JP7158901B2 - Positioning method and positioning device - Google Patents

Description

The present invention relates to a positioning method and a positioning device.

Conventionally, a die bonder is used when bonding chips formed by dicing a wafer. That is, a wafer ring is set on the wafer table of the die bonder, and a plurality of chips are attached to the wafer sheet stretched on the wafer ring. Then, the chip is picked up by a pick-up device and mounted on a substrate such as a lead frame.

By the way, it is necessary to align (position) the chip at the time of pickup. That is, this type of pick-up device generally picks up a chip by sucking it with a sucking collet. Therefore, if the chip is misaligned, it may not be possible to mount the chip at the correct position.

As in this example, in the electronic device manufacturing process and appearance inspection process, the positioning result is directly linked to the manufacturing/inspection accuracy, so accurate and stable positioning is required. Therefore, there is a conventional device described in Patent Document 1 as a device for stably positioning.

In the positioning apparatus described in Patent Document 1, when positioning a part having a plurality of features, a user specifies the order in which feature points such as sides and corners of the part are recognized, and the feature points are recognized according to the order specified by the user. is recognized and image processing is performed. That is, the positioning device described in Patent Document 1 determines positioning positions at a plurality of positions for a single-part workpiece, positions a position with a low degree of difficulty, and uses the result to position a region with a high degree of difficulty. The positioning success rate is increased by positioning with

Japanese Patent No. 4744234

In the positioning device described in Patent Document 1, only the positioning order can be easily changed by the user. In this way, even if the positioning order is changed, retry of the positioning process occurs frequently. When retrying, trial and error is required to change the retry conditions. However, it is difficult to set retry conditions, and it is often the case that suitable conditions cannot be found. In addition, when positioning is not successful (when accurate positioning cannot be achieved), the unsuccessful positioning may be used for determination.

In Patent Document 1, the workpiece is limited to a single component. For this reason, it is possible to use positioning results with a low degree of difficulty for objects with a high degree of difficulty, but this cannot be applied to works in which a plurality of different parts having similar characteristics are adjacent to each other.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a positioning method and a positioning apparatus capable of performing stable positioning without being affected by a plurality of parts having similar characteristics.

A first positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target parts, wherein the plurality of positioning target parts are ranked in misidentification difficulty that causes misidentification as other parts. Positioning of the positioning target region with the lowest misrecognition difficulty level is performed first, and then, when positioning of positioning target regions of other ranks is performed, an image of only the region of the positioning target region is extracted from the inspection image. It is taken out and positioned based on the taken out image.

According to the first positioning method of the present invention, positioning is initially performed on the positioning target part with the lowest misrecognition difficulty level. In this case, the lowest misrecognition difficulty rank is one that is less likely to be affected by other parts. Therefore, positioning with respect to the positioning target portion with the lowest misidentification difficulty has a high degree of reliability. After that, an image of only the area of the next positioning target site is extracted from the inspection image, and positioning is performed based on the extracted image, so the reliability of this positioning is also high.

A second positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target portions, wherein the plurality of positioning target portions are ranked in misidentification difficulty to cause misidentification as other portions. The pixel value of the area other than the positioning target part to be positioned when positioning the positioning target part with the lowest rank of misidentification difficulty first, and then positioning the positioning target parts with other ranks, Then, the positioning is performed by clearing the pixel values of the area of the positioning target part with the lowest rank.

According to the second positioning method of the present invention, positioning is first performed on the positioning target part with the lowest misrecognition difficulty level. Reliability is high in positioning with respect to the positioning target part with the lowest misidentification difficulty level. After that, the pixel values of the regions other than the positioning target region to be positioned and the pixel values of the region of the positioning target region of the lowest rank are cleared before positioning, so the reliability of this positioning is also high.

