JPH09321407A - Semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor package which is surely mounted with no trouble without soldering nor causing poor connection such as what is called a soldering bridge, etc., and whose repairing and positioning are easily performed. SOLUTION: A semiconductor package 10 is provided with a main body part 12, a fixing leg part 20 which is protruded from the main body part 12 and provided with engaging protrusions 21a and 22a which are inserted into a fixing/insertion through hole 54 provided on a wiring board 50 and which catch the wiring board 50 on its rear surface side, and a plurality of terminals 15 having spring characteristics protruded from the main body part 12 and connected to a foot pattern 52, respectively, provided on the wiring board 50. Under the condition where the engagement protrusions 21a and 22a of the fixing leg part 20 catch the wiring board 50 on the rear surface side, a plurality of terminals 15 are press-contacted to the foot pattern 52.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package such as an IC package mounted on a wiring board, and more particularly to a package which can be mounted on a foot pattern of the wiring board without soldering.

[0002]

2. Description of the Related Art A conventional semiconductor package is usually shown in FIG.
As illustrated in FIG.
And project diagonally downward from both sides of the main body 32,
A plurality of terminals 35 connected to the foot patterns 52 provided on the wiring board 50, and the plurality of terminals 35.
To the foot pattern 52 (solder part 4
By doing 0), it is electrically connected and fixed.

[0003]

In the conventional semiconductor package 30 as described above, soldering is indispensable for mounting the semiconductor package 30. However, connection by soldering is troublesome and a so-called solder bridge is required. In addition to problems such as poor connection, difficult to repair (removal, re-attachment), positioning cannot be performed easily, etc. in the future from the viewpoint of environmental hygiene.
Since the use of lead, which is the main material of solder, may be restricted, there is a strong demand for a method of mounting a semiconductor package on a wiring board without relying on soldering.

The present invention has been made to solve the above-mentioned problems, and does not rely on soldering of the semiconductor package to a wiring board, does not cause connection failure, etc. It is an object of the present invention to provide a semiconductor package that can be reliably mounted on a substrate and that can be easily repaired and positioned.

[0005]

In order to achieve the above-mentioned object, a semiconductor package according to the present invention is basically a main body part and a fixing part provided on the wiring board so as to project from the main body part. A fixing foot portion that has a locking projection that is inserted into the insertion hole and that is locked on the back surface side of the wiring board, and a spring property that protrudes from the main body portion and is connected to a foot pattern provided on the wiring board. A plurality of terminals that have the plurality of terminals, and the plurality of terminals are pressed against the foot pattern when the locking projections of the fixing foot portion are locked on the back surface side of the wiring board. It becomes.

In the semiconductor package having such a structure, the wiring board is held so as to be elastically sandwiched between the plurality of terminals and the locking projections of the fixing feet, and the terminals have their own spring property. Is pressed against the foot pattern by means of which an electrical connection is made.

By doing so, the semiconductor package can be surely mounted on the wiring board without depending on soldering, without causing connection failure, and without trouble, and at the same time, repairing can be performed. It can be done easily.

[0008] In a preferred aspect of the present invention, the main body portion is provided with a positioning protrusion fitted into a positioning hole provided in the wiring board. By providing the positioning protrusions in this manner, the semiconductor package can be properly and reliably fixed to the wiring board.

[0009] In a further preferred aspect, a plurality of the positioning projections are provided and the distances from the positioning projections to the fixing foot portion are different. By doing so, erroneous mounting such as erroneous orientation of the semiconductor package can be prevented.

If the terminals are plated with gold, the electrical connection can be maintained more stably and reliably for a long period of time.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of a semiconductor package according to the present invention mounted on a wiring board,
FIG. 2 shows the bottom surface of the semiconductor package.

The semiconductor package 10 of the illustrated example has a resin main body portion 12 having an outer peripheral portion, a fixing leg portion 20 having a circular cross-section projecting downward from the main body portion 12, and the main body portion 12 A plurality of (here, eight) terminals 15 each having a spring property and protruding obliquely downward and having a tip bent upward and connected to a foot pattern 52 provided on the wiring board 50; The wiring board 50 is provided with two cylindrical positioning protrusions 26 and 27 that are fitted and inserted into two positioning holes 56 and 57, respectively.

