JP2013093427A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which conducts clinch processing of a lead terminal of an insertion mounting type electronic component during component placement without installing a special machine.SOLUTION: A circuit board 5 is supported by a buck-up pin 40 of a buck-up device from the rear surface side during component placement. The buck-up pin 40 includes clinch guides 41 disposed immediately below insertion holes 5a to which leads 20a of the lead component 20 are inserted. A lead guide groove 41a vertically extending is formed at an upper end part of each clinch guide 41, and a bottom surface of the lead guide groove 41a is formed as an inclination surface inclining relative to a horizontal surface. This structure inserts the lead 20a of the lead component 20 into the insertion hole 5a and concurrently clinches the lead 20a along the inclination surface.

Description

  The present invention relates to an electronic component mounting apparatus for mounting a component supplied from an electronic component supply device on a substrate.

In an electronic component mounting apparatus, an electronic component is sucked and held by a suction nozzle that can operate in the X, Y, Z, and θ-axis directions, and the electronic component is mounted on a substrate. In such an electronic component mounting apparatus, the mounting process of the electronic component is performed in a state where the substrate is supported from the back surface by a backup device including a plurality of backup pins.
FIG. 16 is a side view showing a schematic configuration of a conventional backup device. Here, FIG. 16A shows a state where the substrate 100 is stopped at the component mounting position. A backup device 102 is disposed below the substrate 101. The backup device 102 includes a backup table 104 on which a plurality of backup pins 103 that support the substrate 101 from the lower surface when components are mounted are erected.

  The backup table 104 is configured to be vertically movable, and after the substrate 101 is positioned at the component mounting position as shown in FIG. 16A, the backup table 104 is raised as shown in FIG. As a result, the substrate 101 is lifted by the backup pins 103. In this way, the electronic component 107 is mounted on the substrate 101 by the suction nozzle 106 of the mounting head 105 in a state where the substrate 101 is supported from the lower surface by the tip of the backup pin 103.

The position of the backup pin 103 erected on the backup table 104 is determined according to the type (size, shape, etc.) of the substrate 101. Therefore, the backup table 104 is provided with a large number of pin holes into which the backup pins 103 can be inserted and removed, and the arrangement position of the backup pins 103 can be changed according to the type of the board.
As a technique for automatically inspecting whether or not the backup pin 103 is arranged at an appropriate position according to the type of the substrate 101, there is a technique described in Patent Document 1, for example. This technology is provided with a plurality of switches that are turned on and off in accordance with the insertion / removal of the backup pin 103, the arrangement position data of the backup pin 103 obtained from the signals of the plurality of switches, and the appropriate position data registered in advance. Are compared.

JP-A-7-212499

  By the way, as electronic parts to be mounted on a substrate, there are radial parts (lead parts) in which leads serving as terminals protrude from the lower surface, such as aluminum electrolytic capacitors and resistors that need to be mounted upright. Such a lead component is an insertion mounting type electronic component, and when mounted on a substrate, first, as shown in FIG. 17A, the lead 20a is inserted into the insertion hole 101a formed in the substrate 101 from the upper surface side of the substrate. And lead 20a is projected from the lower surface of the substrate. Then, as shown in FIG. 17B, the lead component 20 is fixed to the substrate 101 by performing a clinching process for bending the lead portion on the lower surface of the substrate.

However, the electronic component mounting apparatus described in Patent Document 1 is not provided with a mechanism for performing a clinching process on the lead portion. Therefore, when the lead component is mounted, the insertion hole formed on the substrate with the lead is mounted. In this case, after the substrate is carried out of the mounting apparatus, a clinching process is performed by a dedicated apparatus. Therefore, the lead of the lead component may come out of the insertion hole of the board due to the vibration of the board when the board is carried out.
Therefore, an object of the present invention is to provide an electronic component mounting apparatus that can perform a clinching process of lead terminals of an insertion mounting type electronic component at the time of component mounting without installing a dedicated machine.

  In order to solve the above-described problem, an electronic component mounting apparatus according to the present invention sucks an electronic component by a suction nozzle and mounts the electronic component on a predetermined mounting point on a substrate positioned at the component mounting position. A mounting device, wherein a lead terminal protruding downward is inserted into an insertion hole formed in the substrate from above and mounted immediately below the mounting point of an insertion mounting type electronic component, and the substrate is placed from below. A backup pin having a support member to support, the support member includes an inclined surface inclined with respect to a horizontal plane at an upper end thereof, and a position of an upper end portion of the inclined surface in the radial direction of the insertion hole is Within the range of the insertion hole and shifted to one side with respect to the center position of the insertion hole, the position of the lower end portion of the inclined surface in the radial direction of the insertion hole is outside the range of the insertion hole. And in the insertion hole It is characterized by being arranged such that the position deviated on the other side with respect to position.

