JP6680473B2 - Insert component mounting method and insert component mounting apparatus - Google Patents

Description

  The present invention provides an insert component in which both the positioning projection and the lead project downward and the lower end of the lead projects below the lower end of the positioning projection, and a positioning hole for inserting the positioning projection and the insertion hole. The present invention relates to an insertion component mounting method and an insertion component mounting device which are mounted on a circuit board provided with a lead insertion hole for inserting a lead.

  For example, as described in Patent Document 1 (Japanese Unexamined Patent Publication No. 9-35782), Patent Document 2 (Japanese Unexamined Patent Publication No. 8-69838), and the like, the bonding strength of a large component such as a connector mounted on a circuit board. For the purpose of increasing the position of the circuit board, a plurality of parts are provided with positioning protrusions projecting downward, and the positioning protrusions are inserted into the positioning holes formed at a plurality of positions of the circuit board. There is one in which the above-mentioned components are positioned and mounted on a circuit board based on a plurality of positioning holes. Hereinafter, the component provided with the positioning protrusion is referred to as an "inserted component".

  Further, there is an insertion component in which a plurality of leads are arranged so as to project downward, and the plurality of leads are inserted into a plurality of lead insertion holes provided in a circuit board at the time of mounting. When mounting an insert component having such a configuration on a circuit board by a component mounter, the insert component supplied by a component feeder such as a tray feeder is picked up by a component holder (suction nozzle or chuck) of the component mounter. Then, in the middle of moving the circuit board upward, the insertion component is imaged from the lower surface side by a component imaging camera, and the captured image is processed to determine the position of the positioning protrusion of the insertion component. After recognizing and correcting the mounting position and angle deviation of the insertion component based on the recognition result and positioning the positioning protrusion of the insertion component at a position where it can be inserted into the positioning hole of the circuit board, By lowering the component holder that holds the insertion component, the positioning protrusion and the lead of the insertion component are simultaneously inserted into the positioning hole and the lead insertion hole of the circuit board.

JP-A-9-35782 JP-A-8-69838

  In general, the lead of the insertion part is formed of a thin metal of several hundreds μm to several mm, and therefore is easily deformed by an external force. Therefore, there is a possibility that the positional relationship between the positioning protrusion of the insert and the lead may deviate from the original positional relationship due to manufacturing variations of the insert and deformation of the lead due to external force.

  However, in the above-described conventional mounting method of the insertion component, the position of the positioning protrusion of the circuit board is image-recognized, and the positioning protrusion of the insertion component is positioned at a position where it can be inserted into the positioning hole of the circuit board. In this state, the component holder that holds the insertion component is lowered to insert both the positioning protrusion and the lead of the insertion component into the positioning hole and the lead insertion hole of the circuit board at the same time. There is a possibility that the lower ends of the leads may be displaced from the lead insertion holes of the circuit board and cannot be inserted due to variations in manufacturing of components or deformation of the leads.

  It should be noted that, with the lower end of the lead of the insertion part positioned at a position where it can be inserted into the lead insertion hole of the circuit board, the part holder for holding the insertion part is lowered, and the lead of the insertion part and the positioning projection part are lowered. It is possible to insert both of them into the lead insertion hole and the positioning hole of the circuit board at the same time, but in this case, the lower end of the positioning projection is removed from the positioning hole of the circuit board due to manufacturing variation of the insertion parts and deformation of the lead. There is a possibility that it cannot be inserted due to misalignment.

  Therefore, the problem to be solved by the present invention is to solve the problem that the positional relationship between the positioning protrusion of the insertion part and the lead is deviated from the original position due to manufacturing variation of the insertion part or deformation of the lead due to external force. However, as much as possible, it is possible to insert the positioning protrusions and leads of the insertion parts into the positioning holes and the lead insertion holes of the circuit board, and since it is not possible to insert, it is possible to reduce the number of insertion parts to be discarded. It is to be able to reduce the production cost.

  In general, in the insertion part provided so that both the positioning projection and the lead project downward, the lower end of the lead projects below the lower end of the positioning projection.

