JP6370299B2 - Component mounting apparatus, control method thereof, and program for component mounting apparatus - Google Patents

Description

  The present invention relates to a technique for mounting a component having a lead terminal on a substrate.

  2. Description of the Related Art Conventionally, a component mounting apparatus has been provided that can mount not only a surface mount type electronic component but also a type of electronic component in which a lead wire protrudes downward from a component main body. This is because the component body of the electronic component is held by the suction nozzle of the transport head, and the component is transported by the transport head so that the position where the lead terminal originally exists matches the position of the lead insertion hole formed on the board. The lead terminal is inserted into the lead insertion hole by lowering the transport head at that position. If the lead terminal is not bent, the component main body comes into close contact with the substrate by lowering the transport head as it is, and the component is mounted at a regular mounting position.

  However, if the lead terminal is bent, even if the transport head is lowered while the insertion end of the lead terminal is aligned with the lead insertion hole, as long as the component is lowered straight, The terminal hits the edge of the lead insertion hole and the component cannot be lowered. Then, if the component is mounted in a state shifted from the board, or if the positioning boss protrudes from the component body, the boss will not enter the positioning hole of the board. Become.

  In order to prevent such mounting defects, a component mounting apparatus as disclosed in, for example, Japanese Patent Application Laid-Open No. H10-260260 has been provided in which the bending of the lead terminal is detected in advance and the component can be mounted after straightening it. In this component mounting and insertion device, an imaging device for photographing the lower surface of the component is provided in order to detect the bending of the lead terminal of the electronic component, and when the bending of the lead terminal is detected, the electronic component is held by the transport head. In this state, a variable guide portion that applies a force to the lead terminal to correct the bending of the lead terminal and a variable drive portion that drives the lead terminal are provided. As a result, even when there is a shape defect such as a bent lead terminal, an external force is applied to the lead wire to correct it, thereby preventing an electronic component from being mounted on the substrate.

JP-A-6-37492

  However, in the above prior art, since the bending is corrected by a correction mechanism externally added to the lead terminal, there is a problem that these mechanisms become complicated.

  An object of the present invention is to provide a component mounting apparatus capable of correctly mounting even a component having a bent lead terminal while suppressing the structure from becoming complicated.

  The component mounting apparatus disclosed in this specification is a component mounting apparatus that mounts a component on the substrate by inserting a lead terminal protruding from the component main body into a terminal insertion hole of the substrate, and holds the component main body. A transport head that transports the component to a predetermined position and lowers the component onto the substrate; an imaging device that captures an image of the component held by the transport head; and a control unit that controls the operation of the transport head. The control unit recognizes the position of the insertion end of the lead terminal based on the imaging result of the component by the imaging device, and the transport head so that the insertion end of the lead terminal coincides with the terminal insertion hole of the substrate. After moving the transport head down and causing the insertion end of the lead terminal to enter the terminal insertion hole, the transport head is further moved along the surface direction of the substrate, and again The descending make correction process is performed.

  According to this component mounting apparatus, the control unit recognizes the position of the insertion end of the lead terminal based on the imaging result of the component by the imaging device, and the transport head so that the insertion end of the lead terminal matches the terminal insertion hole of the substrate. , And then lowering the transport head, and then performing correction processing for further lowering the transport head along the plane of the substrate. By this correction processing, the component main body is moved in a state where the insertion end enters the terminal insertion hole and the insertion end is restrained, so that the bending of the lead terminal is corrected. Then, the component can be correctly mounted at the original mounting position on the substrate by the lowering of the transport head. Therefore, it is possible to correctly mount even a component having a bent lead terminal while suppressing the complexity of the structure.

  In the component mounting apparatus, the control unit calculates a bending amount of the lead terminal from a predetermined portion of the component main body recognized based on an image captured by the imaging device and a position of an insertion end of the lead terminal. The correction processing may be performed based on the amount of bending.

