JP2008198950A - Head position adjusting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a head position adjusting method for highly accurately controlling a mounting position of a component mounted to an electronic circuit board. <P>SOLUTION: A prescribed site (A) of a prescribed component 130 installed at a prescribed height position is recognized by a camera part so as to acquire a gravity-center position of the prescribed component 130. The prescribed component 130 is sucked while operating a component mounting part so as to suck the gravity-center position of the prescribed component. The prescribed component 130 is rotated by a prescribed angle after suction. Then, the prescribed component 130 is installed again at the prescribed height position. The prescribed site (A) of the prescribed component 130 is recognized by the camera part so as to acquire again the gravity-center position of the prescribed component 130. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for adjusting the head position of a component mounting apparatus for mounting an electronic component or the like on an electronic circuit board, and more specifically, a coordinate system of a board imaging camera for recognizing a reference mark and an electronic circuit board of the component mounting apparatus, The present invention relates to a head position adjusting method capable of easily and accurately matching a coordinate system of a component mounting portion including a head on which an electronic component or the like is mounted.

  FIG. 1 is a plan view showing a schematic configuration of an example of a current component mounting apparatus.

  The component mounting apparatus 100 includes a head unit 102 on which a nozzle for adsorbing components can be mounted, an XY drive unit 104 that can move the head unit 102 in a plane direction (XY direction), and a component 105 (see FIG. 4). A component supply unit 106 to be supplied, a substrate transfer unit 108 that carries in and out the electronic circuit board 108A, and a nozzle replacement unit 110 are provided, and their positions and axial operations are based on the reference mark 112 as a reference point. It is defined in the coordinate system.

  FIG. 2 is a perspective view showing the head unit 102. The head unit 102 includes a camera unit 114 and a component mounting unit 116. The head unit 102 is connected and fixed to the XY driving unit 104 and can be moved in the plane direction (XY direction) by the XY driving unit 104.

  The camera unit 114 captures the reference mark 112 to set the coordinate system, images the electronic circuit board 108A and the component supply unit 106, confirms the mounting position and the suction position, performs teaching, and performs mounting and suction. For positioning.

  FIG. 3 is a diagram showing an outline of the component mounting unit 116.

  The component mounting unit 116 includes a nozzle 118 that can move in the vertical direction. The nozzle 118 can rotate about its axis. The component mounting unit 116 sucks the component by the nozzle 118 and mounts the component 105 on the electronic circuit board 108A.

  One end of the shaft 120 is connected to a vacuum generator (not shown), and the nozzle 118 is attached to the other end. The shaft 120 can be moved in the vertical direction by the Z-axis motor 122, and the shaft 120 can be rotated around the axis by the θ-axis rotation motor 124. In addition, the component mounting unit 116 is provided with a component recognition device 126 that detects the position of the component 105 sucked by the nozzle 118 by emitting laser light in the horizontal direction.

  FIG. 4 is an enlarged perspective view showing the component recognition device 126. The component 105 is positioned in the laser beam R emitted from the light emitting unit 126A in the horizontal direction, the nozzle 118 is rotated about its axis, and the projected laser beam R is received by the light receiving unit 126B. Thereby, the positioning of the component 105 adsorbed by the nozzle 118 in the plane direction (XY direction) and the rotation direction is performed.

  The operation of the component mounting apparatus 100 will be described. First, the coordinate system is set by recognizing the reference mark 112 by the camera unit 114 included in the head unit 102. The head unit 102 is positioned on the component supply unit 106 by the XY driving unit 104 using the set coordinate system. Thereafter, the shaft 120 of the component mounting portion 116 is lowered and the lower end of the nozzle 118 is lowered to a predetermined position. Then, the vacuum generator is operated and the component 105 is sucked by the nozzle 118.

  The position of the component sucked by the nozzle 118 is measured by the component recognition device 126, and the control unit 128 (see FIG. 6) drives the θ-axis rotation motor 124 based on the result, and the component 105 sucked by the nozzle 118. Correct the posture.

