CN113223080A

CN113223080A - Component recognition device, component mounting device, and component recognition method

Info

Publication number: CN113223080A
Application number: CN202110083270.3A
Authority: CN
Inventors: 细川瑠美
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2020-01-21
Filing date: 2021-01-21
Publication date: 2021-08-06
Also published as: JP2021113772A

Abstract

The invention provides a component recognition device, a component mounting device and a component recognition method, which can recognize the angle of a component with a circular feature part with high precision. The component recognition device includes: an image acquisition unit that acquires an image of a component having a plurality of features arranged in a circular shape; a center-of-gravity position calculation unit that calculates a position of a center of gravity of a region surrounded by the plurality of features; a template storage unit for storing a template related to the component; the posture calculation unit relatively rotates the image and the template around the center of gravity, and calculates a relative angle at which the correlation value between the image of the feature portion and the template of the feature portion is highest.

Description

Component recognition device, component mounting device, and component recognition method

Technical Field

The invention relates to a component recognition device, a component mounting device, and a component recognition method.

Background

A component mounting apparatus is used in a manufacturing process of an electronic device. The component mounting device includes a mounting head for mounting a component on a substrate. The mounting head has a suction nozzle that holds a component. As disclosed in patent document 1, an image of a component held by a suction nozzle is acquired before the component is mounted on a substrate. An angle of the part is identified based on the acquired image of the part.

Patent document 1: japanese patent laid-open publication No. 4106301

Disclosure of Invention

Even when a component having a plurality of circular features is mounted on a substrate, it is necessary to accurately recognize the angle of the component.

An object of an aspect of the present invention is to accurately recognize an angle of a member having a feature portion arranged in a circular shape.

According to the 1 st aspect of the present invention, there is provided a component recognition apparatus comprising: an image acquisition unit that acquires an image of a component having a plurality of features arranged in a circular shape; a center-of-gravity position calculation unit that calculates a position of a center of gravity of a region surrounded by the plurality of features; a template storage unit that stores templates related to the components; and a posture calculation unit configured to relatively rotate the image and the template around the center of gravity, and calculate a relative angle at which a correlation value between the image of the feature and the template of the feature is highest.

According to the 2 nd aspect of the present invention, there is provided a component mounting apparatus comprising: a mounting head having a suction nozzle holding the component; and a control device for adjusting the posture of the component before mounting the component on the substrate based on the recognition result of the component recognition device of claim 1.

According to the 3 rd aspect of the present invention, there is provided a component identification method comprising: obtaining an image of a component having a plurality of features arranged in a circle; calculating a position of a center of gravity of a region surrounded by the plurality of features; the image and the template related to the component are relatively rotated around the center of gravity, and a relative angle at which the correlation value between the image of the feature and the template of the feature is the highest is calculated.

According to the aspect of the present invention, the angle of the member having the circular feature portion can be accurately recognized.

Drawings

Fig. 1 is a plan view showing a member according to the embodiment.

Fig. 2 is a plan view schematically showing the component mounting apparatus according to the embodiment.

Fig. 3 is a configuration diagram illustrating a component mounting apparatus according to an embodiment.

Fig. 4 is a flowchart illustrating a component recognition method according to an embodiment.

Fig. 5 is a schematic diagram for explaining a method of calculating the center of gravity according to the embodiment.

Fig. 6 is a schematic diagram for explaining template matching according to the embodiment.

Fig. 7 is a block diagram illustrating a computer system according to an embodiment.

Description of reference numerals:

1: a component mounting device; 2: a component supply device; 3: a substrate supporting device; 4: a suction nozzle; 5: a mounting head; 6: a suction nozzle driving device; 7: a head driving device; 7X: an X-axis moving device; 7Y: a Y-axis moving device; 8: a control device; 10: a component recognition device; 11: a camera device; 12: an illumination device; 13: a display device; 20: an image processing device; 21: an image acquisition unit; 22: a center-of-gravity position calculating unit; 23: a template storage unit; 24: a posture calculation unit; 25: a display control unit; 30: a main body; 40: an electrode (feature); 40I: an image; 40T: a template; 1000: a computer system; 1001: a processor; 1002: a main memory; 1003: a memory; 1004: an interface; c: a component; CI: an image; CT: a template; g1: interval 1; g2: a 2 nd interval; MP: mounting position; and Og: a center of gravity; or: a center; and Ot: a center; p: a substrate; SP: a supply position.