  According to this component mounting apparatus, the bending amount of the lead terminal is calculated from the predetermined part of the component main body and the position of the insertion end of the lead terminal, and correction processing is performed based on the bending amount. This makes it possible to reliably correct the bending of the lead terminal.

  In the component mounting apparatus, the control unit recognizes the position of the insertion end of the lead terminal and the position of another protrusion shorter than the lead terminal of the component based on the imaging result of the component by the imaging device, The amount of movement of the transport head along the surface direction of the substrate in the correction process may be calculated based on the position of the other protrusion and the position where the protrusion is inserted into the substrate.

  If the part has not only the lead terminal but also other protrusions shorter than this, and it is necessary to insert the protrusions together into the board, the lead insertion hole should be corrected by correcting the bending of the longest lead terminal. Even if it is inserted into the substrate, there is a concern that other protrusions cannot be inserted into the substrate. In view of this, according to this component mounting apparatus, the amount of movement of the front transport head in the correction process along the plane of the substrate is calculated based on the position of the other protruding portion and the insertion position of the protruding portion on the substrate. Therefore, the other protruding portions can be reliably inserted into the board, and the components can be correctly mounted at the original mounting positions after all.

  In the component mounting apparatus, when the bending amount of the lead terminal is larger than a limit value, the control unit moves the transport head to a predetermined component recovery position to release the holding of the component. The structure which performs may be sufficient.

  According to this component mounting apparatus, when it is determined that the bending amount of the lead terminal is larger than the limit value, the control unit executes the component collection process. Thereby, defective parts that cannot be inserted into the board can be eliminated.

  The component mounting apparatus may be configured such that the control unit does not perform the correction process when the bending amount of the lead terminal is within a predetermined range.

  According to this component mounting apparatus, the control unit does not perform the correction process when the bending amount of the lead terminal is within a predetermined range. Thereby, when the amount of bending of the lead terminal is small, the component can be mounted at the correct position by simply inserting the insertion end of the lead terminal into the terminal insertion hole and lowering the transport head, and the mounting time can be shortened.

  The technology disclosed in this specification records a component mounting apparatus, a method for controlling the component mounting apparatus, a program for a component mounting apparatus for realizing the functions of these apparatuses or methods, and a program for the component mounting apparatus. It can be realized in various modes such as a recording medium and a computer.

  According to the component mounting apparatus of the present invention, it is possible to provide a component mounting apparatus capable of correctly mounting even a component having a bent lead terminal while suppressing the complexity of the structure.

The top view which shows the component mounting apparatus in one Embodiment Electronic parts showing side view Side view showing component mounting equipment Block diagram showing electrical configuration of component mounting device and controller Flow chart showing the mounting process State transition diagram showing the state transition of the implementation process

<One Embodiment>
(Overall structure of component mounting equipment)
An embodiment of the present invention will be described with reference to FIGS. The component mounting apparatus 1 of the present embodiment is an apparatus for mounting an electronic component B (an example of a component) on the upper surface of a printed circuit board (hereinafter simply referred to as a substrate) P. As shown in FIG. 1, the component mounting apparatus 1 includes a transport conveyor 20 that transports a substrate P, a substrate support device 30 that supports the substrate P transported to a predetermined position, and an electronic circuit on the substrate P. A mounting work device 90 for mounting the component B is arranged.

  In the following description, the longitudinal direction of the base 10 (the left-right direction in FIG. 1) is referred to as the X direction. Further, the Y direction is a direction perpendicular to the longitudinal direction of the base 10 in the horizontal plane (up and down direction in FIG. 1), and the Z direction is a direction perpendicular to both the X direction and the Y direction (front side in FIG. 1). Shall be determined. Further, in FIG. 1, the description will be made assuming that the right hand side is the upstream side (loading side of the substrate P to be worked) and the left hand side is the downstream side (loading side of the worked substrate P).

  The base 10 has a rectangular shape that is long in the X direction. The base 10 has a transport conveyor (hereinafter simply referred to as a conveyor) 20 disposed at the center, a loading conveyor 12 disposed at the right end of the base 10 on the upstream side, and a carry-out conveyor 13 on the left end of the base 10 on the downstream side. Is arranged. These three conveyors 12, 13, and 20 are continuous with each other without any level difference, and the substrate P to be worked can be sequentially sent from the upstream side to the downstream side.