  Thereafter, the XY driving unit 104 positions the head unit 102 on the electronic circuit board 108A. Then, after the shaft 120 of the component mounting portion 116 is lowered by the Z-axis motor 122 and the lower end of the nozzle 118 is lowered to a predetermined position, the vacuum generator is stopped and the suction is released to release the component 105 from the nozzle 118. Then, the component 105 is mounted on the electronic circuit board 108A.

  Here, the mounting accuracy of the component 105 includes a coordinate system set by recognizing the reference mark 112 by the camera unit 114 (hereinafter referred to as a reference coordinate system) and a coordinate system of the component mounting unit 116 (hereinafter referred to as component mounting). It is greatly influenced by how much the coordinate system (denoted as a partial coordinate system) matches.

  How exactly the reference coordinate system and the component mounting unit coordinate system are matched is how accurately the assembly error value between the camera unit 114 and the component mounting unit 116 (hereinafter referred to as a head offset) can be obtained. It depends on.

  The conventional adjustment method is performed as follows.

  The center of gravity of the jig component 130 (see FIG. 5) installed at the height position of the electronic circuit board 108A is recognized by the camera unit 114, and based on the difference between the center position of the camera image and the center of gravity of the jig component 130. The component mounting portion 116 moves to the position of the center of gravity of the jig component 130, and the jig component 130 is sucked by the nozzle 118. However, since the nozzle 118 has an assembly error with the camera unit 114, the nozzle 118 does not accurately adsorb the position of the center of gravity of the jig component 130.

  Next, the shaft 120 is moved up, the jig part 130 sucked by the nozzle 118 is recognized by the part recognition device 126, and the center of gravity position of the jig part 130 is detected based on the recognition result. The head offset can be acquired from the difference between the detected center of gravity of the jig component 130 and the center position of the nozzle 118 acquired in advance, and based on this head offset, the reference coordinate system and the component mounting portion coordinates Make adjustments with the system.

  However, even if the component is mounted on the electronic circuit board by adjusting the reference coordinate system and the component mounting unit coordinate system based on the head offset obtained by the conventional method as described above, the mounting position is shifted. There was a thing.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a head position adjusting method capable of controlling the mounting position of a component mounted on an electronic circuit board with high accuracy.

  As a result of earnest research to solve the above problems, the inventor may find that the position of the center of gravity of the jig component 130 detected by the camera unit 114 is different from the position of the center of gravity of the jig component 130 detected by the component recognition device 126. I found out.

  This is because there are two devices that recognize the jig component 130, and one of the recognition methods by these two devices is that the jig is based on image data obtained by imaging the jig component 130 from above. It is a method for recognizing the part 130, and the other is a method for recognizing the jig part 130 based on the projection shape (light / dark data) obtained by irradiating the laser from the side of the jig part 130. The present inventor thought that there was a difference.

  Here, as an example of a jig component, the case of using a jig component 130 that is rectangular as shown in FIG. 5 and has two through holes 130A on one diagonal line, the cause is as follows: Further description will be given based on the shape of the jig component 130.

  When detecting the position of the center of gravity of the jig component 130 based on the image data obtained by imaging the jig component 130 from above with the camera unit 114, the position of the center of gravity of the jig component 130 based on the positions of the two through holes. Is detected.

  On the other hand, when the position of the center of gravity of the jig component 130 is detected based on the projection shape (light / dark data) obtained by irradiating the side of the jig component 130 with the component recognition device 126, the jig The position of the center of gravity of the jig component 130 is detected based on the outer shape of the component 130.

  As described above, the part (two through holes opened on one diagonal line) of the jig part 130 used when the camera unit 114 detects the position of the center of gravity of the jig part 130, and the part recognition device 126 uses the jig. Since the part (outer shape) of the jig part 130 used for detecting the position of the center of gravity of the part 130 is different, the center of gravity of the jig part 130 detected by the camera unit 114 is determined depending on the processing accuracy of the jig part 130. It is considered that the position and the position of the center of gravity of the jig component 130 detected by the component recognition device 126 are different.

  Therefore, the present inventor considered that the above-mentioned problem could be solved by using a single method for detecting the position of the center of gravity of the jig component 130, and thus proceeded with research and development and led to the present invention.