  As a result, when the lead terminal of the insertion mounting type electronic component (lead component) protrudes from the lower surface of the insertion hole of the circuit board during component mounting, the tip of the lead terminal contacts the inclined surface formed on the upper end of the support member. Touch. When the lead component is further lowered to be mounted on the circuit board from this state, the leading end portion of the lead terminal is bent along the inclined surface. In this manner, the lead terminals can be clinched simultaneously with component mounting.

  Therefore, it is possible to make it difficult for the lead terminal to be removed from the board insertion hole at the same time as mounting the component, and even if the board vibrates during unloading after mounting the component, the lead component can be kept mounted on the board. it can. In addition, the backup pin that supports the circuit board from the bottom when mounting the component has a clinching function that clinches the lead terminal of the lead component, so there is no need to install a dedicated machine, reducing the space for that. Can do. Further, since the backup pin can be used without being limited to the clinching function, it can be used as a normal substrate support pin if it is disposed other than just below the mounting point of the lead component.

In the above, the support member is provided with a concave lead guide groove at the upper end thereof, and the inclined surface is formed by the bottom surface of the lead guide groove.
Therefore, the guide of the lead guide groove can suppress the escape of the lead terminal in the width direction of the lead guide groove at the time of clinching, and an appropriate clinching process can be performed.

Furthermore, in the above, the insertion mounting type electronic component includes a lead group in which a plurality of the lead terminals are arranged at a predetermined lead pitch in the same direction, and the support member includes the lead terminals belonging to the lead group. A plurality of the lead guide grooves corresponding to the number and the lead pitch are provided.
Thus, by adjusting the number of lead guide grooves and the groove width, a plurality of lead terminals can be simultaneously clinched with one support member.

Further, in the above, the inclined surface is composed of two inclined surfaces with different inclination angles with respect to the horizontal plane, and the inclination angle of the upper inclined surface with respect to the horizontal plane is inclined with respect to the horizontal surface of the lower inclined surface. It is characterized by being set smaller than the angle.
Thereby, the angle with respect to the horizontal surface of the lead terminal after a clinching process can be made into the angle of a comparatively small upper inclined surface. Also, since the angle of the lower inclined surface is made larger than the angle of the upper inclined surface, the tip of the lead terminal is released in the clinch direction during the process in which the tip of the lead terminal protrudes under the insertion hole when mounting a component. The lead terminal can be bent appropriately.

Furthermore, in the above, the backup pin couples the pair of support members arranged to face each other and the pair of support members so that the distance between the upper end portions in the facing direction of the pair of support members can be changed. And a connecting member.
Thereby, it can respond to the lead component which has a lead terminal in 2 rows on both sides. In addition, since an opening / closing mechanism for adjusting the opening degree of the upper end portion of the support member can be provided, it is possible to deal with parts having different pitches of the lead terminals in the two rows on both sides.

Further, in the above, the connecting member is configured to connect each lower end of the pair of support members so as to be rotatable about an axis orthogonal to the facing direction and the vertical direction, and the backup pin Is characterized by further comprising a height adjusting means capable of adjusting the height position of the connecting member.
Thereby, the opening / closing mechanism of the support member can be realized with a relatively simple configuration. Moreover, since the height can be made constant by the plurality of backup pins regardless of the opening degree of the upper end portion of the support member by the height adjusting means, the substrate can be stably supported when the components are mounted.
Furthermore, in the above, the height adjusting means includes a screw shaft that extends in the vertical direction and is screwed with the connecting member.
Thereby, the height adjustment mechanism of a connection member is realizable with a comparatively simple structure.

  According to the present invention, a backup pin that supports the substrate from the back side when mounting the component is provided with a function of clinching the lead terminal of the insertion mounting type electronic component (lead component) protruding from the back side of the substrate, so a dedicated machine is required. It is possible to fix the lead component to the board without the need for a failure. Therefore, it is possible to prevent the lead of the lead component from coming out of the insertion hole of the substrate due to the vibration of the substrate when the substrate is carried out.

