JP2019212835A - Positioning method and positioning device - Google Patents

Abstract

To provide a positioning method and a positioning device capable of performing stable positioning without being affected even if there are a plurality of components with similar characteristics.SOLUTION: The positioning method is to position a workpiece having a plurality of positioning target parts. The plurality of positioning target parts are ranked according to misperception difficulties that cause misperception with other parts. First, positioning of a target portion having the lowest rank of the misperception difficulty is performed. After that, when positioning the positioning target parts of other ranks, an image of only a region of the positioning target is extracted from an inspection image to perform positioning on the basis of the extracted image.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a positioning method and a positioning device.

  Conventionally, when bonding a chip formed by dicing a wafer, a die bonder is used. That is, a wafer ring is set on the wafer table of the die bonder, and a plurality of chips are stuck on the wafer sheet stretched on the wafer ring. Then, the chip is picked up by a pick-up device and mounted on a substrate such as a lead frame.

  By the way, at the time of pick-up, it is necessary to perform chip alignment (positioning). That is, this type of pickup device generally picks up a chip by sucking it with a suction collet. For this reason, if the chip is misaligned, it may not be possible to mount the chip at the proper position.

  As in this example, in the electronic device manufacturing process and the appearance inspection process, the positioning result is directly linked to the manufacturing / inspection accuracy, so that accurate and stable positioning is required. Therefore, conventionally, there is one described in Patent Document 1 as one that performs stable positioning.

  In the positioning device described in Patent Document 1, when positioning a part having a plurality of features, the user designates the order of recognizing feature points such as sides of the parts and corners, and the feature is determined according to the order designated by the user. Is recognized and image processing is performed. That is, the positioning device described in Patent Document 1 determines a plurality of positioning parts for a single-part workpiece, positions a low difficulty part, and uses the result to obtain a high difficulty part. The positioning success rate is increased by performing positioning at.

Japanese Patent No. 4744234

  In the positioning device described in Patent Document 1, only the positioning order can be easily changed by the user. Thus, even if the positioning sequence is changed, the positioning process is frequently retried. In the case of retrying, the retry condition is changed by trial and error. However, setting retry conditions is difficult, and often no suitable conditions can be found. In addition, when positioning is not successful (when accurate positioning cannot be performed), the determination may be made with this unsuccessful positioning.

  In Patent Document 1, a work is limited to a single part. For this reason, although the positioning result with a low difficulty level can be used for a high difficulty level, it cannot be applied to a workpiece in which a plurality of other parts having similar characteristics are adjacent to each other.

  In view of the above problems, the present invention provides a positioning method and a positioning apparatus capable of performing stable positioning without being affected by a plurality of parts having similar characteristics.

  The first positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target parts, wherein the plurality of positioning target parts are ranked in the misidentification difficulty level causing misidentification with other parts. First, the positioning target part of the lowest rank of the misunderstanding difficulty is positioned, and then when positioning the positioning target part of the other rank, the image of only the region of the positioning target part is extracted from the inspection image. It is taken out and positioning is performed based on the taken out image.

  According to the first positioning method of the present invention, the positioning target portion having the lowest rank of the misperception difficulty is first positioned. In this case, the lowest rank of the misperception difficulty level is not easily influenced by other parts. For this reason, the positioning with respect to the positioning target portion having the lowest rank of the misperception difficulty is highly reliable. Thereafter, an image of only the region of the next positioning target region is taken out from the inspection image, and positioning is performed based on the taken out image, so that the reliability of this positioning is also high.

  The second positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target parts, wherein the plurality of positioning target parts are ranked with a misidentification difficulty level that causes misidentification with other parts. First, the positioning target part of the lowest rank of the misunderstanding difficulty is positioned, and then when positioning the positioning target part of the other rank, the pixel value of the region other than the positioning target part to be positioned, And the pixel value of the area | region of the positioning target site | part of the lowest rank is cleared, and positioning is performed.

