface mounter 1 includes an arithmetic processing unit 20, a storage unit 21 connected to the arithmetic processing unit 20, a drive control unit 22, an interface 23, and an image processing unit. 24 and a display unit 25.

  The arithmetic processing unit 20 is a device composed of a computer including a well-known CPU that executes logical operations, a ROM that stores initial settings, and a RAM that temporarily stores various data during operation of the device. The memory unit 21, the drive control unit 22, the interface 23, and the image processing unit 24 exchange signals to perform various arithmetic processes. Further, predetermined information is displayed on the display unit 25 as necessary.

  Specifically, the arithmetic processing unit 20 drives the head unit 6 and marks F11, 12 to F41, 42 by the imaging units 17 and 18 via the drive control unit 22 based on the information stored in the storage unit 21. Image pickup, suction of electronic components by the suction nozzle 16a, and mounting operation are controlled.

  Further, the arithmetic processing unit 20 calculates the coordinates of the imaging means 17 and 18 at the present time based on the moving distance of the head unit 6 detected by the encoder 26, or the mark F11 taken by the imaging means 17 and 18. , Based on the image data of 12 to F41 and 42 and the coordinates of the marks F11, 12 to F41 and 42 stored in the storage means 21, the amount of positional deviation between the assumed coordinates and the actual coordinates is calculated, This is used to correct the driving of the head unit 6.

  The storage means 21 has the positions of the marks F11, 12 to F41, 42 set for each type of the substrate 3, the suction position of the electronic component, the mounting position M11, 12, 13, 14, 15, 15-M41, 42 of the electronic component. , 43, 44, 45, and the mounting order thereof, and the like, and are configured so that each piece of information can be exchanged with the arithmetic processing unit 20 as necessary.

  The drive control unit 22 is a device that drives the Y-axis servo motor 9, the X-axis servo motor 14, the Z-axis servo motor (not shown), the R-axis servo motor, and the like based on the information stored in the storage unit 21. .

  The interface 23 is connected to encoders 26 provided in the Y-axis servo motor 9 and the X-axis servo motor 14, respectively. The encoder 26 detects the moving distance of the head unit 6 with respect to a preset origin position. This is output to the interface 23.

  The image processing unit 24 appropriately performs necessary image processing on the imaging data from the imaging units 17 and 18 so that the arithmetic processing unit 20 can perform the processing.

  Next, with reference to FIGS. 6-8, the effect | action of the surface mounter 1 which concerns on embodiment of this invention is demonstrated. FIG. 6 is an explanatory diagram showing a state in which the fourth mounting head 16 has moved to the mounting position of M15 on the substrate 3, and FIG. 7 is a sequence showing a schematic control procedure of the control device 19 of the surface mounter 1. FIG. FIG. 8 is a conceptual diagram showing how the mark imaging order and the electronic component mounting order are set. FIG. 8A shows the electronic component before step S1 is started. FIG. 8B shows the mounting order of electronic components at the time when step S1 is completed. FIG. 8C shows the imaging order of marks and the mounting order of electronic components when step S2 is completed. (D) shows the imaging sequence of marks and the mounting sequence of electronic components at the time when step S3 is completed.

  The control method of the surface mounter 1 according to the embodiment of the present invention includes the optimization steps S1 to S3 shown in FIG. 7, and the imaging order that is optimized by the optimization steps S1 to S3 and stored in the storage unit. And an unillustrated component mounting step of mounting an electronic component on the substrate 3 while recognizing the mark based on the information related to the mounting order.

  In the optimization steps S1 to S3, the imaging order of the marks F11, 12 to F41 and 42 by the imaging means 17 and 18 precedes the mounting order of electronic components that require imaging of the marks F11, 12 to F41 and 42. The imaging order of the marks F11, 12 to F41, 42 and the mounting order of the electronic components are optimized so that the moving time or moving distance of the head unit 6 is shortened while satisfying the above condition. In this step, information relating to the imaging order and the mounting order is stored in the storage means.