A third positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target portions, wherein the plurality of positioning target portions have a misrecognition difficulty rank that causes misidentification as other portions. Positioning is first performed for the positioning target region with the lowest misrecognition difficulty level, and then, when positioning positioning target regions with other ranks, an image of only the region of the positioning target region is extracted from the inspection image. and a step of clearing the pixel values of the regions other than the positioning target portion to be positioned and the pixel values of the region of the positioning target portion of the lowest rank.

According to the third positioning method of the present invention, positioning is first performed on the positioning target part with the lowest misrecognition difficulty level. Reliability is high in positioning with respect to the positioning target part with the lowest misidentification difficulty level. After that, an image of only the area of the positioning target part is extracted from the inspection image, and positioning is performed based on the extracted image, or the pixel values of the area other than the positioning target part to be positioned, and the positioning target of the lowest rank. Since the positioning is performed by clearing the pixel values of the region of the part, the reliability of these positionings is also high.

A first positioning device of the present invention is a positioning device for positioning a work having a plurality of positioning target parts, wherein an imaging means for picking up an image of the work and a positioning target part that is misidentified as another part. The ranking of the resulting misrecognition difficulty is determined by the user, and a low-rank processing means for performing positioning based on the image of the positioning target part with the lowest rank of the misrecognition difficulty ranking, and the positioning target part with the other ranks. An image extraction processing means for extracting an image of only the area of the positioning target part from the inspection image and performing positioning based on the extracted image when positioning is performed.

According to the first positioning apparatus of the present invention, the low-rank processing means performs positioning based on the image of the positioning target part with the lowest rank in the misrecognition difficulty ranking. Reliability is high in positioning with respect to the positioning target part with the lowest misidentification difficulty level. Also, when positioning a positioning target region of another rank, an image of only the region of the positioning target region is extracted from the inspection image, and positioning is performed based on the extracted image. reliability is also high.

A second positioning device of the present invention is a positioning device for positioning a work having a plurality of positioning target parts, wherein an imaging means for picking up an image of the work and a positioning target part that is misidentified as another part. The ranking of the resulting misrecognition difficulty is determined by the user, and a low-rank processing means for performing positioning based on the image of the positioning target part with the lowest rank of the misrecognition difficulty ranking, and the positioning target part with the other ranks. an image value clearing means for performing positioning by clearing pixel values in areas other than the positioning target part to be positioned and pixel values in the area of the positioning target part with the lowest rank when positioning is performed. is.

According to the second positioning apparatus of the present invention, the low-rank processing means performs positioning based on the image of the positioning target part with the lowest rank in the misrecognition difficulty ranking. Reliability is high in positioning with respect to the positioning target part with the lowest misidentification difficulty level. When positioning a positioning target site of another rank, the pixel values of the regions other than the positioning target site to be positioned and the pixel values of the region of the positioning target site of the lowest rank are cleared before positioning. The reliability of positioning is also high.

A third positioning apparatus of the present invention is a positioning apparatus for positioning a work having a plurality of positioning target parts, wherein imaging means for picking up an image of the work and positioning target parts that are misidentified as other parts. The ranking of the resulting misrecognition difficulty is determined by the user, and a low-rank processing means for performing positioning based on the image of the positioning target part with the lowest rank of the misrecognition difficulty ranking, and the positioning target part with the other ranks. When performing positioning, an image extraction process performed by extracting an image of only the area of the positioning target part from the inspection image, the pixel value of the area other than the positioning target part to be positioned, and the pixel value of the area of the positioning target part with the lowest rank and image processing means for performing image value reduction processing after clearing pixel values.

According to the third positioning apparatus of the present invention, the low-rank processing means performs positioning based on the image of the positioning target part with the lowest rank in the misrecognition difficulty ranking. Reliability is high in positioning with respect to the positioning target part with the lowest misidentification difficulty level. An image of only the region of the positioning target portion is extracted from the inspection image, and based on the extracted image, positioning is performed, or the pixel values of the regions other than the positioning target portion to be positioned, and the position of the positioning target portion of the lowest rank. Since the pixel values of the area are cleared and the positioning is performed, the reliability of these positioning is also high.