Detailed Description

Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. In addition, some of the components may not be used.

In the embodiment, an XYZ rectangular coordinate system is set, and the positional relationship of each part will be described with reference to the XYZ rectangular coordinate system. The direction parallel to the X axis in the predetermined plane is defined as the X axis direction. A direction parallel to a Y axis in a predetermined plane orthogonal to the X axis is defined as a Y axis direction. The Z-axis direction is a direction parallel to a Z-axis orthogonal to the X-axis and the Y-axis. The rotation or inclination direction about the X axis is defined as the θ X direction. The rotation or inclination direction about the Y axis is defined as the θ Y direction. The rotation or tilt direction about the Z axis is defined as the θ Z direction. The specified surface is parallel to the horizontal surface. The Z-axis direction is a vertical direction. The predetermined surface may be inclined with respect to the horizontal plane. In the following description, the predetermined plane is referred to as an XY plane as appropriate.

[ Components ]

Fig. 1 is a plan view showing a member C according to the embodiment. As shown in fig. 1, the component C has a main body 30, and a plurality of electrodes 40 provided on the lower surface of the main body 30. In the present embodiment, 8 electrodes 40 are provided. In addition, the electrodes 40 may be provided in, for example, 10. The body 30 has a disc shape. The outer shape of the part C is circular in the XY plane. The plurality of electrodes 40 are arranged in a circular shape on the lower surface of the body 30. The plurality of electrodes 40 are identical in shape and size. The outer shape of the electrode 40 in the XY plane is circular. The outer shape of the electrode 40 may be a polygon such as a quadrangle or an octagon. The plurality of electrodes 40 are arranged to surround the center Or of the lower surface of the body 30. The center Or is the same distance from each of the plurality of electrodes 40. That is, the center of the virtual circle connecting the plurality of electrodes 40 coincides with the center Or of the lower surface of the body 30.

The plurality of electrodes 40 are arranged at intervals in a circular shape. The spacing of the electrodes 40 includes a plurality of 1 st intervals G1 and 1 nd intervals G2. The plurality of 1 st intervals G1 are the same. The 2 nd interval G2 is greater than the 1 st interval G1. That is, although the plurality of electrodes 40 are arranged at equal intervals in a circular shape, the interval between the adjacent specific 2 electrodes 40 is larger than the interval between the other electrodes 40. In the example shown in fig. 1, the interval (the 2 nd interval G2) of the 2 electrodes 40 disposed closest to the-Y side is larger than the interval (the 1 st interval G1) of the other electrodes 40.

The body 30 is made of plastic. The electrode 40 is made of metal. As the component C having the disc-shaped body 30 and the plurality of circular electrodes 40, an operation button of a smartphone or a tablet computer can be exemplified.

[ component mounting device ]

Fig. 2 is a plan view schematically showing the component mounting apparatus 1 according to the embodiment. Fig. 3 is a configuration diagram illustrating the component mounting device 1 according to the embodiment. The component mounting apparatus 1 mounts the component C on the substrate P printed with the cream solder.

The component mounting apparatus 1 includes: a component supply device 2 for supplying the component C; a substrate support device 3 for supporting the substrate P; a mounting head 5 having a suction nozzle 4 for holding the component C and mounting the component C on the substrate P; a nozzle driving device 6 for moving the suction nozzle 4; a head driving device 7 that moves the mounting head 5; a control device 8 for controlling the component mounting device 1; and a component recognition device 10 that recognizes the component C held by the suction nozzle 4.

The component supply device 2 supplies the component C to the supply position SP. The component supply device 2 includes, for example, a plurality of tape feeders. The tape feeder has: a reel on which the tape of the holding member C is wound; and a drive device that feeds out the tape wound on the reel. The driving device discharges the tape so that the component C held on the tape moves to the feeding position SP. The component supply device 2 may include a tray for holding the components C.

