JP3139739B2 - Pin correction device for wiring board and method for manufacturing wiring board using the same - Google Patents

Pin correction device for wiring board and method for manufacturing wiring board using the same

Info

Publication number
JP3139739B2
JP3139739B2 JP08292140A JP29214096A JP3139739B2 JP 3139739 B2 JP3139739 B2 JP 3139739B2 JP 08292140 A JP08292140 A JP 08292140A JP 29214096 A JP29214096 A JP 29214096A JP 3139739 B2 JP3139739 B2 JP 3139739B2
Authority
JP
Japan
Prior art keywords
pin
wiring board
perforated plate
pins
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP08292140A
Other languages
Japanese (ja)
Other versions
JPH10135392A (en
Inventor
一城 森川
正人 長崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP08292140A priority Critical patent/JP3139739B2/en
Publication of JPH10135392A publication Critical patent/JPH10135392A/en
Application granted granted Critical
Publication of JP3139739B2 publication Critical patent/JP3139739B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体集積回路
(IC)を載置するセラミックやプラスチック製のパッケ
ージ等の配線基板であって、その一方の表面に多数の外
部端子となるピンを多数植設した配線基板における上記
ピンの曲がりを矯正するピン矯正装置とこれを用いた配
線基板の製造方法に関する。
The present invention relates to a semiconductor integrated circuit.
A pin correction for correcting a bending of a pin on a wiring board, such as a ceramic or plastic package, on which (IC) is mounted, and on which a large number of pins serving as external terminals are implanted on one surface thereof. The present invention relates to an apparatus and a method for manufacturing a wiring board using the same.

【0002】[0002]

【従来の技術とその問題点】配線基板には、数十乃至数
百本のピンが互いに格子状または千鳥状の所定の位置に
植設され、それぞれが外部のプリント基板と通電可能に
接続される。ところで、各ピンは配線基板本体に対し垂
直に植設されていないと、プリント基板側の回路と通電
しなくなる。従って、配線基板本体から斜めに植設され
たり、途中から曲がったピンは、検査時等にその曲がり
を矯正している。係る矯正に用いる治具として、次のも
のがある。例えば、図6(A)のように、すり鉢状の孔1
02を多数穿設した矯正板100を用い、各孔102内
に配線基板WのピンPを挿入して手作業によって矯正す
るもの(実開平6−50359、実開昭62−8213
5)や、図6(B1)及び(B2)のように、複数のリブ114
を上面に突設した2組のブロック110,112を平行
に配置し、それらの各リブ114間に配線基板Wのピン
Pを挿入し、各ブロック110,112を互いに反対方
向に揺動させるもの(特開平2−275658)等が提案
されている。
2. Description of the Related Art On a wiring board, several tens to several hundreds of pins are planted at predetermined positions in a lattice or staggered pattern, and each of them is connected to an external printed board so as to be able to conduct electricity. You. By the way, if each pin is not implanted perpendicularly to the wiring board main body, electricity is not supplied to the circuit on the printed board side. Therefore, a pin that is obliquely implanted from the wiring board main body or bent from the middle corrects the bent at the time of inspection or the like. The following jigs are used for such correction. For example, as shown in FIG.
No. 02, the pin P of the wiring board W is inserted into each hole 102, and the pin is manually corrected by using the straightening plate 100 (Japanese Utility Model Laid-Open No. 6-50359, 62-8213).
5) and a plurality of ribs 114 as shown in FIGS. 6 (B1) and 6 (B2).
Are arranged in parallel with each other, and pins P of the wiring board W are inserted between the respective ribs 114 to swing the blocks 110 and 112 in directions opposite to each other. (JP-A-2-275658) and the like have been proposed.

【0003】しかし、上記矯正板を用いた手作業による
矯正では、作業者の熟練度によって品質や生産性がバラ
付き易く、場合によりピンの表面を傷付けることもあっ
た。一方、複数のブロックを用いる矯正では、配線基板
の種類毎における多数のピンの配列パターンに対応すべ
く、配列パターンに合致したリブを設けた複数のブロッ
クに取り替える必要があり、矯正の自動化には不向きで
あった。
However, in the manual correction using the above-mentioned correction plate, the quality and productivity tend to vary depending on the skill of the operator, and in some cases, the pin surface may be damaged. On the other hand, in straightening using a plurality of blocks, it is necessary to replace with a plurality of blocks provided with ribs that match the array pattern in order to correspond to the array pattern of a large number of pins for each type of wiring board. It was not suitable.

【0004】[0004]

【発明が解決すべき課題】本発明は、上記従来の技術が
抱える問題点を解決し、配線基板のピンの矯正を正確化
且つ自動化して生産性を向上させると共に、ピンの表面
を傷付けないように矯正できるピン矯正装置とこれを用
いた配線基板の製造方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, corrects and automates the correction of pins on a wiring board, improves productivity, and does not damage the surface of the pins. It is an object to provide a pin straightening device capable of straightening as described above and a method of manufacturing a wiring board using the same.

【0005】[0005]

【課題を解決する手段】本発明は、上記課題を解決する
ため、多数のガイド孔を明けた多孔板の各ガイド孔に配
線基板の各ピンを挿入し、この配線基板をそのピン植設
面に沿う方向に移動可能に保持しつつ、上記多孔板をピ
ン植設面に沿う方向に略円状軌跡の平行移動をさせるこ
とに着想して得られたものである。即ち、本発明の配線
基板のピン矯正装置は、表面に多数のピンを植設してな
る配線基板をそのピン植設面に沿う方向に移動可能に保
持する保持手段と、上記各ピンが挿入可能なガイド孔を
多数穿設してなる多孔板と、上記各ガイド孔に各ピンを
挿入した多孔板を、前記ピン植設面に沿う方向に略円状
軌跡の平行移動させる円状運動手段と、を備え、上記保
持手段は、上記配線基板に当接し、且つ該当接を保ちつ
つ配線基板を上記ピン植設面に沿う方向に移動可能に当
接する当接部と、この当接部を当接される配線基板に
し弾性的に付勢する付勢部と、を有する、ことを特徴と
する。上記によれば、配線基板に弾性的に当接するロー
ラ等の当接部によって、配線基板をそのピン植設面方向
に沿って移動可能に保持した状態で、多孔板が円状運動
するため、多孔板の各ガイド孔は大多数の正常なピンの
周面を回転すると共に、曲がっているピンのみを、傷付
けることなく本来の垂直向きに確実に矯正をすることが
できる。
According to the present invention, in order to solve the above-mentioned problems, each pin of a wiring board is inserted into each guide hole of a perforated plate having a large number of guide holes, and the wiring board is placed on a surface on which the pins are provided. This is obtained by conceiving that the perforated plate is moved in parallel along a substantially circular locus in the direction along the pin planting surface while being held movably in the direction along. In other words, the pin correcting device for a wiring board according to the present invention includes a holding means for holding a wiring board having a large number of pins implanted on its surface so as to be movable in a direction along the pin-implanting surface; A perforated plate having a large number of possible guide holes, and a circular motion means for translating the perforated plate with each pin inserted into each of the guide holes along a substantially circular locus in a direction along the pin planting surface. When, with the said holding means is in contact with the wiring board, and a contact portion that movably abuts the wiring board while maintaining the abutment in a direction along said pins planted設面, this abutment a biasing unit that parts against <br/> the wiring board to be abutted against the resiliently biased, and wherein the. According to the above, the abutment rollers resiliently contacting the wiring board, while movably held along the circuit board on the pin planted設面direction, since the perforated plate is circular movement In addition, each guide hole of the perforated plate rotates the peripheral surface of the majority of normal pins, and can reliably correct only the bent pin in the original vertical direction without damaging it.