  That is, the head position adjusting method according to the present invention is a head position adjusting method for a component mounting apparatus provided with a camera unit capable of recognizing an object and a head having a component mounting unit for mounting a component on a substrate. The camera unit recognizes a predetermined part of a predetermined part installed at a height position of the camera, acquires the position of the center of gravity of the predetermined part, and operates the part mounting unit so as to attract the position of the center of gravity. The component is adsorbed, the predetermined component is rotated by a predetermined angle after the adsorption, and then the predetermined component is re-installed at the predetermined height position and the predetermined part of the predetermined component is recognized by the camera unit. The center-of-gravity position of the predetermined part is acquired again.

  The predetermined angle is rotated a plurality of times, and each time the rotation is performed, the predetermined part is re-installed at the predetermined height position, the predetermined part of the predetermined part is recognized by the camera unit, and the center of gravity of the predetermined part is obtained. It is also preferable to acquire the position a plurality of times, so that the head position can be adjusted with higher accuracy.

  According to the head position adjusting method of the present invention, there is one device (camera unit mounted on the head unit) used for detecting the center of gravity position of the jig component, and the detection method is the same. The offset can be acquired with high accuracy.

  Further, according to the head position adjusting method of the present invention, the head offset can be calculated simply by imaging the jig part before rotation and the jig part after rotation with the camera part mounted on the head part. It can be easily acquired in a short time.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 6 is a block diagram when an example of the embodiment of the head position adjusting method according to the present invention is implemented.

  The control unit 128 includes a CPU 128A and a memory 128B. Data relating to the component 105 and the electronic circuit board 108 </ b> A can be input to the control unit 128 by the data input unit 132, and the control unit 128 can exchange data with the storage device 134.

  The control unit 128 controls the XY driving unit 104 by the X-axis motor 136 having the encoder 136A and the Y-axis motor 138 having the encoder 138A, and the head unit 102 (camera unit 114 and component mounting unit 116) is planar. Move in the direction (XY direction). Further, the position of the nozzle 118 in the vertical direction (Z direction) is controlled by the Z-axis motor 122 incorporating the encoder 122A, and the position of the nozzle 118 in the rotational direction around the axis is controlled by the θ-axis motor 124 incorporating the encoder 124A. Control.

  Image data picked up by the camera unit 114 is sent to the image processing device 140 for data processing. The image processing apparatus 140 includes an A / D converter 140A, a CPU 140B, and a memory 140C. The image data can be displayed on the display device 142.

  Next, the flow until the head offset is acquired will be described with reference to the flowchart of FIG.

(1) The jig component 130 is placed at a reference height position (a position where the height position of the surface of the jig component 130 is the same height as the surface of the electronic circuit board 108A) (step S1), and the camera unit 114 is cured. The jig part 130 is moved upward (step S2), the jig part 130 is recognized by the camera unit 114 (step S3), and the center of gravity position of the jig part 130 is obtained from the obtained image (step S4). Then, the difference between the center position of the camera image and the center of gravity position of the jig component 130 is obtained (step S5).

(2) Based on the difference between the center position of the camera image and the position of the center of gravity of the jig component 130, the position of the component mounting portion 116 in the plane direction (XY direction) is adjusted, and the center of the nozzle 118 is the center of gravity of the jig component 130. (Step S6). However, since the nozzle 118 has an assembly error with the camera unit 114, the center position of the nozzle 118 is not exactly located immediately above the position of the center of gravity of the jig component 130.

  Next, the jig component 130 is sucked by the nozzle 118, and the jig component 130 is pulled up (step S7). Then, after rotating the nozzle 118 by 180 degrees (step S8), the nozzle 118 is lowered and the jig component 130 is placed at the reference height position (step S9).

(3) The camera unit 114 is moved to the position where the jig component 130 is first recognized (position in step S2) (step S10), the jig component 130 is recognized again (step S11), and the obtained image From this, the center of gravity of the jig component 130 is obtained (step S12).