Paying attention to this point, the insertion component mounting method according to claim 1, (1) a component holding step of holding the supplied insertion component in a component holder, and (2) the step of holding the component holder in the component holder. The lower end of the positioning protrusion of the insertion part and the lower end of the lead are separately imaged from below by a component imaging camera, and the captured image is processed, whereby the position of the lower end of the positioning protrusion and the lead An image processing step of recognizing the position of the lower end, and (3) lead positioning for positioning the position of the lower end of the lead of the insertion component held in the component holder at a position insertable into the lead insertion hole of the circuit board. And (4) the component holder holding the insertion component is lowered to slightly insert the lower end of the lead into the lead insertion hole of the circuit board so that the lower end of the positioning protrusion is the circuit board. of A temporary insertion step in which the descending operation of the component holder is temporarily stopped before reaching the surface; and (5) the lower end of the lead of the insertion component is slightly inserted into the lead insertion hole of the circuit board. Positioning protrusion for positioning the lower end of the positioning protrusion of the insertion component at a position where it can be inserted into the positioning hole of the circuit board while moving the component holder in the horizontal direction to deform the lead. And (6) restarting the descending operation of the component holder that holds the insertion component to insert the positioning protrusion of the insertion component into the positioning hole of the circuit board, and at the same time to install the lead. an insertion component mounting method including the present insertion step of inserting into the lead insertion hole of the circuit board, in the image processing step, the insertion from below the component imaging camera Emits laser light in the horizontal direction as the illumination light source of imaging separately lower ends with the lead of the projecting portions for positioning of the goods, using the four laser light sources which is assembled at 90 ° intervals, the lead When recognizing the position of the lower end of the, the inserted component held in the component holder is lowered until the height of the lower end of the lead reaches the same height as the optical axis of the laser light source. The laser light radiated in the horizontal direction from the laser light source is applied to the outer peripheral surface of the lower end portion of the lead, an image including the lower end of the lead is captured from below by the component imaging camera, and the captured image is processed. By recognizing the position of the lower end of the lead by doing, on the other hand, when recognizing the position of the lower end of the positioning protrusion, the insertion component held in the component holder is the lower end of the positioning protrusion. In a state where the height position is lowered to the same height position as the optical axis of the laser light source, the laser light horizontally emitted from the laser light source is applied to the outer peripheral surface of the lower end portion of the positioning protrusion. A component image capturing camera captures an image including the lower end of the positioning protrusion from below , and the captured image is processed to recognize the position of the lower end of the positioning protrusion. Is.

In short, in the insert component mounting method of the present invention, after the image recognition of the position of the lower end of the positioning protrusion of the insert component held by the component holder and the position of the lower end of the lead, the position of the lower end of the lead of the insert component is determined by the circuit. Before positioning the lower end of the positioning protrusion to the position where it can be inserted into the lead insertion hole of the board and slightly inserting the lower end of the lead into the lead insertion hole of the circuit board, reach the surface of the circuit board. The lowering operation is temporarily stopped, and in this state, the position of the lower end of the positioning protrusion can be inserted into the positioning hole of the circuit board while the component holder holding the insertion component is moved in the horizontal direction to deform the leads. After positioning to the position, the lowering operation of the component holder is restarted to insert the positioning protrusion of the inserted component into the positioning hole of the circuit board and at the same time insert the lead into the lead insertion hole of the circuit board. Therefore, even if the positional relationship between the lead and the positioning protrusion of the insertion part deviates from the original position due to manufacturing variation of the insertion part or deformation of the lead due to external force, as much as possible, The positioning protrusion and the lead of the insertion part can be inserted into the positioning hole and the lead insertion hole of the circuit board, and the number of insertion parts to be discarded because they cannot be inserted can be reduced, and the production cost can be reduced accordingly.
By the way, in the illumination of the coaxial epi-illumination light source which is generally used as the illumination light source of the component imaging camera, the position of the lower end of the lead of the insertion component and the position of the lower end of the positioning protrusion are accurately recognized from the image captured by the component imaging camera. Difficult to do. Therefore, as the illumination light source when the lower end of the positioning protrusion of the insertion part and the lower end of the lead are imaged by the component imaging camera, four laser light sources that horizontally emit laser light at 90 ° intervals to the imaging target. However, since the lower end of the lead projects below the lower end of the positioning projection, the lower end of the lead and the lower end of the positioning projection cannot be simultaneously image-recognized by the illumination of the laser light source.
Therefore, in the present invention, image recognition of the position of the lower end of the lead and the position of the lower end of the positioning protrusion is separately performed as follows. When recognizing the position of the lower end of the lead, the insertion part held in the component holder is lowered until the height position of the lower end part of the lead becomes the same height position as the optical axis of the laser light source. By irradiating the outer peripheral surface of the lower end of the lead of the insertion part with laser light radiated in the horizontal direction from the light source, and capturing an image including the lower end of the lead from below by the component imaging camera, the image of the lower end of the lead can be obtained from the image. Recognize position. On the other hand, when recognizing the position of the lower end of the positioning protrusion, the height position of the lower end of the positioning protrusion of the insertion component held in the component holder is the same as the optical axis of the laser light source. In the state in which the laser light source is horizontally radiated, the outer peripheral surface of the lower end portion of the positioning protrusion of the insertion part is irradiated with the laser light emitted from the laser light source, and the lower end of the positioning protrusion is included from below by the component imaging camera. By capturing an image, the position of the lower end of the positioning protrusion is recognized from the image.

  According to a second aspect of the present invention, the reference mark of the circuit board is picked up by a board image pickup camera and the picked-up image is processed to recognize the position of the reference mark, and the reference mark is provided by the manufacturer of the circuit board. The position of the circuit board positioning hole and the position of the lead insertion hole based on the reference mark position using the specified specification data (position data of the positioning hole or lead based on the position of the reference mark of the circuit board) Data may be acquired. In this case, it is only necessary to image-recognize the position of the reference mark on the circuit board, and the image recognition of the position of the reference mark is performed to determine the component mounting position on the circuit board in the component mounter before component mounting. Therefore, the image recognition result may be used as it is, and it is not necessary to newly add image recognition processing.