It is a top view which shows the electronic component mounting apparatus in this invention. It is a block diagram which shows the structure of the control system of an electronic component mounting apparatus. 4 is a flowchart showing a component mounting processing procedure executed by a controller 30. It is the front view and side view which show the structure of a backup pin. It is a figure explaining the opening / closing mechanism and height adjustment mechanism of a backup pin. It is a perspective view which shows the structure of a backup pin. It is a figure which shows the shape of a lead guide groove. It is a figure which shows the example of arrangement | positioning of a backup pin. It is a figure which shows the positional relationship of the insertion hole of a lead | read | reed and the inclined surface of a backup pin. It is a figure which shows the lead clinching method. It is a figure which shows the operation | movement at the time of lead component mounting in this embodiment. It is a figure which shows another example of a lead guide groove. It is a figure which shows another example of a lead guide groove. It is a figure which shows another example of the components recognition method. It is a figure explaining the correction information by component recognition. It is a side view which shows schematic structure of the conventional backup apparatus. It is a figure which shows the clinching process of lead components.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Constitution)
FIG. 1 is a plan view showing an electronic component mounting apparatus according to the present invention.
In the figure, reference numeral 1 denotes an electronic component mounting apparatus. The electronic component mounting apparatus 1 includes a pair of transport rails 11 extending in the X direction on the upper surface of the base 10. The transport rail 11 supports both sides of the circuit board 5 and is driven by a transport motor (not shown) to transport the circuit board 5 in the X direction.

The electronic component mounting apparatus 1 includes a mounting head 12. The mounting head 12 includes a plurality of suction nozzles that suck electronic components at the bottom, and is configured to be horizontally movable on the base 10 in the XY directions by the X-axis gantry 13 and the Y-axis gantry 14.
In this electronic component mounting apparatus 1, electronic component supply devices 15 that supply electronic components by a tape feeder or the like are mounted on both sides of the transport rail 11 in the Y direction. The electronic component supplied from the electronic component supply device 15 is vacuum-sucked by the suction nozzle of the mounting head 12 and mounted on the circuit board 5. In this embodiment, the case where the suction nozzle is applied as the nozzle of the mounting head 12 will be described. However, a nozzle that grips an electronic component can also be applied.

In addition, a recognition camera 21 including a CCD camera is disposed between the component supply device 15 and the circuit board 5. The recognition camera 21 detects the electronic component suction position deviation (deviation between the center position of the suction nozzle and the center position of the suctioned component) and the suction angle deviation (tilt) of the electronic component. Is taken.
A distance sensor 22 is attached to the mounting head 12. The distance sensor 22 measures the distance (height) in the Z direction between the suction nozzle and the circuit board 5 using sensor light.
Furthermore, the electronic component mounting apparatus 1 is provided with a nozzle changer 16 for exchanging the suction nozzle according to the size and shape of the component to be sucked. A plurality of types of nozzles are stored and managed in the nozzle changer 16.

FIG. 2 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus 1.
The electronic component mounting apparatus 1 includes a controller 30 including a microcomputer including a CPU, a RAM, a ROM, and the like that control the entire apparatus. The controller 30 controls each of the components 31 to 35 shown below.
The vacuum mechanism 31 generates a vacuum, and generates a negative vacuum pressure at each suction nozzle via a vacuum switch (not shown).

The X-axis motor 32 is a drive source for moving the mounting head 12 in the X-axis direction along the X-axis gantry 13, and the Y-axis motor 33 is the Y-axis gantry 13 along the Y-axis gantry 14. It is a drive source for moving in the direction. When the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33, the mounting head 12 can move in the XY directions.
The Z-axis motor 34 is a drive source for raising and lowering each suction nozzle in the Z direction. Although only one Z-axis motor 34 is shown here, the number of suction nozzles is actually provided. The θ-axis motor 35 is a drive source for rotating the suction nozzle around the Z axis.

Further, the controller 30 executes the component mounting process shown in FIG. 3 to perform the electronic component suction operation and mounting operation.
First, in step S <b> 1, the controller 30 transports the circuit board 5 in the X direction by the transport rail 11 by driving the transport motor.
Next, in step S2, the controller 30 stops the circuit board 5 at the positioning portion (component mounting position) on which the electronic component is mounted, and proceeds to step S3.
In step S3, the controller 30 fixes the circuit board 5 at the component mounting position. A backup device having a backup table in which a plurality of backup pins are erected is disposed below the circuit board 5 at the component mounting position. In step S3, the backup table is raised and the circuit board 5 is supported from the lower surface by the tip of the backup pin. A detailed configuration of the backup pin in the present embodiment will be described later.

