JP6232221B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method.

  An electronic component mounting apparatus (mounter) has a nozzle that holds an electronic component, and holds the electronic component with the nozzle and mounts it on a substrate. As an electronic component, for example, there is a so-called lead type electronic component (insertion type electronic component) as disclosed in Patent Document 1. The lead-type electronic component has a main body portion and leads (pins) connected to the main body portion. The lead-type electronic component is mounted on the substrate by inserting a lead into an opening provided on the surface of the substrate.

Japanese Patent No. 3967361

  In a lead-type electronic component, if the lead cannot be smoothly inserted into the opening of the substrate, a load may be applied to the electronic component. As a result, there is a possibility that the yield will be lowered and the performance of the electronic component will be lowered.

  The present invention has been made in view of the above, and an object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method capable of smoothly inserting a lead into an opening of a substrate.

  In order to solve the above-described problems and achieve the object, an electronic component mounting apparatus according to the present invention includes an electronic component having a main body portion and leads connected to the main body portion, and a substrate having an opening on the surface. An electronic component mounting apparatus mounted on the lead from a first state in which the nozzle for holding the main body and the leading end of the lead are located inside the opening, the bent portion provided on the lead is the opening of the opening. The movement path of the nozzle holding the main body so that the base end of the lead connected to the main body changes to the third state located inside the opening through the second state located on the inner side. And a drive device that moves the nozzle holding the main body based on the movement path determined by the control apparatus, the movement path including the nozzle on the surface of the substrate. And vertical second While moving to the axis a first direction parallel including a path for movement in a direction parallel to the surface of the substrate.

  In the electronic component mounting apparatus according to the present invention, the bent portion protrudes in a second direction parallel to a second axis in a plane parallel to the surface of the substrate between the distal end portion and the base end portion. The moving path is a first path in which the nozzle moves in the third direction opposite to the second direction while moving in the first direction so as to change from the first state to the second state. And a second path in which the nozzle moves in the second direction while moving in the first direction so as to change from the second state to the third state.

  In the electronic component mounting apparatus according to the present invention, a virtual connection between the distal end portion and the proximal end portion in at least a part of a movement period of the nozzle for changing from the first state to the third state. The movement path may be determined so that the center of the opening passes between the first straight line and the lead.

  In the electronic component mounting apparatus according to the present invention, the first path and the second path may have the same moving distance in a plane parallel to the surface of the substrate.

  In the electronic component mounting apparatus according to the present invention, the movement path is changed so that the nozzle is changed from a state in which a tip end portion of the lead is positioned at the center of the opening to a state in which the lead is in contact with an edge of the opening. The nozzle includes a path that moves in the first direction without moving in a direction parallel to the second axis, and the nozzle moves in a direction parallel to the second axis after the lead contacts the edge of the opening. May be started.

  In the electronic component mounting apparatus according to the present invention, a virtual second straight line that is parallel to the second axis and passes through the bent portion, a first intersection of the bent portion, the second straight line, and the first straight line The movement path may be determined so that the center of the opening passes through the center of the second intersection.

  In the electronic component mounting apparatus according to the present invention, the movement path includes a first portion of the lead between the tip portion inclined with respect to the first axis and the bent portion, the first straight line, and the In a triangle formed by a virtual second straight line that is parallel to the second axis and passes through the bent portion, an apex between the first straight line and the first portion and a midpoint of the second straight line Formed by a first middle line to be connected, a second portion of the lead between the bent portion and the base end portion inclined with respect to the first axis, the first straight line, and the second straight line. The triangle may include at least a part of a second middle line connecting a vertex between the first straight line and the second part and a midpoint of the second straight line.

  The electronic component mounting apparatus according to the present invention may include a detection device that detects a shape of the lead, and the control device may determine the movement path based on a detection result of the detection device.

  In order to solve the above-described problems and achieve the object, an electronic component mounting method according to the present invention includes an electronic component having a main body portion and leads connected to the main body portion, and a substrate having an opening on the surface. An electronic component mounting method for mounting to a lead, wherein a step of holding the main body portion with a nozzle, and a bent portion provided on the lead from a first state in which a tip end portion of the lead is located inside the opening, Through the second state located inside the opening, the nozzle of the nozzle holding the body portion is changed so that the base end portion of the lead connected to the body portion changes to a third state located inside the opening. Determining a movement path, and moving the nozzle holding the main body based on the determined movement path, and inserting the lead into the opening. Noz There comprising a path for moving in a direction parallel to the surface of the substrate while moving in a first direction parallel to the first axis perpendicular to the surface of the substrate.

  In the electronic component mounting method according to the present invention, the step of detecting the shape of the lead, and the step of determining the movement path of the nozzle may be performed based on a detection result of the shape of the lead.

  According to the present invention, the lead can be smoothly inserted into the opening of the substrate.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram showing a schematic configuration of the head. FIG. 3 is a schematic diagram showing a schematic configuration of the head. FIG. 4 is a schematic diagram showing a schematic configuration of the head. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 6 is an explanatory diagram for explaining the holding operation of the nozzle of FIG. FIG. 7 is a front view showing an example of an electronic component. FIG. 8 is a side view showing an example of an electronic component. FIG. 9 is a plan view illustrating an example of an electronic component. FIG. 10 is a plan view showing an example of the substrate. FIG. 11 is a cross-sectional view illustrating an example of a substrate. FIG. 12 is an explanatory diagram for explaining an operation of recognizing the shape of an electronic component. FIG. 13 is an explanatory diagram for explaining an operation of recognizing the shape of an electronic component. FIG. 14 is an explanatory diagram for explaining the shape recognition operation of the electronic component. FIG. 15 is an explanatory diagram for explaining an operation of recognizing the shape of an electronic component. FIG. 16 is an explanatory diagram for explaining an operation of recognizing the shape of an electronic component. FIG. 17 is an explanatory diagram for explaining the shape recognition operation of the electronic component. FIG. 18 is a schematic diagram illustrating an example of a recognition operation detection result. FIG. 19 is a flowchart illustrating an example of the shape recognition operation of the electronic component. FIG. 20 is an explanatory diagram for explaining the shape recognition operation of the electronic component. FIG. 21 is an explanatory diagram for explaining an operation of recognizing the shape of an electronic component. FIG. 22 is a schematic diagram illustrating an example of a recognition operation detection result. FIG. 23 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 24 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 25 is a flowchart illustrating an example of an electronic component mounting operation. FIG. 26 is an explanatory diagram for explaining an electronic component mounting operation. FIG. 27 is an explanatory diagram for explaining an electronic component mounting operation. FIG. 28 is an explanatory diagram for explaining the mounting operation of the electronic component. FIG. 29 is an explanatory diagram for explaining an electronic component mounting operation. FIG. 30 is an explanatory diagram for explaining the mounting operation of the electronic component. FIG. 31 is an explanatory diagram for explaining an electronic component mounting operation. FIG. 32 is an explanatory diagram for explaining the mounting operation of the electronic component. FIG. 33 is a diagram illustrating an example of an electronic component. FIG. 34 is a schematic diagram showing a schematic configuration of an electronic component mounting system. FIG. 35 is a flowchart illustrating an example of the operation of the electronic component mounting system.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be combined as appropriate. Some components may not be used. In addition, constituent elements in the embodiments described below include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range.

  In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. One direction in the horizontal plane for transporting the substrate 8 is the X axis direction, the direction orthogonal to the X axis direction in the horizontal plane is the Y axis direction, and the direction orthogonal to each of the X axis direction and the Y axis direction is the Z axis direction (vertical direction) ). Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. The XY plane is a horizontal plane. Each of the XZ plane and the YZ plane intersects the XY plane perpendicularly. The Z-axis direction substantially coincides with the first axis perpendicular to the substrate surface. Further, the first direction substantially coincides with the Z-axis direction.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus 10 according to the present embodiment. FIG. 2 is a diagram illustrating an example of the head 15 included in the electronic component mounting apparatus 10 according to the present embodiment. FIG. 3 is a diagram illustrating an example of the head 15 included in the electronic component mounting apparatus 10 according to the present embodiment.

  The electronic component mounting apparatus 10 mounts the electronic component 80 on the substrate 8. The electronic component 80 is mounted (mounted) on the substrate 8. In the present embodiment, the electronic component 80 includes a so-called lead type electronic component (insertion type electronic component). The lead type electronic component has a lead 84. The lead-type electronic component is mounted on the substrate 8 by inserting the lead 84 into the opening of the substrate 8. The electronic component 80 may include a so-called chip type electronic component (mounting type electronic component). Chip-type electronic components do not have leads. The chip-type electronic component is mounted on the substrate 8 by being mounted on the substrate 8. Chip-type electronic components include, for example, QFP (quad flat package), SOP (small outline package), and the like.

  In this embodiment, the electronic component mounting apparatus 10 mounts a lead type electronic component (insertion type electronic component) on the substrate 8. The electronic component mounting apparatus 10 may be capable of mounting both the lead type electronic component (insertion type electronic component) and the chip type electronic component (mounting type electronic component) on the substrate 8.

  1, 2, and 3, the electronic component mounting apparatus 10 includes a substrate transport unit 12 that can move the substrate 8, a component supply unit 14 that can supply an electronic component 80, and a head 15 that has a nozzle 32. The drive unit 26 including the head moving mechanism 16 and the nozzle driving unit 34 and capable of moving the nozzle 32, the VCS unit 17 including the camera capable of acquiring an image of the electronic component 80, and the nozzle exchanged for the head 15 The replacement nozzle holding mechanism 18 that holds 32, the component storage unit 19 that can store the electronic component 80, and the housing 11 that accommodates at least a part of the electronic component mounting apparatus 10 are provided. The electronic component mounting apparatus 10 includes an operation unit 40, a display unit 42, a storage unit 44, and a control device 20 that controls the electronic component mounting apparatus 10.

  The substrate transport unit 12 moves (transports) the substrate 8. The substrate transport unit 12 includes a transport mechanism 12H that can move while supporting the substrate 8, and a guide member 12G that guides the transport mechanism 12H. The transport mechanism 12H includes a holding member that releasably holds the substrate 8 and an actuator that can move the holding member. The transport mechanism 12H (holding member) supports the substrate 8 so that the surface (upper surface) 8A of the substrate 8 and the XY plane are parallel to each other. In the present embodiment, the guide member 12G is long in the X-axis direction. The transport mechanism 12H is guided by the guide member 12G and can move in the X-axis direction. The substrate transport unit 12 moves the substrate 8 at least in the X-axis direction. In addition, the board | substrate conveyance part 12 may be able to move the board | substrate 8 to six directions, X-axis, Y-axis, Z-axis, (theta) X, (theta) Y, and (theta) Z. An electronic component 80 is mounted (mounted) on at least a part of the surface 8A of the substrate 8. The surface 8A of the substrate 8 is a mounting target surface on which the electronic component 80 is mounted.