【0006】また、前記円状運動手段が、トルクを発生
させる駆動源と、この駆動源のトルクを前記略円状軌跡
の平行移動の運動に変換する運動変換機構とを有す
ピン矯正装置も含まれる。更に、前記運動変換機構
が、前記多孔板の移動を、前記ピン植設面に沿う方向に
平行で且つ互いに直交する2軸方向に規制する2組のス
ライダと、この多孔板又は2組のスライダのうちの何れ
かの組に連結して設けてなる孔又は軸と、この孔又は軸
に回転可能に嵌合する凸部又は凹部が自己の回転中心に
対し偏心させて設けられ、且つ前記駆動源により回転さ
せられる回転体とを有するピン矯正装置も含む。以
上によれば、配線基板はそのピン植設面方向に移動可能
に保持されつつ、多孔板の各ガイド孔の円状軌跡に倣う
移動によって、各ピンを基板本体に対し垂直化させるこ
とができる。
Further, the circular motion means comprises a drive source for generating a torque, a motion conversion mechanism for converting the torque of the driving source to the movement of translation of the substantially circular trajectory, the pin correction device Is also included. Furthermore, two sets of sliders, wherein the movement conversion mechanism regulates the movement of the perforated plate in two axial directions parallel to and perpendicular to the direction along the pin planting surface, and this perforated plate or two sets of sliders A hole or a shaft provided in connection with any of the sets, and a convex or concave portion rotatably fitted to the hole or the shaft are provided eccentrically with respect to its own rotation center, and the drive having a rotating body which is rotated by the source, including pin correction device. According to the above, while the wiring board is movably held in the direction of the pin planting surface, each pin can be made perpendicular to the board body by moving along the circular locus of each guide hole of the perforated plate. .

【0007】また、前記多孔板のガイド孔が、この多孔
板の前記配線基板のピン植設面に向かって拡がる略円錐
台状のガイド部と、このガイド部に連続し、且つガイド
部よりも細い径を有する矯正部と、を有する、ピン矯正
装置も含まれる。この場合において、矯正部の直径
前記配線基板に植設された前記ピンの直径の1.5乃至
2倍にしたり、上記矯正部の直径、前記回転体の回転
中心からこの回転体に設けた前記凸部又は凹部の中心ま
での偏心距離の3分の一乃至2分の一の範囲にすること
が望ましい。以上によれば、配線基板をそのピンの軸方
向に移動させるのみで、各ピンはガイド孔内に容易に挿
入される。また、ピンと上記矯正部の隙間が適正化され
ると共に、各ガイド孔の円状運動を曲がったピンの矯正
に効果的な範囲にすることができる。尚、前記ピンが多
孔板に挿入された際のピンの挿入深さLに対して、前記
ガイド部の深さFをLの2分の一以上とすると、各ピン
の挿入を一層容易にすることができる。
A guide hole of the perforated plate has a substantially frustoconical guide portion extending toward a pin-implanting surface of the wiring board of the perforated plate, and is continuous with the guide portion and has a greater diameter than the guide portion. A pin straightening device having a straightening portion having a small diameter is also included. In this case, the diameter of the straightening part is
Or 1.5 to 2 times the wiring board to the implanted has been the pin diameter, the diameter of the straightening unit, to the center of the projections or recesses provided on the rotary member from the rotation center of the rotary body It is desirable to set the eccentric distance within a range of one third to one half. According to the above, each pin is easily inserted into the guide hole only by moving the wiring board in the axial direction of the pin. In addition, the gap between the pin and the straightening portion is optimized, and the circular motion of each guide hole can be set to an effective range for straightening a bent pin. In addition, when the depth F of the guide portion is set to one half or more of L with respect to the insertion depth L of the pin when the pin is inserted into the perforated plate, the insertion of each pin is further facilitated. be able to.

【0008】更に、前記配線基板を前記保持手段によっ
て保持するのに先立って、この配線基板の各ピンが多孔
板の各ガイド孔に各々挿入されたか否かを検出する検出
手段を有し、また、上記検出手段が、前記配線基板のう
ち前記ピン植設面の裏面における前記ガイド板からの高
さを測定する裏面高さ測定手段を有するピン矯正装置
も包含される。以上によれば、ピンがガイド孔に入らな
かったり、円錐台状のガイド部で止まって矯正が困難な
ピンを有する配線基板を例えばレーザ光の受光位置によ
って、自動的に検知することができ、ライン外への排出
を行うことが容易になる。尚、前記裏面高さの測定は、
配線基板裏面の中央付近を含む少なくとも1カ所以上の
任意の位置を測定することによって行われる。これによ
り、配線基板の種類に対応して自在に検出すべき位置を
設定することができる。
Further, prior to holding the wiring board by the holding means, there is provided detecting means for detecting whether or not each pin of the wiring board has been inserted into each of the guide holes of the perforated plate. The present invention also includes a pin straightening device, wherein the detecting means has a back surface height measuring means for measuring a height of the wiring board from the guide plate on a back surface of the pin planting surface. According to the above, the pin does not enter the guide hole, or the wiring board having the pin that is difficult to correct by stopping at the truncated cone-shaped guide portion can be automatically detected, for example, by the laser light receiving position, It is easy to discharge the gas to the outside of the line. In addition, the measurement of the back surface height is as follows.
The measurement is performed by measuring at least one or more arbitrary positions including the vicinity of the center of the back surface of the wiring board. Thereby, the position to be detected can be set freely according to the type of the wiring board.

【0009】また、本発明は、表面に多数のピンを植設
してなる配線基板を、各ピンが挿入可能なガイド孔を多
数穿設してなる多孔板の各ガイド孔に各ピンを挿入する
工程と、上記配線基板を上記ピン植設面に沿う方向に移
動可能に当接しつつ、その当接力が弾性的に付勢する応
力により与えられる当接部によって、そのピン植設面に
沿う方向に移動可能に保持する工程と、その後、上記ガ
イド孔にピンが挿入された多孔板を、上記ピン植設面に
沿う方向に略円状軌跡の平行移動させて、各ピンのうち
曲がりを有するピンを矯正するピン矯正工程と、を有す
る、ことを特徴とする配線基板の製造方法も含む。
Further, according to the present invention, there is provided a wiring board having a large number of pins implanted on a surface thereof, wherein each pin is inserted into each of the guide holes of a perforated plate having a large number of guide holes into which the respective pins can be inserted. a step of, while the wiring board abuts movably in a direction along said pins planted設面, by abutments provided by the stress to which the contact force is elastically urged to the pin planted設面A step of holding movably in the direction along the perforated plate, and thereafter, moving the perforated plate in which the pins are inserted into the guide holes in parallel with a substantially circular locus in a direction along the pin planting surface, and bending each of the pins. And a pin correcting step of correcting a pin having the following.