The workpiece in the positioning method and positioning apparatus is, for example, a stacked semiconductor device in which a plurality of chips are stacked.

In the present invention, the influence of parts (patterns) similar to the part to be positioned can be removed, and even if there are a plurality of parts with similar characteristics, stable positioning can be performed without being affected by them. can be done. Therefore, there is no need to retry the positioning process, and the work time can be shortened, resulting in excellent productivity.

1 is a simplified configuration diagram of a main part of a first positioning device of the present invention; FIG. 1 is a simplified diagram of a first positioning device of the present invention; FIG. 3 is a simplified plan view of a work; FIG. 1 is a simplified side view of a workpiece; FIG. A first positioning method is shown, (a) is a simplified diagram of the positioning setting state of the low-rank positioning target portion 1A, (b) is a simplified diagram of the positioning setting state of the positioning target portion 1B, and (c). is a simplified diagram of the positioning setting state of the positioning target portion 1C, and (d) is a simplified diagram of the positioning setting state of the positioning target portion 1D. FIG. 4 is a simplified plan view of a work in a positionally displaced state; FIG. 4 is a flow chart diagram of the first positioning method of the present invention using the first positioning device of the present invention; FIG. 7 is a simplified diagram of a positioning setting state of the positioning target portion 1A with respect to the workpiece shown in FIG. 6; FIG. 7 shows the positioning process of the positioning target portion 1B with respect to the workpiece shown in FIG. 6, (a) is a simplified diagram showing a state in which the position of the region set by the positioning result of the positioning target portion 1A is corrected, and (b). is a simplified diagram of a cut-out region, and (c) is a simplified diagram of the positioning execution state of the positioning target portion 1B. FIG. 7 shows the positioning process of the positioning target portion 1C with respect to the workpiece shown in FIG. 6, (a) is a simplified diagram of the state in which the position of the region set by the positioning result of the positioning target portion 1B is corrected, and (b). is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1C. FIG. 7 shows the positioning process of the positioning target portion 1D with respect to the work shown in FIG. 6, (a) is a simplified diagram of the state in which the position of the region set by the positioning result of the positioning target portion 1C is corrected, and (b). is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1D. FIG. 4 is a simplified configuration diagram of a main part of a second positioning device of the present invention; A second positioning method is shown, (a) is a simplified diagram of the positioning setting state of the low-rank positioning target portion 1A, (b) is a simplified diagram of the positioning setting state of the positioning target portion 1B, and (c). is a simplified diagram of the positioning setting state of the positioning target portion 1C, and (d) is a simplified diagram of the positioning setting state of the positioning target portion 1D. FIG. 4 is a simplified plan view of a work in a positionally displaced state; FIG. 4 is a flow chart diagram of a second positioning method of the present invention using a second positioning device of the present invention; 15 is a simplified diagram of a positioning setting state of the positioning target portion 1A with respect to the workpiece shown in FIG. 14; FIG. 14A and 14B show the positioning process of the positioning target portion 1B with respect to the work shown in FIG. 14, FIG. is a simplified diagram of a cut-out region, and (c) is a simplified diagram of the positioning execution state of the positioning target portion 1B. 14A and 14B show the positioning process of the positioning target portion 1C with respect to the work shown in FIG. 14, and FIG. is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1C. 14A and 14B show the positioning process of the positioning target portion 1D with respect to the work shown in FIG. 14, and FIG. is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1D. FIG. 11 is a simplified configuration diagram of a main part of a third positioning device of the present invention;

An embodiment of the present invention will be described below with reference to FIGS. 1 to 20. FIG. FIG. 1 shows a simplified block diagram of essential parts of a first positioning device of the present invention, and FIG. 2 shows a simplified diagram of the first positioning device. This positioning device positions a work W having a plurality (four) of positioning target portions 1 (1A, 1B, 1C, 1D) shown in FIGS.