FIG. 8 shows a state in which the jig component 130 is first installed at the reference height position (step S1 state), and after the nozzle 118 is rotated 180 degrees after suction by the nozzle 118, the jig component 130 is moved to the reference height position. It is a figure which shows the state (state of step S9) made to mount. O ₀ (X ₀ , Y ₀ ) is the position of the center of gravity of the jig component 130 in the state of step S1, and A (X _A , Y _A ) is the value when the nozzle 118 actually sucks the jig component 130. O ₁ (X ₁ , Y ₁ ) is the center position of the nozzle 118, and the jig part 130 is rotated 180 degrees around the point A (X _A , Y _A ), so that the jig part 130 is at the reference height. This is the position of the center of gravity of the jig component 130 in the state of being placed at the position (state of step S9).

Vector O ₀ A corresponds to the head offset. Since the vector O ₀ O ₁ corresponds to twice the head offset (vector O ₀ A), the head offset can be obtained by reducing the vector O ₀ O ₁ by half (step S13) (step S13). Step S14).

  In the above description, the rotation angle of the jig component 130 is 180 degrees. However, the rotation angle of the jig component 130 is not limited to 180 degrees, and each time the jig component 130 is rotated and rotated several times at another angle, the jig component 130 is rotated. It is also possible to acquire the position of the center of gravity of the component 130 and further improve the accuracy, and for example, it may be rotated four times at 90 degrees. However, if the rotation angle is 180 degrees, the calculation process becomes easy.

  Here, the rotation angle is controlled by the control unit 128 via the component mounting unit 116. The image data is processed by the image processing device 140, the head offset is calculated by the image processing device 140, the calculation result is sent to the control unit 128, and adjustment between the reference coordinate system and the component mounting unit coordinate system is performed. Made.

  As described above, in the head position adjusting method of the present invention, there is one device (camera unit mounted on the head unit) used for detecting the center of gravity position of the jig component, and the detection method is also the same. Therefore, the head offset can be obtained with high accuracy. In addition, since the head offset can be calculated simply by imaging the jig part before rotation and the jig part after rotation with the camera unit mounted on the head unit, the head offset can be easily acquired in a short time.

The top view which shows schematic structure of an example of the present component mounting apparatus The perspective view which shows the head part of the said component mounting apparatus The figure which shows the outline | summary of the component mounting part of the said head part. The perspective view which expands and shows the components recognition apparatus of the said components mounting part Perspective view showing jig parts A block diagram when carrying out an example of an embodiment of a head position adjusting method according to the present invention Flow chart showing the flow up to acquiring the head offset Schematic diagram showing the state of jig parts before and after rotation

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus 102 ... Head part 104 ... XY drive part 105 ... Component 106 ... Component supply part 108 ... Substrate conveyance part 110 ... Nozzle replacement part 112 ... Reference mark 114 ... Camera part 116 ... Component mounting part 118 ... Nozzle 120 ... Shaft 122 ... Z-axis motor 124 ... θ-axis motor 126 ... Part recognition device 128 ... Control unit 128A ... CPU
128B ... Memory 130 ... Jig parts 130A ... Through hole 132 ... Data input means 134 ... Storage device 136 ... X axis motor 138 ... Y axis motor 122A, 124A, 136A, 138A ... Encoder 140 ... Image processing device 140A ... A / D Converter 140B ... CPU
140C ... Memory 142 ... Display device

Claims (2)

A head position adjusting method for a component mounting apparatus provided with a camera unit capable of recognizing an object and a head having a component mounting unit for mounting a component on a substrate,
The camera unit recognizes a predetermined part of a predetermined part installed at a predetermined height position, acquires the position of the center of gravity of the predetermined part, and operates the part mounting unit so as to suck the position of the center of gravity. The predetermined part is sucked, and after the suction, the predetermined part is rotated by a predetermined angle, and then the predetermined part is re-installed at the predetermined height position and the predetermined part of the predetermined part is recognized by the camera unit. The head position adjusting method is characterized in that the position of the center of gravity of the predetermined part is acquired again.   The predetermined angle is rotated a plurality of times, and each time the rotation is performed, the predetermined part is re-installed at the predetermined height position, the predetermined part of the predetermined part is recognized by the camera unit, and the center of gravity of the predetermined part is obtained. The head position adjusting method according to claim 1, wherein the position is acquired a plurality of times.

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