  According to the second positioning method of the present invention, first, the positioning target portion having the lowest rank of the misperception difficulty is positioned. Positioning with respect to the positioning target portion having the lowest misunderstanding difficulty is highly reliable. Thereafter, the positioning is performed by clearing the pixel value of the region other than the positioning target portion to be positioned and the pixel value of the region of the positioning target portion having the lowest rank, and this positioning reliability is also high.

  The third positioning method of the present invention is a positioning method for positioning a workpiece having a plurality of positioning target parts, wherein the plurality of positioning target parts are ranked in the misidentification difficulty level causing misidentification with other parts. First, the positioning target part of the lowest rank with the lowest misunderstanding difficulty is positioned, and then when positioning the positioning target part of the other rank, only the region of the positioning target part is extracted from the inspection image. And the step of clearing the pixel value of the region other than the positioning target portion to be positioned and the pixel value of the region of the positioning target portion having the lowest rank.

  According to the third positioning method of the present invention, the positioning target portion having the lowest rank of the misperception difficulty is first positioned. Positioning with respect to the positioning target portion having the lowest misunderstanding difficulty is highly reliable. Thereafter, an image of only the region of the positioning target part is taken out from the inspection image, and positioning is performed based on the extracted image, or the pixel value of the region other than the positioning target part to be positioned and the positioning target of the lowest rank Since positioning is performed by clearing the pixel value of the region of the part, the reliability of these positioning is also high.

  The first positioning device of the present invention is a positioning device for positioning a workpiece having a plurality of positioning target parts, and an imaging means for picking up an image of the work and the positioning target part are misidentified as other parts. The ranking of the misidentification difficulty level that occurs is determined by the user, and the low rank processing means that performs positioning based on the image of the positioning target site of the lowest rank of this misperception difficulty ranking, and positioning target sites of other ranks When positioning is performed, an image of only the region to be positioned is extracted from the inspection image, and image extraction processing means for performing positioning based on the extracted image is provided.

  According to the first positioning device of the present invention, the low rank processing means performs positioning based on the image of the positioning target portion of the lowest rank of ranking of the misperception difficulty level. Positioning with respect to the positioning target portion having the lowest misunderstanding difficulty is highly reliable. In addition, when positioning the positioning target parts of other ranks, the image of only the region of the positioning target part is extracted from the inspection image, and positioning is performed based on the extracted images. The reliability of is also high.

  A second positioning device of the present invention is a positioning device for positioning a workpiece having a plurality of positioning target parts, and an imaging means for picking up an image of the work and the positioning target part are misidentified as other parts. The ranking of the misidentification difficulty level that occurs is determined by the user, and the low rank processing means that performs positioning based on the image of the positioning target site of the lowest rank of this misperception difficulty ranking, and positioning target sites of other ranks An image value clear processing means for performing positioning by clearing the pixel value of the region other than the positioning target portion for positioning and the pixel value of the region of the positioning target portion having the lowest rank when performing positioning It is.

  According to the second positioning device of the present invention, the low rank processing means performs positioning based on the image of the positioning target portion of the lowest rank of ranking of the misperception difficulty level. Positioning with respect to the positioning target portion having the lowest misunderstanding difficulty is highly reliable. When positioning the positioning target part of another rank, the pixel value of the area other than the positioning target part to be positioned and the pixel value of the positioning target part of the lowest rank are cleared and positioned. The reliability of positioning is also high.

  A third positioning device of the present invention is a positioning device for positioning a work having a plurality of positioning target parts, and an imaging means for picking up an image of the work and the positioning target part are misidentified as other parts. The ranking of the misidentification difficulty level that occurs is determined by the user, and the low rank processing means that performs positioning based on the image of the positioning target site of the lowest rank of this misperception difficulty ranking, and positioning target sites of other ranks When performing positioning, an image extraction process in which only an image of a positioning target region is extracted from an inspection image, a pixel value of a region other than the positioning target region to be positioned, and a positioning target region of the lowest rank And image processing means for performing image value reduction processing performed by clearing the pixel value.