The substrate supporting device 3 supports the substrate P at the mounting position MP. The substrate supporting apparatus 3 includes: a substrate transfer device for transferring the substrate P to the mounting position MP; and a substrate supporting member supporting the substrate P conveyed to the mounting position MP. The substrate conveying device comprises: a conveyor that conveys the substrate P in the X-axis direction; and a guide member for guiding the substrate P in the X-axis direction.

The suction nozzle 4 detachably holds the component C. The suction nozzle 4 is a suction nozzle that sucks the component C. An opening is provided at the front end of the suction nozzle 4. The opening of the suction nozzle 4 is connected to a vacuum system. The component C is sucked and held at the tip of the suction nozzle 4 by performing a suction operation from the opening of the suction nozzle 4 in a state where the tip of the suction nozzle 4 is in contact with the component C. The component C is released from the suction nozzle 4 by releasing the suction operation from the opening of the suction nozzle 4. In addition, the suction nozzle 4 may be a holding nozzle that pinches the component C.

The mounting head 5 supports a plurality of suction nozzles 4. The mounting head 5 mounts the component C held by the suction nozzle 4 to the substrate P. The mounting head 5 can move from one of the supply position SP and the mounting position MP to the other. The supply position SP and the mounting position MP are defined at different positions in the XY plane. The mounting head 5 moves to the supply position SP, holds the component C supplied from the component supply device 2 by the suction nozzle 4, and then moves to the mounting position MP to mount the component C on the substrate P supported by the substrate support device 3.

The nozzle driving device 6 moves the nozzle 4 in the Z-axis direction and the θ Z direction, respectively. The nozzle driving device 6 includes an actuator provided to the mounting head 5. The suction nozzle driving devices 6 are provided to the plurality of suction nozzles 4, respectively.

The head driving device 7 moves the mounting head 5 in the X-axis direction and the Y-axis direction, respectively. The head drive device 7 includes: an X-axis moving device 7X that moves the mounting head 5 in the X-axis direction; and a Y-axis moving device 7Y that moves the mounting head 5 in the Y-axis direction. The X-axis moving device 7X and the Y-axis moving device 7Y each include an actuator. The X-axis moving device 7X is connected to the mounting head 5. The mounting head 5 is moved in the X-axis direction by the drive of the X-axis moving device 7X. The Y-axis moving device 7Y is connected to the mounting head 5 via the X-axis moving device 7X. The Y-axis moving device 7Y is driven, and the X-axis moving device 7X moves in the Y-axis direction. The mounting head 5 is moved in the Y-axis direction by the X-axis moving device 7X moving in the Y-axis direction.

The suction nozzle 4 is movable in 4 directions of an X-axis direction, a Y-axis direction, a Z-axis direction, and a θ Z direction by a suction nozzle driving device 6 and a head driving device 7. By the movement of the suction nozzle 4, the component C held by the suction nozzle 4 can also be moved in 4 directions of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ Z direction.

The control device 8 includes a computer system that outputs control commands for controlling the substrate support device 3, the nozzle drive device 6, and the head drive device 7.

[ component recognizing device ]

As shown in fig. 2 and 3, the component recognition apparatus 10 includes an imaging apparatus 11, an illumination apparatus 12, a display apparatus 13, and an image processing apparatus 20.

The imaging device 11 is disposed between the supply position SP and the mounting position MP. The imaging device 11 images the component C before being mounted on the substrate P. The imaging device 11 images the component C held by the suction nozzle 4 from below. The suction nozzle 4 holds the component C such that the lower surface of the main body 30 faces downward. The imaging device 11 can image the lower surface of the main body 30 and the electrode 40 provided on the lower surface of the main body 30. The imaging device 11 includes an optical system, and an imaging element such as a ccd (charge Coupled device) image sensor or a cmos (complementary Metal Oxide semiconductor) image sensor. In the present embodiment, the imaging device 11 is provided such that the optical axis of the optical system is parallel to the Z axis.

The illumination device 12 illuminates the component C imaged by the imaging device 11. The illumination device 12 has a light source that emits illumination light. An example of the Light source is a Light Emitting Diode (LED). The lighting device 12 illuminates the component C held by the suction nozzle 4 from below. As described above, the electrode 40 is made of metal. The electrode 40 has a reflectivity higher than that of the body 30. The illumination light applied to the electrode 40 is reflected by the electrode 40 and enters the optical system of the imaging device 11.