  Alternatively, as described in claim 3, the positioning hole of the circuit board and the lead insertion hole are imaged separately or simultaneously by the board imaging camera, and the imaged image is processed to thereby position the positioning hole of the circuit board. The position of the lead insertion hole may be recognized. By doing so, even if there are variations in the positions of the positioning holes and the lead insertion holes due to variations in the manufacturing of the circuit board, it is possible to image-recognize the variations in the positions of the positioning holes and the lead insertion holes of the circuit board. It is also possible to deal with variations in the positions of the holes and the lead insertion holes. As a result, even if the positional relationship between the positioning hole of the circuit board and the lead insertion hole deviates from the original positional relationship due to variations in manufacturing of the circuit board, etc. Can be inserted into the positioning hole and the lead insertion hole of the circuit board.

  By the way, if the positional relationship between the lower end of the positioning protrusion of the insert part and the lower end of the lead does not deviate from the original positional relationship, the insert part can be mounted on the circuit board by the same mounting method as the conventional one. is there.

  Therefore, as in claim 4, the positional relationship between the lower end of the positioning protrusion of the insertion part and the lower end of the lead recognized in the image processing step is the positional relationship between the positioning hole of the circuit board and the lead insertion hole. It is determined whether or not, and only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, the positioning protrusion positioning step and the main insertion step are executed, When it is determined that the positional relationship between the two is the same, the lower end of the positioning protrusion of the insertion part and the lower end of the lead are simultaneously positioned at positions that can be inserted into the positioning hole of the circuit board and the lead insertion hole, and then inserted. The positioning protrusion of the component and the lead may be simultaneously inserted into the positioning hole and the lead insertion hole of the circuit board. With this configuration, when the positional relationship between the lower end of the positioning protrusion of the insertion part and the lower end of the lead of the image-recognized insert part matches the positional relationship between the positioning hole of the circuit board and the lead insertion hole. In the same manner as in the past, in both the positioning step and the insertion step, it is possible to simultaneously insert both the positioning protrusion of the insertion part and the lead into the positioning hole and the lead insertion hole of the circuit board. The number can be reduced, and the cycle time for mounting the insertion parts on the circuit board can be shortened.

  In general, a plurality of leads are provided in a row in the insert component, and correspondingly, a plurality of lead insertion holes are provided in the circuit board in a row, so that the positions of the lower ends of the leads of the insert component are However, if the deformation direction and the amount of deformation deviate from the original position for each lead, the lower ends of the plurality of leads may not be inserted into the plurality of lead insertion holes of the circuit board. Therefore, as in claim 5, the positions of the lower ends of the plurality of leads of the image-recognized insert component are deviated from the original position to be different for each lead, and the lower ends of the plurality of leads are formed in the plurality of lead insertion holes of the circuit board. If it is determined that the component cannot be inserted, it is determined that the component cannot be mounted, and the component to be inserted may be disposed of at a predetermined disposal location or collection location. By doing so, when it is determined that the lower ends of the leads of the insertion part cannot be inserted into the lead insertion holes of the circuit board based on the image recognition result, the subsequent steps can be omitted. Improper insert parts can be promptly discarded, and the process for the next insert part can be started promptly, and the cycle time for mounting the insert parts on the circuit board can be shortened.

  The invention according to claim 6 describes substantially the same technical idea as the invention of the "insertion component mounting method" described in claim 1 as the "insertion component mounting device" invention.

FIG. 1 is a perspective view showing the configuration of a modular component mounting system according to an embodiment of the present invention. FIG. 2 is a perspective view showing the positional relationship between the mounting head, the component imaging camera, the coaxial incident illumination light source, and the side illumination laser light source. FIG. 3 is a block diagram showing the configuration of the control system of the component mounter. 4A is a front view of the insertion part, FIG. 4B is a bottom view of the insertion part, and FIG. 4C is a left side view of the insertion part. FIG. 5 is a diagram showing a configuration example of a circuit board on which the insertion component is mounted. FIG. 6 is a plan view showing a state in which the insertion parts are mounted on the circuit board. 7A to 7D are process charts for explaining each process of the method of mounting the insertion component on the circuit board.

An embodiment in which a mode for carrying out the present invention is applied to a module-type component mounting system and embodied will be described below.
First, the configuration of the modular component mounting system will be described with reference to FIGS.

  On a base 11 of the modular component mounting system, a plurality of component mounters 12 are arranged in an exchangeable manner adjacent to each other in the circuit board transport direction. Each component mounter 12 is a component feeder 14 such as a tape feeder or a tray feeder, a conveyer 15 that conveys a circuit board 43 (see FIGS. 5 to 7), and a component holder on the main body bed 1. Mount head 17 that holds one or a plurality of suction nozzles 21 (see FIG. 2) or chucks in a replaceable manner, a head moving device 22 that moves the mount head 17 in the XY directions, and a component holder for the mount head 17. A component image pickup camera 16 for picking up an image of a component (insertion component 41, etc., described later) held in 21 from its lower surface side is mounted, and a display device such as a liquid crystal display or a CRT is mounted on the front surface of the upper frame 18. 19 and an operation unit 20 such as an operation key and a touch panel are provided. A board image pickup camera 23 (see FIG. 3) for picking up a reference mark (not shown) on the circuit board 43 is attached to the head moving device 22 so as to move integrally with the mounting head 17 in the XY directions. ing. It should be noted that the circuit board 43 shown in FIGS. 5 to 7 shows only the portion on which the insertion component 41 is mounted, and the portions on which other electronic components are mounted are not shown.