  The optimization steps S1 to S3 include a mounting order optimization step S1, a provisional setting step S2 (steps S21 to S26), and an imaging sequence advancement step S3 (steps S31 to S36).

  The mounting order optimizing step S1 is a step of optimizing the mounting order of the electronic components in each of the blocks 3a to 3d. The order shown in FIG. Based on the above, it is investigated whether the moving distance or moving time is shortened by changing the mounting order of the electronic components. If the moving distance or moving time of the head unit 6 is shortened by preceding the subsequent mounting order, this mounting order is advanced before the previous mounting order, and the order shown in FIG. Change the order as follows.

  In the temporary setting step S2 (steps S21 to S26), in the mounting order obtained in the mounting order optimization step S1, the imaging order of the block fiducial marks is inserted into the delimiters of the individual blocks 3a to 3d. This is a step of temporarily setting the imaging order and the mounting order, and the order is rearranged as shown in FIG.

  Specifically, first, in step S21, the sequence number S is set to S = 1, and the block number B is set to B = 1.

  Next, in step S22, it is determined whether or not the S-th mounting position belongs to the B-th block. If NO, the process proceeds to step S23, and the sequence number S is set to S = S + 1. Then, the process proceeds to step S22.

Further, in step S2 2, YES i.e., when the S-th mounting position belongs to the B-th block, the process proceeds to step S24, fiducial recognition sequence of B-th block in front of the S-th mounting sequence i.e., Insert imaging order of marks.

  Next, in step S25, the sequence number S is set to S = S + 2, and the block number B is set to B = B + 1.

  In step S26, it is determined whether or not B has reached the final block number. If NO, the sequence is repeated from step S22.

  If YES in step S22, that is, if B has reached the final block number, the process proceeds to the next imaging sequence advance step S3.

  The above-described imaging order raising step S3 (steps S31 to S36) includes the mounting order of each electronic component and the mounting order in the imaging order and the mounting order obtained in the temporary setting step S2 (steps S21 to S26). In the case where the moving distance or moving time of the head unit 6 is shortened by comparing the imaging order of the subsequent block fiducial marks with the imaging order of the subsequent block fiducial marks. This is a step of moving up this imaging order before the mounting order.

  Specifically, in step S31, the sequence number S is set to S = 1.

  Next, in step S32, it is determined whether or not the S-th sequence is mounting of an electronic component. If NO, the process proceeds to step S33, and the sequence number S is set to S = S + 1. Then, the process proceeds to step S36.

  If YES in step S32, that is, if the S-th sequence is mounting of an electronic component, the process proceeds to step S34, and whether the moving distance is shorter immediately after the S-th mounting than the subsequent fiducial recognition sequence. If the determination is YES, the process proceeds to step S35, the fiducial recognition sequence is advanced, and the process proceeds to step S33.

  If NO, that is, if the movement distance is longer immediately after the Sth mounting than the subsequent fiducial recognition sequence, the process proceeds to step S33 as it is.

  In step S32, the sequence number S is set to S = S + 1, and the process proceeds to step S36.

  Then, in S36, it is determined whether or not the sequence number S has reached the final sequence number. If NO, the sequence is repeated from step S32.

  In step S36, if YES, that is, if the sequence number S has reached the final sequence number, the sequence is terminated and the process proceeds to the next component mounting step.

  Although the details of the component mounting process are not shown, the block fiducial marks F11, 12 to F41 are based on the imaging order and mounting order such as the order of FIG. 8D obtained in the imaging order advance process S3. , 42 is imaged and the electronic components are mounted on the respective blocks 3a to 3d of the substrate 3 while recognizing the positions of the respective blocks 3a to 3d.

  Although not shown in detail, the marks F11, 12 to F41, 42 are the imaging means 17, selected from among the plurality of imaging means 17, 18, so that the moving distance or moving time of the head unit 6 is shortened. In the optimization steps S1 to S3, the information related to the optimized imaging order is appended with the information related to the selected imaging means 17 and 18. .