The display device 13 displays the image of the component C imaged by the imaging device 11 and the image processed by the image processing device 20. The Display device 13 is exemplified by a flat panel Display such as a Liquid Crystal Display (LCD) or an Organic EL Display (OELD).

The image processing apparatus 20 includes a computer system that processes the image of the component C imaged by the imaging apparatus 11. The image processing device 20 calculates the posture of the component C based on the image acquired by the imaging device 11. The attitude of the component C includes the angle of the component C in the θ Z direction.

The image processing apparatus 20 includes an image acquisition unit 21, a center-of-gravity position calculation unit 22, a template storage unit 23, a posture calculation unit 24, and a display control unit 25.

The image obtaining unit 21 obtains an image of the component C imaged by the imaging device 11. As described above, the electrode 40 has a reflectance higher than that of the body 30. The brightness of the image of the electrode 40 is higher than that of the image of the subject 30. The electrode 40 functions as a feature of the component C.

The image acquisition unit 21 acquires an image of the component C defined in the camera coordinate system. The camera coordinate system is a coordinate system based on an origin defined in an imaging element of the imaging device 11.

The center-of-gravity position calculation unit 22 calculates the position of the center of gravity Og of the region surrounded by the plurality of electrodes 40 based on the image of the component C acquired by the image acquisition unit 21.

The template storage section 23 stores templates related to the components C. The template related to the component C is previously created based on the design data of the component C. Additionally, a template associated with component C may be created based on the image of component C. The templates associated with component C include the coordinates of the center of the body 30 in the camera coordinate system and the templates of the electrodes 40. The template for the electrode 40 includes the coordinates of the center of the electrode 40 in the camera coordinate system and the outline of the electrode 40.

The posture calculation unit 24 relatively rotates the image of the part C and the template of the part C in the camera coordinate system with the center of gravity Og calculated by the center of gravity position calculation unit 22 as the center, and calculates a relative angle at which the correlation value between the image of the electrode 40 and the template of the electrode 40 is the highest. Further, the posture calculation unit 24 calculates a correction amount for setting the component C to the target angle based on the relative angle at which the correlation value between the image of the electrode 40 and the template is the highest.

The display control unit 25 causes the display device 13 to display the image of the component C or the image processed by the image processing device.

The recognition result of the component recognition apparatus 10 includes: the relative angle at which the correlation value between the image of the electrode 40 and the template of the electrode 40 is the highest, and the correction amount for setting the component C to the target angle, which are calculated by the posture calculation unit 24. The control device 8 adjusts the posture of the component C held by the suction nozzle 4 before mounting the component C on the substrate P based on the recognition result of the component recognition device 10. The control device 8 controls the nozzle driving device 6 to rotate the nozzle 4 holding the component C in the θ Z direction so that the component C is at the target angle, based on the correction amount calculated by the posture calculation unit 24. The controller 8 mounts the component C on the substrate P after adjusting the angle of the component C in the θ Z direction.

[ method of identifying Components ]

Fig. 4 is a flowchart illustrating a component recognition method according to an embodiment. The mounting head 5 moves to the feeding position SP to hold the component C by the suction nozzle 4. The suction nozzle 4 holds the component C supplied from the component supply device 2. The suction nozzle 4 holds the upper surface of the main body 30. The mounting head 5 moves above the image pickup device 11. The imaging device 11 images the component C held by the suction nozzle 4 from below. The imaging device 11 images the lower surface of the main body 30 and the plurality of electrodes 40. The image obtaining unit 21 obtains the image of the component C captured by the imaging device 11 (step S1).

The center-of-gravity position calculation unit 22 calculates the coordinates of each of the plurality of electrodes 40 in the camera coordinate system based on the image of the component C acquired by the image acquisition unit 21 (step S2).

The center of gravity position calculation unit 22 calculates the position of the center of gravity Og of the region surrounded by the plurality of electrodes 40 based on the coordinates of each of the plurality of electrodes 40 (step S3).