【0010】上記の製造方法によれば、配線基板に弾性
的に当接するローラ等の当接部によって、配線基板をそ
のピン植設面方向に沿って移動可能に保持した状態で、
多孔板が円状運動することにより、曲がりを有するピン
を含む配線基板を自動的且つ正確に矯正でき、係るピン
の表面を傷付けることもないので、多数の配線基板を品
質良く大量に製造することが可能となる。
According to the manufacturing method described above, in a state where the contact portion of the roller or the like elastically in contact with the wiring board, and movably held along the circuit board on the pin planted設面direction,
The circular movement of the perforated plate makes it possible to automatically and accurately correct a wiring board including a bent pin, and does not damage the surface of the pin, so that a large number of wiring boards can be mass-produced with good quality. Becomes possible.

【0011】[0011]

【発明の実施の形態】以下に本発明の実施に好適な形態
を図面と共に説明する。図1はピン矯正装置1の概略縦
断面図、図2はその分解斜視図で、矯正装置1は、表面
(下面)に多数のピンPを植設した半導体パッケージ等の
配線基板Wを、水平姿勢のままそのピンPが植設された
面(以下、ピン植設面という)に沿う方向に移動可能に保
持する保持手段2と、上記配線基板Wの下方に位置し、
その各ピンPを挿入可能なガイド孔32を多数穿設した
多孔板30と、この多孔板30を支持し且つその水平姿
勢を保ちつつ、多孔板30がそのガイド孔32を略同一
径の円形軌跡上を移動するように、前記ピン植設面に沿
う方向に円状運動させる円状運動手段40とからなる。
前記保持手段2は、図2に示すように、配線基板Wの対
角位置において、隣接する側面に対し互いに直角に当接
し且つ当該側面上を移動可能とする一対のローラ4を水
平方向に進退可能に取付けた一対の対称なアーム10
と、これらのアーム10をその基端に固定したガイド1
2を介して水平方向にスライド可能に支持するレール1
6と、上記ガイド12にそれぞれピストンロッド18の
先端を連結し、各ロッド18を左右対称に伸縮させるエ
アシリンダ20とからなる。尚、このシリンダ20は中
央に対向するピストン(図示せず)間に挟まれた膨張・収
縮可能なエア室を有する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic longitudinal sectional view of the pin straightening device 1, and FIG.
A wiring board W such as a semiconductor package having a large number of pins P implanted on its (lower surface) can be moved in a direction along a surface on which the pins P are implanted (hereinafter, referred to as a pin implantation surface) in a horizontal posture. Holding means 2 for holding, located below the wiring board W,
A perforated plate 30 having a large number of guide holes 32 into which the respective pins P can be inserted, and a perforated plate 30 supporting the perforated plate 30 and maintaining the horizontal position of the perforated plate 30 so that the guide holes 32 are substantially circular in diameter. And circular motion means 40 for circularly moving in a direction along the pin planting surface so as to move on the locus.
As shown in FIG. 2, the holding means 2 moves a pair of rollers 4 in a diagonal position of the wiring board W, which abut at right angles to the adjacent side surface and move on the side surface in a horizontal direction. A pair of symmetrically mounted arms 10
And a guide 1 having these arms 10 fixed to the base end thereof.
Rail 1 supporting horizontally slidable through 2
6 and an air cylinder 20 that connects the tip of a piston rod 18 to the guide 12 and expands and contracts each rod 18 symmetrically. The cylinder 20 has an inflatable / contractible air chamber sandwiched between opposed pistons (not shown) at the center.

【0012】上記の各ローラ4は、本発明の当接部に相
当し、その上方で摺動片5の先端に垂直に軸支され、摺
動片5は断面凹形のホルダ6に前後方向に移動可能に支
持される。上記摺動片5の後方には外側のアングル9か
ら延びるボルト7が接近し、ボルト7に巻装されたコイ
ルバネ8が摺動片5の後端と後方に立設するアングル9
とに両端を当接するので、上記ローラ4をそれぞれ内向
き方向に付勢している。これら摺動片5、ボルト7、コ
イルバネ8、及びアングル9によって、本発明の付勢部
を構成する。従って、図示しない吸着部を有するマニピ
ュレータ等に水平に吸着された配線基板Wを上方から降
下させ、各ローラ4の囲まれた平面内に位置させると、
前記エアシリンダ20を駆動し、そのピストンロッド1
8を後退させて、一対のアーム10を互いに接近させる
と、配線基板Wは各ローラ4間にて付勢されつつ、水平
方向、即ち前記ピン植設面に沿う方向に移動可能な状態
で保持される。
Each of the rollers 4 corresponds to an abutting portion of the present invention, and is vertically supported by a tip of a sliding piece 5 above the roller, and the sliding piece 5 is mounted on a holder 6 having a concave cross section in the front-rear direction. It is movably supported. A bolt 7 extending from an outer angle 9 approaches the rear of the sliding piece 5, and a coil spring 8 wound around the bolt 7 has an angle 9 erected on the rear end of the sliding piece 5 and rearward.
, The rollers 4 are urged inward, respectively. These sliding pieces 5, bolts 7, coil springs 8, and angles 9 constitute an urging portion of the present invention. Therefore, when the wiring board W horizontally sucked by a manipulator or the like having a suction section (not shown) is lowered from above and positioned in a plane surrounded by each roller 4,
By driving the air cylinder 20, the piston rod 1
When the pair of arms 10 approach each other by retreating the wiring board 8, the wiring board W is held in a state in which it can move in the horizontal direction, that is, the direction along the pin-planting surface, while being urged between the rollers 4. Is done.