  The substrate transport unit 12 can move the substrate 8 so that the surface 8A of the substrate 8 and at least a part of the head 15 (nozzle 32) face each other. The substrate 8 is supplied from the substrate supply device to the electronic component mounting device 10. The transport mechanism 12H transports the substrate 8 supplied from the substrate supply device to a predetermined position of the guide member 12G. The head 15 (nozzle 32) mounts the electronic component 80 on the surface 8A of the substrate 8 arranged at a predetermined position. After the electronic component 80 is mounted on the substrate 8, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next process.

  The component supply unit 14 supplies the electronic component 80 to the head 15 (nozzle 32). The component supply unit 14 holds a plurality of electronic components 80. At least one of the electronic components 80 is supplied to the head 15 (nozzle 32). The component supply unit 14 includes a component supply unit 14f disposed on the front side of the substrate transport unit 12 and a component supply unit 14r disposed on the rear side. The component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10. The component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. The head 15 (nozzle 32) mounts (mounts) the electronic component 80 supplied from the component supply unit 14 on the substrate 8. The electronic component 80 supplied from the component supply unit 14 may be the same type of electronic component or a different type of electronic component. In the present embodiment, the component supply unit 14 (14f, 14r) supplies lead type electronic components (insertion type electronic components). The component supply unit 14 has an electronic component holding tape. The electronic component 80 is held on an electronic component holding tape. The component supply unit 14 moves the electronic component 80 held on the electronic component holding tape by pulling out and moving the electronic component holding tape.

  The head 15 mounts the electronic component 80 on the substrate 8. The head 15 includes a base frame 31 and a nozzle 32 that is supported by the base frame 31 and releasably holds at least a part of the electronic component 80. The head 15 holds the electronic component 80 supplied from the component supply unit 14 with the nozzle 32. The nozzle 32 mounts the electronic component 80 on the substrate 8. The nozzle 32 mounts the electronic component 80 on the substrate 8 supported by the substrate transport unit 12.

  The driving device 26 moves the nozzle 32. The driving device 26 can move the nozzle 32 to a position facing the substrate 8 and a position facing the component supply unit 14. The driving device 26 can move the nozzle 32 in the XY plane so that the electronic component 80 is transferred from the component supply unit 14 to the substrate 8. The driving device 26 includes a head moving mechanism 16 that can move the head 15 (base frame 31), and a nozzle driving unit 34 that is supported by the base frame 31 and that can move the nozzle 32. The head moving mechanism 16 includes an actuator and can move the head 15 (nozzle 32) in the XY plane. The nozzle driving unit 34 includes an actuator and can move the nozzle 32 in the Z-axis direction and the θZ direction.

  The head moving mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Each of the X-axis drive unit 22 and the Y-axis drive unit 24 includes an actuator. The X-axis drive unit 22 is connected to the base frame 31 (head 15). The base frame 31 moves in the X-axis direction by the operation of the X-axis drive unit 22. The Y-axis drive unit 24 is connected to the base frame 31 (head 15) via the X-axis drive unit 22. When the X-axis drive unit 22 is moved in the Y-axis direction by the operation of the Y-axis drive unit 24, the base frame 31 is moved in the Y-axis direction.

  The base frame 31 supports the nozzle driving unit 34. The nozzle 32 is supported by the base frame 31 via the nozzle driving unit 34. The operation of the head moving mechanism 16 moves the base frame 31 in the X axis direction and the Y axis direction. When the base frame 31 is moved in the XY plane, the nozzle drive unit 34 and the nozzle 32 supported by the base frame 31 also move in the X-axis direction and the Y-axis direction together with the base frame 31. The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction and the θZ direction. In other words, in the present embodiment, the drive device 26 can move the nozzle 32 in four directions of the X axis, the Y axis, the Z axis, and θZ. Note that the driving device 26 may be capable of moving the nozzle 32 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  When the nozzle 32 is moved by the operation of the driving device 26, the electronic component 80 held by the nozzle 32 is also moved. The driving device 26 can adjust the relative position between the nozzle 32 and the substrate 8. By moving the nozzle 32, the relative position between the electronic component 80 held by the nozzle 32 and the substrate 8 is adjusted. The nozzle 32 can move the held electronic component 80 to an arbitrary position on the surface 8 </ b> A of the substrate 8. The nozzle 32 can mount (mount) the held electronic component 80 at an arbitrary position on the surface 8 </ b> A of the substrate 8.

  The VCS unit (component state detection unit, state detection unit) 17 detects the shape of the electronic component 80 held by the nozzle 32 and the holding state of the electronic component 80 by the nozzle 32. The VCS unit 17 includes an image recognition device and includes a camera that can acquire an image of the electronic component 80. The VCS unit 17 takes an image of the electronic component 80 held by the nozzle 32 from the lower side (−Z side), and analyzes the taken image to thereby determine the shape of the electronic component 80 held by the nozzle 32 and the nozzle. The holding state of the electronic component 80 by 32 is detected. Information acquired by the VCS unit 17 (information regarding the shape of the electronic component 80 and information regarding the holding state of the electronic component 80 by the nozzle 32) is sent to the control device 20.

  The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles 32. The replacement nozzle holding mechanism 18 holds a plurality of nozzles 32 to be replaced with respect to the head 15. In the present embodiment, the nozzle 32 includes a suction nozzle 321 that sucks and holds the electronic component 80 and a gripping nozzle 322 that holds the electronic component 80 in between. The replacement nozzle holding mechanism 18 holds the suction nozzle 321 and the gripping nozzle 322. The nozzle 32 mounted on the head 15 is changed (replaced) by the replacement nozzle holding mechanism 18. The head 15 holds the electronic component 80 with the nozzle 32 attached thereto.

  The component storage unit 19 stores the electronic component 80 that is not mounted on the substrate 8. The component storage unit 19 includes a disposal box in which electronic components 80 that are not mounted on the substrate 8 are discarded. When the electronic component 80 held by the nozzle 32 is not mounted on the substrate 8, the electronic component 80 held by the nozzle 32 is thrown into the component storage unit 19 (discarded).

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 may be an aggregate of various control units. The control device 20 includes an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. The operation unit 40 and the display unit 42 are each connected to the control device 20. The operation unit 40 is an input device through which an operator inputs an operation, and includes at least one of a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a touch panel and a vision monitor. The display unit 42 displays various images on the touch panel and the vision monitor based on the image signal input from the control device 20. The storage unit 44 stores various types of information related to mounting. The storage unit 44 is connected to the control device 20. The storage unit 44 stores information (data) related to the electronic component 80 and information (data) related to the substrate 8.

  As shown in FIGS. 2 and 3, the head 15 includes a base frame 31, a nozzle drive unit 34, a nozzle 32, an imaging device (substrate state detection unit) 36, and a height sensor (substrate state detection unit) 37. And a laser recognition device (component state detection unit, state detection unit) 38.

  The head 15 has a plurality of nozzles 32. A plurality of nozzles 32 are arranged in a line. In the present embodiment, six nozzles 32 are arranged in the X-axis direction.

  The base frame 31 supports the nozzle 32, the nozzle driving unit 34, the imaging device 36, the height sensor 37, and the laser recognition device 38. As described above, the base frame 31 is movable in the X-axis direction and the Y-axis direction by the operation of the head moving mechanism 16. When the base frame 31 is moved by the operation of the head moving mechanism 16, each of the nozzle 32, the nozzle driving unit 34, the imaging device 36, the height sensor 37, and the laser recognition device 38 supported by the base frame 31. Moves together with the base frame 31.

  The nozzle 32 holds the electronic component 80 releasably. In the example shown in FIGS. 2 and 3, the nozzle 32 is a suction nozzle 321 that sucks and holds the electronic component 80. The suction nozzle 321 includes a suction mechanism that sucks and holds the electronic component 80. An opening 33 is provided at the tip of the suction nozzle 321. By sucking air from the opening 33, the electronic component 80 is adsorbed and held at the tip of the suction nozzle 321. The suction nozzle 321 includes a shaft 32a. An opening 33 is provided at the tip of the shaft 32a. A pipe (flow path) that connects the opening 33 and the vacuum system (suction device) is provided inside the shaft 32a. The electronic component 80 is held by the suction nozzle 321 by performing a suction operation from the opening 33 in a state where the tip of the suction nozzle 321 including the opening 33 is in contact with the electronic component 80. The electronic component 80 is released from the suction nozzle 321 by releasing the suction operation from the opening 33.

  The imaging device 36 includes a camera. The imaging device 36 can acquire an image of the substrate 8. In addition, the imaging device 36 can acquire an image of the reference mark FM formed on the surface 8A of the substrate 8. In addition, the imaging device 36 can acquire an image of the electronic component 80 mounted on the substrate 8. In addition, the imaging device 36 can acquire an image of the electronic component 80 existing in the component supply unit 14. The imaging device 36 can acquire an image of an object arranged not only in the substrate 8 and the electronic component 80 but also in a region where the head 15 faces.

  The height sensor 37 detects the distance between the head 15 and the object facing it. The height sensor 37 can detect the distance from the substrate 8 and the distance from the electronic component 80 mounted on the substrate 8. The height sensor 37 irradiates a light emitting element that emits laser light (detection light) and an object disposed at a position facing the head 15, and can receive at least part of the laser light reflected by the object. A light receiving element.

  The laser recognition device 38 detects the state of the electronic component 80. The state of the electronic component 80 includes at least one of the shape of the electronic component 80 and the posture of the electronic component 80 held by the nozzle 32. The laser recognition device 38 detects the state of the electronic component 80 held by the nozzle 32. The laser recognition device 38 is built in a bracket 50 connected to the lower part of the base frame 31. The laser recognition device 38 includes a light source 38a that emits laser light (detection light), and a light receiving element 38b that can receive at least part of the laser light emitted from the light source 38a. The light source 38a is a light emitting element that can emit laser light. The light receiving element 38b is disposed at a position facing the light source 38a. With respect to the Z-axis direction, the light source 38a and the light receiving element 38b are arranged at the same position (height). The laser recognition device 38 detects the state of the electronic component 80 by irradiating the electronic component 80 held by the nozzle 32 with laser light.

  Next, the nozzle drive unit 34 will be described. FIG. 4 is a diagram illustrating an example of the nozzle driving unit 34. The nozzle drive unit 34 includes an actuator (Z-axis motor) 341 that can move the nozzle 32 in the Z-axis direction and an actuator (θZ motor) 342 that can move the nozzle 32 in the θZ direction.

  As shown in FIG. 4, the head 15 includes a base frame 31, a guide portion 101 provided on the base frame 31, a movable member 102 that is guided by the guide portion 101 and can move in the Z-axis direction, and the base frame 31. And an actuator (Z-axis motor) 341 that moves the movable member 102 in the Z-axis direction. A ball screw 111 is connected to the Z-axis motor 341 via a coupling 110.