  Next, in step S <b> 4, the controller 30 drives the X-axis motor 32 and the Y-axis motor 33 to move the mounting head 12 to the component supply position of the electronic component supply device 15. Then, the Z-axis motor 34 is driven to lower the suction nozzle and suck the electronic component. When the suction nozzle is lowered, the suction nozzle is lowered at the first acceleration until the tip of the suction nozzle reaches a position a predetermined distance (for example, 2 mm) from the component supply position. The suction nozzle is lowered at a second acceleration slower than the first acceleration by the predetermined distance.

Next, in step S5, the controller 30 images the electronic component sucked by the suction nozzle by the recognition camera 21, and performs component recognition (part presence / absence, component verification). If the component recognition result is NG, the process proceeds to step S6, and after the suction component is discarded or protected, the process proceeds to step S4. On the other hand, if the component recognition result is OK, the process proceeds to step S7.
In step S <b> 7, the controller 30 drives the X-axis motor 32 and the Y-axis motor 33 to move the mounting head 12 to the suction component mounting point on the circuit board 5. At this time, the mounting coordinates (X, Y) and mounting angle (θ) are corrected based on the deviation amount of the component center with respect to the head rotation center at the time of component suction calculated based on the component recognition result.

  Next, in step S <b> 8, the controller 30 drives the Z-axis motor 34 to lower the suction nozzle, and mounts the electronic component on the circuit board 5. When the suction nozzle is lowered, the suction nozzle is lowered at the first acceleration until the lower surface of the sucked electronic component reaches a position above the upper surface of the circuit board 5 by a predetermined distance (for example, 2 mm) as in the case of the component suction described above. Then, after stopping the lowering of the suction nozzle, the suction nozzle is lowered again at a second acceleration slower than the first acceleration by the predetermined distance. In this way, the suction nozzle is lowered at two stages of acceleration to mount the electronic component.

Next, in step S9, the controller 30 releases the fixing of the circuit board 5 at the component mounting position. That is, the backup table is lowered and the support of the circuit board 5 by the backup pins is released.
In step S10, the controller 30 drives the conveyance motor to carry out the circuit board 5 by the conveyance rail 11, and ends the component mounting process.

Next, a specific configuration of the backup pin in the present embodiment will be described.
4A and 4B are diagrams showing the configuration of the backup pin, where FIG. 4A is a front view and FIG. 4B is a side view.
In the figure, reference numeral 40 denotes a backup pin in the present embodiment. The backup pin 40 includes a pair of clinch guides (support members) 41 that extend in the vertical direction and support the lower surface of the circuit board 5 at the upper end of the component when the components are mounted. The pair of clinch guides 41 are arranged to face each other in the left-right direction in FIG. 4A, and the lower ends thereof are connected to the guide flange 42 at a predetermined interval. Here, each clinch guide 41 rotates about the guide flange 42 around a shaft 43 extending in the direction perpendicular to the paper surface in FIG. Connect movably. At that time, the clinch guide 41 is tightly attached to the guide flange 42 by caulking or the like.
Thereby, as shown to Fig.5 (a)-(c), the space | interval (alpha) of the upper end part of the clinch guide 41 can be made variable. In this way, the opening and closing mechanism of the clinch guide 41 is realized by the guide flange 42 and the shaft 43.

Furthermore, a lead guide groove 41 a is formed at the upper end of each clinch guide 41 on the side surface opposite to the arrangement side of the opposing clinch guide 41. The lead guide groove 41a has a constant groove width in the extending direction, and the bottom surface of the lead guide groove 41a is an inclined surface inclined with respect to the horizontal plane.
Each clinch guide 41 supports the lower surface of the circuit board 5 by the upper surface 41b shown in FIG. Here, the upper surface 41b of the clinch guide 41 is a horizontal surface.

FIG. 7 is a view showing the shape of the lead guide groove 41a. As shown in FIG. 7, the inclined surface formed by the lead guide groove 41a is composed of two inclined surfaces having different inclination angles with respect to the horizontal plane. That is, the inclination angle of the inclined surface changes at a point P halfway in the vertical direction, the inclination angle of the upper inclined surface QP is gentle (inclination angle = θ1), and the lower inclined surface The inclination angle of PR is steep (inclination angle = θ1 + θ2). The angles θ1 and θ2 are, for example, θ1 = 30 ° and θ2 = 30 °.
In FIG. 7, point Q is the upper end portion of the bottom surface (inclined surface) of the lead guide groove 41a, and point R is the lower end portion of the bottom surface (inclined surface) of the lead guide groove 41a.