【0013】また、前記多孔板30は、配線基板Wの下
面に植設された多数のピンPの配列位置に対応して垂直
にガイド孔32を多数穿設したベークライトのような柔
軟な表面を有する板である。各ガイド孔32は、図3
(A)に示すように、配線基板Wのピン植設面に向かって
拡がるテーパ面を有する円錐台状のガイド部34と、こ
のガイド部34の下端に連続し、且つこれよりも細い内
径を有する円筒形の矯正部36とからなる。各ピンP
は、ガイド部34側から挿入され、図示のように先端を
矯正部36より下方に突出し、後述するようにこの矯正
部36の円状軌跡上の移動により、その曲がりを矯正さ
れる。因みに、例えばピンPの直径が0.5mmの場合、
矯正部36の内径は約0.8mm程度であり、また、矯正
部36の長さはガイド部34の約3分の一程度とする。
更に、上記ガイド部34のテーパ面は約70度下向きに
傾斜している。尚、上記矯正部36は、ピンPを挿入可
能であれば、貫通孔に限らず、下端が塞がれていても良
く、また、貫通孔の場合でもピンPをその途中まで挿入
することとしても良い。
The perforated plate 30 has a flexible surface such as a bakelite in which a large number of guide holes 32 are vertically formed corresponding to the arrangement positions of a large number of pins P planted on the lower surface of the wiring board W. It is a plate having. Each guide hole 32 is shown in FIG.
As shown in (A), a frusto-conical guide portion 34 having a tapered surface that expands toward the pin planting surface of the wiring board W, and an inner diameter that is continuous with the lower end of the guide portion 34 and is smaller than the guide portion 34. And a cylindrical correction part 36 having the same. Each pin P
Is inserted from the guide portion 34 side, and its tip protrudes below the correction portion 36 as shown in the figure, and its bending is corrected by movement of the correction portion 36 on a circular locus as described later. By the way, for example, when the diameter of the pin P is 0.5 mm,
The inner diameter of the straightening section 36 is about 0.8 mm, and the length of the straightening section 36 is about one third of the guide section 34.
Further, the tapered surface of the guide portion 34 is inclined downward by about 70 degrees. In addition, the straightening part 36 is not limited to the through hole as long as the pin P can be inserted. The lower end may be closed, and in the case of the through hole, the pin P is inserted halfway. Is also good.

【0014】更に、前記円状運動手段40は、図1に示
す略角柱状のフレーム42からその側方に突出するプレ
ート43に垂直に取付けたモータ44と、以下の運動変
換機構とからなる。この機構は、上記モータ44の軸に
固定したプーリ46とフレーム42の中央に軸受48を
介して回転自在に垂直に支持された回転軸50の下端の
プーリ52の間に掛け渡したタイミングベルト54と、
上記回転軸50の上端にこの回転軸50の中心軸に対し
数ミリ水平方向にその中心軸を偏心して固定された円筒
状の凸部56と、この凸部56の周囲に軸受58を介し
て凸部56を嵌合する下向きの円形の孔60を有する回
転体62を含む。この回転体62は、前記多孔板30を
着脱可能に支える支持板64の中央下面に固定され、且
つ、支持板64の四周は、左右及び図示の前後方向に互
いに直角な2組のスライダ66,67を介して前記フレ
ーム42の上端に支持されている。
Further, the circular motion means 40 is composed of a motor 44 vertically mounted on a plate 43 projecting laterally from a substantially prismatic frame 42 shown in FIG. 1, and the following motion conversion mechanism. This mechanism includes a timing belt 54 laid between a pulley 46 fixed to the shaft of the motor 44 and a pulley 52 at the lower end of a rotating shaft 50 rotatably supported vertically at the center of the frame 42 via a bearing 48. When,
A cylindrical convex portion 56 fixed to the upper end of the rotary shaft 50 at a position eccentric to the central axis of the rotary shaft 50 by several millimeters in a horizontal direction, and a bearing 58 is provided around the convex portion 56. A rotating body 62 having a downward circular hole 60 into which the projection 56 is fitted is included. The rotating body 62 is fixed to the lower surface at the center of a support plate 64 that detachably supports the perforated plate 30, and the four circumferences of the support plate 64 have two sets of sliders 66, It is supported by the upper end of the frame 42 via 67.

【0015】従って、上記モータ44の駆動にて回転す
る回転軸50により偏心回転する凸部56によって、多
孔板30は、支持板64と共に同じ姿勢のまま、上記2
組のスライダ66,67の長手方向に沿う平行移動を許
容されるが、回転軸50による捻りトルクは受けない。
上記各スライダ66,67は、直線上に配置された多数
のボール68とこれらの上下球面を覆う上下一対の長尺
な凹面板69からなり、且つ各々一対ずつが平行に配置
される。尚、各スライダ66,67同士が接する中間部
分は、互いにコーナにて結合された四角形枠状の一体物
とされるが、前記フレーム42の外側へ離脱しないよう
に、別途位置規制をされている。これらのスライダ6
6,67も前記運動変換手段に含まれる。
Therefore, the perforated plate 30 is kept in the same posture as the supporting plate 64 by the convex portion 56 eccentrically rotated by the rotating shaft 50 rotated by the driving of the motor 44.
The parallel movement of the pair of sliders 66 and 67 along the longitudinal direction is allowed, but the torsion torque by the rotating shaft 50 is not received.
Each of the sliders 66 and 67 is composed of a number of balls 68 arranged in a straight line and a pair of upper and lower elongated concave plates 69 covering the upper and lower spherical surfaces, and each pair is arranged in parallel. An intermediate portion where the sliders 66 and 67 are in contact with each other is a rectangular frame-shaped integral body that is joined to each other at a corner, but is separately regulated so as not to separate from the outside of the frame 42. . These sliders 6
6, 67 are also included in the motion conversion means.

【0016】従って、上記モータ44を駆動させ、ベル
ト54を介して回転軸50を回すと、凸部56の偏心回
転によって、多孔板30も水平姿勢を保ったまま、各ガ
イド孔32は略同一径の円状軌跡上を移動する、公転的
な平行移動運動を行う。すると、前記保持手段2の各ロ
ーラ4間に水平姿勢で移動可能に挟持された配線基板W
は、その表面の各ピンPをそれぞれガイド孔32内に挿
入した状態で、多孔板30の各ガイド孔32を略中心と
した前記円状運動を受け、曲がったピンPを後述するよ
うに矯正する。また、図1の上方には、前記保持に先立
って、後述する矯正が困難なピンPを有する配線基板W
を検出するため、配線基板Wの裏面(上面)の中央付近に
レーザ光を照射し、且つその反射光を受光して、受光位
置によって矯正可能な配線基板Wか否かを検出する検出
手段たるレーザ装置70がセットされている。
Accordingly, when the motor 44 is driven and the rotary shaft 50 is rotated via the belt 54, the guide holes 32 are substantially the same while the perforated plate 30 is kept horizontal by the eccentric rotation of the projection 56. Performs a revolving parallel movement that moves on a circular locus of diameter. Then, the wiring substrate W movably held between the rollers 4 of the holding means 2 in a horizontal posture.
Receives the circular motion about the respective guide holes 32 of the perforated plate 30 in a state where the respective pins P on the surface thereof are inserted into the respective guide holes 32, and corrects the bent pins P as described later. I do. Prior to the holding, a wiring board W having pins P which are difficult to correct, as described later, is shown above FIG.
Detecting means for irradiating a laser beam near the center of the back surface (upper surface) of the wiring board W and receiving the reflected light to detect whether or not the wiring board W can be corrected by the light receiving position. The laser device 70 is set.