  As shown in FIG. 2, the mounting head 17 is rotatably assembled to a support bracket 24 that moves in the XY directions by a head moving device 22, and a head rotation motor 25 causes a suction nozzle around the central axis of the mounting head 17. The arrangement nozzles 21 are configured to intermittently rotate (pitch drive) by the arrangement pitch angle, and the suction nozzle 21 is rotated integrally with the rotation of the mounting head 17. A plurality of nozzle holders 26 for holding the suction nozzles 21 are assembled to the mounting head 17 so as to be able to move up and down in the vertical direction (Z direction), and the mounting head 17 rotates in a predetermined manner during a component suction operation or a component mounting operation. One nozzle holder 26 (suction nozzle 21) located at a position is moved up and down by a nozzle elevating mechanism 28 having a nozzle elevating motor 27 as a drive source. The suction nozzle 21 of each nozzle holder 26 is configured to rotate (rotate) by a motor 29 for rotating the nozzle, and the inclination (deviation of the rotation angle in the horizontal direction) of the component sucked by each suction nozzle 21 is mounted on the component. The correction is performed by rotating each suction nozzle 21 before.

  On the other hand, the component imaging camera 16 is arranged upward near the component suction position of the component supply device 14. As shown in FIG. 2, a coaxial epi-illumination light source 32 is attached to the upper side of the component imaging camera 16 via a lens 31 so as to face upward. The coaxial epi-illumination light source 32 is configured by arranging light emitting elements such as LEDs in an annular shape coaxial with the optical axis of the component imaging camera 16, and a component holder of the mounting head 17 (suction nozzle 21 or chuck) during component imaging. Etc.) are lit from the bottom side. On the upper surface side of the frame-shaped illumination cover 33 of the coaxial incident illumination light source 32, four laser light sources 34 that emit laser light in the horizontal direction toward the optical axis of the component imaging camera 16 are assembled at 90 ° intervals. ing.

  The components held by the component holder such as the suction nozzle 21 are arranged so that the positioning protrusion 42 (eg, boss, pin, etc.) and the inverted L-shaped lead 45 as shown in FIGS. 4 and 7 both project downward. In the case of the insertion component 41 provided in the above, the four laser light sources 34 are used as illumination light sources when the lower end of the positioning protrusion 42 of the insertion component 41 and the lower end of the lead 45 are imaged by the component imaging camera 16 from below. I am trying to use.

  In the insertion part 41 to be mounted by the mounting method of the present embodiment, since the lower end of the lead 45 projects below the lower end of the positioning protrusion 42, image recognition of the position of the lower end of the lead 45 and the positioning protrusion 42. Image recognition of the position of the lower end of is performed separately as follows. When recognizing the image of the position of the lower end of the lead 45, the height of the lower end portion of the lead 45 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set to the same height position as the optical axis of the laser light source 34. In this state, the outer peripheral surface of the lower end portion of the lead 45 of the insertion component 41 is irradiated with the laser light horizontally radiated from the four laser light sources 34 so that the component imaging camera 16 includes the lower end of the lead 45. By capturing an image, the lower end of the lead 45 can be clearly recognized from the image by distinguishing it from the background. Next, when recognizing an image of the position of the lower end of the positioning protrusion 42, the height of the lower end of the positioning protrusion 42 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set to the laser light source 34. In a state where the laser light is horizontally emitted from the four laser light sources 34 while being lowered to the same height position as the optical axis of, the lower end outer peripheral surface of the positioning protrusion 42 of the insertion part 41 is irradiated, By capturing an image including the lower end of the positioning protrusion 42 with the component imaging camera 16, the shape of the lower end surface of the positioning protrusion 42 can be clearly recognized by distinguishing it from the lower surface of the insertion component 41 from the image. Has become.

  The lower end surface of the positioning projection 42 is colored in a different color from the lower surface of the insertion part 41, and the lower surface of the insertion part 41 is illuminated by the coaxial epi-illumination light source 32. When the shape of the lower end surface of the portion 42 can be recognized by distinguishing it from the lower surface of the insertion component 41, the lower surface side of the insertion component 41 is illuminated by the coaxial epi-illumination light source 32, and an image including the lower end of the positioning protrusion 42 is included. May be imaged and the position of the lower end of the positioning protrusion 42 may be recognized from the image. Similarly, the lower end surface of the lead 45 is colored with a color different from that of the other portions of the lead 45, and the lower end of the lead 45 is taken from the image captured by illuminating with the coaxial epi-illumination light source 32. When it is recognizable separately from the background, the coaxial epi-illumination light source 32 is used to illuminate, an image including the lower end of the lead 45 is captured, and the position of the lower end of the lead 45 can be recognized from the image. good.