  A substrate stopper 25 capable of moving up and down is provided on the base 10, and the substrate P sent from the upstream side to the downstream side by the conveyor 20 is stopped at the mounting work position in the center of the base. And the board | substrate support apparatus 30 is provided in the base center, and supports the printed circuit board P stopped in the mounting operation position from the bottom.

  Also, on the base 10, component supply units 80 are provided at four locations around the mounting work position, and a plurality of feeders 85 as component supply devices are installed in the component supply unit 80 side by side in the X direction. Has been. The electronic component B is supplied from each feeder 85. And the electronic component B is mounted on the board | substrate P backed up by the board | substrate instruction | indication apparatus 30 in the mounting work position by the mounting work apparatus 90 mentioned later.

  There are two types of electronic components: surface mount type and those with lead terminals. These can be mixed and mounted on the substrate P. An example of the electronic component B with lead terminals is a mechanical relay. As shown in FIG. 2, this comprises a resin-molded component main body H and metal lead terminals L protruding from the lower surface thereof. On the lower surface of the component main body H, another protrusion (boss Q) having a low protrusion length different from that of the lead terminal L is integrally formed by the resin of the component main body H at a position offset to the side opposite to the lead terminal L. Is formed. The boss Q is shorter and thicker than the lead terminal L, and is used for the purpose of positioning and fixing the electronic component B on the substrate P.

  A pair of component recognition cameras 95 (an example of an imaging device) is installed on both sides in the Y direction on the base 10 with the conveyor 20 interposed therebetween. This component recognition camera 95 is for photographing the electronic component B sucked and held by a suction head 185 described later from the lower side.

  As shown in FIGS. 1 and 3, the mounting work device 90 includes a moving device 135 and a head unit 170 (an example of a transport head). The moving device 135 is a Cartesian coordinate robot having three XYZ orthogonal drive shafts. By driving these three drive shafts in combination by the controller 100 described later, the head unit 170 is moved above the base 10. It can be moved to any position.

  Specifically, as shown in FIGS. 1 and 3, a pair of support legs 141 are installed on the base 10 so as to straddle the conveyor 20. Both support legs 141 are located on both sides (both sides in the X direction) of the mounting work position, and both extend straight in the Y direction (up and down direction in FIG. 1).

  Both support legs 141 are provided with guide rails (Y direction guide shafts) 142 extending in the Y direction on the upper surfaces of the support legs, and head supports 151 guided by the left and right guide rails 142. 1, a Y-axis ball screw shaft (Y-direction drive shaft) 145 extending in the Y direction is attached to the support leg 141 located on the right side, and a ball nut (not shown) is further attached to the Y-axis ball screw shaft 145. It is screwed. A Y-axis motor 147 is provided at the shaft end of the Y-axis ball screw shaft 145.

  When the Y-axis motor 147 is driven, the ball nut advances and retreats along the Y-axis ball screw shaft 145. As a result, the head support 151 fixed to the ball nut, and thus the head unit 170 described below, horizontally moves in the Y direction along the guide rail 142 (Y-axis servo mechanism).

  As shown in FIG. 3, a guide member (X direction guide shaft) 153 extending in the X direction is installed on the head support 151, and the head unit 170 is movably attached to the guide member 153. . An X-axis ball screw shaft (X-direction drive shaft) 155 extending in the X direction is attached to the head support 151, and a ball nut is screwed onto the X-axis ball screw shaft 155.

  An X-axis motor 157 is provided at the shaft end of the X-axis ball screw shaft 155. When the X-axis motor 157 is driven, the ball nut advances and retreats along the X-axis ball screw shaft 155. As a result, the head unit 170 fixed to the ball nut moves in the X direction along the guide member 153 (X-axis servo mechanism).