  Returning to FIG. 4, the guide flange 42 is screwed onto a screw shaft 44 extending in the vertical direction, and the height position thereof can be adjusted. Further, a nut 45 is also screwed onto the screw shaft 44 below the guide flange 42 so that the height position of the guide flange 42 can be locked by a double nut method. The lower end of the screw shaft 44 is fixed to a base 46 installed on the backup table. Thus, the guide flange 43, the screw shaft 44, and the nut 45 realize a height adjusting mechanism (height adjusting means) of the clinch guide 41.

When the backup pin 40 is erected on the backup table, as shown in FIGS. 5A to 5C, the height of the backup pin 40 (from the bottom surface of the base 46 to the tip of the clinch guide 41). Is adjusted so as to be always constant irrespective of the interval α (the distance between the points Q shown in FIG. 7) of the upper end portion of the clinch guide 41.
The arrangement position of the backup pins 40 on the backup table is determined in advance based on the type (substrate mounting pattern) of the circuit board 5. Therefore, before starting the component mounting process, a layout diagram showing the layout positions of the backup pins 40 is pasted on the backup table 50 in accordance with the board mounting pattern, and the backup pins 40 are arranged according to the layout diagrams. To.
The backup pin 40 is erected on the backup table 50 by being attracted to the backup table 50 with a magnet or inserted into a hole provided in the backup table 50.

  FIG. 8 is a diagram illustrating an arrangement example of the backup pins 40. As shown in FIG. 8, a plurality of backup pins 40 are arranged on the backup table 50. At this time, the backup pin 40 is always arranged at a position corresponding to the mounting point of the insertion mounting type lead component 20 as shown in FIG. In other regions, the backup pin 40 in a state where the upper end portion of the clinch guide 41 is closed is appropriately arranged at a position where the circuit board 5 can be supported so as not to bend when components are mounted.

  The lead component 20 includes lead terminals 20a that protrude downward from the lower surface, one on each side. A plurality of insertion holes for inserting the leads 20a of the lead component 20 are formed in the circuit board 5. When the lead component 20 is mounted on the circuit board 5, first, the insertion holes of the circuit board 5 are formed. The lead 20 a is inserted from above, and the lead 20 a is protruded from the lower surface of the circuit board 5. Then, the lead component 20 is fixed to the circuit board 5 by performing a clinching process for bending the leads 20 a on the lower surface of the circuit board 5.

In this embodiment, when the backup pin 40 is disposed at a position corresponding to the mounting point of the lead component 20, the positional relationship between the insertion hole of the lead 20a and the clinch guide 41 is set to the relationship shown in FIG. 9A is a plan view, and FIG. 9B is a front sectional view. Here, the tip of the backup pin 40 is shown in a simplified manner.
As shown in FIG. 9, the backup pin 40 arranged at a position corresponding to the mounting point of the lead component 20 has a tip diameter A (a distance α between the upper ends of the clinch guide 41) of the lead 20 a of the lead component 20. The opening degree of the clinch guide 41 is adjusted by an opening / closing mechanism so as to be smaller than the center-to-center distance B of the insertion hole 5a for insertion. In the clinch guide 41, the outer diameter C of the backup pin 40 (the distance between the points R of each clinch guide 41) is larger than the sum D of the center distance B of the insertion holes 5a and the diameter of the insertion holes 5a. As such, its thickness is set.

  That is, as shown in FIG. 9B, in the front view, the position Q in the horizontal direction (the radial direction of the insertion hole 5a) of the upper end of the inclined surface is within the range of the insertion hole 5a and the insertion hole 5a. The position is shifted to the inside of the backup pin 40 from the center position. In front view, the position R in the horizontal direction (the radial direction of the insertion hole 5a) of the lower end portion of the inclined surface is outside the range of the insertion hole 5a and outside the backup pin 40 from the center position of the insertion hole 5a. It is in a shifted position.

Although not particularly illustrated, the center position in the horizontal direction (the radial direction of the insertion hole 5a) of the upper end portion of the inclined surface coincides with the center position of the insertion hole 5a in a side view. Further, the width of the upper end portion of the inclined surface (the groove width of the upper end portion of the lead guide groove 41a) is set to be equal to or larger than the diameter of the insertion hole 5a.
With this configuration, when the lead component 20 is mounted on the circuit board 5, when the lead 20a is inserted into the insertion hole 5a and the lead component 20 is lowered, the tip of the lead 20a is formed at the upper end of the backup pin 40. 10 is brought into contact with the inclined surface and bent along the inclined surface as shown in FIG. In this manner, the lead 20a can be clinched simultaneously with the mounting of the lead component 20 on the circuit board 5.