  Each component mounter 12 conveys the circuit board 43 conveyed from the component mounter 12 on the upstream side to a predetermined position by the conveyor 15 and clamps and positions the circuit board 43 by a clamp mechanism (not shown). After that, the reference mark of the circuit board 43 is imaged by the board imaging camera 23, the captured image is processed to recognize the position of the reference mark of the circuit board 43, and the component supplied by the component supply device 14 Is held by a component holder such as the suction nozzle 21 of the mounting head 17, the component is moved to an imaging position, and the component image capturing camera 16 captures an image to recognize the holding posture and positional deviation of the component. The circuit board 43 on the conveyor 15 is mounted. At this time, with reference to the position of the reference mark on the circuit board 43, the specification data (data of the component mounting position of the circuit board 43 based on the position of the reference mark) provided by the manufacturer of the circuit board 43 is used. The component mounting position of the circuit board 43 is determined, and the positional deviation and inclination (deviation of the rotation angle in the horizontal direction) of the component held by the component holder such as the suction nozzle 21 of the mounting head 17 are corrected to make the circuit of the component. It is mounted at the component mounting position on the substrate 43.

  By the way, among the components mounted on the circuit board 43 by the component mounter 12, there is the insertion component 41 as shown in FIG. The insert part 41 is a large part such as a connector part, and a plurality of lower parts of the insert part 41 are used for the purpose of increasing the bonding strength between the insert part 41 and the circuit board 43 (see FIGS. 5 to 7). Positioning projections 42 (for example, bosses, pins, etc.) projecting downward are provided at locations (for example, two locations), and the positioning projections 42 are provided at positioning holes 44 formed at a plurality of locations (for example, two locations) of the circuit board 43. I am trying to insert. Further, the plurality of leads 45 are arranged in a line in the insertion component 41 so as to project downward, and at the time of mounting, the plurality of leads 45 are inserted into the plurality of lead insertion holes 46 provided in the circuit board 43. There is something. In general, the lead 45 of the insertion component 41 is formed of a thin metal of several 100 μm to several mm, and thus is easily deformed by an external force. Therefore, there is a possibility that the positional relationship between the positioning protrusion 42 of the insert part 41 and the lead 45 may deviate from the original positional relationship due to manufacturing variations of the insert part 41 and deformation of the leads 56 due to external force. In the conventional mounting method, there is a possibility that the positioning protrusion 42 and the lead 45 of the insertion component 41 cannot be inserted into the positioning hole 44 and the lead insertion hole 46 of the circuit board 43.

  As a countermeasure against this, in the present embodiment, the control device 51 that controls the operation of each mechanism of the component mounter 12 executes an insertion component mounting program (not shown) to perform the component holding process, the image processing process, and the read process. The functions of the image processing means, the lead positioning means, the temporary insertion means, the positioning projection positioning means, and the main insertion means are realized by sequentially executing the positioning step, the temporary insertion step, the positioning protrusion positioning step, and the main insertion step. To do. The contents of each step will be described below.

[Parts holding process]
The insertion component 41 supplied by the component supply device 14 is held by a component holder such as the suction nozzle 21 of the mounting head 17.

[Image processing step (image processing means)]
In the illumination of the coaxial epi-illumination light source 32, it is difficult to accurately recognize the position of the lower end of the lead 45 and the position of the lower end of the positioning protrusion 42 from the image captured by the component imaging camera 16, and thus the insertion component 41 The four laser light sources 34 are used as illumination light sources when the lower end of the positioning protrusion 42 and the lower end of the lead 45 are imaged by the component imaging camera 16, but the lower end of the lead 45 is lower than the lower end of the positioning protrusion 42. Since it projects downward, the lower end of the lead 45 and the lower end of the positioning protrusion 42 cannot be simultaneously image-recognized by the illumination of the laser light source 34.

  Therefore, in the present embodiment, image recognition of the position of the lower end of the lead 45 and the position of the lower end of the positioning protrusion 42 is separately performed as follows. When recognizing the image of the position of the lower end of the lead 45, the height of the lower end portion of the lead 45 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set to the same height position as the optical axis of the laser light source 34. In this state, the outer peripheral surface of the lower end portion of the lead 45 of the insertion component 41 is irradiated with the laser light horizontally radiated from the four laser light sources 34 so that the component imaging camera 16 includes the lower end of the lead 45. By capturing an image, the position (XY coordinate) of the lower end of the lead 45 is recognized from the image. Next, when recognizing an image of the position of the lower end of the positioning protrusion 42, the height of the lower end of the positioning protrusion 42 of the insertion component 41 held by the component holder such as the suction nozzle 21 is set to the laser light source 34. In a state where the laser light is horizontally emitted from the four laser light sources 34 while being lowered to the same height position as the optical axis of, the lower end outer peripheral surface of the positioning protrusion 42 of the insertion part 41 is irradiated, By capturing an image including the lower end of the positioning protrusion 42 by the component imaging camera 16, the position (XY coordinate) of the lower end of the positioning protrusion 42 is recognized from the image.

  On the other hand, the data of the position of the positioning hole 44 and the position of the lead insertion hole 46 of the circuit board 43 is the reference mark of the circuit board 43 recognized in advance from the image of the reference mark of the circuit board 43 captured by the board imaging camera 23. The position is used as a reference, and the data is obtained from the specification data provided by the manufacturer of the circuit board 43 (data of the position of the positioning hole 44 and the position of the lead insertion hole 46 of the circuit board 43 with reference to the position of the reference mark). Since the image recognition of the position of the reference mark on the circuit board 43 is performed to determine the component mounting position on the circuit board 43 in the component mounter 12 before the component mounting, if the image recognition result is used as it is. Well, there is no need to add new image recognition processing.