【0017】次に、配線基板Wが保持手段2の各ローラ
4間に挟持された状態について説明する。図3(A)に示
すように、配線基板Wに対し垂直に植設された正常なピ
ンPは、ガイド孔32内に挿入されるとその矯正部36
と同心の位置にセットされる。一方、図3(B)に示すよ
うに、配線基板Wに対し僅かに曲がりを有して植設され
たピンPは、当初はその下端をガイド孔32のガイド部
34のテーパ面に沿って下方にガイドされた後、矯正部
36の内周面に接触した状態になる。係る状態におい
て、各配線基板Wは、内方向へ付勢される各ローラ4間
に保持される。これらに対し、図3(C)に示すように、
配線基板Wに対しある程度曲がったピンPは、ガイド孔
32のガイド部34内において停止し、このピンPを含
む配線基板Wは、下方にはそれ以上挿入されない。従っ
て、係る配線基板Wは、本矯正装置1では矯正が困難と
して排除される。かかる配線基板を検出するため、後述
するように、前記レーザ装置70が用いられる。
Next, a state in which the wiring board W is sandwiched between the rollers 4 of the holding means 2 will be described. As shown in FIG. 3A, when the normal pins P implanted perpendicularly to the wiring board W are inserted into the guide holes 32, the corrective portions 36 are formed.
Is set to a concentric position with On the other hand, as shown in FIG. 3B, the pin P implanted with a slight bend in the wiring board W initially has its lower end along the tapered surface of the guide portion 34 of the guide hole 32. After being guided downward, it comes into contact with the inner peripheral surface of the correction unit 36. In such a state, each wiring board W is held between the rollers 4 urged inward. On the other hand, as shown in FIG.
The pins P bent to some extent with respect to the wiring board W stop in the guide portions 34 of the guide holes 32, and the wiring board W including the pins P is not inserted any more below. Therefore, such a wiring board W is excluded because it is difficult to correct the wiring board W in the correction apparatus 1. In order to detect such a wiring board, the laser device 70 is used as described later.

【0018】因みに、従来の図6(A)に示した矯正板1
00にて手作業で矯正する場合、上記の曲がったピンP
を作業者が強引にすり鉢状の孔102内に押し込むた
め、ピンPの表面に被覆した金メッキが剥がれたり、ピ
ンP自体を傷付けてしまうことがあった。これに対し、
本装置1では、上記のように、ピンPが挿入され易い円
錐台状のガイド孔32を用いることにより、一定以上に
曲がったピンPを有する配線基板Wを排除することにし
たので、ピンPを傷付けることは解消される。また、係
る選別操作は、矯正工程全体の効率を向上させることに
も繋がる。
Incidentally, the conventional correction plate 1 shown in FIG.
In the case of manual correction at 00, the bent pin P
Is forced into the mortar-shaped hole 102 by the operator, so that the gold plating covering the surface of the pin P may be peeled off or the pin P itself may be damaged. In contrast,
In the present device 1, as described above, the use of the truncated conical guide hole 32 into which the pin P can be easily inserted eliminates the wiring board W having the pin P bent more than a certain amount. Injury is eliminated. In addition, such a sorting operation also leads to improving the efficiency of the entire correction process.

【0019】次いで、矯正作用について図4に基づき説
明する。同図(A)は、正常なピンPに対し、ガイド孔3
2の矯正部36が円状運動する状態を示し、ピンPの周
面に対し、多孔板30の平行移動により矯正部36は略
同一径の円状軌跡上を移動する公転的な運動を行う。こ
の場合、矯正部36はその内周面をピンPの周面に接触
しながら矢印のように移動するか、又は、その内周面を
ピンPの周面に押圧しながら移動する。後者の場合、正
常なピンPは、配線基板Wの全てのピンPの殆どを占め
るので、曲げられることなく、矯正部36の移動に連れ
て円状に移動する。同時に配線基板Wも前記各ローラ4
に保持されたまま、前記バネ8の付勢によって同期的に
平行移動する。
Next, the correcting action will be described with reference to FIG. FIG. 3A shows that the guide hole 3
2 shows a state in which the second correction section 36 moves in a circular motion, and the correction section 36 performs a revolving motion of moving on a circular locus having substantially the same diameter by the parallel movement of the perforated plate 30 with respect to the peripheral surface of the pin P. . In this case, the correction unit 36 moves as shown by the arrow while contacting the inner peripheral surface thereof with the peripheral surface of the pin P, or moves while pressing the inner peripheral surface thereof against the peripheral surface of the pin P. In the latter case, the normal pins P occupy most of all the pins P on the wiring board W, and therefore move in a circular shape with the movement of the correction unit 36 without being bent. At the same time, the wiring board W
, And is parallelly moved synchronously by the urging of the spring 8.

【0020】一方、図4(B)に示す曲がったピンPは、
その曲がった方向と反対側に矯正部36が位置した際
に、図示のようにその中心軸方向に押圧される。しか
も、この押圧は、その他のピンPは殆ど正常なものであ
るため、多孔板30全体の円状運動となり、曲がったピ
ンPは配線基板Wに対し垂直な本来の姿勢に矯正され
る。尚、ピンPの直径が0.5mmの場合、矯正部36の
内径はその1.5乃至2倍の範囲内、例えば0.8mmが望
ましい。1.5倍未満では矯正部36とピンPとの隙間
が不足して十分な円状運動ができず、逆に2倍を越える
と隙間が過大となり矯正が不十分になるためである。ま
た、矯正部36の内径が0.8mmの場合、前記凸部56の
偏心距離はその2倍乃至3倍の範囲内(換言すると、矯正
部36の直径が上記偏心距離の3分の一乃至2分の
一)、例えば約2mm程度が望ましい。2倍未満と3倍超
以上では、円状運動が過小及び過大になり矯正効果に過
不足を招くためである。因みに、多孔板30の前記円状
運動は、1回以上行えばその効果が得られ、2〜10回
程度で通常のピンP(長さ4mm直径×0.5mm)の矯正は
完了する。しかもピンPに対して、多孔板30のうち矯
正部36のみが公転状に周回しつつ接触するため、矯正
されるピンPの表面を擦ったりして傷付けることもな
い。
On the other hand, the bent pin P shown in FIG.
When the straightening portion 36 is located on the side opposite to the bending direction, the straightening portion 36 is pressed in the direction of its central axis as shown in the figure. In addition, since this pressing is almost normal for the other pins P, the perforated plate 30 moves in a circular motion, and the bent pins P are corrected to the original posture perpendicular to the wiring board W. When the diameter of the pin P is 0.5 mm, the inner diameter of the straightening portion 36 is desirably 1.5 to 2 times the range, for example, 0.8 mm. If the ratio is less than 1.5 times, the gap between the straightening portion 36 and the pin P is insufficient, so that a sufficient circular movement cannot be performed. If the ratio exceeds 2 times, the gap becomes excessively large and the correction becomes insufficient. When the inner diameter of the correcting portion 36 is 0.8 mm, the eccentric distance of the convex portion 56 is within a range of 2 to 3 times the same (in other words, the diameter of the correcting portion 36 is 1/3 to 1/3 of the eccentric distance). 1/2), for example, about 2 mm is desirable. If it is less than 2 times and more than 3 times, the circular motion becomes too small or too large, resulting in excessive or insufficient correction effect. By the way, the circular movement of the perforated plate 30 can be achieved by performing the circular movement once or more, and the correction of the normal pin P (length 4 mm diameter × 0.5 mm) is completed in about 2 to 10 times. In addition, since only the correction portion 36 of the perforated plate 30 contacts the pin P while revolving around the orbit, the surface of the pin P to be corrected is not rubbed or damaged.