  Therefore, the X-axis servo mechanism and the Y-axis servo mechanism are controlled in combination, so that the head unit 170 can move along the horizontal direction (XY direction), that is, the surface direction of the substrate P, on the base 10. It has become.

  The head unit 170 is provided with a suction head 185. The suction head 185 can be moved in the Z direction (up and down direction) and can be rotated around the Z axis (R direction) by a Z axis servo mechanism (not shown) provided with a Z axis ball screw. A suction nozzle 186 is provided at the tip of the suction head 185, and a suction force is generated at the tip of the suction nozzle 186 by driving a vacuum motor. The suction head 185 can hold the electronic component B by generating a suction force at the tip of the suction nozzle 186.

  As described above, the head unit 170 reciprocates between the component supply unit 80 and the mounting work position in the center of the base, and the suction head 185 appropriately moves up and down, so that the electronic component B is transferred from the component supply unit 80. The taken-out electronic component B is mounted on the substrate P backed up at the mounting work position.

(Electrical configuration of component mounting equipment)
Next, the electrical configuration of the component mounting apparatus 1 will be described with reference to FIG. In the component mounting apparatus 1 of the present embodiment, a controller 100 (an example of a control unit) shown in FIG. 1 controls the entire component mounting apparatus 1 including the component recognition camera 95 in an integrated manner.

  As shown in FIG. 4, the control controller 100 includes an arithmetic processing unit 110 configured by a CPU or the like, as well as a mounting program storage unit 120, a conveyance system data storage unit 130, a motor control unit 140, an external input / output unit 150, An image processing unit 160 is provided.

  The arithmetic processing unit 110 controls each unit by various programs such as a component mounting program stored in the mounting program storage unit 120 and a conveyance program stored in the conveyance system data storage unit 130.

  The motor control unit 140 includes a motor for driving the head unit 170 in each of the X, Y, and R directions, a motor for moving a suction head 185 described later in the Z direction, and an electronic component B on the suction head 185. A vacuum motor for generating a suction force for adsorbing the vacuum is controlled.

  The external input / output unit 150 is a so-called interface, so that a detection signal output from each sensor provided in the component mounting apparatus 1 is input, and a control signal for driving the board stopper 25 is output. It has become.

  Based on the captured image from the lower side of the electronic component B obtained from the component recognition camera 95, the image processing unit 160 is outside the tip (insertion end) of the lead terminal L, the tip of the boss Q, and the bottom surface of the component body H. The peripheral edge can be recognized, and the position coordinates (XY coordinates) in the XY plane can be acquired.

  The controller 100 executes the movement of the head unit 170 and the lifting / lowering operation of the suction head 185 at predetermined timing based on the various programs described above and the acquired various position information. Thus, the controller 100 can mount the electronic component B taken out from the component supply unit 80 on the board P.

(Electronic component B mounting flow)
The flow of the mounting process for mounting the electronic component B with lead terminals on the substrate P will be described with reference to FIGS. 5 and 6. First, the controller 100 sucks the electronic component B in the feeder 85 to the suction nozzle 186 by the suction head 185. Then, the controller 100 conveys the head unit 170 onto the component recognition camera 95 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination. Then, the controller 100 executes the following recognition process (S1).

  In this recognition process S1, the controller 100 determines the insertion end of the lead terminal L, the tip of the boss Q, and the bottom surface of the component main body H based on the captured image from the lower side of the electronic component B obtained from the component recognition camera 95. The position coordinate (XY coordinate) in the XY plane of the outer periphery of is acquired. Then, a center position M (an example of a predetermined portion) in the XY plane is calculated from the position of the outer peripheral edge of the bottom surface of the component body H, and a distance A (hereinafter referred to as a lead) between the center and the insertion end of the lead terminal L is calculated. The tip distance is calculated.