  In the component mounting process, when the marks F11, 12 to F41, 42 are imaged, the imaging means 17, 18 are selected based on the information related to the selected imaging means 17, 18, and the marks F11, 12 are respectively selected. To F41 and 42.

  As described above, according to the surface mounter 1 and the control method of the surface mounter 1 according to the embodiment of the present invention, in particular, the imaging order of the marks F11, 12 to F41, 42 is the blocks 3a to 3d. Since it is possible to optimize the moving time or moving distance of the head unit 6 while satisfying the condition that it precedes the mounting order of the electronic components, the electronic components can be efficiently used in the blocks 3a to 3d of the substrate 3. Can be installed.

  Further, since the marks F11, 12 to F41, 42 are picked up by the image pickup means 17, 18 selected so as to shorten the moving distance or moving time of the head unit 6 from among the plurality of image pickup means 17, 18, the head unit The travel path 6 can be made more appropriate, and productivity related to mounting of electronic components can be further improved.

  Furthermore, since the optimization steps S1 to S3 include the mounting order optimization step S1, the provisional setting step S22, and the imaging sequence advancement step S3, the imaging order of the marks F11, 12 to F41, 42 is reliably ensured. It is possible to optimize the moving time or moving distance of the head unit 6 while satisfying the condition that it precedes the mounting order of the electronic components of the blocks 3a to 3d.

  As described above, according to the surface mounter 1 and the control method of the surface mounter 1 according to the embodiment of the present invention, the imaging order and mounting optimized so as to shorten the moving time or moving distance of the head unit 6. Since the electronic component is mounted on the substrate 3 while recognizing the marks F11, 12 to F41, 42 based on the information related to the order, productivity related to mounting of the electronic component on the substrate 3 can be improved.

  The above-described embodiment is merely a preferred specific example of the present invention, and the present invention is not limited to the above-described embodiment.

  For example, the imaging unit is provided in the head unit 6 with any one of the imaging units 17 and 18, and the component mounting process is performed by the single imaging unit when imaging the marks F 11, 12 to F 41 and 42. The marks F11, 12 to F41, 42 may be configured to be imaged.

  In this way, since there is only one imaging means for the head unit 6, it is possible to improve productivity related to mounting of electronic components with an inexpensive system.

  Next, the board | substrate 3 does not need to be divided into several blocks 3a-3d. The present invention is also applicable to the substrate 3 that is not divided into blocks.

  In addition to the block fiducial marks for recognizing the positions of the blocks 3a to 3d, marks can be provided on the substrate 3. For example, the present invention can be applied to a substrate 3 that includes a bad mark for recognizing the quality of a component and is configured to mount an electronic component based on data based on the image of the bad mark.

  Furthermore, the configurations of the conveyor 2b, the component supply units 4 and 4, the X-axis and Y-axis drive mechanisms, and the control device 19 are not necessarily limited to the illustrated configurations. Various design changes are possible.

  In the optimization steps S1 to S3, the moving time or moving distance of the head unit 6 is not necessarily the shortest. While satisfying the condition that the imaging order of the marks F11, 12 to F41 and 42 by the imaging means 17 and 18 precedes the mounting order of the electronic components of the blocks 3a to 3d that require data based on the imaging of the marks, the head unit As long as the moving time or moving distance of 6 is shortened, various optimizations are possible.

  In addition, it goes without saying that various design changes are possible within the scope of the claims of the present invention.