【0021】また、前記図3(C)で示した矯正困難なピ
ンPを有する配線基板Wに対しては、図5に示すよう
に、前記レーザ装置70の発光部72からこの配線基板
Wの裏面に照射されたレーザ光は、その裏面高さがピン
Pが挿入された配線基板Wに比べ、その反射位置が高く
なる。このため、反射したレーザ光は、上記レーザ装置
70の受光部74の光センサ76中の正常な位置とは離
れた位置に届くため、上記の曲がったピンPを有する配
線基板Wとして検出される。係る配線基板Wは、再度マ
ニピュレータに吸着され、ライン外に排除される。尚、
上記矯正を終えた配線基板Wは、再びマニピュレータに
吸着され、前記アーム10と共に各ローラ4が後退する
ことにより、持ち上げられて次工程に送給されると共
に、新たな配線基板Wが前記と同様にセットされる。ま
た、ピンPの配列が異なるパターンの配線基板Wを矯正
する場合は、予め係る配列に対応してガイド孔を穿設し
た多孔板30を前記支持板64に固定する。更に、ピン
Pの長さに応じて前記保持手段2の位置を多孔板30に
対し接離自在に調整する。
As shown in FIG. 5, the light emitting section 72 of the laser device 70 applies the wiring board W to the wiring board W having the pins P which are difficult to correct as shown in FIG. The reflection position of the laser beam irradiated on the back surface is higher than that of the wiring substrate W on which the pins P are inserted. Therefore, the reflected laser light reaches a position distant from the normal position in the optical sensor 76 of the light receiving section 74 of the laser device 70, and is detected as the wiring substrate W having the bent pin P. . Such a wiring board W is sucked again by the manipulator and is discharged out of the line. still,
The wiring board W that has completed the above correction is sucked again by the manipulator, and the rollers 4 move back together with the arm 10 to be lifted and sent to the next step. Is set to When correcting the wiring board W having a pattern in which the arrangement of the pins P is different, the perforated plate 30 in which the guide holes are formed corresponding to the arrangement in advance is fixed to the support plate 64. Further, the position of the holding means 2 is adjusted so as to be able to freely contact and separate from the perforated plate 30 according to the length of the pin P.

【0022】本発明は、以上の形態に限定されるもので
はない。前記保持手段に保持される配線基板と多孔板
は、各ピンが各ガイド孔内に挿入されれば互いに平行に
配置することに限らず、その姿勢は任意に設定できる。
また、前記の形態では多孔板の上方から配線基板を移動
させて各ピンをガイド孔内に挿入したが、逆に基板を所
定位置に保持しておき、多孔板側を移動させてそのガイ
ド孔内にピンを挿入するようにすることもできる。更
に、前記保持手段における当接部は、前記ローラに替え
て湾曲面や半球面を有する当接片やボールを用いたり、
また、その付勢部も前記コイルバネに替えて板バネ、ゴ
ム片、又は弾性を有する合成樹脂片を用いることもでき
る。例えば板バネ自体を直に配線基板の側面に面接触す
るように当接させ、当接部と付勢部を兼用させることも
できる。更に、当接部は、少なくとも配線基板に対し対
称に2カ所以上設けてあれば良い。
The present invention is not limited to the above embodiment. The positions of the wiring board and the perforated plate held by the holding means are not limited to being parallel to each other as long as each pin is inserted into each guide hole, and their postures can be set arbitrarily.
In the above embodiment, the wiring board is moved from above the perforated plate to insert each pin into the guide hole. Conversely, the board is held at a predetermined position, and the perforated plate side is moved to move the guide hole. It is also possible to insert a pin therein. Further, the contact portion in the holding means, a contact piece or a ball having a curved surface or a hemispherical surface instead of the roller,
Further, the urging portion may be a leaf spring, a rubber piece, or a synthetic resin piece having elasticity instead of the coil spring. For example, the leaf spring itself may be brought into direct contact with the side surface of the wiring board so as to be in surface contact, and the contact portion and the urging portion may be used. Further, it is sufficient that at least two contact portions are provided symmetrically with respect to the wiring board.

【0023】前記円状運動手段の運動変換機構における
回転体は、多孔板自体や、或いは2組のスライダの何れ
かの組に固定しても良い。その固定する位置も多孔板等
の中央付近以外の任意の位置にすることができる。ま
た、多孔板側に軸を設け、回転体側にこの軸を偏心した
位置で嵌合する凹部を設けることもできる。尚、前記偏
心して設けられる凸部または凹部の嵌合側の水平断面形
状は、円形の他、ピンの曲がり傾向等に応じて楕円形や
卵形にすることもできる。更に、多孔板の材質は、ベー
クライトやそれ以外の石炭酸系樹脂や、フェノール、メ
ラミン、又はエポキシ等の熱硬化性樹脂としても良い。
多孔板のガイド孔のガイド部は、一定の傾斜のテーパ面
に限らず、緩くカーブした円錐状のテーパ面としたり、
矯正部も僅かに内側にカーブした鼓形状の内周面を有す
るものとすることもできる。
The rotating body in the motion converting mechanism of the circular motion means may be fixed to the perforated plate itself or any one of two sets of sliders. The fixing position may be any position other than near the center of the perforated plate or the like. Alternatively, a shaft may be provided on the perforated plate side, and a concave portion may be provided on the rotating body side for fitting the shaft at an eccentric position. The horizontal cross-sectional shape on the fitting side of the eccentrically provided projection or recess may be elliptical or oval in accordance with the bending tendency of the pin, in addition to the circular shape. Further, the material of the perforated plate may be bakelite or other calcified resin, or a thermosetting resin such as phenol, melamine, or epoxy.
The guide portion of the guide hole of the perforated plate is not limited to a tapered surface with a constant inclination, or a conically tapered surface with a gentle curve,
The straightening section may also have a drum-shaped inner peripheral surface that curves slightly inward.