  According to the third positioning apparatus of the present invention, the low rank processing means performs positioning based on the image of the positioning target portion of the lowest rank of ranking of the misperception difficulty level. Positioning with respect to the positioning target portion having the lowest misunderstanding difficulty is highly reliable. An image of only the region of the positioning target part is taken out from the inspection image, positioning is performed based on the extracted image, the pixel value of the region other than the positioning target part for positioning, and the positioning target part of the lowest rank Since positioning is performed by clearing the pixel value of the region, the reliability of these positioning is also high.

  The workpiece in the positioning method and positioning apparatus is, for example, a stacked semiconductor device in which a plurality of chips are stacked.

  In the present invention, the influence of a part (pattern) similar to the part to be positioned can be removed, and even if there are a plurality of parts having similar characteristics, stable positioning is performed without being affected by these parts. Can do. For this reason, it is not necessary to retry the positioning process, the working time can be shortened, and the productivity is excellent.

It is a principal part simplified block diagram of the 1st positioning device of this invention. 1 is a simplified diagram of a first positioning device of the present invention. It is a simplified top view of a workpiece. It is a simplified side view of a workpiece. The first positioning method is shown, (a) is a simplified diagram of the positioning setting state of the positioning target part 1A of low rank, (b) is a simplified diagram of the positioning setting state of the positioning target part 1B, (c) Is a simplified diagram of the positioning setting state of the positioning target site 1C, and (d) is a simplified diagram of the positioning setting status of the positioning target site 1D. It is a simple top view of the workpiece | work of the state which has shifted. It is a flowchart figure of the 1st positioning method of this invention using the 1st positioning device of this invention. FIG. 7 is a simplified diagram of a positioning setting state of a positioning target portion 1A with respect to the workpiece shown in FIG. 6. FIG. 6 shows a positioning process of the positioning target part 1B with respect to the workpiece shown in FIG. 6, wherein (a) is a simplified diagram of a state where the position of the region set by the positioning result of the positioning target part 1A is corrected; Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1B. FIG. 6 shows a positioning process of the positioning target part 1C with respect to the workpiece shown in FIG. 6, wherein (a) is a simplified diagram of a state in which the position of the region set by the positioning result of the positioning target part 1B is corrected; Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target part 1C. FIG. 6 shows a positioning process of the positioning target part 1D with respect to the workpiece shown in FIG. 6, wherein (a) is a simplified diagram of a state in which the position of the region set by the positioning result of the positioning target part 1C is corrected; Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target part 1D. It is a principal part simplified block diagram of the 2nd positioning device of this invention. The second positioning method is shown, (a) is a simplified diagram of the positioning setting state of the low-rank positioning target part 1A, (b) is a simplified diagram of the positioning setting state of the positioning target part 1B, (c) Is a simplified diagram of the positioning setting state of the positioning target site 1C, and (d) is a simplified diagram of the positioning setting status of the positioning target site 1D. It is a simple top view of the workpiece | work of the state which has shifted. It is a flowchart figure of the 2nd positioning method of this invention using the 2nd positioning device of this invention. FIG. 15 is a simplified diagram of a positioning setting state of a positioning target portion 1A with respect to the workpiece illustrated in FIG. FIG. 14 shows a positioning process of the positioning target part 1B with respect to the workpiece shown in FIG. 14, wherein (a) is a simplified diagram of a state in which the position of the region set by the positioning result of the positioning target part 1A is corrected. Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target portion 1B. FIG. 14 shows a positioning process of the positioning target part 1C with respect to the workpiece shown in FIG. 14, wherein (a) is a simplified diagram of a state in which the position of the region set by the positioning result of the positioning target part 1B is corrected; Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target part 1C. FIG. 14 shows a positioning process of the positioning target part 1D with respect to the workpiece shown in FIG. 14, and (a) is a simplified diagram of a state where the position of the region set by the positioning result of the positioning target part 1C is corrected, (b) Is a simplified diagram of a state in which a region is cut out, and (c) is a simplified diagram of a positioning execution state of the positioning target part 1D. It is a principal part simplified block diagram of the 3rd positioning apparatus of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. FIG. 1 shows a simplified block diagram of the main part of the first positioning device of the present invention, and FIG. 2 shows a simplified diagram of the first positioning device. This positioning device performs positioning of a workpiece W having a plurality (four) of positioning target portions 1 (1A, 1B, 1C, 1D) shown in FIGS.