  The controller 100 calculates the calculated lead tip distance and the distance A0 between the center of the component main body H and the tip of the lead terminal L when the lead terminal L is not bent and the tip is in the correct position. Are compared, and the bending amount Δα (= A−A0) of the lead terminal is calculated (see FIG. 2). The bending amount Δα is calculated for each axis component for the X-axis and Y-axis coordinate axes, but in the following description, only the X-axis component will be described for the sake of simplification. Further, the lead tip distance A0 when the lead terminal L is not bent is measured in advance for each electronic component B and stored in the controller 100 in advance.

  Further, the controller 100 may calculate a distance F between the center position M and the tip of the boss Q (hereinafter referred to as a boss tip distance). However, since the boss Q is integrally formed with the resin of the component main body H, the boss Q hardly bends, and the boss tip distance F0 when the boss Q is not bent is substantially equal to the distance F described above.

  Next, the controller 100 determines whether other recognition processing is necessary (S2). The “other recognition process” means that, for example, when a mark indicating the installation direction of the electronic component B is attached to a predetermined location on the XY plane of the component main body H, the controller 100 recognizes the mark. Etc.

  For example, if the controller 100 determines that other recognition processing is necessary based on the component mounting program stored in the mounting program storage unit 120 (S2: YES), the control controller 100 returns to S1 and executes the recognition processing. On the other hand, when the controller 100 determines that no other recognition process is required (S2: NO), the controller 100 determines whether or not the electronic component B to be mounted on the board P can be mounted on the board P (S3). ).

  Here, the controller 100 compares the bending amount Δα of the lead terminal calculated in S1 with the limit value LM. When the controller 100 determines that the bending amount Δα of the lead terminal is larger than the limit value LM, that is, determines that the limit value LM <Δα, the controller 100 determines that the electronic component B cannot be mounted on the board P.

  When it is determined that the electronic component B cannot be mounted on the board P (S3: NO), the control controller 100 executes a disposal operation of the electronic component B (an example of a component collection process) (S4). In this discarding operation, the controller 100 moves the head unit 170 in the horizontal direction (XY direction), and moves the electronic component B to a discardable region (component recovery position GP). Then, the controller 100 stops the suction of the electronic component B by the suction head 185, releases the electronic component B, and drops the electronic component B to the component collection position GP.

  When the controller 100 determines that the electronic component B can be mounted on the board P (S3: YES), that is, when it determines that the limit value LM ≧ Δα, the component mounting stored in the mounting program storage unit 120 is performed. Based on the program, the X-axis servo mechanism and the Y-axis servo mechanism are controlled in combination to move the head unit 170 in the horizontal direction (XY direction) on the base 10 (S5).

  Specifically, the controller 100 controls the electronic component B by using the head unit 170 so that the insertion end of the lead terminal L of the electronic component B matches the terminal insertion hole SK that is the insertion position of the lead terminal L on the substrate P. B is moved (FIG. 6A).

  Next, the Z-axis servo mechanism is controlled to lower the suction head 185 by a predetermined amount vertically downward (Z direction). As a result, the insertion end of the lead terminal L is slightly inserted into the terminal insertion hole SK of the substrate P (FIG. 6B).

  Subsequently, the controller 100 determines whether or not position correction is necessary before the insertion of the lead terminal L into the terminal insertion hole SK is completed (S7). This can be determined, for example, by comparing the bending amount Δα of the lead terminal calculated in step S1 with a reference value ST that is a range in which the boss Q can be inserted into the board insertion hole SL. That is, the controller 100 determines that the boss Q is inserted into the board insertion hole SL even if the difference between the lead terminal bending amount Δα and the reference value (| Δα−ST |) assumes the clearance between the boss Q and the board insertion hole SL. If it exceeds the predetermined range that can be inserted into the position, it is determined that position correction is necessary.

  When the controller 100 determines that position correction is necessary (S7: YES), the controller 100 performs correction processing to insert the uninserted boss Q into the substrate insertion hole SL of the substrate P (S8). As a result of this correction processing, the controller 100 calculates the movement amount V from the boss tip distance F and the position of the substrate insertion hole SL, and moves the head unit 170 on the base 10 along the X axis and Y axis along the horizontal direction. Position correction may be performed by moving the axis by the movement amount V of each axis. However, since the boss Q is integrally formed of the resin of the component main body H as described above, the boss Q hardly bends. For this reason, the movement amount V and the bending amount Δα are substantially equal. Therefore, the controller 100 performs position correction on the base 10 by moving the head unit 170 by the bending amount Δα of the lead terminal L of each axis with respect to the X axis and the Y axis along the horizontal direction (FIG. 6C).