  The head 15 includes an actuator (θZ motor) 342, a pulley 108 connected to the θZ motor 342, a spline bearing 107, a timing belt 109 supported by the pulley 108 and the spline bearing 107, a pulley 108, and a timing belt. 109 and a vertical rotation drive unit bearing 105 connected to the θZ motor 342 through a spline bearing 107. The spline bearing 107 is disposed inside the vertical rotation drive unit bearing 105. The vertical rotation drive unit bearing 105 is connected to the shaft 32a. A rotation bearing 106 is disposed on the outer periphery of the vertical rotation drive unit bearing 105. An outer peripheral portion of the rotary bearing 106 is fixed to the base frame 100. The movable member 102 is provided with a lower rotary bearing 141 and an upper rotary bearing 142 that rotatably support the shaft 32a. The shaft 32a can be moved in the Z-axis direction and can be moved (rotated) in the θZ direction by the vertical rotation drive unit bearing 105.

  A nut portion 118 that meshes with the ball screw 111 is fixed to a part of the movable member 102. When the ball screw 111 is rotated by the operation of the Z-axis motor 341, the nut portion 118 moves in the Z-axis direction. When the nut portion 118 moves in the Z-axis direction, the movable member 102 to which the nut portion 118 is fixed also moves in the Z-axis direction. Thereby, the nozzle 32 including the shaft 32a is moved in the Z-axis direction.

  The movable member 102 has a deformed portion 112 between the shaft 32a and the nut portion 118. The deformation part 112 includes a circular hole provided in the movable member 102. A strain gauge 113 is disposed on the deforming portion 112. In place of the strain gauge 113, a load cell may be disposed in the deforming portion 112.

  For example, when the electronic component 80 held by the nozzle 32 is mounted on the substrate 8, if at least a part of the electronic component 80 (lead 84) contacts the substrate 8 and movement (lowering) of the nozzle 32 is prevented, As the torque generated by the actuator 341 increases, the detection value of the strain gauge (load cell) 113 increases. Thus, in this embodiment, the head 15 can detect whether or not at least a part of the electronic component 80 held by the nozzle 32 has contacted the substrate 8. In the following description, one or both of the strain gauge (load cell) 113 and the actuator 341 capable of detecting whether or not at least a part of the electronic component 80 held by the nozzle 32 is in contact with the substrate 8 is appropriately detected by the detection device 100. Called. The detection device 100 can detect whether or not at least a part of the electronic component 80 (lead 84) held by the nozzle 32 has contacted the substrate 8. An example of the technology regarding the detection apparatus 100 is disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-174822.

  The nozzle drive unit 34 includes an actuator 341 that can move the nozzle 32 in the Z-axis direction and an actuator 342 that can move the nozzle 32 in the θZ direction. The nozzle 32 is moved in the Z-axis direction and the θZ direction by the operation of the nozzle drive unit 34. The nozzle 32 is supported by the base frame 31 via the nozzle driving unit 34. The base frame 31 is moved in the X-axis direction and the Y-axis direction by the operation of the head moving mechanism 16. The nozzle 32 supported by the base frame 31 can move in the X-axis direction and the Y-axis direction by the operation of the head moving mechanism 16. That is, in the present embodiment, the nozzle 32 can be moved in the X-axis direction and the Y-axis direction by the operation of the head moving mechanism 16, and can be moved in the Z-axis direction and the θZ direction by the operation of the nozzle driving unit 34. is there. In the present embodiment, the driving device 26 can move the nozzle 32 in at least four directions of the X axis, the Y axis, the Z axis, and θZ. Note that the driving device 26 may be capable of moving the nozzle 32 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  Next, the gripping nozzle 322 will be described. As described above, in the present embodiment, the nozzle 32 includes the suction nozzle 321 and the gripping nozzle 322. Note that the gripping nozzle 322 may be referred to as a gripper nozzle 322. For example, when it is difficult for the suction nozzle 321 to hold the electronic component 80, the gripping nozzle 322 is used.

  FIG. 5 is an explanatory diagram illustrating an example of the gripping nozzle 322. FIG. 6 is an explanatory diagram for explaining the holding operation of the gripping nozzle 322. The gripping nozzle 322 has a fixed arm 692, a movable arm 694, and a drive unit 696 that can move the movable arm 694. The movable arm 694 is supported by the main body of the gripping nozzle 322. The movable arm 694 can rotate around a fulcrum 695. The fulcrum 695 includes, for example, a hinge mechanism that rotatably connects the movable arm 694 and the main body of the gripping nozzle 322. The movable arm 694 is rotatable about the fulcrum 695 as an axis (rotation axis) so that the portion facing the fixed arm 692 moves from one of the directions approaching and moving away from the fixed arm 692 to the other. The drive unit 696 can move the movable arm 694 so that a portion of the movable arm 694 that faces the fixed arm 692 moves from one of the directions approaching and moving away from the fixed arm 692 to the other. The drive unit 696 is operated by a drive source (air pressure) that drives the suction nozzle 321. The movable arm 694 moves relative to the fixed arm 692 by suctioning air or releasing suction from the drive unit 696 of the gripping nozzle 322. As the driving unit 696 moves, the movable arm 694 moves in a direction away from a direction in which the portion facing the fixed arm 692 approaches the fixed arm 692.

  The gripping nozzle 322 holds the electronic component 80 releasably. As shown in FIG. 6, the gripping nozzle 322 reduces the distance between the fixed arm 692 and the movable arm 694 while at least a part of the electronic component 80 exists between the fixed arm 692 and the movable arm 694. The electronic component 80 can be held (gripped). The gripping nozzle 322 holds (holds) the electronic component 80 from above.

  The head 15 can be exchanged from one of the suction nozzle 321 and the gripping nozzle 322 to the other. The electronic component mounting apparatus 10 can appropriately hold the electronic component 80 by selecting the type of the nozzle 32 that holds the electronic component 80 according to the type of the electronic component 80 to be held. Specifically, depending on the electronic component 80 to be held, whether to use the suction nozzle 321 or the gripping nozzle 322 is selected, and furthermore, by switching which nozzle among the types of nozzles is used, More types of electronic components 80 can be mounted with the electronic component mounting apparatus 10.

  Next, the electronic component 80 according to the present embodiment will be described. FIG. 7 is a front view showing an example of the electronic component 80 according to the present embodiment. FIG. 8 is a side view showing an example of the electronic component 80 according to the present embodiment. FIG. 9 is a plan view showing an example of the electronic component 80 according to the present embodiment. In the present embodiment, the electronic component 80 is an insertion type electronic component (lead type electronic component, radial lead type electronic component). The electronic component 80 has a main body portion 82 and leads 84 connected to the main body portion 82. The lead 84 may be referred to as a pin 84.

  The main body 82 has an upper surface 82A, a lower surface 82B facing the opposite direction of the upper surface 82A, and a side surface 82C connecting the upper surface 82A and the lower surface 82B. The lead 84 is disposed so as to protrude from the lower surface 82B. The lead 84 has a base end portion 84A connected to the main body portion 82 (the lower surface 82B) and a tip end portion 84B that is an end portion on the opposite side to the base end portion 84A. A part of the lead 84 is bent. That is, the lead 84 has a bent portion 84C. The bent portion 84C is provided between the distal end portion 84B and the proximal end portion 84A. The distal end portion 84B, the bent portion 84C, and the proximal end portion 84A are arranged in the same plane (in the XZ plane in the example shown in FIG. 8). In the present embodiment, the position of the distal end portion 84B and the position of the proximal end portion 84A in the X axis direction are substantially equal. The bent portion 84C is provided so as to protrude in the + X direction between the distal end portion 84B and the proximal end portion 84A. The electronic component 80 has a plurality of leads 84. A plurality of leads 84 are arranged in the Y-axis direction in the drawing. In the present embodiment, the electronic component 80 has four leads 84. Each of the plurality of (four) leads has a base end portion 84A, a tip end portion 84B, and a bent portion 84C.

  In the present embodiment, the suction nozzle 321 holds (sucks) the main body portion 82 of the electronic component 80. The suction nozzle 321 sucks and holds the upper surface 82A of the main body portion 82. The gripping nozzle 322 holds (holds) the main body 82 of the electronic component 80. The gripping nozzle 322 holds the side surface 82 </ b> C of the main body portion 82.

  Next, the substrate 8 according to the present embodiment will be described. FIG. 10 is a plan view showing a part of the substrate 8 according to this embodiment. FIG. 11 is a cross-sectional view showing a part of the substrate 8 according to this embodiment. The substrate 8 is a member on which the electronic component 80 is mounted (mounted). The substrate 8 is a plate-like member. The substrate 8 has a front surface (upper surface) 8A and a back surface (lower surface) 8B facing the opposite direction of the front surface 8A. The front surface 8A and the back surface 8B are substantially parallel.

  The substrate 8 has holes (insertion holes, substrate holes) 81 into which the leads 84 of the electronic component 80 are inserted. The hole 81 of the substrate 8 is a through hole. The hole 81 is formed so as to connect the front surface 8A and the back surface 8B. The end (opening end) of the hole 81 on the surface 8A side is connected to the surface 8A. In the following description, the opening end of the hole 81 on the surface 8A side is appropriately referred to as an opening 83. The opening 83 is provided on the surface 8A of the substrate 8. A surface 8 </ b> A of the substrate 8 is disposed around the opening 83.

  The electronic component 80 is mounted on the substrate 8 by inserting the leads 84 into the holes 81 of the substrate 8. The lead 84 is inserted into the hole 81 through the opening 83. In a state where the lead 84 is inserted into the hole 81 and the electronic component 80 is mounted on the substrate 8, the lower surface 82 </ b> B of the main body 82 and the surface 8 </ b> A of the substrate 8 face each other. In the present embodiment, the substrate 8 has a plurality (four) of openings 83 (holes 81) so that each of the plurality (four) of leads 84 is inserted. As shown in FIG. 10, on the surface 8A of the substrate 8, a plurality (four) of openings 83 are arranged in the Y-axis direction.

  In the present embodiment, the lead 84 has a bent portion 84C. By inserting the lead 84 having the bent portion 84 </ b> C into the hole 81 of the substrate 8, the inserted lead 84 is suppressed from coming out of the hole 81 of the substrate 8.

  A wiring pattern is provided on the surface 8A of the substrate 8. Solder is provided on the surface of the wiring pattern by reflow, and the solder functions as a joining member that joins the wiring pattern and the electronic component 80. In addition, the board | substrate 8 should just be a member in which the electronic component 80 can be mounted (mountable), and the structure is not specifically limited.

  Next, the shape recognition operation of the electronic component 80 by the laser recognition device 38 will be described with reference to FIGS. FIG. 12 is an explanatory diagram for explaining an operation of recognizing the shape of the electronic component 80. FIG. 13 is an explanatory diagram for explaining the shape recognition operation of the electronic component 80. FIG. 14 is an explanatory diagram for explaining the shape recognition operation of the electronic component 80. FIG. 15 is an explanatory diagram for explaining the shape recognition operation of the electronic component 80. FIG. 16 is an explanatory diagram for explaining the shape recognition operation of the electronic component 80. FIG. 17 is an explanatory diagram for explaining an operation of recognizing the shape of the electronic component 80. FIG. 18 is a schematic diagram illustrating an example of a recognition operation detection result.