1 is a plan view showing a schematic configuration of a surface mounter according to an embodiment of the present invention. It is a side view which shows the structure of the outline of a surface mounter. It is explanatory drawing which shows arrangement | positioning of the head for mounting of a head unit, and an imaging means, (a) is a perspective view, (b) has each shown the top view. It is a top view which shows the structure of the outline of a board | substrate. It is a block diagram which shows the structure of the outline of a control apparatus. It is explanatory drawing which shows the state which the 4th mounting head moved to the mounting position of M15 in the board | substrate. It is a sequence diagram which shows the outline control point of the control apparatus of a surface mounter. FIG. 8A is a conceptual diagram showing how the mark imaging order and the electronic component mounting order are set, and FIG. 8A shows the electronic component mounting order before step S1 is started, and FIG. b) is the mounting order of the electronic components when step S1 is completed, FIG. 8C is the mark imaging order and electronic component mounting order when step S2 is completed, and FIG. 8D is the step. The mark imaging order and the electronic component mounting order when S3 ends are shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mounter 2 Mounter main body 3 Board | substrate 3a-3d Block 6 Head unit 16a Suction nozzle 17, 18 Imaging means 19 Control apparatus 21 Memory | storage means F11, 12-F41, 42 Mark S1-S3 Optimization process S1 Optimization of mounting order Process S2 Temporary setting process S3 Imaging sequence advance process

Claims (4)

A mounting machine main body including a plurality of divided blocks and a board on which each block includes a mark for position recognition, and a head provided movably with respect to the mounting machine main body and the unit, provided in the head unit, and at least one imaging device capable of acquiring data necessary for the mounting of the electronic component to the substrate by imaging individually the mark provided on the substrate, provided on the head unit , an electronic component adsorbed a control method of a surface mounting machine equipped with a suction nozzle that can be implemented with respect to the substrate,
While satisfying the condition that the imaging order of the mark by the imaging means precedes mounting order of electronic components of a block requiring the data based on the imaging of the mark, and a mounting order of the imaging sequence and the electronic components of the mark An optimization process for storing information on the optimized imaging order and mounting order in the storage unit, together with optimization,
Based on the information relating to the mounting order as imaging order stored in the storage means, seen containing a component mounting step of mounting the electronic component to the substrate, the while recognizing the mark,
The optimization process includes, for each block, a mounting order optimization process for optimizing the mounting order of electronic components so that the moving time or moving distance of the head unit is shortened,
In the mounting order obtained in this mounting order optimization step, a provisional setting step for temporarily setting the imaging order and the mounting order by inserting the imaging order of the marks at the delimiters of the individual blocks,
Based on the imaging order and the mounting order obtained in this temporary setting process, in order from the electronic component with the earliest mounting order, the case of mounting the electronic component and the subsequent imaging order mark instead of the electronic component were imaged. Compare the moving time or moving distance of the head unit with the case, and if the moving distance or moving time is shortened by preceding the imaging order of the subsequent mark, the imaging order of the mark is changed to the mounting order of the electronic components. A method for controlling a surface mounter, comprising: an imaging order raising step that is advanced before the imaging step, and storing information related to the imaging order and mounting order obtained in the imaging order advancement step in the storage means . The imaging means, one provided has a head unit,
In the component mounting step, when the imaging of the marks, a control method of a surface mounting apparatus according to claim 1, each of the marks, wherein the imaging to Turkey by this single imaging device. A plurality of the imaging means are provided in the head unit ,
In the above SL optimizing process, the information relating to the optimized been captured sequence, the information relating to the selected imaging means as the moving distance or moving time of the head unit is shortened with respect to the imaging of the marks of the plurality of image pickup means Addendum,
The component in the mounting process, the upper Symbol selected control surface mounting apparatus according to claim 1, each mark by selecting the imaging means rather based on information relating to the imaging means, characterized the imaging to Turkey Method. A mounting machine main body including a plurality of partitioned blocks, and a substrate on which a block for position recognition is included in each block can be placed;
A head unit movably provided with respect to the mounting machine body;
Provided in the head unit, and at least one imaging device capable of recognizing the marks provided on the substrate,
Provided on the head unit, a suction nozzle which can mount electronic components adsorbed to said substrate,
The control method according to any one of the above claims 1 to 3, comprising the above head unit, an imaging unit, and a control device for controlling the suction nozzle,
The control device, based on information relating to the mounting order as the imaging sequence, a surface mounting machine, characterized by mounting electronic components to a substrate while recognizing the mark.

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