That is, the workpiece W of this embodiment is formed by stacking a plurality of (four in this embodiment) semiconductor chips 2A, 2B, 2C, and 2D, and is adhered onto the lead frame 3 . Also, the 2D semiconductor chip is at the bottom, and the 2C, 2B, and 2A semiconductor chips are stacked below. In this case, the respective semiconductor chips 2A, 2B, 2C, and 2D are stacked with a predetermined displacement.

The uppermost semiconductor chip 2A has its entire upper surface exposed, and the wiring pattern 5 and pattern 6 can be observed from above. The second semiconductor chip 2B from the top is mostly covered with the uppermost semiconductor chip 2A, and the pattern 7 can be observed from above in a state where a part thereof is exposed. The semiconductor chip 2C in the third row from the top is mostly covered with the semiconductor chip 2B in the second row, and the pattern 8 can be observed from above in a state in which a part thereof is exposed. The semiconductor chip 2D in the fourth row from the top is mostly covered with the semiconductor chip 2C in the third row, and the pattern 9 can be observed from above in a state in which a part thereof is exposed.

For this reason, the upper surface of the semiconductor chip 2A on the uppermost stage becomes the positioning target portion 1A, and the upper exposed portion (rectangular portion including the pattern 7) of the upper surface of the semiconductor chip 2B on the second stage becomes the positioning target portion 1B. The upper exposed portion (rectangular portion including the pattern 8) of the upper surface of the semiconductor chip 2C in the third stage becomes the positioning target portion 1C, and the upper exposed portion (the rectangular portion including the pattern 8) of the upper surface of the semiconductor chip 2D in the fourth stage. A rectangular portion including the pattern 9) becomes the positioning target portion 1D.

The positioning target part 1 (1A, 1B, 1C, 1D) is determined by the user as to the misrecognition difficulty ranking that causes misrecognition with other parts. That is, the lower the misrecognition difficulty, the less likely misrecognition with other parts occurs, and the higher the misrecognition difficulty, the more likely misrecognition with other parts occurs. In this case, since the entire top surface of the semiconductor chip 2A is exposed upward, the positioning target portion 1A uses the wiring pattern 5 on the front surface for positioning, and is thus positioned more easily than the other positioning target portions 1B, 1C, and 1D. This makes it difficult for misidentification to occur. In other words, the positioning target site 1A has the lowest misrecognition difficulty level.

As can be seen from FIG. 3, the pattern 7 of the positioning target portion 1B is sandwiched between the pattern 6 of the positioning target portion 1A and the pattern 8 of the positioning target portion 1C. The pattern 7 of the positioning target portion 1D is sandwiched between the pattern 7 of the positioning target portion 1D and the pattern 9 of the positioning target portion 1D, and the pattern 8 of the positioning target portion 1C is positioned above the pattern 9 of the positioning target portion 1D. In this case, since the patterns 6, 7, 8, and 9 have the same shape and the same size, these positioning target parts 1B to 1D have a higher misrecognition difficulty than the positioning target part 1A. In FIG. 3, the range surrounded by the chain double-dashed line indicates the work mounting positional deviation allowable range.

As shown in FIGS. 1 and 2, this positioning apparatus includes imaging means 10 for imaging a workpiece W, and control means 11 for controlling the imaging means 10 . Further, the control means 11 has a low-rank processing means 12 and an image extraction processing means 13 and is connected to a storage means 14 . The control means 11 is, for example, a microcomputer in which a CPU (Central Processing Unit) as a center and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. A storage device as the storage means 14 includes a HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), and the like. The ROM stores programs and data executed by the CPU. The ranking of the misrecognition difficulty of the positioning target part 1 is stored in the storage means 14 .