  The electronic component mounting apparatus 10 detects the shape of the electronic component 80 using the laser recognition device 38. As shown in FIGS. 12 and 13, the laser recognizing device 38 has a laser beam (detection light) from the light source 38a in a state where at least a part of the electronic component 80 is disposed between the light source 38a and the light receiving element 38b. The laser beam reaching the light receiving element 38b is detected by the light receiving element 38b, and the shape of the electronic component 80 disposed between the light source 38a and the light receiving element 38b is detected.

  The shape of at least a part of the electronic component 80 arranged in the detection area MA of the laser recognition device 38 is detected by the laser recognition device 38. The detection region MA of the laser recognition device 38 is a region where the laser recognition device 38 can detect the shape, and includes an irradiation region of laser light (detection light) emitted from the light source 38a. In the present embodiment, laser light (detection light) emitted from the light source 38a travels in a direction parallel to the Y axis. Further, a plurality of laser beams are emitted from the light source 38a. The plurality of laser beams are arranged in the X-axis direction. As shown in FIG. 14, in this embodiment, the detection area MA is long in the X-axis direction. Further, the detection area MA is substantially parallel to the X axis. The control device 20 adjusts the position of the nozzle 32 that holds the main body 82 by controlling the drive device 26 so that the detection target portion of the electronic component 80 is arranged in the detection region MA of the laser recognition device 38. The detection target part is a part whose shape is detected by the laser recognition device 38. In the example shown in FIGS. 13 and 14, a part of the main body 82 is arranged in the detection area MA as a detection target part.

  The laser recognition device 38 moves the electronic component 80 by detecting the shape of the electronic component 80 held by the nozzle 32 in one direction and then moving or rotating the nozzle 32 by the driving device 26 (nozzle driving unit 34). Alternatively, the shape of the electronic component 80 is detected by turning. As described above, the rotation of the electronic component 80 changes the direction in which the electronic component 80 is irradiated with the laser light and the angle of the light receiving element 38b with respect to the electronic component 80, as shown in FIG.

  As illustrated in FIG. 16, the control device 20 adjusts the position (height) of the electronic component 80 in the Z-axis direction, and the light source 38 is disposed between the light source 38 a and the light receiving element 38 b. Laser light (detection light) is emitted from 38a (step S11). At least a part of the laser light emitted from the light source 38a is received by the light receiving element 38b. Thereby, the shape of at least a part of the electronic component 80 is detected by the laser recognition device 38. That is, the laser light blocked by the electronic component 80 does not reach the light receiving element 38b or its intensity is reduced. Thereby, the laser recognition apparatus 38 can detect the shape of the electronic component 80 in the cross section of the measured angle based on the distribution of the laser light received by the light receiving element 38b. In the present embodiment, the laser recognition device 38 detects the end of the laser beam received by the light receiving element 38b and detects the outermost shape of the electronic component 80 in that direction. Thereafter, the control device 20 starts rotating the electronic component 80 (rotation in the θ direction) (step S12).

  After the rotational speed of the rotation of the electronic component 80 reaches a constant speed, the control device 20 starts detecting the shape of the electronic component 80 in the predetermined direction by the laser recognition device 38 (step S13). The laser recognition device 38 emits laser light from the light source 38a in a state where the electronic component 80 is disposed between the light source 38a and the light receiving element 38b, and at least part of the laser light emitted from the light source 38a. Light is received by the light receiving element 38b. The electronic component mounting apparatus 10 detects the shape of one round of the electronic component 80 by repeating the detection of the shape of the electronic component 80 by the method of step S13 while rotating the electronic component 80 (step S14). Thereby, the shape of the electronic component 80 in all directions is detected. As described above, the laser recognition device 38 detects the shape from the direction of one round and superimposes the detection results of each direction as shown in FIG. Can be accurately detected. For example, when the detection target part is at least a part of the main body part 82, the laser light (detection light) is emitted from the light source 38a in a state where the main body part 82 (detection target part) is arranged in the detection area MA of the laser recognition device 38. , And at least part of the laser light from the light source 38a is detected by the light receiving element 38b, so that the laser recognition device 38 can detect the shape of the main body 82 as shown in FIG. .

  Next, an example of processing for detecting the shape of the electronic component 80 will be described with reference to FIGS. 19, 20, and 21. In the present embodiment, at least the shape of the lead 84 of the electronic component 80 is detected using the laser recognition device 38. FIG. 19 is a flowchart illustrating an example of a procedure for detecting the shape of the lead 84. FIG. 20 is an explanatory diagram for explaining the relationship between the electronic component 80 and the detection area MA of the laser recognition device 38. FIG. 21 is a schematic diagram showing the relationship among the light source 38 a, the light receiving element 38 b and the lead 84 of the laser recognition device 38 when detecting the shape of the lead 84.

  The control device 20 determines a detection target part of the electronic component 80 (step S22). The detection target part is a part whose shape is detected by the laser recognition device 38. The control device 20 determines a detection target part whose shape is detected in the electronic component 80. The electronic component 80 has a main body portion 82 and leads 84. In the present embodiment, at least the lead 84 is determined as a detection target site.

  The shape of the electronic component 80 (lead 84) is different in the Z-axis direction. For example, the shape of the lead 84 at the proximal end portion 84A, the shape of the lead 84 at the distal end portion 84B, and the shape of the lead 84 at the bent portion 84C are different. In the present embodiment, each of the plurality of lead 84 portions different in the Z-axis direction is determined as a detection target portion. In the present embodiment, at least the proximal end portion 84A, the distal end portion 84B, and the bent portion 84C of the lead 84 are determined as detection target portions. The control device 20 adjusts the position (height) of the nozzle 32 holding the electronic component 80 in the Z-axis direction, and sequentially arranges a plurality of detection target portions of the lead 84 in the detection region MA of the laser recognition device 38. Then, the shape of each of the plurality of detection target parts is detected using the laser recognition device 38.

  For example, as shown in FIG. 20, when detecting the shape of the lead 84 at the base end portion 84A, the laser light (detection) is detected from the light source 38a in a state where the base end portion 84A is arranged in the detection region MA of the laser recognition device 38. Light). Then, by detecting at least a part of the laser light from the light source 38a by the light receiving element 38b, the laser recognition device 38 can detect the shape of the lead 84 at the base end portion 84A. Further, when detecting the shape of the lead 84 at the distal end portion 84B, laser light (detection light) is emitted from the light source 38a in a state where the distal end portion 84B is disposed in the detection region MA of the laser recognition device 38. Then, by detecting at least a part of the laser light from the light source 38a by the light receiving element 38b, the laser recognizing device 38 can detect the shape of the lead 84 at the tip end portion 84B. Further, when detecting the shape of the lead 84 in the bent portion 84C, laser light (detection light) is emitted from the light source 38a in a state where the bent portion 84C is disposed in the detection area MA of the laser recognition device 38. The laser recognition device 38 can detect the shape of the lead 84 in the bent portion 84C by detecting at least a part of the laser light from the light source 38a with the light receiving element 38b.

  The control device 20 controls the drive device 26 so that at least a part of the lead 84 is disposed in the detection region MA of the laser recognition device 38, and relates to the Z-axis direction of the electronic component 80 held by the nozzle 32. Adjust the position. As shown in FIG. 21, when the light source 38a and the light receiving element 38b are arranged in the Y-axis direction, and the laser light (detection light) emitted from the light source 38a travels parallel to the Y axis, the light source 38a and the light receiving element 38b. The position of the electronic component 80 (lead 84) with respect to the laser recognition device 38 is determined such that a plurality (four) of leads 84 are arranged in the Y-axis direction. As described with reference to FIG. 8 and the like, in the present embodiment, the proximal end portion 84A, the distal end portion 84B, and the bent portion 84C are arranged in the same plane (in the example shown in FIGS. 8 and 21, in the XZ plane). Is done. In the present embodiment, the position of the proximal end portion 84A and the position of the distal end portion 84B in the X-axis direction are substantially equal. The bent portion 84C is provided so as to protrude in the + Z direction between the distal end portion 84B and the proximal end portion 84A. The plural (four) leads 84 are arranged in a direction parallel to the Y axis perpendicular to the XZ plane on which the base end portion 84A, the tip end portion 84B, and the bent portion 84C are arranged. In the present embodiment, laser light (detection light) is provided between the light source 38a and the light receiving element 38b so that the positional relationship among the base end portion 84A, the distal end portion 84B, and the bent portion 84C in the XZ plane is detected. Lead direction between the light source 38a and the light receiving element 38b so that the traveling direction (Y-axis direction) is perpendicular to the plane (XZ plane) on which the base end portion 84A, the distal end portion 84B, and the bent portion 84C are arranged. 84 is arranged.

  As shown in FIG. 21, when detecting the shape of the lead 84, the lead 84 closest to the light source 38a among the four leads 84 is irradiated with laser light (detection light). For example, when detecting the shape of the lead 84 in the bent portion 84C, the bent portion 84C is disposed in the detection region MA of the laser recognition device 38, and the bent portion 84C is irradiated with laser light (detection light). . FIG. 21 shows a recognition process when the drive device 26 is sequentially moved in the vertical direction (recognition states are overlapped to the base end portion 84A84A, the bent portion 84C, and the front end portion 84B).

  In the state where the lead 84 is disposed between the light source 38a and the light receiving element 38b, the laser recognition device 38 irradiates the detection area MA with laser light from the light source 38a and receives the laser light with the light receiving element 38b. The laser light blocked by the lead 84 does not reach the light receiving element 38b, or its intensity is reduced. As a result, the laser recognition device 38 can detect the shape of the lead 84 in the XZ plane based on the distribution of the laser light received by the light receiving element 38b.

  For example, when detecting the shape of the lead 84 at the base end portion 84A, the control device 20 determines the base end portion 84A as a detection target site. The control device 20 adjusts the position (position in the Z-axis direction) of the nozzle 32 holding the main body portion 82 so that the base end portion 84B is disposed in the detection region MA of the laser recognition device 38. In other words, the control device 20 controls the drive device 26 to adjust the position of the electronic component 80 held by the nozzle 32 in the Z-axis direction, and lasers the proximal end portion 84A (detection target portion) of the lead 84. It arrange | positions to the detection area MA of the recognition apparatus 38 (step S24).

  In a state where the position of the electronic component 80 in the Z-axis direction is adjusted and the base end portion 84A (detection target portion) is arranged in the detection region MA of the laser recognition device 38, the control device 20 outputs laser light (detection) from the light source 38a. Light). That is, laser light is emitted from the light source 38a in a state where the lead 84 (base end portion 84A) is disposed between the light source 38a and the light receiving element 38b. At least a part of the laser light emitted from the light source 38a is applied to the base end portion 84A disposed in the detection area MA. At least a part of the laser light emitted from the light source 38a is detected by the light receiving element 38b. Thereby, the shape of the lead 84 at the base end portion 84A disposed between the light source 38a and the light receiving element 38b is detected by the laser recognition device 38 (step S26).