(Operation)
Next, a method of mounting the lead component 20 on the circuit board 5 in the present embodiment will be described with reference to FIG.
First, the mounting head 12 is moved, and the upper surface of the lead component 20 is sucked from the component supply device 15 by the suction nozzle. Then, after the component recognition by the recognition camera 21 is performed, the mounting head 12 is moved to the mounting point of the sucked lead component 20. At this time, as shown in FIG. 11A, the mounting head 12 is stopped at a position where the lead 20 a of the lead component 20 is directly above the insertion hole 5 a formed in the circuit board 5.

  Next, the suction nozzle of the mounting head 12 is lowered. At this time, as shown in FIG. 11B, the lead 20a is inserted into the insertion hole 5a. Since the tip diameter A (upper end space α) of the clinch guide 41 is set smaller than the center distance B of the insertion hole 5a, if the suction nozzle is further lowered from the state shown in FIG. As shown in FIG. 11C, the lower end portion of the lead 20 a comes into contact with the bottom surface of the lead guide groove 41 a formed at the upper end portion of the backup pin 40.

Since the bottom surface of the lead guide groove 41a is an inclined surface inclined with respect to the horizontal plane, when the suction nozzle is further lowered from the state shown in FIG. 11C, the lead 20a is caused by the pressure of the suction nozzle from the top surface of the lead component 20. As shown in FIG. 11 (d), the lower end of the folds along the shape of the lead guide groove 41a. Thereafter, as shown in FIG. 11E, the suction nozzle descends until the lower surface of the lead component 20 comes into contact with the upper surface of the circuit board 5 to release the suction of the lead component 20.
At this time, the angle of the tip of the lead 20a with respect to the horizontal plane is the angle θ1 of the upper inclined surface on the bottom surface of the lead guide groove 41a. Since the angle θ1 of the upper inclined surface is set to a relatively small angle, the lead component 20 cannot be removed from the circuit board 5 by clinching with the upper inclined surface.

  By the way, in this embodiment, the inclined surface formed by the bottom surface of the lead guide groove 41a is composed of two inclined surfaces having different inclination angles in the vertical direction. If the lower inclined surface with a relatively large inclination angle with respect to the horizontal plane is not provided, and the clinching process is performed only with the upper inclined surface with a relatively small inclination angle with respect to the horizontal plane, the tip of the lead 20a is below the insertion hole 5a. In the process of projecting, the tip portion does not spread outside the clinch guide 41, and there is a possibility that the clinching process is not performed appropriately.

  On the other hand, in the present embodiment, in the process in which the distal end portion of the lead 20a protrudes below the insertion hole 5a, the distal end portion can be released to the outside of the clinch guide 41 by the lower inclined surface. 20a can be expanded appropriately. At this time, since the lead 20a can be clinched while being guided by the side surface of the concave lead guide groove 41a, it is possible to suppress escape of the lead 20a in the width direction of the lead guide groove 41a during clinching.

When all the electronic components are mounted on the circuit board 5, the backup table is lowered, and the backup pins 40 are separated from the circuit board 5 as shown in FIG. After the support of the circuit board 5 by the backup device is released in this way, the circuit board 5 is unloaded from the electronic component mounting apparatus 1, and the lead 20a of the lead component 20 is completely fixed by reflow soldering or the like.
As described above, since the lead 20a of the lead component 20 is clinched when mounted on the circuit board 5, even if the circuit board 5 vibrates when the circuit board 5 is unloaded, no external force is directly applied to the lead component 20. As long as the lead 20a is inserted into the insertion hole 5a, the state can be maintained.

(effect)
Thus, in the above embodiment, an inclined surface that is inclined with respect to the horizontal plane is formed at the upper end portion of the backup pin that supports the circuit board from the back surface when the component is mounted, and this backup pin is at least directly below the mounting point of the lead component. To place. At this time, the position of the upper end portion of the inclined surface in the radial direction of the insertion hole of the lead formed on the circuit board is shifted to one side within the range of the insertion hole and the center position of the insertion hole. Arrange so that Furthermore, the position of the lower end portion of the inclined surface in the radial direction of the insertion hole is disposed so as to be out of the range of the insertion hole and shifted to the other side with respect to the center position of the insertion hole.