  After executing the position correction, the controller 100 moves the suction head 185 downward in the vertical downward direction (Z direction) based on the component mounting program stored in the mounting program storage unit 120 (S9). As a result, the controller 100 completes the insertion of the lead terminal L into the terminal insertion hole SK and the insertion of the boss Q into the substrate insertion hole SL (FIG. 6D).

  When the controller 100 determines that position correction is not necessary (S7: NO), the controller 100 does not perform position correction, and immediately executes the Z-axis operation (lowering of the suction head 185) process in step S9.

  When the difference (| Δα−ST |) between the bending amount Δα of the lead terminal and the reference value ST is within the reference range, the bending of the lead terminal L is small and the posture of the lead terminal L is close to the correct posture. It is shown that. For this reason, the controller 100 can mount the electronic component B at the correct position on the substrate P by simply lowering the suction head 185 without executing position correction.

(Effect of this embodiment)
According to the present embodiment, the controller 100 controls the head unit 170 so that the insertion end of the lead terminal L of the electronic component B matches the terminal insertion hole SK that is the insertion position of the lead terminal L on the substrate P. The electronic component B is moved (FIG. 6A). Next, the Z-axis servo mechanism is controlled to lower the suction head 185 by a predetermined amount vertically downward (Z direction). As a result, the insertion end of the lead terminal L is slightly inserted into the terminal insertion hole SK of the substrate P (FIG. 6B). Subsequently, the controller 100 performs position correction for inserting the uninserted boss Q into the substrate insertion hole SL that is the insertion position of the substrate P (FIG. 6C). Finally, the controller 100 moves the suction head 185 downward in the vertical downward direction (Z direction) based on the component mounting program stored in the mounting program storage unit 120, thereby entering the terminal insertion hole SK of the lead terminal L. And the insertion of the boss Q into the board insertion hole SL are completed (FIG. 6D). When the XY-axis operation in step S5 is performed, the component body H is moved along the XY plane while the insertion end of the lead terminal L enters the terminal insertion hole SK and the insertion end is restrained. The bending of the terminal L is corrected. Then, the electronic component B can be correctly mounted at the original mounting position on the substrate P by the subsequent lowering of the suction head 185 (S9).
As described above, in the present embodiment, when position correction is necessary (S7: YES), the XY axis operation in step S5 and steps S6 and S9 are performed using the XY axis drive mechanism and the Z axis drive mechanism that are originally provided. Since the Z-axis operation and the position correction in step S8 are performed, the bending of the lead terminal L is naturally corrected. Accordingly, a configuration for correcting the insertion posture of the lead terminal L is not required as compared with the conventional configuration in which the insertion posture of the lead terminal L is corrected by an additional external mechanism and the electronic component B is mounted on the substrate P. The electronic component B can be correctly mounted on the substrate P while suppressing an increase in the configuration of the insertion device.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and includes, for example, the following various aspects.

  In the above embodiment, the controller 100 has a configuration including one arithmetic processing unit 110. However, the controller 100 is not limited to this, and may have a configuration including a plurality of arithmetic processing units, a configuration including a hardware circuit such as an ASIC (Application Specific Integrated Circuit), or a configuration including both a hardware circuit and an arithmetic processing unit. Good. For example, a configuration in which a part or all of the mounting processing is executed by a separate arithmetic processing unit or hardware circuit may be used.