  That is, the workpiece W of this embodiment is formed by laminating a plurality (four in this embodiment) of semiconductor chips 2A, 2B, 2C, and 2D, and is bonded onto the lead frame 3. In addition, the 2D semiconductor chip is the lowermost stage, and 2C, 2B, and 2A semiconductor chips are stacked below. In this case, the semiconductor chips 2A, 2B, 2C, and 2D are stacked with a predetermined amount shifted.

  The uppermost semiconductor chip 2A can be observed from above with the wiring pattern 5 and the pattern 6 with the entire upper surface exposed. The pattern 7 can be observed from above with the semiconductor chip 2B in the second stage from the top covered with the uppermost semiconductor chip 2A and partly exposed. The pattern 8 can be observed from above, with the third-stage semiconductor chip 2C from the top covered mostly by the second-stage semiconductor chip 2B and partially exposed. The pattern 9 can be observed from above with the fourth-stage semiconductor chip 2D from the top covered with the third-stage semiconductor chip 2C and a part thereof exposed.

  For this reason, the upper surface of the uppermost semiconductor chip 2A becomes the positioning target portion 1A, and the upper exposed portion (the rectangular portion including the pattern 7) of the upper surface of the second stage semiconductor chip 2B becomes the positioning target portion 1B. Of the upper surface of the third-stage semiconductor chip 2C, the portion exposed upward (rectangular portion including the pattern 8) becomes the positioning target portion 1C, and the portion of the upper surface of the fourth-stage semiconductor chip 2D exposed upward ( A rectangular portion including the pattern 9 is the positioning target portion 1D.

  The positioning target part 1 (1A, 1B, 1C, 1D) is determined by the user in the ranking of the degree of misidentification difficulty that causes misidentification with other parts. That is, the lower the misperception difficulty is, the less likely it is to be misidentified with other parts, and the higher the misperception difficulty is, the easier it is to misidentify with other parts. In this case, since the entire upper surface of the semiconductor chip 2A is exposed upward, the positioning target portion 1A uses the surface wiring pattern 5 for positioning, so that the positioning target portion 1A is more than the other positioning target portions 1B, 1C, 1D. Misidentification is unlikely to occur. That is, the positioning target portion 1A has the lowest recognition difficulty level.

  As can be seen from FIG. 3, the pattern 7 of the positioning target part 1B is sandwiched between the pattern 6 of the positioning target part 1A and the pattern 8 of the positioning target part 1C, and the pattern 8 of the positioning target part 1C is the positioning target part 1C. The pattern 7 of the positioning target part 1D is located above the pattern 8 of the positioning target part 1C. The pattern 9 of the positioning target part 1D is sandwiched between the pattern 7 of 1B and the pattern 9 of the positioning target part 1D. In this case, since the patterns 6, 7, 8, and 9 have the same shape and the same dimensions, the positioning target portions 1B to 1D have a higher misunderstanding difficulty than the positioning target portion 1A. In FIG. 3, a range surrounded by a two-dot chain line indicates a workpiece mounting position deviation allowable range.

  As shown in FIGS. 1 and 2, the positioning device includes an imaging unit 10 that images the workpiece W, and a control unit 11 that controls the imaging unit 10. The control means 11 includes a low rank processing means 12 and an image extraction processing means 13, and a storage means 14 is connected to the control means 11. The control means 11 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The storage device as the storage means 14 includes an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), or the like. The ROM stores programs executed by the CPU and data. The ranking of the misidentification difficulty level of the positioning target part 1 is stored in the storage unit 14.