  Thereby, when the lead of the lead component protrudes from the lower surface of the insertion hole of the circuit board at the time of component mounting, the tip portion thereof can be brought into contact with the inclined surface. Therefore, by lowering the lead component from this state, the tip end portion of the lead terminal can be bent along the inclined surface. In this way, the lead terminals are clinched at the same time as the components are mounted, making it difficult for the lead terminals to be removed from the insertion holes of the board. Therefore, even if the board vibrates during unloading after mounting the components, the state in which the lead parts are mounted on the board can be maintained.

Further, since the backup pin has a lead clinching function, it is not necessary to newly install a dedicated machine for the clinching process, and the space for that can be reduced. In addition, since the backup pin can be used without being limited to the clinching function, it can be used as a normal substrate support pin if it is disposed other than just below the mounting point of the lead component.
Furthermore, a lead guide groove extending in the vertical direction is provided at the upper end of the clinch guide, and the inclined surface is constituted by the bottom surface of the lead guide groove. Appropriate clinching can be performed.

  In addition, the inclined surface is composed of two inclined surfaces with different inclination angles with respect to the horizontal plane, and the angle of the upper inclined surface is set smaller than the angle of the lower inclined surface. In the process in which the tip portion protrudes below the insertion hole, the lead tip portion can be released in the clinch direction by the lower inclined surface. Therefore, the lead terminal can be bent smoothly. Further, since the angle of the lead terminal after the clinching process can be set to a relatively small angle of the upper inclined surface, the lead component after the clinching process can be stably fixed to the circuit board.

In addition, since the opening / closing mechanism capable of adjusting the opening degree of the upper end portion of the clinch guide is provided, it is possible to cope with a clinching process of a plurality of lead parts having different lead pitches with one type of backup pin. At this time, since the lower ends of the pair of clinch guides are rotatably connected to the guide flange, the above opening / closing mechanism can be realized with a relatively simple configuration.
Furthermore, since the clinch guide height adjustment mechanism is provided, the height of the plurality of backup pins can be made constant regardless of the opening degree of the upper end portion of the clinch guide, and the circuit board can be stably supported. it can. At this time, by locking the height position of the clinch guide by the double nut method, it is possible to withstand the height change during component mounting.

(Modification)
In the above embodiment, the case where only one lead guide groove 41a is provided in the clinch guide 41 has been described. However, as shown in FIG. 12, two lead guide grooves 41a may be provided. As a result, it is possible to correspond to a lead component having two leads on one side, instead of a lead component 20 having one lead 20a on one side as shown in FIG. Moreover, it is possible to cope with a lead component having two or more leads on one side by adjusting the number of leads, the interval between the grooves, the groove width, etc. according to the number of leads and the lead pitch. .

Furthermore, although the case where the groove width of the lead guide groove 41a is constant in the extending direction has been described in the above embodiment, as the distance from the distal end portion of the clinch guide 41 increases in the extending direction, as shown in FIG. The groove width may be narrowed. Thereby, the lead escape at the time of clinching can be suppressed more effectively.
Moreover, although the case where component recognition was performed using the recognition camera 21 was demonstrated in the said embodiment, the laser apparatus for components recognition can be provided in the mounting head 12, and component recognition can also be performed with the said laser device. In this case, the laser device includes a laser irradiation unit that irradiates laser light in the horizontal direction and a laser light receiving unit that receives the laser light irradiated by the laser irradiation unit.

FIGS. 14A and 14B are diagrams illustrating a state at the time of component recognition by the laser device, where FIG. 14A is a side view of the lead component 20 and FIG. 14B is a bottom view of the lead component 20. As shown in FIG. 14A, when the lead component 20 is recognized, the component recognition is performed with the suction nozzle moved to a position where the lead 20a is on the laser surface.
As a component recognition method using a laser, for example, the following method is used. First, the suction component is rotated while receiving the laser beam irradiated from the laser irradiation unit by the laser receiving unit, and a shadowed portion is stored for each predetermined rotation angle. When the rotation is completed, the part outline is drawn by the laser optical axis and shadow. By this method, as shown in FIG. 15, it is possible to recognize the X-direction dimension (distance X between the leads 20a) and the Y-direction dimension (diameter Y of the lead 20a) of the lead portion.

  Next, the component center position is calculated based on the outer shape recognition result of the lead portion, and the deviation amount of the component center with respect to the head rotation center (component suction center) stored in advance as a parameter is calculated. Here, as the amount of displacement, the amount of displacement in the X direction of the component center with respect to the head rotation center (dX), the amount of displacement in the Y direction of the component center with respect to the head rotation center (dY), and the angle of the component center with respect to the head rotation center. A deviation amount (dθ) is calculated. Then, using the calculated deviation amounts dX, dY, and dθ as the X direction correction value, the Y direction correction value, and the θ direction correction value, the position of the component mounting coordinates is corrected, and the component mounting is performed. Thereby, the lead component 20 can be mounted on the circuit board 5 at an appropriate angle at an appropriate position.