  After detecting the shape of the lead 84 at the base end portion 84A (detection target portion) in step S26, the control device 20 determines whether or not the detection process has ended (step S28). That is, the control device 20 determines whether or not the detection of the shape in the detection target part determined in step S22 is completed.

  The control device 20 determines that the detection is not completed in step S28, and starts a process of detecting the shape of the lead 84 at the distal end portion 84B. That is, the control device 20 adjusts the position (position in the Z-axis direction) of the nozzle 32 holding the main body portion 82 so that the tip end portion 84B is disposed in the detection area MA of the laser recognition device 38. The control device 20 controls the drive device 26 to adjust the position of the electronic component 80 held by the nozzle 32 in the Z-axis direction, so that the tip end portion 84B (detection target portion) of the lead 84 is positioned in the laser recognition device 38. In the detection area MA (step S24).

  In a state where the position of the electronic component 80 in the Z-axis direction is adjusted and the distal end portion 84B (detection target site) is arranged in the detection region MA of the laser recognition device 38, the control device 20 outputs laser light (detection light) from the light source 38a. ). That is, laser light is emitted from the light source 38a in a state where the lead 84 (tip portion 84B) is disposed between the light source 38a and the light receiving element 38b. At least a part of the laser light emitted from the light source 38a is applied to the tip end portion 84B disposed in the detection area MA. At least a part of the laser light emitted from the light source 38a is detected by the light receiving element 38b. Thereby, the shape of the lead 84 at the tip portion 84B disposed between the light source 38a and the light receiving element 38b is detected by the laser recognition device 38 (step S26).

  After detecting the shape of the lead 84 at the distal end portion 84B (detection target portion) in step S26, the control device 20 determines whether or not the detection process has ended (step S28). That is, the control device 20 determines whether or not the detection of the shape in the detection target part determined in step S22 is completed.

  The control device 20 determines that the detection is not completed in step S28, and starts a process of detecting the shape of the lead 84 in the bent portion 84C. That is, the control device 20 adjusts the position (position in the Z-axis direction) of the nozzle 32 holding the main body portion 82 so that the bent portion 84C is disposed in the detection region MA of the laser recognition device 38. The control device 20 controls the driving device 26 to adjust the position of the electronic component 80 held by the nozzle 32 in the Z-axis direction, so that the bent portion 84C (detection target portion) of the lead 84 is detected by the laser recognition device 38. In the detection area MA (step S24).

  In a state where the position of the electronic component 80 in the Z-axis direction is adjusted and the bent portion 84C (detection target portion) is arranged in the detection region MA of the laser recognition device 38, the control device 20 emits laser light (detection light) from the light source 38a. ). That is, laser light is emitted from the light source 38a in a state where the lead 84 (bent portion 84C) is disposed between the light source 38a and the light receiving element 38b. At least a part of the laser light emitted from the light source 38a is applied to the bent portion 84C disposed in the detection area MA. At least a part of the laser light emitted from the light source 38a is detected by the light receiving element 38b. Accordingly, the shape of the lead 84 in the bent portion 84C disposed between the light source 38a and the light receiving element 38b is detected by the laser recognition device 38 (step S26).

  After detecting the shape of the lead 84 at the bent portion 84C (detection target site) in step S26, the control device 20 determines whether or not the detection process has been completed (step S28). That is, the control device 20 determines whether or not the detection of the shape in the detection target part determined in step S22 is completed. When it is determined that the detection is not finished (No), the control device 20 proceeds to step S24, performs the processing of step S24 and step S26 again, and detects the shape of the detection target part where the detection is not finished. The control device 20 detects the shape of the set detection target part by repeating the adjustment of the position of the electronic component 80 and the detection of the shape as described above.

  Note that the detection target portion of the lead 84 is not limited to the proximal end portion 84A, the distal end portion 84B, and the bent portion 84C. A part of the lead 84 between the distal end part 84B and the bent part 84C may be set as a detection target part, or a part of the lead 84 between the bent part 84C and the base end part 84A is set as a detection target part. May be.

  The interval (pitch) between the detection target portions in the Z-axis direction may be determined based on a target detection accuracy (shape detection accuracy). In other words, when detecting the shape of the lead 84 by moving the lead 84 (electronic component 80) in the Z-axis direction and sequentially arranging a plurality of detection target parts in the detection area MA, the lead 84 for the detection area MA is detected. May be determined based on a target detection accuracy (shape detection accuracy). For example, when it is desired to obtain the shape of the lead 84 in the vicinity of the bent portion 84C with high accuracy, as shown in FIG. 20, the control device 20 reduces the pitch pt of the detection target portion R and detects by the laser recognition device 38. Execute. Note that the control device 20 may execute detection by the laser recognition device 38 by increasing the pitch pt for the purpose of shortening the detection time, for example. The control device 20 adjusts the position (height) in the Z-axis direction of the nozzle 32 holding the electronic component 80, and changes the detection target portion arranged in the detection region MA of the laser recognition device 38. The shape of various positions (parts) of the electronic component 80 can be detected using the laser recognition device 38.

  FIG. 22 is a diagram illustrating an example of the lead 84 detected using the laser recognition device 38. In the present embodiment, the detection region MA of the laser recognition device 38 is arranged such that at least the base end portion 84A, the distal end portion 84B, and the bent portion 84C of the lead 84 are disposed in the detection region MA of the laser recognition device 38. On the other hand, laser light (detection light) is emitted from the light source 38a while moving the lead 84 (the nozzle 32 holding the main body portion 82) in the Z-axis direction, and at least of the laser light emitted from the light source 38a. A part is detected by the light receiving element 38b.

  As shown in FIG. 22, by detecting the shape of the lead 84 using the laser recognition device 38, in the coordinate system (coordinate system in the XZ plane) defined by the laser recognition device 38, the base end portion 84A, The positions of the distal end portion 84B and the bent portion 84C are defined. In this coordinate system, the position of the base end portion 84A is defined as point a, the position of the distal end portion 84B is defined as point b, and the position of the bent portion 84C is defined as point c. Point a is the center position of the base end portion 84A with respect to the X-axis direction, point b is the center position of the tip end portion 84B with respect to the X-axis direction, and point c is the tip of the bent portion 84C on the most + X side. Is the position. The point a is arranged on the + Z side with respect to the points b and c. The point c is arranged on the + X side from the points a and b. The point c is arranged on the −Z side with respect to the point a, and is arranged on the + Z side with respect to the point b. In the present embodiment, the position of point a and the position of point b in the X-axis direction are equal.

  Further, in this coordinate system, a virtual first straight line L1 connecting point a (base end portion 84A) and point b (tip end portion 84B) is defined. The first straight line L1 is parallel to the Z axis. Further, in this coordinate system, a virtual second straight line L2 that is parallel to the X axis and passes through the point c (bent portion 84C) is defined. The first straight line L1 and the second straight line L2 intersect perpendicularly. A point d is defined as an intersection of the first straight line L1 and the second straight line L2. Point c is an intersection of the second straight line L2 and the bent portion 84C.

  In the present embodiment, the control device 20 derives the shape of the entire lead 84 based on the detection results of each of the plurality of detection target portions of the lead 84. For example, the shape of the entire lead 84 may be derived based on the detection result at the proximal end portion 84A, the detection result at the distal end portion 84B, and the detection result at the bent portion 84C. That is, the control device 20 obtains the position of the point a, the position of the point b, and the position of the point c in the coordinate system, and connects (interpolates) the positions of these three points (points a, b, and c). Thus, the shape of the entire lead 84 may be obtained. Of course, the pitch pt of the detection target portions may be sufficiently reduced to increase the number of detection target portions, and the shape of the lead 84 as a whole may be derived based on the shape detection results in each of the many detection target portions. .

  Next, an example of a method for mounting the electronic component 80 on the substrate 8 using the electronic component mounting apparatus 10 described above will be described. FIG. 23 is a flowchart showing an example of the operation of the electronic component mounting apparatus 10 according to the present embodiment. The flowchart shown in FIG. 23 shows an outline of the overall processing operation of the electronic component mounting apparatus 10. Note that the processing illustrated in FIG. 23 is executed by the control device 20 controlling each unit.

  The production program is read into the control device 20 (step S52). The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After the production program is read, the control device 20 detects the state of the device (step S54). Specifically, the configuration of the component supply unit 14 (14f, 14r), the type of the electronic component 80 filled, the type of the prepared nozzle 32, and the like are detected.

  After the state of the apparatus is detected and preparation is completed, acquisition of advance data is performed (step S56). The preliminary data includes information (data) related to the electronic component 80 and information (data) related to the substrate 8, and includes various information necessary for mounting the electronic component 80 on the substrate 8. The information regarding the electronic component 80 includes information (data) regarding the shape of the electronic component 80. Information regarding the shape of the electronic component 80 includes information (data) regarding the shape of the lead 84. As described above, information regarding the shape of the electronic component 80 (lead 84) can be obtained using the laser recognition device 38. The prior data may be referred to as part data. The information related to the substrate 8 includes information (data) related to the size of the hole 81 (opening 83). The prior data includes information related to the position where the nozzle 32 holds the electronic component 80 (position related to the Z-axis direction) and information related to the detection target portion of the electronic component 80 detected by the laser recognition device 38. The acquired prior data (component data) is stored (stored) in the storage unit 44 connected to the control device 20.

  In the present embodiment, acquiring prior data includes acquiring information related to target values (target shape, reference shape) related to the shape of the electronic component 80 (lead 84). For example, the shape of a plurality of electronic components 80 (leads 84) is acquired using the laser recognition device 38, and an average value of information regarding the plurality of shapes is stored in the storage unit 44 as prior data (component data). Good. Further, design value information (design data) of the electronic component 80 (lead 84) may be stored in the storage unit 44 as prior data (component data).

  In step S56, an allowable range (allowable value) regarding the shape of the electronic component 80 (lead 84) is determined.

  The board 8 is carried into the electronic component mounting apparatus 10 (step S58). After the board | substrate 8 is carried in and the board | substrate 8 is arrange | positioned in the position which mounts the electronic component 80, the control apparatus 20 carries in the electronic component 80 (step S60).

  The control device 20 determines whether or not to detect the shape of the electronic component 80 using the laser recognition device 38 for each electronic component 80 (step S62).

  The detection of the shape of the electronic component 80 includes checking whether or not the electronic component 80 is defective. If it is determined in step S62 that shape detection is to be performed for each electronic component 80 (in the case of Yes), the control device 20 uses information (data) relating to the shape of the electronic component 80 (lead 84) carried in the laser. Obtained using the recognition device 38 (step S64). In the present embodiment, at least the shape of the lead 84 is detected.

