CN104201138B - The whole foot devices of IC - Google Patents
The whole foot devices of IC Download PDFInfo
- Publication number
- CN104201138B CN104201138B CN201410441535.2A CN201410441535A CN104201138B CN 104201138 B CN104201138 B CN 104201138B CN 201410441535 A CN201410441535 A CN 201410441535A CN 104201138 B CN104201138 B CN 104201138B
- Authority
- CN
- China
- Prior art keywords
- slide rail
- driving wheel
- motor
- shaping
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/02—Straightening
Abstract
The invention discloses a kind of whole foot devices of IC, including bearing, the slide rail of strip, motor mounting plate, motor, driving wheel and at least two shaping rollers, the slide rail and motor mounting plate are fixedly connected with bearing, motor is fixed on motor mounting plate, driving wheel is fixedly connected in the rotating shaft of motor, the diameter parallel of the axis of driving wheel and the rotating shaft, the axis of rotating shaft is vertical with the length direction of slide rail, driving wheel is located between the two ends of slide rail, two shaping rollers are separately fixed at the not homonymy of slide rail, and two shaping rollers are symmetrical into line relative to the center line of slide rail.The present invention has pin widths shaping performance higher；The power of IC elements is provided by driving wheel, so that the present invention also has the advantages that pin shaping efficiency higher and suitable for high-volume shaping while with simple structure.
Description
Technical field
The present invention relates to electronic product production equipment field, more particularly to a kind of whole foot devices of IC.
Background technology
IC, i.e. integrated circuit, are the acronyms of integrated circuit, are to use semiconductor fabrication process,
The component such as many transistors and resistor, capacitor is made on one piece of less monocrystalline silicon piece, and according to multilayer wiring
Or component is combined into complete electronic circuit by the method for tunnel wiring.It is in circuit with alphabetical " IC "（Also useful word
Symbol " N " etc.）Represent.The IC of broad sense is the general designation of semiconductor element product in existing electronic applications, the IC of narrow sense is mono- refer to it is integrated
Circuit（Chip）.
The connection of the electronic component and circuit board or other IC that are referred to as IC is subject to the pin by being arranged on IC
Realize, in practice, because the pin hole width for pin configuration differs, often need to carry out bending process to pin on IC
To change the width between two row's pins.
The device dedicated for electronic component pin bending is occurred in that in the prior art, i.e., by a briquetting in same
Pin on one row applies compression, reaches the purpose for causing pin bending.Existing apparatus braking briquetting is realized carrying out pin
The size control inconvenience of bending pins amount, is unfavorable for the bending precision of pin during bending, at the same it is also less efficient in the presence of bending, no
Suitable for the defect of mass disposal.
The content of the invention
The size of bending pins amount controls inconvenience when realizing bending pin for above-mentioned existing apparatus braking briquetting,
It is unfavorable for the bending precision of pin, at the same it is also less efficient in the presence of bending, it is not suitable for the problem of the defect of mass disposal, this
Invention provides a kind of whole foot devices of IC.
To solve the above problems, the whole foot devices of IC that the present invention is provided are by following technical essential come solve problem：IC is whole
Foot device, including the slide rail of bearing, strip, motor mounting plate, motor, driving wheel and at least two shaping rollers, the slide rail and
Motor mounting plate is fixedly connected with bearing, and motor is fixed on motor mounting plate, and driving wheel is fixedly connected on turning for motor
On axle, the diameter parallel of the axis of driving wheel and the rotating shaft, the axis of rotating shaft is vertical with the length direction of slide rail, driving wheel position
Between the two ends of slide rail, two shaping rollers are separately fixed at the not homonymy of slide rail, and two shaping rollers relative in slide rail
Heart line is symmetrical into line.
Specifically, the slide rail for setting is support platform of the present invention to IC elements, i.e. IC elements are provided with the side of pin
With the end contact of slide rail, pin is respectively positioned at the side of slide rail.The driving wheel of setting is used to drive IC elements to be slided along slide rail
It is dynamic：Specifically, motor is used to drive driving wheel wheel to rotate, driving wheel is determined relative to the distance of slide rail by the thickness of IC element bases
It is fixed, it is set to driving wheel and is slightly less than base thickness with the distance of slide rail, before driving wheel is located at shaping roller when the present invention is used
End, so when IC elements are by between driving wheel and slide rail, driving wheel is applied to IC elements, IC units to the frictional force of IC elements
Part transmits power successively, and last IC elements are successively to a lateral movement of shaping roller；The shaping roller of setting is IC component pin shapings
Direct effect part：Specifically, the slide rail width being arranged between two shaping roller closest approaches is drawing that IC component requirements are adjusted
Pin pitch is the width of pin with the distance of slide rail from, shaping roller, so, when IC elements pass through two shaping rollers, shaping roller side
Face and slide rail side collective effect realize the top width shaping of IC component pins.