[Lead positioning process (lead positioning means)]
After the completion of the image processing step, the process proceeds to the lead positioning step, where the head moving device 22 moves the mounting head 17 in the horizontal direction, and as shown in FIG. The position of the lower end of the lead 45 of the insertion component 41 held in the holder (the position recognized in the image processing step) is positioned so that it can be inserted into the lead insertion hole 46 of the circuit board 43. At this time, the insertion component 41 is positioned so that the center of the lower end surface of the lead 45 coincides with the center of the lead insertion hole 46 of the circuit board 43.

[Temporary insertion step (temporary insertion means)]
After the lead positioning step is completed, the process proceeds to the temporary insertion step, and as shown in FIG. 7B, the component holder that holds the insertion component 41 is lowered, and the lower end of the lead 45 is inserted into the lead insertion hole of the circuit board 43. It is slightly inserted into 46 and the lowering operation of the component holder is temporarily stopped before the lower end of the positioning projection 42 reaches the surface of the circuit board 43.

[Positioning process for positioning protrusion (positioning means for positioning protrusion)]
After the temporary insertion step is completed, the process proceeds to a positioning protrusion positioning step, and as shown in FIG. 7C, the component holder holding the insertion component 41 is moved in the horizontal direction to deform the leads 45 and perform positioning. The position of the lower end of the projection portion 42 (the position recognized in the image processing step) is positioned so that it can be inserted into the positioning hole 44 of the circuit board 43. At this time, the insertion part 41 is positioned so that the center of the lower end surface of the positioning protrusion 42 is aligned with the center of the positioning hole 44 of the circuit board 43.

[Main insertion step (main insertion means)]
After the positioning step positioning step is completed, the process proceeds to the main insertion step, and as shown in FIG. 7D, the descending operation of the component holder is restarted to move the positioning projection 42 of the insertion component 41 to the circuit board 43. The lead 45 is inserted into the lead insertion hole 46 of the circuit board 43 at the same time as the lead 45 is inserted into the positioning hole 44. If the leads 45 are soldered to the circuit board 43 in this state, the mounting process of the insertion component 41 on the circuit board 43 is completed.

  If the positioning process and the insertion process are performed in two steps as in the above-described embodiment, the positioning protrusion of the insertion component 41 is caused by manufacturing variation of the insertion component 41 or deformation of the lead 45 due to external force. Even if the positional relationship between the portion 42 and the lead 45 deviates from the original positional relationship, the positioning protrusion 42 and the lead 45 of the insertion component 41 are inserted into the positioning hole 44 of the circuit board 43 and the lead insertion as much as possible. Since it can be inserted into the hole 46 and cannot be inserted, the number of the inserted components 41 to be discarded can be reduced, and the production cost can be reduced accordingly.

  By the way, when the positional relationship between the lower end of the positioning protrusion 42 of the insert part 41 and the lower end of the lead 45 is not deviated from the original positional relationship, the insert part 41 is mounted on the circuit board by the same mounting method as the conventional one. 43 can be implemented.

  Therefore, in the present embodiment, the control device 51 of the component mounter 12 determines that the positional relationship between the lower end of the positioning protrusion 42 of the insert component 41 and the lower end of the lead 45 recognized in the image processing step is the circuit board 43. It is determined whether or not the positional relationship between the positioning hole 44 and the lead insertion hole 46 matches, and only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, and the positioning When the protrusion positioning step and the main insertion step are executed and it is determined that the positional relationship between the two is matched, the lower end of the positioning protrusion 42 of the insertion component 41 and the lower end of the lead 45 held by the component holder are simultaneously released. The positioning of the insertion component 41 is performed by lowering the component holder that holds the insertion component 41 after positioning the insertion hole into the positioning hole 44 of the circuit board 43 and the lead insertion hole 46. And a projecting portion 42 and the lead 45 are simultaneously inserted into the positioning hole 44 and the lead insertion hole 46 of the circuit board 43.

  With this configuration, the positional relationship between the lower end of the positioning protrusion 42 of the insertion part 41 and the lower end of the lead 45 recognized in the image processing step is determined by the positioning hole 44 of the circuit board 43 and the lead insertion hole 46. If they match the positional relationship between the positioning projections 42 and the leads 45 of the insertion component 41, the positioning holes of the circuit board 43 are simultaneously formed in one positioning step and one insertion step as in the conventional case. 44 and the lead insertion hole 46, the number of steps can be reduced, and the cycle time for mounting the insertion component 41 on the circuit board 43 can be shortened.

  In general, the insert component 41 is provided with a plurality of leads 45 in a line, and correspondingly, the circuit board 43 is provided with a plurality of lead insertion holes 46 in a line, so that a plurality of lead components 45 of the insert component 41 are provided. When the positions of the lower ends of the leads 45 are deviated from the original positions in the deformation direction and the amount of deformation for each lead 45, the lower ends of the leads 45 may not be inserted into the lead insertion holes 46 of the circuit board 43. There is.