  The imaging means 10 is configured by a camera such as a CCD camera or a CMOS camera, for example, and the work W is illuminated by the illumination means 15. Illumination means includes bright field illumination and dark field illumination. Bright field illumination refers to illuminating a light beam that illuminates a measurement object vertically along the center of the optical axis. Dark field illumination refers to irradiating a light beam illuminating a measurement object from an oblique direction, not the center of the optical axis. In other words, bright-field illumination is a type of illumination that directly observes the reflected or transmitted light, and the sample is placed in a bright background of the color of the illumination light (bulb color, warm white, etc.) Observe the light and look darker than the background. Dark field illumination is a type of illumination in which irradiated light is reflected or scattered to observe scattered light, and a bright sample floats on a dark background and is observed. For this reason, in the dark field illumination, it is possible to observe fine structures, scratches, defects, and the like that were not seen blurred in the bright field illumination. In this embodiment, dark field illumination is used. However, bright field illumination or dark field illumination and bright field illumination may be used.

  The low rank processing means 12 performs positioning based on the image of the positioning target part 1A of the lowest rank ranked with the misperception difficulty level, and the image extraction processing means 13 positions the positioning target parts of other ranks. When performing, an image of only the region to be positioned is extracted from the inspection image, and positioning is performed based on the extracted image.

  Next, a workpiece positioning method using the positioning device shown in FIGS. 1 and 2 will be described. In this apparatus, as shown in FIGS. 5 (a), (b), (c), and (d), positioning settings are sequentially performed from the positioning target portion 1A to 1D. That is, in FIG. 5A, the wiring pattern 5 of the positioning target part 1A is the position determination model, and the area surrounding the positioning target part 1A is the model search area H1. R1 indicates a set area for the next positioning area by positioning the positioning target part 1A.

  In FIG. 5B, the model search region H2 is a region including the pattern 6 of the positioning target site 1A, the pattern 7 of the target site 1B, and the pattern 8 of the positioning target site 1C, and the pattern 7 of the positioning target site 1B. Becomes the positioning model, and the positioning target portion 1C becomes the setting region R2.

  In FIG. 5C, the model search region H3 is a region including the pattern 7 of the positioning target site 1B, the pattern 8 of the target site 1C, and the pattern 9 of the positioning target site 1D, and the pattern 8 of the positioning target site 1C. Becomes the positioning model, and the positioning target portion 1D becomes the setting region R3.

  In FIG. 5D, the model search area H4 is an area including the pattern 8 of the positioning target part 1C and the pattern 9 of the target part 1D, and the pattern 9 of the positioning target part 1D is the positioning model.

  Next, as shown in FIG. 6, a positioning method when the workpiece W is displaced will be described with reference to a flowchart shown in FIG. 7 and simplified diagrams shown in FIGS. In this case, as shown in FIG. 8, the positioning model (wiring pattern 5) of the positioning target portion 1A (with the lowest misunderstanding difficulty rank) is in the model search area H1. Thereby, positioning of this positioning object part 1A can be performed.

  For this reason, as shown in FIG. 7, the first positioning in step S <b> 1 (positioning target part 1 </ b> A with the lowest misunderstanding difficulty rank) can be executed. Here, the positioning is performed by detecting the position information of the wiring pattern from the captured image of the model search area H1, and calculating the deviation between the detected position and a preset reference position. This is to correct the position of the deviation amount. Next, as shown in FIG. 9A, the position of the set region R1 is corrected based on the positioning result. That is, step S2 in FIG. 7 is executed.

  Next, as shown in FIG. 9B, the region R1 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 9A) (only this region R1 is displayed) (step S3). . Based on the extracted image, positioning of the positioning target portion 1B is executed (next positioning is executed) (in this case, as shown in FIG. 9C, using the pattern 7 in the model search region H2). Positioning is performed) (step S4). Thereafter, the process proceeds to step S5, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S5, the process ends. If not completed, the process returns to step S2. Since the work shown in FIG. 6 is not completed, the process returns to step S2.