【0024】また、配線基板のピンがガイド孔に挿入さ
れたか否かを検出する検出手段は、光電管やフォトダイ
オードを用い配線基板の裏面高さの相違による光反射位
置や照度差等によって検出するものにしたり、配線基板
の裏面の高さによって接触するリミットスイッチの信号
によるものとしても良い。更には、CCDカメラ等によ
り、配線基板の側面方向からその画像を取り込み、画像
処理により基板の裏面高さや基板の位置を算出すること
もできる。尚、矯正の対称となる配線基板は、表面にピ
ンを多数植設した各種回路を有する配線基板であれば、
ICの有無やICを載置する位置に限らず全て含まれ
る。
The detecting means for detecting whether or not the pins of the wiring board have been inserted into the guide holes uses a photoelectric tube or a photodiode to detect the light reflection position or illuminance difference due to the difference in the height of the back surface of the wiring board. Alternatively, it may be based on a signal from a limit switch that comes into contact depending on the height of the back surface of the wiring board. Further, the image can be captured from the side of the wiring board by a CCD camera or the like, and the height of the back surface of the board and the position of the board can be calculated by image processing. In addition, a wiring board that is symmetrical to correction is a wiring board having various circuits in which a large number of pins are implanted on the surface.
This includes not only the presence or absence of an IC and the position where the IC is mounted, but also all of them.

【0025】[0025]

【発明の効果】以上において説明した本発明のピン矯正
装置によれば、半導体パッケージ等の配線基板の各ピン
を、多孔板の各ガイド孔への挿入が容易にでき、配線基
板に弾性的に当接するローラ等の当接部によって、配線
基板をそのピン植設面方向に沿って移動可能に保持した
状態で、多孔板が円状運動する。このため、多孔板の各
ガイド孔は大多数の正常なピンの周面を回転すると共
に、曲がっているピンのみを、本来の垂直向きに確実に
矯正をする矯正工程の自動化を可能とし、且つ正確に矯
正することができる。しかも、曲がったピンをその表面
を傷付けることなく、確実且つ迅速に本来の姿勢に矯正
することができる。特に、請求項4乃至6の発明によれ
ば、ピンの挿入が一層確実になり、且つ、ピンの適切な
矯正を可能にすることができる。更に、請求項7及び8
の発明によれば、ピンの挿入が困難な配線基板を迅速に
検出でき、過度な矯正によるピンの傷付けや多孔板の損
傷を防ぐことができる。加えて、請求項9の発明によれ
ば、配線基板に弾性的に当接するローラ等の当接部によ
って、配線基板をそのピン植設面方向に沿って移動可能
に保持した状態で、多孔板が円状運動することにより、
曲がりを有するピンを含む配線基板を自動的且つ正確に
矯正でき、ピンの表面を傷付けることもない。従って、
多数の配線基板の矯正作業全体の効率も向上させ、且つ
その自動化も容易となるので、配線基板の生産性を向上
させることもできる。
According to the pin straightening device of the present invention described above, each pin of a wiring board such as a semiconductor package can be easily inserted into each guide hole of a perforated plate.
The perforated plate moves circularly while the wiring board is movably held along the direction of the pin planting surface by a contact portion such as a roller that elastically contacts the plate. For this reason, each guide hole of the perforated plate rotates the peripheral surface of the majority of normal pins, and enables the automation of the straightening process of reliably correcting only the bent pin in the original vertical direction, and It can be corrected accurately. Moreover, the bent pin can be reliably and quickly corrected to the original posture without damaging the surface. In particular, according to the fourth to sixth aspects of the present invention, the insertion of the pin can be further reliably performed, and the pin can be appropriately corrected. Claims 7 and 8
According to the invention, it is possible to quickly detect a wiring board in which it is difficult to insert a pin, and to prevent damage to the pin and damage to the perforated plate due to excessive correction. In addition, according to the invention of claim 9, the abutment rollers resiliently contacting the wiring board, while movably held along the circuit board on the pin planted設面direction, porosity By the circular motion of the plate,
The wiring board including the bent pin can be automatically and accurately corrected, and the surface of the pin is not damaged. Therefore,
Since the efficiency of the whole work of correcting a large number of wiring boards can be improved and the automation thereof can be facilitated, the productivity of the wiring boards can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のピン矯正装置の概略縦断面図である。FIG. 1 is a schematic longitudinal sectional view of a pin straightening device of the present invention.

【図2】本発明のピン矯正装置の分解斜視図である。FIG. 2 is an exploded perspective view of the pin straightening device of the present invention.

【図3】(A)及び(B)は共に、配線基板のピンを多孔板
のガイド孔に挿入した状態を、(C)はピンが挿入されな
い状態を示す概略縦断面図である。
FIGS. 3A and 3B are schematic longitudinal sectional views showing a state where pins of a wiring board are inserted into guide holes of a perforated plate, and FIG. 3C is a state where pins are not inserted.

【図4】(A)及び(B)は共に、ピンが矯正される状態を
示す概略平面図である。
FIGS. 4A and 4B are schematic plan views showing a state where a pin is corrected.

【図5】本発明のピン矯正装置における検出手段を示す
概略図である。
FIG. 5 is a schematic view showing a detecting means in the pin straightening device of the present invention.

【図6】(A)及び(B1)(B2)は、何れも従来の技術に
おける矯正治具を示す概略図である。
FIGS. 6A, 6B, and 6B are schematic diagrams showing a correction jig according to the related art.

【符号の説明】[Explanation of symbols]

1……………ピン矯正装置 2……………保持手段 4……………ローラ(当接部) 5……………摺動片(付勢部) 7……………ボルト(付勢部) 8……………コイルバネ(付勢部) 9……………アングル(付勢部) 30…………多孔板 32…………ガイド孔 34…………ガイド部 36…………矯正部 40…………円状運動手段 44…………モータ 50…………回転軸 56…………凸部 60…………孔 62…………回転体 66,67…スライダ 70…………レーザ装置(検出手段) W……………配線基板 P……………ピン DESCRIPTION OF SYMBOLS 1 ... Pin straightening device 2 ... Holding means 4 ... Roller (contact part) 5 ... Sliding piece (biasing part) 7 ... Bolt (Biasing part) 8 Coil spring (Biasing part) 9 Angle (Biasing part) 30 Perforated plate 32 Guide hole 34 Guide part 36 correction part 40 circular motion means 44 motor 50 rotating shaft 56 convex part 60 hole 62 rotating body 66 , 67 Slider 70 Laser device (detection means) W Wiring board P Pin

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−15997(JP,A) 特開 平3−136357(JP,A) 特開 平2−81500(JP,A) 特開 昭62−274646(JP,A) 実開 平2−70831(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01L 23/50 H05K 13/04 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-15997 (JP, A) JP-A-3-136357 (JP, A) JP-A-2-81500 (JP, A) JP-A-62 274646 (JP, A) Hikaru 2-70831 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 23/50 H05K 13/04