  In the above-described embodiment, the controller 100 determines whether the electronic component B to be mounted on the board P can be mounted on the board P, and determines the bending amount Δα of the lead terminal and the limit value LM. The configuration was compared. However, the present invention is not limited to this, and the controller 100 detects, for example, the stress applied from the lead terminal L to the suction head 185 by a stress sensor (not shown) while the suction head 185 is being lowered. When the stress exceeds the reference value, the control controller 100 determines that the lead terminal L has abutted against the board P itself, not the terminal insertion hole SK of the board P, so that the electronic component A configuration may be adopted in which the disposal operation is performed on the assumption that B cannot be mounted on the substrate P.

  In the above embodiment, the controller 100 executes the position correction (S8) only when the difference (| Δα−ST |) between the bending amount Δα of the lead terminal and the reference value ST is outside the reference range. However, the present invention is not limited to this, and the position correction in step S8 may be performed even if (| Δα−ST |) is within the reference range.

  In the above embodiment, the “other recognition process” means that when a mark or the like indicating the installation direction of the electronic component B is attached to a predetermined location on the XY plane of the main body, the controller 100 recognizes the mark. The treatment is given as an example. However, the present invention is not limited to this, and the “other recognition process” may be a process in which the controller 100 recognizes the tip of each lead terminal L separately when there are a plurality of lead terminals L and the lengths of the lead terminals L are different. .

In the embodiment described above, the electronic component B has an example in which the component main body H is provided with the lead terminal L and the boss Q having a projection length shorter than the lead terminal L. However, the present invention is not limited to this, and the present invention may be applied to the case where the electronic component B including two types of lead terminals having different protrusion lengths is mounted on the component main body H. Further, the electronic component B may be a passive component such as a capacitor with a lead terminal or a resistor, and can also be applied to a semiconductor product.
When an electronic component having two types of lead terminals having different lengths is mounted, both of the two types of lead terminals may be bent. When mounting such a component, the correction process in the controller 100 can be performed as follows. First, in the recognition process S1, in addition to the position of the insertion end of the lead terminal having the longer protrusion length, the position of the insertion end of the shorter lead terminal is also calculated. Subsequently, the head unit 170 is moved in the XY axes according to the position of the insertion end of the lead terminal having the longer protruding length (S5), thereby causing the lead terminal to enter the terminal insertion hole SK, and then the short terminal. The movement amount V in the XY-axis direction is calculated in accordance with the position of the insertion end of the other lead terminal, the Z-axis operation is performed after performing the necessary position correction in step S8, and the lead terminal is inserted into the board insertion hole. What is necessary is just to enter SL.

  In the above embodiment, when the controller 100 determines that position correction is necessary (S7: YES), the controller 100 performs the Z-axis operation (S9) separately after performing position correction (S8). A configuration in which the correction and the Z-axis operation are executed simultaneously may be employed.

  1: Component mounting apparatus 95: Component recognition camera 100: Controller 170: Head unit 185: Suction head 186: Suction nozzle B: Electronic component L: Lead terminal Q: Boss P: Board SK: Terminal insertion hole M: Center position Δα : Bending amount SL: Substrate insertion hole GP: Part collection position V: Movement amount

Claims (6)