  If it returns to step S2, as shown to Fig.10 (a), position correction of area | region R2 will be performed based on the positioning result of positioning object site | part 1B. After that, as shown in FIG. 10B, the region R2 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 10A) (only this region R2 is displayed) (step S3). . Based on the extracted image, the positioning target part 1C is positioned (the next positioning is performed) (in this case, as shown in FIG. 10C, using the pattern 8 in the model search region H3). Positioning is performed) (step S4). Next, the process proceeds to step S5, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S5, the process ends. If not completed, the process returns to step S2. Since the work shown in FIG. 6 is not completed, the process returns to step S2.

  If it returns to step S2, as shown to Fig.11 (a), position correction of area | region R3 will be performed based on the positioning result of positioning object site | part 1C. Thereafter, as shown in FIG. 11B, the region R3 corrected in step S2 is cut out from the original image (the image in the state shown in FIG. 11A) (only this region R3 is displayed) (step S3). . Based on the extracted image, positioning of the positioning target portion 1D is executed (next positioning is executed) (in this case, as shown in FIG. 11C, using the pattern 9 of the model search region H4). Positioning is performed) (step S4). Thereafter, the process proceeds to step S5, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S5, the process ends. If not completed, the process returns to step S2. Since the work shown in FIG. 6 has been completed, the work ends.

  In the positioning method using this positioning device, first, the positioning target part 1 (1A) having the lowest rank of misperception difficulty is positioned. In this case, the lowest rank of the misperception difficulty level is not easily influenced by other parts. For this reason, the positioning with respect to the positioning target part 1 (1A) having the lowest rank of the misperception difficulty is highly reliable. After that, since an image of only the region of the next positioning target region 1 is taken out from the inspection image and positioning is performed based on the taken out image, the reliability of this positioning is also high.

  Next, FIG. 12 shows a second positioning device according to the present invention. In this case, an image value clear processing means 17 is provided instead of the image fetch processing means 13 of the first positioning device. Here, the image value clear processing means 17 refers to the pixel value of the area other than the positioning target part to be positioned and the area of the positioning target part of the lowest rank when positioning the positioning target part of another rank. The pixel value is cleared.

  Also in this case, as shown in FIGS. 13A, 13B, 13C, and 13D, positioning settings from the positioning target portion 1A to 1D are sequentially performed. That is, in FIG. 13A, the wiring pattern 5 of the positioning target part 1A is the position determination model, and the area surrounding the positioning target part 1A is the model search area H1. R1a and R1b indicate areas where pixel values are cleared. R1a is a positioning target site 1A, and R1b indicates a region other than the positioning target site for positioning.

  In FIG. 13B, the model search region H2 is a region including the pattern 6 of the positioning target site 1A, the pattern 7 of the target site 1B, and the pattern 8 of the positioning target site 1C, and the pattern 7 of the positioning target site 1B. Becomes the positioning model. In this case, R2a and R2b indicate areas where pixel values are cleared. R2a is a positioning target part 1A and a positioning target part 1B, and R2b is a positioning target part 1D.

  In FIG. 13C, the model search region H3 is a region including the pattern 7 of the positioning target site 1B, the pattern 8 of the target site 1C, and the pattern 9 of the positioning target site 1D, and the pattern 8 of the positioning target site 1C. Becomes the positioning model, and the positioning target portions 1A to 1C become the setting region R3.

  In FIG. 13D, the model search region H4 is a region including the pattern 8 of the positioning target part 1C and the pattern 9 of the target part 1D, and the pattern 9 of the positioning target part 1D is the positioning model.

  Next, as shown in FIG. 14, the positioning method when the workpiece W is displaced will be described with reference to the flowchart shown in FIG. 15 and the simplified diagrams shown in FIGS. In this case, as shown in FIG. 16, the positioning model (wiring pattern 5) of the positioning target portion 1A (having the lowest misunderstanding difficulty rank) is in the model search area H1. Thereby, positioning of this positioning object part 1A can be performed.