The imaging means 10 is composed of, for example, a camera such as a CCD camera or a CMOS camera, and the work W is illuminated by an illumination means 15 . Illumination means include bright field illumination and dark field illumination. Bright-field illumination refers to illuminating the object to be measured perpendicularly along the center of the optical axis. Dark-field illumination refers to illuminating the object to be measured obliquely rather than at the center of the optical axis. In other words, bright field illumination is a type of illumination that observes the direct light reflected or transmitted from the irradiated light. obscures the light and is darker than the background. Dark-field illumination is a type of illumination that observes light scattered by reflection or transmission of irradiated light, and observes a bright sample that stands out against a dark background. For this reason, with dark field illumination, it becomes possible to observe fine structures, flaws, defects, etc. that cannot be seen blurry with bright field illumination. Although dark field illumination is used in this embodiment, bright field illumination may be used, or both dark field illumination and bright field illumination may be used.

The low-rank processing means 12 performs positioning based on the image of the positioning target portion 1A with the lowest rank in the misrecognition difficulty ranking, and the image extraction processing means 13 performs positioning of the positioning target portions of other ranks. When performing the positioning, an image of only the region of the positioning target site is taken out from the inspection image, and the positioning is carried out based on the taken out image.

Next, a work positioning method using the positioning device shown in FIGS. 1 and 2 will be described. In this device, as shown in FIGS. 5(a), 5(b), 5(c) and 5(d), positioning setting is sequentially performed from the positioning target portion 1A to 1D. That is, in FIG. 5A, the wiring pattern 5 of the positioning target portion 1A is the positioning model, and the area surrounding the positioning target portion 1A is the model search area H1. Also, R1 indicates the area to be set for the next positioning area by positioning the positioning target portion 1A.

In FIG. 5B, the model search area H2 is an area including the pattern 6 of the positioning target portion 1A, the pattern 7 of the target portion 1B, and the pattern 8 of the positioning target portion 1C. becomes the positioning model, and the positioning target portion 1C becomes the setting region R2.

In FIG. 5C, the model search area H3 is an area including the pattern 7 of the positioning target portion 1B, the pattern 8 of the target portion 1C, and the pattern 9 of the positioning target portion 1D. becomes the positioning model, and the positioning target portion 1D becomes the setting region R3.

In FIG. 5D, the model search area H4 is an area including the pattern 8 of the positioning target portion 1C and the pattern 9 of the target portion 1D, and the pattern 9 of the positioning target portion 1D is the positioning model.

Next, as shown in FIG. 6, the positioning method when the work W is out of position will be described with reference to the flow chart shown in FIG. 7 and simplified diagrams shown in FIGS. In this case, as shown in FIG. 8, the positioning model (wiring pattern 5) of the positioning target portion 1A (having the lowest false recognition difficulty rank) is in the model search area H1. Accordingly, the positioning of the positioning target portion 1A can be executed.

Therefore, as shown in FIG. 7, it is possible to execute the positioning of the first position (positioning target region 1A with the lowest misrecognition difficulty rank) in step S1. Here, executing positioning means detecting the positional information of the wiring pattern from the captured image of the model search area H1, calculating the deviation between the detected position and a preset reference position, and calculating the calculated positional information. It is to correct the position by the amount of deviation. Next, based on this positioning result, as shown in FIG. 9A, the position of the set region R1 is corrected. That is, step S2 in FIG. 7 is executed.

Next, as shown in FIG. 9B, the region R1 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 9A) (only this region R1 is displayed) (step S3). . Based on this extracted image, positioning of the positioning target region 1B is executed (the next positioning is executed) (in this case, as shown in FIG. 9C, the pattern 7 of the model search area H2 is used. positioning) (step S4). After that, the process proceeds to step S5, and it is determined whether or not the positioning of all positioning target parts has been completed. If it is completed in step S5, it ends, and if it is not completed, it returns to step S2. Since the work shown in FIG. 6 is not completed, the process returns to step S2.