In a component having a lead terminal protruding from a component main body and a boss integrally formed with the component main body and a boss having a protruding length shorter and thicker than the lead terminal, the protruding length being shorter than the thickness of the substrate, A component mounting apparatus for mounting the component on the board by inserting the lead terminal and the boss into a terminal insertion hole and a board insertion hole formed in the board, respectively.
A conveying head that holds the component body and conveys the component body to a predetermined position and lowers the component onto the substrate;
An imaging device that captures an image of a component held by the transport head;
A control unit for controlling the operation of the transport head,
The controller is
Recognizing the position of the insertion end of the lead terminal based on the imaging result of the component by the imaging device,
The transport head is moved so that the insertion end of the lead terminal coincides with the terminal insertion hole of the substrate, the transport head is lowered, and the insertion end of the lead terminal enters the terminal insertion hole,
A difference between a bending amount of the lead terminal calculated from a distance between the insertion end of the lead terminal and a predetermined part of the component and a reference value in which the boss can be inserted into the board insertion hole is within a predetermined range. If it has exceeded, correction processing is performed to move the transport head along the surface direction of the substrate by the amount of movement calculated from the position of the boss and the position of the substrate insertion hole, and then the transport head is moved again. Lowered, insert the boss into the board insertion hole,
If the stress applied to the transport head from the lead terminal exceeds a reference value, it is determined that the lead terminal has abutted against the board itself, not the terminal insertion hole of the board, and the component is A component mounting apparatus that controls to perform a discarding operation because it cannot be mounted on the board. The component mounting apparatus according to claim 1,
The component mounting apparatus, wherein the control unit calculates a bending amount of the lead terminal from a center position of the component body recognized based on an image captured by the imaging apparatus and a position of the insertion end of the lead terminal. The component mounting apparatus according to claim 1 or 2,
When the bending amount of the lead terminal is larger than a limit value, the control unit moves the transport head to a predetermined component collection position and performs a component collection process for unholding the component. . The component mounting apparatus according to claim 1 or 2,
The control unit does not perform the correction process when the difference between the bending amount of the lead terminal and the reference value is within the predetermined range. A conveyance head that holds the component body and conveys the component body to a predetermined position and lowers the component on the substrate;
An image pickup device that picks up an image of a component held by the transport head; and a lead terminal protruding from the component main body is inserted into a terminal insertion hole of the substrate so as to be integrated with the component main body. A control method for mounting the component on the board by inserting a boss formed in a board insertion hole having a projection length shorter and thicker than the lead terminal and having a projection length shorter than the thickness of the board. Because
The position of the insertion end of the lead terminal is recognized based on the imaging result of the component by the imaging device, and the conveyance head is moved so that the insertion end of the lead terminal coincides with the terminal insertion hole of the substrate. The head is lowered to allow the insertion end of the lead terminal to enter the terminal insertion hole, and the bending amount of the lead terminal calculated from the distance between the insertion end of the lead terminal and a predetermined part of the component and the boss are calculated. When the difference from the reference value ST that is the range that can be inserted into the substrate insertion hole exceeds a predetermined range, the transport head is moved by the amount of movement calculated from the position of the boss and the position of the substrate insertion hole. After carrying out correction processing to move along the surface direction of the substrate, the transport head is lowered again, and the boss is inserted into the substrate insertion hole,
If the stress applied to the transport head from the lead terminal exceeds a reference value, it is determined that the lead terminal has abutted against the board itself, not the terminal insertion hole of the board, and the component is A method for controlling a component mounting apparatus, wherein control is performed so that a discarding operation is performed as being unmountable on the board. A conveyance head that holds the component body and conveys the component body to a predetermined position and lowers the component on the substrate;
An imaging device for imaging the component held by the transport head, and inserting a lead terminal protruding from the component main body into a terminal insertion hole of the substrate so that the lead terminal is integrated with the component main body. A computer having a component mounting apparatus for mounting a component on the board by inserting a boss having a shorter projecting length than the board thickness into the board insertion hole. In addition,
The position of the insertion end of the lead terminal is recognized based on the imaging result of the component by the imaging device, and the conveyance head is moved so that the insertion end of the lead terminal coincides with the terminal insertion hole of the substrate. The head is lowered to allow the insertion end of the lead terminal to enter the terminal insertion hole, and the bending amount of the lead terminal calculated from the distance between the insertion end of the lead terminal and a predetermined part of the component and the boss are calculated. When the difference from a reference value that is a range that can be inserted into the substrate insertion hole exceeds a predetermined range, the transport head is moved by the amount of movement calculated from the position of the boss and the position of the substrate insertion hole. After carrying out correction processing to move along the surface direction of the substrate, the transport head is lowered again, and the boss is inserted into the substrate insertion hole,
If the stress applied to the transport head from the lead terminal exceeds a reference value, it is determined that the lead terminal has abutted against the board itself, not the terminal insertion hole of the board, and the component is A program for a component mounting apparatus that executes a process of controlling to perform a discarding operation because it cannot be mounted on the board.

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