  It should be noted that the lead 84 shape detection accuracy executed in step S64 may be higher than the lead 84 shape detection accuracy executed in step S56. For example, the pitch pt of the detection target part in the detection of the lead 84 performed in step S64 may be smaller than the pitch pt of the detection target part in the detection of the lead 84 performed in step S56. For example, the position of the bent portion 84C in the Z-axis direction may be different from the design value (target value) due to the individual difference (manufacturing error) of the electronic component 80 carried in step S60. In such a case, in order to accurately acquire the shape (position) of the bent portion 84C, the pitch pt of the detection target portion (detection target portion in the vicinity of the bent portion 84C) in the detection of the lead 84 performed in step S64 is set. The detection accuracy may be increased by reducing the size. The control device 20 may set the detection target part indicating the detection result having the longest distance between the points c and d among the detection results of the plurality of detection target parts as the bent portion 84C. The detection accuracy can be increased by setting the pitch pt to, for example, about 1 mm.

  The control device 20 compares the information regarding the shape of the lead 84 acquired using the laser recognition device 38 in step S64 with the information regarding the shape of the lead 84 acquired in advance in step S56 (step S66).

  Based on the result of the comparison in step S66, the control device 20 determines whether or not the electronic component 80 carried in in step S60 is appropriate (step S68). In other words, the control device 20 determines whether or not the carried electronic component 80 is a defective product. The control device 20 compares the detection result in step S66 with the preliminary data acquired in step S56, so that the electronic component 80 held in the nozzle 32 has a shape that matches the preliminary data (component data). It is determined whether the shape is within the allowable range with respect to the prior data, whether the shape is mountable, whether the lead 84 can be inserted into the hole 81, and the like.

  The determination of whether or not the electronic component 80 is appropriate includes the determination of whether or not the detected shape (dimension) of the electronic component (lead) is within an allowable range. The determination of whether or not the detected shape of the electronic component (lead) is within an allowable range is based on the outermost dimension of the plurality (four) of leads (the lead arranged most on the −Y side among the four leads). The distance between the lead and the lead arranged on the + Y side) is included in the allowable range. Further, the detected outermost shape of the lead may be compared with the hole of the board into which the lead is inserted to determine whether the interval between the outermost shapes of the leads is within the allowable range of the interval between the insertion holes. Further, for example, it may be determined whether the distance between the point c and the point d as described with reference to FIG. 22 is equal to or less than a predetermined tolerance value (within a tolerance range) in step S56.

  Further, the determination as to whether or not the electronic component 80 is appropriate includes determination as to whether or not the detected electronic component 80 matches the electronic component 80 to be mounted. For example, based on the feature point of the shape of the lead 84, it may be determined whether the electronic component 80 held by the nozzle 32 is the electronic component 80 to be mounted. The feature points of the shape of the lead 84 include, for example, at least one of the number of the leads 84, the interval between the leads 84, the length, the diameter, and the shape.

  Moreover, the control apparatus 20 may determine whether the electronic component 80 is hold | maintained at the nozzle 32 in the state which can be mounted as a result of comparing a detection result and prior data.

  When it is determined in step S62 that the shape detection is not performed for each electronic component 80, the control device 20 determines the shape of the electronic component 80 (lead 84) acquired in advance in step S56. The process after step S68 is performed.

  In step S68, when it is determined that the electronic component 80 is not appropriate (defective product) (No in step S68), the control device 20 discards the electronic component 80 held by the nozzle 32 ( Step S70). The control device 20 moves the nozzle 32 to a position facing the component storage unit 19, and throws (disposes) the electronic component 80 held by the nozzle 32 into the component storage unit 19. After the electronic component 80 is discarded, a new electronic component 80 is carried in (step S60). The new electronic component 80 is the same type of electronic component 80 as the discarded electronic component 80, and the process of mounting at the same mounting position (mounting position) of the substrate 8 is executed again.

  When it is determined in step S68 that the electronic component 80 is appropriate (Yes in step S68), the control device 20 mounts the electronic component 80 held by the nozzle 32 (step S72).

  After the mounting of the electronic component 80 is completed, the control device 20 carries out the board 8 (step S74). After the board | substrate 8 is carried out, the control apparatus 20 determines whether production is complete | finished (step S76). If it is determined in step S76 that the production is not finished (No), the electronic component mounting apparatus 10 proceeds to step S58 and executes the processes from step S58 to step S74. That is, the process of mounting the electronic component 80 on the board 8 is executed based on the production program. If it is determined in step S76 that the production is finished (Yes), this processing is finished.

  As described above, the control device 20 reads the production program, performs various settings, and then mounts the electronic component 80 on the substrate 8 to manufacture the substrate 8 on which the electronic component 80 is mounted.

  Next, an example of processing for acquiring prior data (component data) (step S56 in FIG. 23) will be described with reference to the flowchart shown in FIG.

  As described above, the preliminary data includes various kinds of information necessary for mounting the electronic component 80 on the substrate 8. The preliminary data includes information (data) related to the electronic component 80 and information (data) related to the substrate 8. In the present embodiment, information regarding the substrate 8 on which the electronic component 80 is mounted is acquired. Specifically, information regarding the dimension of the hole 81 (opening 83) of the substrate 8 is acquired. In the present embodiment, the opening 83 is circular. Information relating to the diameter (or radius) of the opening 83 is acquired as prior data. The information regarding the dimension of the opening 83 may be design value information (design data). Based on the acquired information, the dimension of the opening 83 is determined (step S562). Information regarding the dimensions of the opening 83 is stored (stored) in the storage unit 44.

  Information (data) related to the shape of the electronic component 80 is acquired (step S564). Information regarding the shape of the electronic component 80 includes information (data) regarding the shape of the lead 84. Information regarding the shape of the electronic component 80 (lead 84) can be obtained using the laser recognition device 38. The information regarding the shape of the electronic component 80 (lead 84) may be design value information (design data). Information regarding the shape of the electronic component 80 (lead 84) is stored (stored) in the storage unit 44. In the present embodiment, a plurality of pieces of information regarding the shape of the electronic component 80 (lead 84) are acquired and stored in a database.

  As described above, the advance data (component data) includes information regarding the target value (target shape, reference shape) regarding the shape of the electronic component 80 (lead 84). For example, the shape of a plurality of electronic components 80 (leads 84) is acquired using the laser recognition device 38, and an average value of information regarding the plurality of shapes is stored in the storage unit 44 as prior data (component data). Good.

  In the present embodiment, an allowable value for the shape of the electronic component 80 (lead 84) is determined based on the information acquired in step S564 (step S566). For example, an allowable value as to whether or not the shape of the lead 84 can be inserted into the opening 83 of the substrate 8 is determined.

  Next, an example of a process for mounting (mounting) the electronic component 80 on the substrate 8 (step S72 in FIG. 23) will be described with reference to FIGS. In the present embodiment, the process of mounting the electronic component 80 on the substrate 8 includes the process of inserting the lead 84 of the electronic component 80 into the opening 83 (hole 81) of the substrate 8. FIG. 25 is a flowchart illustrating an example of processing for mounting (mounting) the electronic component 80 on the substrate 8. FIG. 26 is an explanatory diagram for explaining a movement path of the nozzle 32 that holds the main body 82 of the electronic component 80. FIG. 27 to FIG. 32 are diagrams schematically showing a procedure for mounting the electronic component 80 on the substrate 8. The electronic component 80 is mounted on the substrate 8 while being held by the nozzle 32. 27 to 32, the illustration of the nozzle 32 that holds the electronic component 80 (main body portion 82) is omitted. 27 to 32, the opening 83 is exaggerated. The dimension (diameter) of the opening 83 may be set to, for example, 1.5 times or more and 5 times or less of the dimension (thickness) of the cross section of the lead 84. The size of the opening 83 may be, for example, about twice the size of the lead 84 or about three times.

  The control device 20 determines a moving path of the nozzle 32 (electronic component 80) for inserting the lead 84 into the opening 83 (hole 81) based on the shape of the lead 84 (step S722). The drive device 26 moves the nozzle 32 holding the main body 82 based on the movement path determined by the control device 20.

  As described above, in the present embodiment, the shape of the lead 84 is detected using the laser recognition device 38. The control device 20 determines the moving path of the nozzle 32 (electronic component 80) for inserting the lead 84 into the opening 83 (hole 81) based on the detection result of the laser recognition device 38. That is, in the control device 20, based on the shape of the lead 84, the bent portion 84 </ b> C provided on the lead 84 is positioned inside the opening 83 from the first state where the tip end 84 </ b> B of the lead 84 is positioned inside the opening 83. Through the second state, the movement path of the nozzle 32 holding the main body portion 82 is determined so that the base end portion 84A of the lead 84 changes to the third state located inside the opening 83.

  FIG. 26 is an explanatory diagram for explaining the movement path of the nozzle 32. As shown in FIG. 26, the bent portion 84C is provided so as to protrude in the + X direction (second direction) between the distal end portion 84B and the proximal end portion 84A. In the present embodiment, at least one of the moving periods of the nozzle 32 for the change from the first state in which the distal end portion 84B is located inside the opening 83 to the third state in which the proximal end portion 84A is located inside the opening 83 is provided. In this portion, the movement path is determined so that the center of the opening 83 passes between the virtual first straight line L1 connecting the distal end portion 84B and the proximal end portion 84A and the lead 84.

  In the present embodiment, the point c that is the intersection of the virtual second straight line L2 and the bent part 84C that is parallel to the X axis and passes through the bent part 84C, and the second straight line L2 and the first straight line L1 The movement path is determined so that the center of the opening 83 passes through the center (middle point) M with the point d which is the intersection.

  In the present embodiment, the movement path is formed by the first portion 841 of the lead 84 between the distal end portion 84B and the bent portion 84C that is inclined with respect to the Z axis, the first straight line L1, and the second straight line L2. Is determined so as to include a first middle line LM1 connecting a vertex (point b) between the first straight line L1 and the first portion 841 and a midpoint M of the second straight line L2. In other words, the movement path is determined so that the center of the opening 83 passes through at least a part of the first middle line LM1.

  The movement path is a triangle formed by the second portion 842 of the lead 84 between the bent portion 84C and the base end portion 84A inclined with respect to the Z axis, the first straight line L1, and the second straight line L2. In acd, it is determined so as to include at least a part of the second middle line LM2 connecting the vertex (point a) between the first straight line L1 and the second portion 842 and the midpoint M of the second straight line L2. In other words, the movement path is determined so that the center of the opening 83 passes through at least a part of the second middle line LM2.

  After the movement path is determined, as shown in FIG. 27, the control device 20 moves the nozzle 32 holding the main body portion 82 in the XY plane so that the tip portion 84B of the lead 84 is positioned at the center of the opening 83. Move (step S724).

  In the present embodiment, the lead 84 is recognized by the VCS unit 17 (image recognition device, camera) while being held by the nozzle 32, and the position of the tip 84B in the coordinate system of the VCS unit 17 is determined. The control device 20 is formed on the surface 8A of the substrate 8 using the photographing device 36 (camera) while detecting the position of the transport mechanism 12H in the XY plane using a substrate position detection device (not shown). The reference mark FM is detected. The positional relationship between the fiducial mark FM and the opening 83 is known, for example, by processing (step S56) for acquiring prior data (including design data of the substrate 8). Thereby, the position of the opening 83 in the coordinate system of the substrate position detecting device is determined. Further, the size of the opening 83 is known by the process of acquiring prior data (step S56). The control device 20 associates the coordinate system of the VCS unit 17 with the coordinate system of the substrate position detection device, so that the positional relationship between the tip 84B of the lead 84 and the opening 83 (the center of the opening 83) in the XY plane. Can be requested. As a result, the control device 20 can position the tip end portion 84 </ b> B of the lead 84 at the center of the opening 83. Note that the position of the tip 84B may be determined using the laser recognition device 38 instead of the VCS unit 17. By associating the coordinate system of the laser recognition device 38 with the coordinate system of the substrate position detection device, the positional relationship between the tip 84B of the lead 84 and the opening 83 (the center of the opening 83) in the XY plane is obtained. May be.