After returning to step S2, as shown in FIG. 10(a), the position of the region R2 is corrected based on the positioning result of the positioning target portion 1B. After that, as shown in FIG. 10(b), the region R2 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 10(a)) (only this region R2 is displayed) (step S3). . Based on this extracted image, positioning of the positioning target region 1C is executed (the next positioning is executed) (in this case, as shown in FIG. 10C, pattern 8 in model search region H3 is used to positioning) (step S4). Next, the process proceeds to step S5 to determine whether or not positioning of all positioning target portions has been completed. If it is completed in step S5, it ends, and if it is not completed, it returns to step S2. Since the work shown in FIG. 6 is not completed, the process returns to step S2.

After returning to step S2, as shown in FIG. 11(a), the position of the region R3 is corrected based on the positioning result of the positioning target portion 1C. Thereafter, as shown in FIG. 11(b), the region R3 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 11(a)) (only this region R3 is displayed) (step S3). . Based on this extracted image, positioning of the positioning target region 1D is executed (the next positioning is executed) (in this case, as shown in FIG. 11C, the pattern 9 of the model search area H4 is used). positioning) (step S4). After that, the process proceeds to step S5, and it is determined whether or not the positioning of all positioning target parts has been completed. If it is completed in step S5, it ends, and if it is not completed, it returns to step S2. Since the work shown in FIG. 6 has been completed, it will end.

In the positioning method using this positioning device, the positioning target part 1 (1A) with the lowest misrecognition difficulty level is positioned first. In this case, the lowest misrecognition difficulty rank is one that is less likely to be affected by other parts. Therefore, the reliability of positioning with respect to the positioning target portion 1 (1A) having the lowest misidentification difficulty level is high. Thereafter, an image of only the area of the next positioning target site 1 is extracted from the inspection image, and positioning is performed based on the extracted image, so the reliability of this positioning is also high.

Next, FIG. 12 shows a second positioning device according to the present invention, in which image value clear processing means 17 is provided in place of the image extraction processing means 13 of the first positioning device. Here, the image value clear processing means 17, when positioning a positioning target part of another rank, sets the pixel value of the area other than the positioning target part to be positioned, and the pixel value of the area of the positioning target part of the lowest rank. It clears the pixel value.

Also in this case, as shown in FIGS. 13A, 13B, 13C, and 13D, the positioning setting is performed sequentially from the positioning target portion 1A to 1D. That is, in FIG. 13A, the wiring pattern 5 of the positioning target portion 1A is the positioning model, and the area surrounding the positioning target portion 1A is the model search area H1. Also, R1a and R1b indicate regions where pixel values are cleared. R1a is the positioning target portion 1A, and R1b indicates a region other than the positioning target portion to be positioned.

In FIG. 13B, the model search area H2 is an area including the pattern 6 of the positioning target portion 1A, the pattern 7 of the target portion 1B, and the pattern 8 of the positioning target portion 1C. is the positioning model. In this case, R2a and R2b indicate areas where pixel values are cleared. R2a is the positioning target portion 1A and the positioning target portion 1B, and R2b is the positioning target portion 1D.

In FIG. 13C, the model search area H3 is an area including the pattern 7 of the positioning target portion 1B, the pattern 8 of the target portion 1C, and the pattern 9 of the positioning target portion 1D. becomes the positioning model, and the positioning object parts 1A to 1C become the set region R3.

In FIG. 13D, the model search area H4 is an area including the pattern 8 of the positioning target portion 1C and the pattern 9 of the target portion 1D, and the pattern 9 of the positioning target portion 1D is the positioning model.

Next, as shown in FIG. 14, the positioning method when the workpiece W is out of position will be described with reference to the flow chart shown in FIG. 15 and simplified diagrams shown in FIGS. In this case, as shown in FIG. 16, the positioning model (wiring pattern 5) of the positioning target portion 1A (having the lowest false recognition difficulty rank) is in the model search area H1. Accordingly, the positioning of the positioning target portion 1A can be executed.