Fig. 5 is a schematic diagram for explaining a method of calculating the center of gravity Og according to the embodiment. As shown in fig. 5, image CI of component C includes an image 40I of electrode 40. The center-of-gravity position calculation unit 22 scans the image 40I of the electrode 40 and detects the edge of the image 40I of the electrode 40. The center-of-gravity position calculation unit 22 calculates coordinates of the center of the image 40I of the electrode 40 in the camera coordinate system based on the edge of the image 40I of the electrode 40. The center-of-gravity position calculation unit 22 calculates the coordinates of each of the images 40I of the plurality of electrodes 40.

The center-of-gravity position calculation unit 22 can calculate the position of the center of gravity Og of the region surrounded by the images 40I of the plurality of electrodes 40 based on the coordinates of the centers of the images 40I of the plurality of electrodes 40.

After the center of gravity Og is calculated, the posture calculation unit 24 compares the template 40T of the electrode 40 with the image 40I of the electrode 40 by template matching.

Fig. 6 is a schematic diagram for explaining template matching according to the embodiment. As shown in fig. 6, the template CT associated with the part C includes the coordinates of the center Ot of the subject 30 in the camera coordinate system and the template 40T of the electrode 40. The template 40T of the electrode 40 includes the coordinates of the center of the electrode 40 in the camera coordinate system and the outline of the electrode 40.

The posture calculation unit 24 sets windows for each image 40I, and compares the template 40T of the counter electrode 40 with the image 40I of the electrode 40 by template matching. The posture calculating unit 24 aligns the center of gravity Og of the image CI of the component C with the center Ot of the template CT of the component C, and then relatively rotates the image CI of the component C and the template CT of the component C around the center of gravity Og in the camera coordinate system, thereby calculating the relative angle between the image CI of the component C and the template CT of the component C, in which the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest (step S4).

In the present embodiment, the angle of the template CT of the part C is defined to coincide with the target angle of the part C in the camera coordinate system. The posture calculation unit 24 rotates the image CI of the component C so that the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest, with the template CT of the component C fixed in the camera coordinate system.

The posture calculating unit 24 calculates a correction amount for setting the component C to the target angle based on the relative angle between the image CI of the component C and the template CT of the component C, which has the highest correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 (step S5).

As described above, in the present embodiment, the posture calculation unit 24 rotates the image CI of the component C so that the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest, with the template CT of the component C fixed in the camera coordinate system. The relative angle at which the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest is the rotation angle when the image CI of the component C is rotated with the template CT of the component C fixed. The posture calculation unit 24 calculates a correction amount based on the rotation angle of the image CI of the component C. The correction amount corresponds to the rotation angle of the image CI of the component C.

The control device 8 controls the nozzle drive device 6 to rotate the nozzle 4 holding the component C in the θ Z direction so that the component C becomes the target angle, based on the correction amount calculated by the posture calculation unit 24. The controller 8 adjusts the angle of the component C in the θ Z direction, and then mounts the component C on the substrate P.

[ computer System ]

Fig. 7 is a block diagram illustrating a computer system 1000 according to an embodiment. The image processing apparatus 20 described above includes a computer system 1000. The computer system 1000 has: a processor 1001 such as a cpu (central Processing unit); a main memory 1002 including a nonvolatile memory such as a rom (read Only memory) and a volatile memory such as a ram (random Access memory); a memory 1003; and an interface 1004 including input-output circuitry. The functions of the image processing apparatus 20 are stored in the memory 1003 as a computer program. The processor 1001 reads the computer program from the memory 1003, expands the computer program in the main memory 1002, and executes the above-described processing in accordance with the computer program. In addition, the computer program may be transmitted to the computer system 1000 via a network.

The computer program enables the computer system 1000 to perform the following in accordance with the embodiments described above: acquiring an image of a part C having a plurality of features arranged in a circle; calculating a position of a center of gravity Og of a region surrounded by the plurality of features; the image CI and the template CT relating to the component C are relatively rotated around the center of gravity Og, and a relative angle at which the correlation value between the image 40I of the feature and the template 40T of the feature is the highest is calculated.