  Therefore, in the present embodiment, the control device 51 of the component mounter 12 detects that the positions of the lower ends of the leads 45 of the insertion component 41 recognized in the image processing step are deviated from the original position for each lead 45. When it is determined that the lower ends of the leads 45 cannot be inserted into the plurality of lead insertion holes 46 of the circuit board 43, it is determined that mounting is not possible, and the insertion component 41 is discarded at a predetermined disposal location or recovery location. There is. With this configuration, if it is determined that the lower ends of the leads 45 of the insertion component 41 cannot be inserted into the lead insertion holes 46 of the circuit board 43 based on the image recognition result, the subsequent steps are not performed. In addition, the non-mountable insert component 41 can be promptly discarded, and the process for the next insert component 41 can be started promptly, and the cycle time for mounting the insert component 41 on the circuit board 43 can be shortened.

  In the present embodiment, the data of the positions of the positioning holes 44 and the lead insertion holes 46 of the circuit board 43 are recognized in advance from the image of the reference mark of the circuit board 43 captured by the board imaging camera 23. Based on the position of the reference mark 43, the specification data provided by the manufacturer of the circuit board 43 (the data of the position of the positioning hole 44 of the circuit board 43 and the position of the lead insertion hole 46 with the position of the reference mark as the reference). However, according to the present invention, the positioning hole 44 and the lead insertion hole of the circuit board 43 are separately or simultaneously imaged by the board imaging camera 23, and the imaged image is processed to obtain the circuit board. The position of the positioning hole 44 of 43 and the position of the lead insertion hole may be recognized. By doing so, even if there are variations in the positions of the positioning holes 44 and the lead insertion holes 46 due to variations in the manufacturing of the circuit board 43, it is possible to image-recognize the variations in the positions of the positioning holes 44 and the lead insertion holes 46 of the circuit board 43. Therefore, it is possible to deal with variations in the positions of the positioning hole 44 and the lead insertion hole 46. As a result, even if the positional relationship between the positioning hole 44 of the circuit board 43 and the lead insertion hole 46 deviates from the original positional relationship due to manufacturing variation of the circuit board 43, etc., the positioning of the insertion component 41 is performed as much as possible. The projecting portion 42 and the lead 45 can be inserted into the positioning hole 44 and the lead insertion hole 46 of the circuit board 43.

  Note that the present invention is not limited to the above-described embodiment, and the scope of the invention is not deviated from, for example, the configuration of the component mounter 12 may be appropriately changed, the configurations of the insertion component 41 and the circuit board 43 may be appropriately changed, and the like. It goes without saying that various modifications can be made within the implementation.

  12 ... Component mounter, 14 ... Component supply device, 15 ... Conveyor, 16 ... Component imaging camera, 17 ... Mounting head, 21 ... Suction nozzle (component holder), 22 ... Head moving device, 23 ... Board imaging camera , 32 ... Coaxial epi-illumination light source, 34 ... Laser light source, 41 ... Inserted component, 42 ... Positioning projection, 43 ... Circuit board, 44 ... Positioning hole, 45 ... Surface mounting electrode section, 46 ... Lead insertion hole, 51 ... Control device (image processing means, lead positioning means, temporary insertion means, positioning projection positioning means, main insertion means)

Claims (6)