  Next, the control device 20 moves the nozzle 32 in the X-axis direction and the Y direction so that the state in which the tip 84B of the lead 84 is located at the center of the opening 83 changes to the state in which the lead 84 contacts the edge of the opening 83. Move (lower) in the -Z direction without moving in the axial direction. That is, as shown in FIG. 28, the control device 20 lowers the electronic component 80 until the lead 84 contacts the edge of the opening 83 (a part of the substrate 8) (step S726). The control device 20 can determine whether or not the lead 84 has contacted the edge (substrate 8) of the opening 83 based on the detection result of the detection device 100 described with reference to FIG. Thus, in this embodiment, the movement path changes from the state in which the tip 84C of the lead 84 is located at the center of the opening 83 to the state in which the lead 84 contacts the edge of the opening 83. A path that moves in the −Z direction without moving in the axial direction and the Y-axis direction is included.

  Next, the control device 20 derives the amount of the lead 84 inserted into the opening 83 (hole 81) based on the size of the opening 83 and the shape of the lead 84 (step S728).

  The diameter W of the opening 83 is smaller than the distance between the points c and d. In a state where the lead 84 is in contact with the edge (substrate 8) of the opening 83, the third straight line L3 orthogonal to the first straight line L1 and connecting the contact portion of the lead 84 with the edge of the opening 83 and the first straight line L1 has a diameter. Half of W (ie W / 2). That is, when the lead 84 is inserted into the opening 83 (hole 81) until the lead 84 comes into contact with the edge (substrate 8) of the opening 83, the first straight line L1 is arranged at the center of the opening 83. The amount of the lead 84 inserted into the opening 83 depends on the dimension (W / 2) of the third straight line L3 and the inclination angle of the first part 841 (the angle formed by the third straight line L3 and the first part 841) θ. Can be based on.

  After the lead 84 contacts the edge of the opening 83, the control device 20 starts moving the nozzle 32 in the X-axis direction while moving the nozzle 32 in the −Z direction. As shown in FIG. 29, the control device 20 moves the nozzle 32 holding the electronic component 80 so that the center of the opening 83 passes through the first middle line LM1.

  The control device 20 moves the nozzle 32 in the −X direction while moving the nozzle 32 in the −Z direction so that the bent portion 84 </ b> C changes to the second state located inside the opening 83. The control device 20 moves in the −X direction while moving the nozzle 32 holding the electronic component 80 in the −Z direction so that the center of the opening 83 moves along the first middle line LM1. As a result, the state shown in FIG. 29 is changed to the state shown in FIG. 30 (second state). In the second state shown in FIG. 30, the center of the opening 83 passes through the midpoint M.

  The control device 20 moves the nozzle 32 to the electronic component 80 so that the bent portion 84C changes from the second state where the bent portion 84C is located inside the opening 83 to the third state where the base end portion 84A is located inside the opening 83. Move in the + X direction while moving in the Z direction. That is, the control device 20 moves (falls) in the −Z direction while moving the nozzle 32 holding the electronic component 80 in the XY plane until the base end portion 84A is disposed inside the opening 83 (step S40). S730).

  Thereby, the state shown in FIG. 30 (second state) is changed to the state shown in FIG. 32 (third state) through the state shown in FIG. Thus, the process of mounting the electronic component 80 on the substrate 8 is completed.

  In the movement period of the nozzle 32 for the change from the second state to the third state, the control device 20 moves the nozzle 32 holding the electronic component 80 so that the center of the opening 83 passes through the second middle line LM2. Moving. In the third state shown in FIG. 32, at least a part of the lower surface 82B of the main body portion 82 and the surface 8A of the substrate 8 are in contact with each other. In a state where the lower surface 82 </ b> B of the main body 82 and the surface 8 </ b> A of the substrate 8 are in contact, the base end portion 84 </ b> A of the lead 84 is disposed inside the opening 83.

  Thus, in the present embodiment, the bent portion 84C has a + X direction (second axis (X-axis direction or Y-axis direction in a plane parallel to the surface of the substrate) between the distal end portion 84B and the base end portion 84A. ) In a second direction (X-axis direction or Y-axis direction) parallel to the first direction), the movement path of the nozzle 32 is the first where the tip 84B is located inside the opening 83. -X direction (third direction opposite to the second direction) while the nozzle 32 moves in the -Z direction (first direction) so that the bent portion 84C changes from the state to the second state where the bent portion 84C is located inside the opening 83. And the nozzle 32 moves in the −Z direction so that the bent state 84C changes from the second state where the bent portion 84C is located inside the opening 83 to the third state where the base end portion 84A is located inside the opening 83. Move in + X direction (second direction) while moving in (first direction) That includes a second path, the.

  As described above, according to the present embodiment, when the lead 84 having the bent portion 84 </ b> C is inserted into the opening 83 of the substrate 8, the leading end portion 84 </ b> B of the lead 84 is from the first state positioned inside the opening 83. The movement path of the nozzle 32 holding the electronic component 80 (main body portion 82) for changing to the third state in which the base end portion 84A is located inside the opening 83 is parallel to the X axis while moving in the −Z direction. By including a path that moves in the directions (+ X direction and −X direction), the lead 84 can be smoothly inserted into the opening 83 of the substrate 8. Therefore, the electronic component 80 is restrained from being loaded, and the yield and the performance of the electronic component 80 are reduced.

  Further, if the lead 84 is bent in the Y-axis direction, it becomes a path that moves in the directions parallel to the Y-axis (+ Y direction and -Y direction) while moving in the -Z direction. Further, if the lead 84 is bent in a spiral shape, it becomes a path that moves in the anti-spiral shape while moving in the −Z direction. Thus, the movement path for canceling the bent shape of the lead 84 moves while the nozzle 32 moves in the first direction (Z-axis direction) parallel to the first axis (Z-axis direction) perpendicular to the surface of the substrate 8. This is a path that moves in a direction parallel to the surface of the substrate 8 (X-axis direction or Y-axis direction).

  Further, according to the present embodiment, the movement path of the nozzle 32 is changed so that the tip 84B of the lead 84 changes from the state where it is positioned at the center of the opening 83 to the state where the lead 84 contacts the edge of the opening 83. Including a path that moves in the first direction (Z-axis direction) without moving in the direction parallel to the two axes (X-axis direction or Y-axis direction), and the second after the lead 84 contacts the edge of the opening 83 The movement of the nozzle 32 in a direction parallel to the axis is started.

  Further, according to the present embodiment, the first intersection (point c), the second straight line L2, and the first straight line between the virtual second straight line L2 and the bent part 84C that are parallel to the second axis and pass through the bent part 84C. The movement path is determined so that the center of the opening passes through the center M of the second intersection (point d) with L1.

  Further, according to the present embodiment, the first path and the second path have the same moving distance in a plane parallel to the surface of the substrate 8. That is, after the head moving mechanism 16 moves the nozzle 32 holding the electronic component 80 to the substrate mounting target position, the nozzle 32 moves in the −X direction while moving in the −Z direction, and then moves in the −Z direction. While moving in the + X direction, the same predetermined amount. As a result, it can be accurately mounted at the mounting target position.

  In the present embodiment, since the lead 84 is provided with the bent portion 84C, the lead 84 having the bent portion 84C is inserted into the hole 81 of the substrate 8, whereby the inserted lead 84 becomes the substrate. Escape from the eight holes 81 is suppressed. Therefore, a decrease in the performance of the manufactured device is suppressed.

  In the present embodiment, since the electronic component 80 is moved in the XY plane while moving in the −Z direction, the lead 84 can be smoothly inserted into the opening 83 even if the opening 83 is small.

  In the present embodiment, the movement path of the nozzle 32 may be determined so that the center of the opening 83 passes through the middle point M, or may be determined so that the center of the opening 83 does not pass through the middle point M. Good.

  In the present embodiment, the movement path of the nozzle 32 may be determined such that the center of the opening 83 passes through the first middle line LM1, or the center of the opening 83 does not pass through the first middle line LM1. It may be determined. In the present embodiment, the movement path of the nozzle 32 may be determined such that the center of the opening 83 passes through the second middle line LM2, or the center of the opening 83 does not pass through the second middle line LM2. It may be determined.

  In the present embodiment, the nozzle 32 does not move in the XY plane so that the state in which the tip 84B of the lead 84 is located at the center of the opening 83 changes to a state in which the lead 84 contacts the edge of the opening 83. It was decided to move in the -Z direction. The nozzle 84 may move in the −Z direction while moving in the XY plane, and the lead 84 may be brought into contact with the edge of the opening 83. The lead 84 is opened between the first state where the distal end 84B of the lead 84 is located inside the opening 83 and the third state where the base end 84A of the lead 84 is located inside the opening 83. It is not necessary to contact the 83 edge (substrate 8). Note that the lead 84 may contact the edge (substrate 8) of the opening 83 in at least a part of the period from the first state to the third state.

  In the present embodiment, each of the plural (four) leads 84 has a bent portion 84C. Among the plurality of leads 84, some of the leads 84 may have the bent portion 84C, and some of the leads 84 may not have the bent portion 84C. In that case, the movement path of the nozzle 32 that holds the main body portion 82 may be determined so that each of the plurality of leads 84 is smoothly inserted into the opening 83. For example, a first movement path that is optimal for inserting the lead 84 having the bent portion 84C into the opening 83, and a second movement path that is optimal for inserting the lead 84 not having the bent portion 84C into the opening 83, May be determined, and the nozzle 32 may be moved along a third movement path passing between the first movement path and the second movement path.

  Further, for example, in the electronic component 80 including five leads 84, when the two leads 84 have the bent portion 84C and the three leads 84 do not have the bent portion 84C (the three leads 84 are linear). A first movement path that is optimal for inserting the lead 84 having the bent portion 84C into the opening 83, and a second movement that is optimal for inserting the lead 84 having no bent portion 84C into the opening 83. After determining each of the routes, the first moving route is corrected with the weighting factor, and the third moving route passing between the first moving route and the second moving route corrected with the weighting factor is used. The nozzle 32 may be moved. Since the strength of the two leads 84 is lower than that of the three leads 84, the first moving path that is optimal for inserting the two leads 84 into the opening 83 is given priority over the second moving path. May be.