[ Effect ]

As described above, according to the embodiment, the position of the center of gravity Og of the region surrounded by the image 40I of the plurality of electrodes 40 is calculated. After the position of the center of gravity Og is calculated, the image CI of the part C and the template CT of the part C are relatively rotated around the center of gravity Og, and the relative angle between the image CI of the part C and the template CT of the part C, in which the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest, is calculated. This enables the angle of the component C having the plurality of electrodes 40 arranged in a circular shape to be recognized with high accuracy.

When the template 40T of the electrode 40 is compared with the image 40I of the electrode 40 by only template matching using the outer shape of the electrode 40 without obtaining the center of gravity Og, there is a high possibility that a high correlation value is calculated even if all the templates 40T do not match all the images 40I. For example, as shown in fig. 1, in the case where there are 8 electrodes 40, it is difficult for a large difference to occur between the correlation value when 8 templates 40T match 8 images 40I and the correlation value when 7 templates 40T match 7 images 40I. As a result, it is difficult to accurately recognize the angle of the component C.

According to an embodiment, after the center of gravity Og is calculated, the image CI of the part C and the template CT of the part C are relatively rotated around the center of gravity Og so that the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is the highest. This makes clear the difference between the correlation value when, for example, 8 templates 40T and 8 images 40I coincide and the correlation value when 7 templates 40T and 7 images 40I coincide. Therefore, the angle of the component C can be recognized with high accuracy.

The spacing of the electrodes 40 includes a plurality of 1 st intervals G1 and 1 nd intervals G2. That is, although the plurality of electrodes 40 are arranged in a circular shape, the plurality of electrodes 40 are provided with directivity at the 2 nd interval G2. Thus, only when the image CI of the part C is rotated to the target angle, the 8 templates 40T coincide with the 8 images 40I. Therefore, the angle of the component C can be recognized with high accuracy.

[ other embodiments ]

In the above-described embodiment, the electrode 40 is a feature. By using the electrode 40 having a higher reflectance to the illumination light than the main body 30 as the feature portion, template matching can be performed with high accuracy using the electrode 40. Additionally, the feature may not be an electrode 40. The feature portion may be any portion that forms a characteristic image in the image of the component captured by the imaging device 11.

In the above embodiment, the 2 nd interval G2 may be smaller than the 1 st interval G1.

In the above-described embodiment, when the correlation value between the image 40I of the electrode 40 and the template 40T of the electrode 40 is obtained, the image CI of the component C is rotated in a state where the template CT of the component C is fixed in the camera coordinate system. The template CT of the component C may be rotated in a state where the image CI of the component C is fixed, or both the image CI of the component C and the template CT of the component C may be rotated.

Claims

1. A component recognition device is provided with:

an image acquisition unit that acquires an image of a component having a plurality of features arranged in a circular shape;

a center-of-gravity position calculation unit that calculates a position of a center of gravity of a region surrounded by the plurality of features;

a template storage unit that stores templates related to the components;

and a posture calculation unit configured to relatively rotate the image and the template around the center of gravity, and calculate a relative angle at which a correlation value between the image of the feature and the template of the feature is highest.

2. The component recognizing apparatus according to claim 1,

the member has a disk-shaped body and a plurality of electrodes provided to the body,

the feature comprises the electrode.

3. The component recognizing apparatus according to claim 1 or 2,

the spacing of the features includes a plurality of 1 st spacings and 1 nd spacings,

a plurality of said 1 st intervals are the same,

the 2 nd interval is larger than the 1 st interval.

4. The component recognizing apparatus according to claim 1 or 2,

the posture calculation unit calculates a correction amount for setting the member to a target angle based on the relative angle.

5. A component mounting device is provided with:

a mounting head having a suction nozzle that holds a component; and

a control device that adjusts the posture of the component before mounting the component on the substrate based on a recognition result of the component recognition device according to any one of claims 1 to 4.

6. A component identification method, comprising:

obtaining an image of a component having a plurality of features arranged in a circle;

calculating a position of a center of gravity of a region surrounded by the plurality of features;

the image and the template related to the component are relatively rotated around the center of gravity, and a relative angle at which the correlation value between the image of the feature and the template of the feature is the highest is calculated.