An insertion component in which both the positioning projection and the lead project downward and the lower end of the lead projects below the lower end of the positioning projection is inserted into the positioning hole into which the positioning projection is inserted and the lead. In an insertion component mounting method for mounting on a circuit board provided with a lead insertion hole,
A component holding step of holding the inserted component supplied to a component holder,
The lower end of the positioning protrusion and the lower end of the lead of the insertion part held by the part holder are separately imaged from below by a parts imaging camera, and the imaged image is processed to perform the positioning. An image processing step of recognizing the position of the lower end of the protrusion and the position of the lower end of the lead;
A lead positioning step of positioning the lower end position of the lead of the insertion component held in the component holder at a position insertable into the lead insertion hole of the circuit board;
Before lowering the component holder that holds the insertion component and slightly inserting the lower ends of the leads into the lead insertion holes of the circuit board so that the lower ends of the positioning protrusions reach the surface of the circuit board. A temporary insertion step of temporarily stopping the descending operation of the component holder,
The positioning protrusion of the insertion part while the lower end of the lead of the insertion part is slightly inserted into the lead insertion hole of the circuit board to move the part holder horizontally to deform the lead. A positioning protrusion positioning step of positioning the lower end of the position at a position insertable into the positioning hole of the circuit board,
The descending operation of the component holder holding the insertion component is restarted to insert the positioning protrusion of the insertion component into the positioning hole of the circuit board, and at the same time, insert the lead into the lead of the circuit board. An insertion component mounting method including a main insertion step of inserting into a hole,
In the image processing step, a laser beam is horizontally emitted as an illumination light source when the lower end of the positioning protrusion of the insertion part and the lower end of the lead are separately imaged from below by the part imaging camera , 90 Using 4 laser light sources assembled at ° intervals ,
When recognizing the position of the lower end of the lead, it is lowered to the insertion part which is held by the component holder height position of the lower end portion of the lead at the same level as the optical axis of the laser light source In this state, the laser light horizontally radiated from the laser light source is applied to the outer peripheral surface of the lower end portion of the lead, and an image including the lower end of the lead is captured from below by the component imaging camera, and the image is captured. Recognize the position of the bottom edge of the lead by processing the image,
On the other hand, when recognizing the position of the lower end of the positioning protrusion, the height position of the lower end of the positioning protrusion of the insertion component held by the component holder is the same as the optical axis of the laser light source. With the laser light radiated from the laser light source in the horizontal direction in a state of being lowered to the height position, the outer peripheral surface of the lower end portion of the positioning projection is irradiated, and the positioning camera is used from below to perform the positioning. An insertion component mounting method characterized in that the position of the lower end of the positioning protrusion is recognized by capturing an image including the lower end of the protrusion and processing the captured image. The insertion component mounting method according to claim 1,
By capturing the reference mark of the circuit board with a board imaging camera and processing the captured image, the position of the reference mark is recognized, and using the specification data provided from the manufacturer of the circuit board, An insertion component mounting method, which acquires data on a position of the positioning hole and a position of the lead insertion hole of the circuit board with reference to a position of a reference mark. The insertion component mounting method according to claim 1,
The position of the positioning hole and the position of the lead insertion hole are recognized by imaging the positioning hole and the lead insertion hole of the circuit board separately or simultaneously with a board imaging camera and processing the captured image. A method for mounting an insertion part, which comprises: The insertion component mounting method according to any one of claims 1 to 3,
The positional relationship between the lower end of the positioning protrusion of the insertion part and the lower end of the lead recognized in the image processing step matches the positional relationship between the positioning hole of the circuit board and the lead insertion hole. Decide whether to do,
Only when it is determined that the positional relationship between the two does not match, the lead positioning step, the temporary insertion step, the positioning protrusion positioning step and the main insertion step are executed.
When it is determined that the positional relationship between the both is the same, the lower end of the positioning protrusion of the insertion part and the lower end of the lead are placed at a position where they can be simultaneously inserted into the positioning hole and the lead insertion hole of the circuit board. After the positioning, the positioning protrusion of the insertion part and the lead are simultaneously inserted into the positioning hole and the lead insertion hole of the circuit board. The insertion component mounting method according to any one of claims 1 to 4,
The insertion part is provided with a plurality of the leads in a row, and correspondingly, the circuit board is provided with a plurality of the lead insertion holes in a row,
The positions of the lower ends of the leads of the insertion part recognized in the image processing step are deviated from the original position for each lead, and the lower ends of the leads are inserted into the lead insertion holes of the circuit board. When it is determined that the component cannot be inserted, it is determined that the component cannot be mounted, and the component is discarded at a predetermined disposal location or collection location. An insertion component in which both the positioning projection and the lead project downward and the lower end of the lead projects below the lower end of the positioning projection is inserted into the positioning hole into which the positioning projection is inserted and the lead. In an insertion component mounting device mounted on a circuit board provided with a lead insertion hole,
A component holder for holding the inserted component to be supplied,
The lower end of the positioning protrusion and the lower end of the lead of the insertion part held by the part holder are separately imaged from below by a parts imaging camera, and the imaged image is processed to perform the positioning. Image processing means for recognizing the position of the lower end of the protrusion and the position of the lower end of the lead;
Lead positioning means for positioning the position of the lower end of the lead of the insertion component held in the component holder to a position insertable into the lead insertion hole of the circuit board;
Before lowering the component holder that holds the insertion component and slightly inserting the lower ends of the leads into the lead insertion holes of the circuit board so that the lower ends of the positioning protrusions reach the surface of the circuit board. A temporary insertion means for temporarily stopping the descending operation of the component holder,
The positioning protrusion of the insertion part while the lower end of the lead of the insertion part is slightly inserted into the lead insertion hole of the circuit board to move the part holder horizontally to deform the lead. Positioning protrusion positioning means for positioning the position of the lower end of the position at a position where it can be inserted into the positioning hole of the circuit board,
The descending operation of the component holder holding the insertion component is restarted to insert the positioning protrusion of the insertion component into the positioning hole of the circuit board, and at the same time, insert the lead into the lead of the circuit board. An insertion component mounting apparatus comprising: a main insertion unit that is inserted into a hole,
Emits laser light in the horizontal direction as the illumination light source of imaging separately lower ends with the lead of the projecting portions for positioning of the insert part from below by the component imaging camera, assembled at 90 ° intervals With four laser light sources,
The image processing means,
When recognizing the position of the lower end of the lead, lower the insertion component held by the component holder until the height position of the lower end portion of the lead becomes the same height position as the optical axis of the laser light source. In this state, the laser light horizontally radiated from the laser light source is applied to the outer peripheral surface of the lower end portion of the lead, and an image including the lower end of the lead is captured from below by the component imaging camera, and the image is captured. Recognize the position of the bottom edge of the lead by processing the image,
On the other hand, when recognizing the position of the lower end of the positioning protrusion, the height position of the lower end of the positioning protrusion of the insertion component held by the component holder is the same as the optical axis of the laser light source. With the laser light radiated from the laser light source in the horizontal direction in a state of being lowered to the height position, the outer peripheral surface of the lower end portion of the positioning projection is irradiated, and the positioning camera is used from below to perform the positioning. An insertion component mounting apparatus characterized by recognizing a position of a lower end of the positioning protrusion by capturing an image including a lower end of the protrusion and processing the captured image.

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