  Further, when the electronic component 80 includes a plurality of leads 84, when the strength of some of the leads 84 is lower than the strength of the other leads 84, the leads 84 having low strength are opened. The first moving path that is optimal for insertion into the 83 may be given priority over the second moving path that is optimal for inserting the lead 84 having a high strength into the opening 83. In other words, the first movement path is corrected with the weighting coefficient, and the nozzle 32 is moved along the third movement path between the first movement path and the second movement path corrected with the weighting coefficient. Also good.

  In the above-described embodiment, the example in which the plurality of leads 84 are arranged in the Y-axis direction and the leads 84 are bent in the XZ plane orthogonal to the Y-axis has been described. As shown in FIG. 33, at least some of the plurality of leads 84 may be bent in the YZ plane. That is, the bent portion 84C may be provided so as to protrude in the + Y direction (or −Y direction) between the distal end portion 84B and the proximal end portion 84A. In the example shown in FIG. 33, the base end portion 84A, the distal end portion 84B, and the bent portion 84C are arranged in the same plane (in the YZ plane in the example shown in FIG. 33). When detecting the shape of the lead 84, the traveling direction of the laser light (detection light) of the laser recognition device 38 is orthogonal to the surface on which the base end portion 84A, the tip end portion 84B, and the bent portion 84C are arranged. The positional relationship between the laser recognition device 38 and the lead 84 is adjusted. That is, in the control device 20, the surface on which the proximal end portion 84A, the distal end portion 84B, and the bent portion 84C are disposed is orthogonal to the traveling direction (Y-axis direction) of the laser light (detection light) of the laser recognition device 38. Thus, the drive device 26 is controlled to move (rotate) the nozzle 32 holding the electronic component 80 (main body portion 82) in the θZ direction. Also in the example shown in FIG. 33, when the shape of the lead 84 is detected by the laser recognition device 38, the control device 20 causes the tip of the lead 84 to be inside the opening 83 based on the detection result of the laser recognition device 38. The movement path of the nozzle 32 can be determined so as to change from the state in which the portion 84B is disposed to the state in which the base end portion 84A is disposed through the state in which the bent portion 84C is disposed.

  In the above embodiment, the electronic component 80 has a plurality of leads 84. One lead 84 may be provided on the electronic component 80. When the one lead 84 has the bent portion 84C, the state where the bent portion 84C is arranged from the state in which the tip portion 84B of the lead 84 is arranged inside the opening 32 based on the shape of the lead 84. The load applied to the electronic component 80 can be reduced by determining the movement path of the nozzle 32 so that the base end portion 84A is changed to the state where the base end portion 84A is disposed.

  Further, in the above-described embodiment, when data in which the shape of the lead is detected in advance is stored, an electronic component having a main body portion and a lead connected to the main body portion is provided on the surface of the substrate. An electronic component mounting method for mounting on a lead, the step of holding the main body portion with a nozzle, and a bent portion provided on the lead from the first state in which a tip portion of the lead is located inside the opening, The movement path of the nozzle holding the main body portion is determined so that the base end portion of the lead connected to the main body portion changes to the third state located inside the opening through the second state located inside the main body. And moving the nozzle holding the main body based on the determined moving path, and inserting a lead into the opening, the moving path including the nozzle being perpendicular to the surface of the substrate. The first axis Electronic component mounting method including a path for movement in a direction parallel to the surface of the substrate while moving in the line of the first direction is described. In addition, there is a step of detecting the shape of the lead when there is no lead shape data and a new electronic component is mounted, and the step of determining the movement path of the nozzle is based on the detection result of the shape of the lead. It may be done.

  Next, an example of an electronic component mounting system (mounting system) using the electronic component mounting apparatus 10 described above will be described with reference to FIGS. 34 and 35. FIG. 34 is a schematic diagram showing a schematic configuration of an electronic component mounting system. An electronic component mounting system (hereinafter also referred to as “mounting system”) 1 shown in FIG. 34 includes a pattern forming device 2, a reflow processing device 4, a transport device 6, a transport device 7, and an electronic component mounting device 10. Have. In the mounting system 1, each part is arranged so that the substrate 8 is transported in the order of the pattern forming device 2, the transport device 6, the electronic component mounting device 10, the transport device 7, and the reflow processing device 4.

  The pattern forming apparatus 2 is an apparatus for forming a solder paste pattern on the surface 8A of the substrate 8 and filling the holes 81 of the substrate 8 with the solder paste. The reflow device 4 heats the substrate 8 to a predetermined temperature, and temporarily melts the solder paste of the substrate 8, thereby bonding the substrate 8 in contact with the solder paste and the electronic component 80. In other words, the reflow device 4 adheres the mounted electronic component mounted on the solder paste pattern formed on the surface 8A of the substrate 8 and the substrate 8 with the pattern solder paste, and inserts into the hole 81. The lead 84 of the electronic component is bonded with a solder paste filled in the hole 81.

  The transport device 6 and the transport device 7 are devices that transport the substrate 8. The transport device 6 carries the substrate 8 processed and carried out by the pattern forming device 2 into the electronic component mounting device 10. The transport device 7 carries the substrate 8 processed and carried out by the electronic component mounting device 10 into the reflow processing device 4.

  The electronic component mounting apparatus 10 mounts the electronic component 80 on the substrate 8. The electronic component mounting apparatus 10 mounts a lead type electronic component as the electronic component 80. The electronic component mounting apparatus 10 can mount both the lead type electronic component and the mountable electronic component as the electronic component 80.

  FIG. 35 is a flowchart illustrating an example of the operation of the electronic component mounting system. The mounting system 1 prints a solder paste on the substrate 8 as step S960. That is, the mounting system 1 forms a solder paste pattern on the surface 8A of the substrate 8 and fills the holes 81 with the solder paste by using the pattern forming apparatus 2 in step S960. The mounting system 1 prints the solder paste on the substrate in step S960, and then carries the substrate 8 into the electronic component mounting apparatus 10 by the transport device 6, and in step S962, the electronic component mounting apparatus 10 attaches the lead-type electronic component to the substrate 8. And mounting electronic components. The mounting system 1 mounts the electronic component 80 on the substrate 8 in step S962, and then loads the substrate 8 on which the electronic component 80 is mounted by the transfer device 7 into the reflow processing device 4, and executes reflow processing in step S964. This process is terminated.

  As described above, the mounting system 1 mounts the lead-type electronic component and the mountable electronic component by the electronic component mounting apparatus 10, so that both the lead-type electronic component and the mountable electronic component can be processed in one flow process. Can be fixed to. Thereby, the mounting system 1 can simplify the configuration of the production line.

DESCRIPTION OF SYMBOLS 1 Mounting system 2 Pattern formation apparatus 4 Reflow processing apparatus 8 Board | substrate 10 Electronic component mounting apparatus 11 Case 12 Board | substrate conveyance part 14 Component supply unit 15 Head 16 Head moving mechanism 17 VCS unit 18 Replacement nozzle holding mechanism 19 Component storage part 20 Control apparatus 22 X-axis drive unit 24 Y-axis drive unit 26 Drive unit 31 Base frame 32 Nozzle 34 Nozzle drive unit 38 Laser recognition device 40 Operation unit 42 Display unit 44 Storage unit 80 Electronic component 82 Body unit 84 Lead 84A Base end unit 84B Tip unit 84C Bent part 321 Suction nozzle 322 Gripping nozzle

Claims (8)

An electronic component mounting apparatus for mounting an electronic component having a main body and a plurality of leads connected to the main body on a substrate having an opening on the surface,
A nozzle for holding the main body,
A light source that emits laser light and a light receiving element that can receive at least a part of the laser light emitted from the light source, and irradiates the plurality of leads of the electronic component held by the nozzle with the laser light And a laser recognition device for detecting the shape of each of the plurality of leads,
The base of the lead that is connected to the main body portion from the first state in which the tip portion of the lead is located inside the opening to the second state in which the bent portion provided in the lead is located inside the opening. A control device for determining a movement path of the nozzle holding the main body based on a detection result of the laser recognition device , so that an end portion changes to a third state located inside the opening;
A drive device for moving the nozzle holding the main body based on the movement path determined by the control device;
The moving path includes an electronic component mounting apparatus including a path in which the nozzle moves in a direction parallel to the surface of the substrate while moving in a first direction parallel to a first axis perpendicular to the surface of the substrate. The bent portion is provided so as to protrude in a second direction parallel to a second axis in a plane parallel to the surface of the substrate between the distal end portion and the base end portion,
The movement path includes a first path in which the nozzle moves in the first direction so as to change from the first state to the second state, and moves in a third direction opposite to the second direction; The electronic component mounting apparatus according to claim 1, further comprising: a second path in which the nozzle moves in the second direction while moving in the first direction so as to change from the second state to the third state.   Between at least a part of the movement period of the nozzle for the change from the first state to the third state, between a virtual first straight line connecting the tip portion and the base end portion and the lead. The electronic component mounting apparatus according to claim 2, wherein the movement path is determined so that the center of the opening passes.   4. The electronic component mounting apparatus according to claim 3, wherein the first path and the second path have the same movement distance in a plane parallel to the surface of the substrate. The movement path is such that the nozzle moves in a direction parallel to the second axis so that the lead changes from a state where the tip of the lead is positioned at the center of the opening to a state where the lead contacts the edge of the opening. A path that travels in the first direction without
The electronic component mounting apparatus according to claim 3, wherein the nozzle starts to move in a direction parallel to the second axis after the lead contacts the edge of the opening.   The center of the first intersection of the imaginary second straight line passing through the bent portion and the second bent axis and the bent portion, and the second intersection of the second straight line and the first straight line is parallel to the second axis. The electronic component mounting apparatus according to claim 3, wherein the movement path is determined so that the center passes.   The movement path is parallel to the first portion of the lead, the first straight line, and the second axis between the distal end portion and the bent portion inclined with respect to the first axis, and the bent portion. In a triangle formed by a virtual second straight line passing through the first straight line connecting the vertex between the first straight line and the first portion and the midpoint of the second straight line, and the first In a triangle formed by the second portion of the lead between the bent portion and the base end portion inclined with respect to the axis, the first straight line, and the second straight line, the first straight line and the The electronic component mounting apparatus according to any one of claims 3 to 6, including at least a part of a second middle line connecting a vertex between the second part and a midpoint of the second straight line. An electronic component mounting method for mounting an electronic component having a main body and a plurality of leads connected to the main body on a substrate having an opening on a surface thereof,
Holding the body with a nozzle;
Irradiating a plurality of the leads of the electronic component held by the nozzle with a laser beam, receiving at least a part of the laser beam, and detecting a shape of each of the plurality of leads;
The base of the lead that is connected to the main body portion from the first state in which the tip portion of the lead is located inside the opening to the second state in which the bent portion provided in the lead is located inside the opening. Determining a movement path of the nozzle holding the main body based on the detection result of the shape of the lead so that the end portion changes to a third state located inside the opening;
Moving the nozzle holding the main body based on the determined movement path, and inserting the lead into the opening, and
The electronic component mounting method, wherein the moving path includes a path in which the nozzle moves in a direction parallel to the surface of the substrate while moving in a first direction parallel to a first axis perpendicular to the surface of the substrate.