  For this reason, as shown in FIG. 15, the first positioning (positioning target part 1A having the lowest recognition difficulty rank) in step S6 can be executed. Next, based on the positioning result, as shown in FIG. 17A, the positions of the set regions R1a and R1b are corrected. That is, step S7 in FIG. 15 is executed.

  Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 17B, the image values (luminance and distance) of the regions R1a and R1b (regions indicated by cross hatching) are cleared. Here, as a method of clearing the pixel value, for example, there is a method of setting 0. However, in the case of 0, there are places where the original information is 0 and places where the information becomes 0 after clearing. When it is necessary to discriminate these, for example, if a portion where the original information is 0 is processed as 1, it is possible to discriminate a portion where the information is 0 after positioning.

  Thereafter, as shown in FIG. 17C, positioning of the positioning target portion 1B is executed (next positioning is executed) (step S10). Next, the process proceeds to step S11, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S11, the process ends. If not completed, the process returns to step S7. Since the work shown in FIG. 14 is not completed, the process returns to step S7.

  If it returns to step S7, as shown to Fig.18 (a), position correction of area | region R2a, R2b will be performed based on the positioning result of positioning object site | part 1B. That is, step S7 in FIG. 15 is executed. Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 18B, the image values (luminance and distance) of the regions R2a and R2b (regions indicated by cross hatching) are cleared.

  Then, as shown in FIG.18 (c), positioning of 1 C of positioning object site | parts is performed (next positioning is performed) (step S10). Next, the process proceeds to step S11, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S11, the process ends. If not completed, the process returns to step S7. Since the work shown in FIG. 14 is not completed, the process returns to step S7.

  If it returns to step S7, as shown to Fig.19 (a), position correction of area | region R3 will be performed based on the positioning result of positioning object site | part 1C. That is, step S7 in FIG. 15 is executed. Next, the process proceeds to step S8, image selection is performed, and the process proceeds to step S9. In step S9, as shown in FIG. 19B, the image value (luminance and distance) of the region R3 (region indicated by cross-hatching) is cleared.

  Thereafter, as shown in FIG. 19 (c), positioning of the positioning target portion 1D is executed (next positioning is executed) (step S10). Next, the process proceeds to step S11, and it is determined whether or not the positioning of all the positioning target parts has been completed. If completed in step S11, the process ends. If not completed, the process returns to step S7. Since the work shown in FIG. 14 has been completed, the process ends.

  The positioning device shown in FIG. 12 and the positioning method using this positioning device also have the same effects as the positioning device shown in FIG. 1 and the positioning method using this positioning device. By the way, the image value clear area is an area set for the purpose of reducing the difficulty of positioning performed next. For this reason, some or all of the positioning target parts may be included or not included at all. In addition, when the difficulty level of the positioning target part to be executed next is originally low, it is not necessary to set the image value clear area. As described above, by setting only when it is necessary to set the image value clear area, it is possible to perform stable positioning at high speed.

  Next, FIG. 20 shows a third positioning device according to the present invention. In this case, an image processing means 18 is provided instead of the image extraction processing means 13 of the first positioning device. The image processing means 18 includes an image extraction processing means 13 shown in FIG. 1 and an image value clear processing means 17 shown in FIG.

  For this reason, any of the steps shown in FIGS. 9 to 11 can be replaced with the steps of FIGS. That is, the process of FIG. 9 can be replaced with the process of FIG. 17, the process of FIG. 10 can be replaced with the process of FIG. 18, and the process of FIG. 11 can be replaced with the process of FIG. 9 is replaced with the process of FIG. 17, the process of FIG. 10 is replaced with the process of FIG. 18, the process of FIG. 9 is replaced with the process of FIG. 17, and the process of FIG. 11 is replaced with the process of FIG. Further, the process of FIG. 10 can be replaced with the process of FIG. 18, and the process of FIG. 11 can be replaced with the process of FIG.

  The positioning device shown in FIG. 20 and the positioning method using this positioning device also have the same effects as the positioning device shown in FIG. 1 and the positioning method using this positioning device.