The fixing foot portion 20 has a pair of elastic bending piece portions 21 and 22 divided into two forks, and the pair of elastic bending piece portions 21 and 22 is provided on the wiring board 50. Locking projections 21a having a right-angled triangular cross section, which are inserted through the fixing insertion holes 21 and are locked on the back surface side of the wiring board 50,
22a are respectively provided so as to project outward.

The positioning projections 26 and 27 are
As can be seen by referring to FIG. 2, their centers O
The separation distances from a and Ob to the center Oc of the fixing foot portion 20 are La and Lb, respectively. In other words, the positioning protrusions 26 and 27 are the fixing foot portion 2 respectively.
They are arranged in concentric circles with different radii around 0.

In mounting the semiconductor package 10 of the present embodiment having such a structure on the wiring board 50, the semiconductor package 10 resists the biasing force of the terminal 15 and
The fixing foot portion 20 is pushed into the fixing hole 54, and the positioning protrusions 26 and 27 are inserted into the positioning hole 5.
Insert it in 6,57. As a result, the wiring board 50 is fixed to the eight terminals 15 and the locking projections 21a and 22a of the fixing foot portion 20.
It is elastically sandwiched between and held by the terminal 15 and the terminal 15 has a foot pattern 52 due to its own spring property.
Are pressed against, thereby making an electrical connection.
That is, the locking projections 21a, 22a of the fixing foot portion 20
In the state in which is locked on the back surface side of the wiring board 50, the eight terminals 15 are pressed against the foot pattern 52.

By doing so, the semiconductor package 10 is surely mounted on the wiring board 50 without depending on soldering, without causing a connection failure such as a solder bridge, and without trouble. In addition to being able to do, repair can be easily performed. Also, 2
Since the positioning projections 26 and 27 are provided and the distances from the positioning projections 26 and 27 to the fixing foot portion 20 are different, the semiconductor package 10 is mounted on the wiring board 5.
It can be properly and surely fixed to 0 and erroneous mounting such as erroneous orientation of the semiconductor package 10 can be prevented.

If the terminals 15 are plated with gold,
The electrical connection can be maintained more stably and reliably for a long period of time.

In the above embodiment, the terminals are provided only on the left, right, front and rear of the main body, but the same effect can be obtained even if the terminals are provided on the front, rear, left and right of the main body. To be

Further, the shape of the terminal can be appropriately changed, as shown in FIG. 3, such as a J-shaped end portion (15 ') facing the main body portion 12 side.

[0020]

As can be understood from the above description, the semiconductor package according to the present invention does not rely on soldering of the semiconductor package to a wiring board, does not cause a connection failure such as a solder bridge, and is troublesome. There is an excellent effect that it can be surely mounted without applying and that repairing and positioning can be easily performed.

[Brief description of drawings]

FIG. 1 is a view showing an embodiment of a semiconductor package according to the present invention mounted on a wiring board.

FIG. 2 is a bottom view of the semiconductor package of FIG. 1;

FIG. 3 is a view showing a modified example of the semiconductor package of FIG.

FIG. 4 is a view showing an example of a conventional semiconductor package mounted on a wiring board.

[Explanation of symbols]

 10 Semiconductor Package 12 Main Body 15 Terminal 20 Fixing Foot 26, 27 Positioning Foot 21a, 22a Locking Protrusion 50 Wiring Board 52 Foot Pattern

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location H05K 7/12 H05K 7/12 Q

Claims (4)

[Claims] 1. A fixing foot having a main body portion and a locking projection protruding from the main body portion, inserted into a fixing insertion hole provided in the wiring board, and locked on the rear surface side of the wiring board. And a plurality of terminals having a spring property that project from the main body and are connected to a foot pattern provided on the wiring board, and the locking projections of the fixing feet are provided on the back surface of the wiring board. A semiconductor package in which the plurality of terminals are pressed into contact with the foot pattern in a state of being locked at the side. 2. The semiconductor package according to claim 1, wherein the main body portion is provided with a positioning protrusion that is fitted into a positioning hole provided in the wiring board. 3. A plurality of the positioning protrusions are provided,
3. The semiconductor package according to claim 2, wherein the separation distance from them to the fixing foot portion is different. 4. The semiconductor package according to claim 1, wherein the terminals are plated with gold.