Further technical scheme is：
Require that there is enough compression to promote IC elements to transport to produce between driving wheel and IC elements in above procedure
Dynamic frictional force, to prevent IC elements to be damaged under compression and beneficial to the big of the frictional force produced between driving wheel and IC elements
Small, the driving wheel is rubber wheel.
Further to increase operating efficiency of the invention so that the IC elements on the slide rail of driving wheel front end can be certainly
By driving wheel under again, the slide rail is inclined to set, and shaping roller is located at the lower section of driving wheel.
To reduce the load of motor and being easy to discharging of the invention, width gradual change section is additionally provided with the slide rail, it is described
The initiating terminal of width gradual change section connects apart from line with two closest approaches of shaping roller with the joining of slide rail.
For power output when avoiding pin from being contacted with shaping roller due to both interaction force consumption motors, avoid
There is frictionally damage on pin and shaping roller, the shaping roller includes the rolling element of connecting shaft and column, and the connecting shaft is fixed
The end of rolling element, and both axis collinears are connected to, rolling element can be rotatable around its axis.
The invention has the advantages that：
The slide rail of setting is side and the slide rail that support platform of the present invention to IC elements, i.e. IC elements are provided with pin
End contact, pin is respectively positioned at the side of slide rail.The driving wheel of setting is used to drive IC elements to be slided along slide rail：Specifically
, motor is used to drive driving wheel wheel to rotate, and driving wheel is determined relative to the distance of slide rail by the thickness of IC element bases, is set
For the distance of driving wheel and slide rail is slightly less than base thickness, when the present invention is used, driving wheel is located at the front end of shaping roller, so
When IC elements are by between driving wheel and slide rail, driving wheel is applied to IC elements to the frictional force of IC elements, and IC elements are successively
Transmission power, last IC elements are successively to a lateral movement of shaping roller；The shaping roller of setting is the direct work of IC component pin shapings
Use part：Specifically, the slide rail width being arranged between two shaping roller closest approaches is the pin distance that IC component requirements are adjusted,
The distance of shaping roller and slide rail is the width of pin, so, when IC elements pass through two shaping rollers, shaping roller side and slide rail
Side collective effect realizes the top width shaping of IC component pins.In above procedure, due to the width of slide rail between shaping roller and often
Individual shaping roller determines with the distance of slide rail, so that be only capable of exporting the IC component pin width of specific dimensions so that the present invention
With pin widths shaping performance higher；The power of IC elements is provided by driving wheel, so that the present invention is with structure
While simple, also there is pin shaping efficiency higher and suitable for high-volume shaping.
Brief description of the drawings
Fig. 1 is IC of the present invention one structural representation of specific embodiment of whole foot device；
Fig. 2 is the partial enlargement structural representation in A portions described in Fig. 1；
Fig. 3 is IC of the present invention one structural representation of specific embodiment of whole foot device shaping roller.
Figure acceptance of the bid note is respectively：1st, bearing, 2, slide rail, 3, shaping roller, 31, connecting shaft, 32, rolling element, 4, motor installs
Plate, 5, driving wheel, 6, motor.
Specific embodiment
With reference to embodiment, the present invention is described in further detail, but structure of the invention be not limited only to it is following
Embodiment：
Embodiment 1：
As shown in Figure 1 to Figure 3, including the slide rail 2 of bearing 1, strip, motor mounting plate 4, motor 6, driving wheel 5 and at least
Two shaping rollers 3, the slide rail 2 and motor mounting plate 4 are fixedly connected with bearing 1, and motor 6 is fixed on motor mounting plate 4
On, driving wheel 5 is fixedly connected in the rotating shaft of motor 6, the diameter parallel of the axis of driving wheel 5 and the rotating shaft, the axle of rotating shaft
Line is vertical with the length direction of slide rail 2, and driving wheel 5 is located between the two ends of slide rail 2, and two shaping rollers 3 are separately fixed at slide rail 2
Not homonymy, and two shaping rollers 3 are symmetrical into line relative to the center line of slide rail 2.
In the present embodiment, the material of the slide rail 2 of setting is stainless steel, and each surface of slide rail 2 is smooth plane,
The outermost of the driving wheel 5 of setting is the flexible material with elastic deformability, to protect IC elements and cause between the two
With larger static friction factor, the motor 6 of setting is direct current generator, and pressure regulation dress is additionally provided with the electrical energy inputs of motor 6
Put, in order to adjust the rotating speed of motor 6 according to the size of IC component pin shaping amounts, imitated with maximizing optimization work of the invention
Rate.
Embodiment 2：
The present embodiment is further qualified on the basis of embodiment 1, requires to drive as shown in Figure 1 to Figure 3, in above procedure
There is enough compression to promote the frictional force of IC member motions to produce, to prevent IC elements between driving wheel 5 and IC elements
It is damaged under compression and beneficial to the size of the frictional force produced between driving wheel 5 and IC elements, the driving wheel 5 is rubber
Wheel.