Therefore, as shown in FIG. 15, the first positioning (the positioning target region 1A with the lowest recognition difficulty rank) in step S6 can be performed. Next, based on this positioning result, as shown in FIG. 17A, the positions of the set regions R1a and R1b are corrected. That is, step S7 in FIG. 15 is executed.

Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 17B, image values (brightness and distance) of regions R1a and R1b (regions indicated by cross hatching) are cleared. Here, as a method of clearing the pixel value, there is a method of setting it to 0, for example. However, when it is set to 0, there are places where the original information is 0 and places where it becomes 0 after clearing. If it is necessary to discriminate between them, for example, if the original information of 0 is processed to 1, it is possible to discriminate the part where the information is 0 after positioning.

Thereafter, as shown in FIG. 17(c), positioning of the positioning target portion 1B is executed (the next positioning is executed) (step S10). Next, the process proceeds to step S11 to determine whether or not positioning of all positioning target portions has been completed. If it is completed in step S11, the processing ends, and if it is not completed, the processing returns to step S7. Since the work shown in FIG. 14 is not completed, the process returns to step S7.

After returning to step S7, as shown in FIG. 18A, the positions of the regions R2a and R2b are corrected based on the positioning result of the positioning target portion 1B. That is, step S7 in FIG. 15 is executed. Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 18B, image values (brightness and distance) of regions R2a and R2b (regions indicated by cross hatching) are cleared.

After that, as shown in FIG. 18(c), positioning of the positioning target portion 1C is executed (the next positioning is executed) (step S10). Next, the process proceeds to step S11 to determine whether or not positioning of all positioning target portions has been completed. If it is completed in step S11, the processing ends, and if it is not completed, the processing returns to step S7. Since the work shown in FIG. 14 is not completed, the process returns to step S7.

After returning to step S7, as shown in FIG. 19(a), the position of the region R3 is corrected based on the positioning result of the positioning target portion 1C. That is, step S7 in FIG. 15 is executed. Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 19B, the image values (brightness and distance) of region R3 (region indicated by cross hatching) are cleared.

After that, as shown in FIG. 19(c), positioning of the positioning target portion 1D is executed (the next positioning is executed) (step S10). Next, the process proceeds to step S11 to determine whether or not positioning of all positioning target portions has been completed. If it is completed in step S11, the processing ends, and if it is not completed, the processing returns to step S7. Since the work shown in FIG. 14 has been completed, the work ends.

The positioning device shown in FIG. 12 and the positioning method using this positioning device have the same effects as the positioning device shown in FIG. 1 and the positioning method using this positioning device. By the way, the image value clear area is an area set for the purpose of lowering the difficulty level of positioning to be executed next. Therefore, it may include part or all of the positioning target site, or may not include it at all. Also, if the difficulty level of the positioning target part to be executed next is originally low, there is no need to set the image value clear area. In this way, by setting the image value clear area only when it is necessary, high-speed and stable positioning becomes possible.

Next, FIG. 20 shows a third positioning device according to the present invention, in which image processing means 18 is provided in place of the image extraction processing means 13 of the first positioning device. The image processing means 18 comprises the image extraction processing means 13 shown in FIG. 1 and the image value clear processing means 17 shown in FIG.

Therefore, any one of the steps shown in FIGS. 9-11 can be replaced with the steps shown in FIGS. 17-19. 9 can be replaced with the process of FIG. 17, the process of FIG. 10 can be replaced with the process of FIG. 18, and the process of FIG. 11 can be replaced with the process of FIG. 9 is replaced with the process of FIG. 17, the process of FIG. 10 is replaced with the process of FIG. 18, the process of FIG. 9 is replaced with the process of FIG. 17, and the process of FIG. 11 is replaced with the process of FIG. , or furthermore, the process of FIG. 10 can be replaced with the process of FIG. 18, and the process of FIG. 11 can be replaced with the process of FIG.