The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the workpiece is not limited to a four-layer stacked semiconductor device, and may be less than four layers or five layers or more. Good. In addition, although the stack type semiconductor device is composed of a plurality of parts, it may be a work composed of a single part. 17B, FIG. 18B, and FIG. 19B, when clearing an image value, the clear value is not limited to 0. For example, the maximum value that can be handled by the information (in the case of 8 bits, 255), or an average value in the area to be cleared, etc., can be set to a value in a range that does not cause misidentification of positioning.

1 (1A, 1B, 1C, 1D) Target part 2A, 2B, 2C, 2D Chip (semiconductor chip)
DESCRIPTION OF SYMBOLS 10 Imaging means 12 Low rank processing means 13 Image extraction processing means 17 Image value clear processing means 18 Image processing means W Work

Claims (8)

A positioning method for positioning a workpiece having a plurality of positioning target parts,
The plurality of positioning target parts are ranked with a misperception difficulty level that causes misidentification with other parts, first positioning the positioning target part with the lowest rank of misperception difficulty level, and then positioning targets with other ranks A positioning method characterized in that when positioning a part, an image of only the region of the positioning target part is taken out from the inspection image, and positioning is performed based on the taken out image. A positioning method for positioning a workpiece having a plurality of positioning target parts,
The plurality of positioning target parts are ranked with a misperception difficulty level that causes misidentification with other parts, first positioning the positioning target part with the lowest rank of misperception difficulty level, and then positioning targets with other ranks A positioning method characterized in that when positioning a part, the pixel value of a region other than the positioning target part to be positioned and the pixel value of a region of the positioning target part of the lowest rank are cleared. A positioning method for positioning a workpiece having a plurality of positioning target parts,
The plurality of positioning target parts are ranked with a misperception difficulty level that causes misidentification with other parts, first positioning the positioning target part with the lowest rank of misperception difficulty level, and then positioning targets with other ranks When positioning a part, a step of taking out an image of only the region of the positioning target part from the inspection image, a pixel value of a region other than the positioning target part to be positioned, and a region of the positioning target part of the lowest rank And a step of clearing the pixel value.   The positioning method according to any one of claims 1 to 3, wherein the work is a stacked semiconductor device in which a plurality of chips are stacked. A positioning device for positioning a workpiece having a plurality of positioning target parts,
Imaging means for capturing an image of the workpiece;
Low-rank processing for positioning based on the image of the positioning target part of the lowest rank of the ranking of the misidentification difficulty, which is determined by the user, with the positioning target part being misidentified with other parts. Means,
Image positioning processing means for taking out an image of only the region of the positioning target part from the inspection image and positioning based on the extracted image when positioning the positioning target part of another rank is provided. Characteristic positioning device. A positioning device for positioning a workpiece having a plurality of positioning target parts,
Imaging means for capturing an image of the workpiece;
Low-rank processing for positioning based on the image of the positioning target part of the lowest rank of the ranking of the misidentification difficulty, which is determined by the user, with the positioning target part being misidentified with other parts. Means,
Image values that perform positioning by clearing the pixel value of the area other than the positioning target part to be positioned and the pixel value of the positioning target part of the lowest rank when positioning the positioning target part of another rank A positioning apparatus comprising a clear processing means. A positioning device for positioning a workpiece having a plurality of positioning target parts,
Imaging means for capturing an image of the workpiece;
Low-rank processing for positioning based on the image of the positioning target part of the lowest rank of the ranking of the misidentification difficulty, which is determined by the user, with the positioning target part being misidentified with other parts. Means,
When positioning a positioning target site of another rank, an image extraction process for extracting only an image of the positioning target site from the inspection image, a pixel value of a region other than the positioning target site for positioning, and An image processing means comprising: an image processing means for performing an image value lowering process performed by clearing a pixel value of a region of a positioning target part having the lowest rank.   8. The positioning apparatus according to claim 5, wherein the work is a stack type semiconductor device in which a plurality of chips are stacked.

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