Embodiment 3：
The present embodiment is further qualified on the basis of embodiment 1, is further to increase this hair as shown in Figure 1 to Figure 3
Bright operating efficiency so that the IC elements on the front end slide rail 3 of driving wheel 5 can be under deadweight by driving wheel 5, the cunning
Rail 2 is inclined to set, and shaping roller 3 is located at the lower section of driving wheel.In the present embodiment, the inclination angle of slide rail 2 and horizontal plane at 45 ° extremely
In the range of 80 °.
To reduce the load of motor 6 and being easy to discharging of the invention, width gradual change section, institute are additionally provided with the slide rail 2
State the initiating terminal of width gradual change section and connecting with the joining of slide rail 2 apart from line for two closest approaches of shaping roller 3.
Embodiment 4：
The present embodiment is further qualified on the basis of above example, as shown in Figure 1 to Figure 3, for avoid pin with
Shaping roller 3 contact when due to both interaction force consume motor power output, avoid on pin and shaping roller 3 occur
Frictionally damage, the shaping roller 3 includes the rolling element 32 of connecting shaft 31 and column, and the connecting shaft 31 is fixedly connected on rolling element
32 end, and both axis collinears, rolling element 32 can be rotatable around its axis.
Above content is to combine the further description that specific preferred embodiment is made to the present invention, it is impossible to assert this
The specific embodiment of invention is confined to these explanations.For general technical staff of the technical field of the invention,
The other embodiment drawn in the case where technical scheme is not departed from, should be included within the scope of the present invention.
Claims (2)
- The whole foot devices of 1.IC, it is characterised in that including bearing（1）, strip slide rail（2）, motor mounting plate（4）, motor（6）、 Driving wheel（5）With at least two shaping rollers（3）, the slide rail（2）And motor mounting plate（4）It is fixedly connected with bearing（1）On, Motor（6）It is fixed on motor mounting plate（4）On, driving wheel（5）It is fixedly connected on motor（6）Rotating shaft on, driving wheel（5）Axle The diameter parallel of line and the rotating shaft, the axis and slide rail of rotating shaft（2）Length direction it is vertical, driving wheel（5）Positioned at slide rail（2） Two ends between, two shaping rollers（3）It is separately fixed at slide rail（2）Not homonymy, and two shaping rollers（3）Relative to slide rail （2）Center line it is symmetrical into line；The driving wheel（5）It is rubber wheel；The slide rail（2）It is inclined to set, shaping roller（3）It is located at Driving wheel（5）Lower section；The slide rail（2）On be additionally provided with width gradual change section, the initiating terminal of width gradual change section and two Shaping roller（3）Closest approach apart from line and slide rail（2）Joining connect；Slide rail（2）Material be stainless steel, and slide rail （2）Each surface be smooth plane, driving wheel（5）Outermost be the flexible material with elastic deformability, electricity Machine（6）It is direct current generator, motor（6）Electrical energy inputs on be additionally provided with regulator.
- 2. whole foot devices of IC according to claim 1, it is characterised in that the shaping roller（3）Including connecting shaft（31）With The rolling element of column（32）, the connecting shaft（31）It is fixedly connected on rolling element（32）End, and both axis collinear, rolling Kinetoplast（32）Can be rotatable around its axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410441535.2A CN104201138B (en) | 2014-09-02 | 2014-09-02 | The whole foot devices of IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410441535.2A CN104201138B (en) | 2014-09-02 | 2014-09-02 | The whole foot devices of IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104201138A CN104201138A (en) | 2014-12-10 |
| CN104201138B true CN104201138B (en) | 2017-07-04 |
Family
ID=52086410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410441535.2A Expired - Fee Related CN104201138B (en) | 2014-09-02 | 2014-09-02 | The whole foot devices of IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104201138B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2182512Y (en) * | 1993-11-11 | 1994-11-09 | 陈长清 | Setup device for integrated circuit use |
| CN2182513Y (en) * | 1993-10-16 | 1994-11-09 | 陈长清 | Automatic mounting machine for integrated circuit |
| CN204167269U (en) * | 2014-09-02 | 2015-02-18 | 中江县凯讯电子有限公司 | IC pins arranging machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3139739B2 (en) * | 1996-11-01 | 2001-03-05 | 日本特殊陶業株式会社 | Pin correction device for wiring board and method for manufacturing wiring board using the same |
-
2014
- 2014-09-02 CN CN201410441535.2A patent/CN104201138B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2182513Y (en) * | 1993-10-16 | 1994-11-09 | 陈长清 | Automatic mounting machine for integrated circuit |
| CN2182512Y (en) * | 1993-11-11 | 1994-11-09 | 陈长清 | Setup device for integrated circuit use |
| CN204167269U (en) * | 2014-09-02 | 2015-02-18 | 中江县凯讯电子有限公司 | IC pins arranging machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104201138A (en) | 2014-12-10 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20190902 |
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| CF01 | Termination of patent right due to non-payment of annual fee |