Claims (9)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】表面に多数のピンを植設してなる配線基板
をそのピン植設面に沿う方向に移動可能に保持する保持
手段と、 上記各ピンが挿入可能なガイド孔を多数穿設してなる多
孔板と、 上記各ガイド孔に各ピンを挿入した多孔板を、前記ピン
植設面に沿う方向に略円状軌跡の平行移動させる円状運
動手段と、を備え、 上記保持手段は、上記配線基板に当接し、且つ該当接を
保ちつつ配線基板を上記ピン植設面に沿う方向に移動可
能に当接する当接部と、この当接部を当接される配線基
板に対し弾性的に付勢する付勢部と、を有する、 ことを特徴とする配線基板のピン矯正装置。
1. A holding means for holding a wiring board having a large number of pins implanted on its surface so as to be movable in a direction along the pin installation surface, and a large number of guide holes into which the pins can be inserted. A perforated plate comprising: a perforated plate; and a circular motion means for translating the perforated plate in which each pin is inserted into each of the guide holes in a substantially circular locus in a direction along the pin planting surface; abuts on the wiring board, and a wiring board while maintaining abutment movably in a direction along said pins planted設面abutment portion abutting, wiring base that contacts the contact portion
A biasing unit for elastically urged against the plate, the pin correction device wiring board, characterized in that.
【請求項2】前記円状運動手段が、トルクを発生させる
駆動源と、 この駆動源と前記多孔板との間に介在して、駆動源のト
ルクを多孔板の前記略円状軌跡の平行移動の運動に変換
する運動変換機構と、を有する ことを特徴とする請求項1に記載の配線基板のピン矯正
装置。
2. The driving device according to claim 1, wherein said circular motion means is provided between said driving source and said perforated plate to generate torque. having a motion converting mechanism for converting the movement of the moving pin correction device circuit board according to claim 1, characterized in that.
【請求項3】前記運動変換機構が、前記多孔板の移動
を、前記ピン植設面に沿う方向に平行で且つ互いに直交
する2軸方向に規制する2組のスライダと、 この多孔板又は2組のスライダのうちの何れかの組に連
結して設けてなる孔又は軸と、 この孔又は軸に回転可能に嵌合する凸部又は凹部が自己
の回転中心に対し偏心させて設けられ、且つ前記駆動源
により回転させられる回転体と、を有する ことを特徴とする請求項に記載の配線基板のピン矯正
装置。
3. The slider according to claim 2, wherein the movement conversion mechanism regulates the movement of the perforated plate in two axial directions parallel to and perpendicular to the direction along the pin planting surface. A hole or a shaft provided in connection with any of the sets of sliders, and a convex or concave portion rotatably fitted to the hole or the shaft is provided eccentrically with respect to its own rotation center, The pin correction device for a wiring board according to claim 2 , further comprising: a rotating body rotated by the driving source.
【請求項4】前記多孔板のガイド孔が、この多孔板の前
記配線基板のピン植設面に向かって拡がる略円錐台状の
ガイド部と、 このガイド部に連続し、且つガイド部よりも細い径を有
する矯正部と、を有することを特徴とする請求項1乃
に記載の配線基板のピン矯正装置。
4. A guide portion of the perforated plate, the guide portion having a substantially truncated cone shape extending toward a pin planting surface of the wiring board of the perforated plate; having a straightening portion having a small diameter, the pin correction device circuit board according to claim 1乃<br/> optimum 3, characterized in that.
【請求項5】前記矯正部の直径が、前記配線基板に植設
された前記ピンの直径の1.5乃至2倍にされている
ことを特徴とする請求項に記載の半導体パッケージの
ピン矯正装置。
5. The diameter of the straightening portion is 1.5 to 2 times the diameter of the pin implanted in the wiring board .
The pin correction device for a semiconductor package according to claim 4 , wherein
【請求項6】前記矯正部の直径が、前記回転体の回転中
心からこの回転体に設けた前記凸部又は凹部の中心まで
の偏心距離の3分の一乃至2分の一の範囲にあること
を特徴とする請求項又はに記載の配線基板のピン矯
正装置。
6. The eccentric distance from the center of rotation of the rotator to the center of the convex or concave portion provided on the rotator, wherein the diameter of the straightening portion is in the range of one third to one half of the eccentric distance. pin correction device circuit board according to claim 4 or 5, characterized in.
【請求項7】前記配線基板を前記保持手段によって保持
するのに先立って、 この配線基板に植設された各ピンが前記多孔板の各ガイ
ド孔に各々挿入されたか否かを検出する検出手段を有す
ことを特徴とする請求項1乃至に記載の配線基板
のピン矯正装置。
7. A detecting means for detecting whether or not each pin implanted in the wiring board is inserted into each of the guide holes of the perforated plate before holding the wiring board by the holding means. the a, that pin correction device circuit board according to claim 1, wherein the.
【請求項8】前記検出手段が、前記配線基板のうち前記
ピン植設面の裏面における前記ガイド板からの高さを測
定する裏面高さ測定手段を有することを特徴とする請
求項に記載の配線基板のピン矯正装置。
Wherein said detecting means comprises a back surface height measuring means for measuring the height from the guide plate on the back surface of said pin planted設面of the wiring board, it in claim 7, wherein A pin straightening device for a wiring board according to the above.
【請求項9】表面に多数のピンを植設してなる配線基板
を、各ピンが挿入可能なガイド孔を多数穿設してなる多
孔板の各ガイド孔に各ピンを挿入する工程と、 上記配線基板を上記ピン植設面に沿う方向に移動可能に
当接しつつ、その当接力が弾性的に付勢する応力により
与えられる当接部によって、そのピン植設面に沿う方向
に移動可能に保持する工程と、 その後、上記ガイド孔にピンが挿入された多孔板を、上
記ピン植設面に沿う方向に略円状軌跡の平行移動させ
て、各ピンのうち曲がりを有するピンを矯正するピン矯
正工程と、を有する、ことを特徴とする配線基板の製造
方法。
9. A step of inserting each pin into each guide hole of a perforated plate having a plurality of guide holes into which pins can be inserted, wherein the wiring board has a large number of pins implanted on its surface. while the wiring board abuts movably in a direction along said pins planted設面, by abutments provided by the stress to which the contact force is resiliently biased, movable in a direction along its pin planted設面And a step of holding the hole as possible, and thereafter, the perforated plate having the pin inserted into the guide hole is translated in a substantially circular locus in a direction along the pin planting surface, and a pin having a bend among the pins is formed. A method for manufacturing a wiring board, comprising a step of correcting a pin.
JP08292140A 1996-11-01 1996-11-01 Pin correction device for wiring board and method for manufacturing wiring board using the same Expired - Fee Related JP3139739B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08292140A JP3139739B2 (en) 1996-11-01 1996-11-01 Pin correction device for wiring board and method for manufacturing wiring board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08292140A JP3139739B2 (en) 1996-11-01 1996-11-01 Pin correction device for wiring board and method for manufacturing wiring board using the same

Publications (2)

Publication Number Publication Date
JPH10135392A JPH10135392A (en) 1998-05-22
JP3139739B2 true JP3139739B2 (en) 2001-03-05

Family

ID=17778067

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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