Furthermore, although the case where the leads 20a on both sides are clinched in opposite directions has been described in the above embodiment, the direction in which the leads 20a are clinched is not limited to this. That is, the surface of the clinch guide 41 on which the lead guide groove 41a is formed can be selected as appropriate.
Further, the rotation position is adjusted and maintained by attaching each lower end portion of the clinch guide 41 to the guide flange 42 by caulking. However, the rotation position may be adjusted and maintained by being able to be tightened or loosened with a screw or the like. .

  Moreover, in the said embodiment, although the case where an opening / closing mechanism was implement | achieved by connecting each lower end part of a pair of clinch guide 41 to the guide flange 42 rotatably was demonstrated, of the upper end part of a pair of clinch guide 41 The structure is not limited to this as long as the interval α is variable. Further, the case where the height adjusting mechanism is realized by screwing the guide flange 42 to the screw shaft 44 extending in the vertical direction has been described. However, if the structure of the clinch guide 41 is adjustable, It is not limited to.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus, 5 ... Circuit board, 5a ... Insertion hole, 11 ... Conveying rail, 12 ... Mounting head, 13 ... X-axis gantry, 14 ... Y-axis gantry, 15 ... Component supply apparatus, 16 ... Nozzle exchange machine, DESCRIPTION OF SYMBOLS 20 ... Lead component, 20a ... Lead, 30 ... Controller, 31 ... Vacuum mechanism, 32 ... X-axis motor, 33 ... Y-axis motor, 34 ... Z-axis motor, 35 ... θ-axis motor, 40 ... Backup pin, 41 ... Clinch Guide (support member), 41a ... lead guide groove, 41b ... horizontal plane, 42 ... guide flange (connection member), 43 ... shaft, 44 ... screw shaft, 45 ... nut, 46 ... base, 50 ... backup table

Claims (7)

An electronic component mounting apparatus that sucks an electronic component by a suction nozzle and mounts the electronic component on a predetermined mounting point on a substrate positioned at a component mounting position.
A support member is provided directly below the mounting point of an insertion mounting type electronic component that mounts by inserting a lead terminal protruding downward into an insertion hole formed in the substrate from above and mounting the electronic component. With a backup pin,
The support member includes an inclined surface inclined with respect to a horizontal plane at an upper end portion thereof, and a position of an upper end portion of the inclined surface in a radial direction of the insertion hole is within the range of the insertion hole and the insertion hole. The position is shifted to one side with respect to the center position, and the position of the lower end portion of the inclined surface in the radial direction of the insertion hole is outside the range of the insertion hole and the other position with respect to the center position of the insertion hole. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is arranged so as to be shifted to a position on the side.   The electronic component mounting apparatus according to claim 1, wherein the support member includes a concave lead guide groove at an upper end portion thereof, and the inclined surface is formed by a bottom surface of the lead guide groove. The insertion mounting type electronic component includes a lead group in which a plurality of lead terminals are arranged at a predetermined lead pitch in the same direction,
The electronic component mounting apparatus according to claim 2, wherein the support member includes a plurality of the lead guide grooves corresponding to the number of the lead terminals belonging to the lead group and the lead pitch. The inclined surface is composed of two inclined surfaces whose inclination angles with respect to a horizontal plane are different up and down,
The electronic component according to any one of claims 1 to 3, wherein an inclination angle of the upper inclined surface with respect to a horizontal plane is set smaller than an inclination angle of the lower inclined surface with respect to the horizontal plane. Mounting device.   The backup pin includes a pair of support members arranged to face each other, and a connecting member that connects the pair of support members so that a distance between upper end portions in a facing direction of the pair of support members can be changed. The electronic component mounting apparatus according to claim 1, wherein: The connecting member is configured to connect the respective lower end portions of the pair of support members so as to be rotatable around an axis orthogonal to the facing direction and the vertical direction, respectively.
The electronic component mounting apparatus according to claim 5, wherein the backup pin further includes a height adjusting unit capable of adjusting a height position of the connecting member.   The electronic component mounting apparatus according to claim 6, wherein the height adjusting unit includes a screw shaft that extends in a vertical direction and is screwed with the connecting member.

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