The positioning device shown in FIG. 20 and the positioning method using this positioning device have the same effects as the positioning device shown in FIG. 1 and the positioning method using this positioning device.

The present invention is not limited to the above embodiments, and various modifications are possible. good. Moreover, although the stacked semiconductor device is composed of a plurality of parts, it may be a workpiece composed of a single part. In FIGS. 17(b), 18(b), and 19(b), when the image value is cleared, the clear value is not limited to 0. For example, the maximum value (in the case of 8 bits, 255), or the average value in the area to be cleared can be set to a value within a range that does not cause misrecognition of positioning.

1 (1A, 1B, 1C, 1D) Target portion 2A, 2B, 2C, 2D Chip (semiconductor chip)
10 imaging means 12 low rank processing means 13 image extraction processing means 17 image value clear processing means 18 image processing means W work

Claims (8)

A positioning method for positioning a workpiece having a plurality of positions to be positioned , wherein the workpiece is composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other,
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. First, positioning is performed for a positioning target portion with high positioning reliability, and then, when positioning a positioning target portion of another rank, an image of only the area of the positioning target portion is taken out from the inspection image, A positioning method characterized by performing positioning based on the extracted image. A positioning method for positioning a workpiece having a plurality of positions to be positioned , wherein the workpiece is composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other,
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. Positioning is first performed on a positioning target site with high positioning reliability, and then, when positioning a positioning target site of another rank, the pixel value of the area other than the positioning target site to be positioned, and the minimum A positioning method characterized by clearing pixel values in an area of a positioning target site of rank and performing positioning. A positioning method for positioning a workpiece having a plurality of positions to be positioned , wherein the workpiece is composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other,
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. A step of first positioning a positioning target portion with high positioning reliability, and then, when positioning a positioning target portion of another rank, extracting an image of only the region of the positioning target portion from the inspection image. and a step of clearing the pixel values of areas other than the positioning target site to be positioned and the pixel values of the area of the positioning target site of the lowest rank. 4. The positioning method according to any one of claims 1 to 3, wherein the work is a stacked semiconductor device in which a plurality of chips are stacked. A positioning method for positioning a workpiece having a plurality of positions to be positioned , wherein the workpiece is composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other,
imaging means for imaging an image of the workpiece;
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. a low-rank processing means for performing positioning based on an image of a positioning target part with the lowest rank;
an image extraction processing means for extracting an image of only the area of the positioning target part from the inspection image and performing positioning based on the extracted image when positioning the positioning target part of another rank. A positioning device characterized by: A positioning device for positioning a workpiece having a plurality of positions to be positioned , the workpiece being composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other , wherein
imaging means for imaging an image of the workpiece;
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. a low-rank processing means for performing positioning based on an image of a positioning target part with the lowest rank;
When positioning a positioning target part of another rank, the pixel values of the area other than the positioning target part to be positioned and the pixel values of the area of the positioning target part of the lowest rank are cleared, and the image value to be positioned and clearing means. A positioning device for positioning a workpiece having a plurality of positions to be positioned , the workpiece being composed of a plurality of semiconductor chips laminated with a predetermined amount of deviation from each other , wherein
imaging means for imaging an image of the workpiece;
With respect to a plurality of positions to be positioned of the workpiece, the wider the range that can be observed, the more elements such as wiring patterns and patterns used for positioning, and the higher the reliability of positioning. a low-rank processing means for performing positioning based on an image of a positioning target part with the lowest rank;
When positioning a positioning target part of another rank, an image extraction process for extracting an image of only the positioning target part area from the inspection image, a pixel value of the area other than the positioning target part to be positioned, and and image processing means for performing an image value reduction process by clearing pixel values in an area of a positioning target part with the lowest rank. 8. The positioning apparatus according to any one of claims 5 to 7, wherein the workpiece is a stacked semiconductor device in which a plurality of chips are stacked.

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