JPS58197900A - Method of inserting multilead electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for inserting an electronic component having three or more lead wires fixed in parallel into a hole in a mating component, and particularly to a method for automatically inserting and mounting an electronic component with a general-purpose mechanical device. The present invention relates to an improved insertion method that is suitable for carrying out.

FIG. 11 shows an example of a multi-lead electronic component in which three or more lead wires are fixed in parallel. 1 is the main body of the electronic component, and 2 is the lead wire. A mating component (for example, a printed circuit board) to which this electronic component is assembled has an insertion hole corresponding to the lead wire described above. Electronic parts supplied for assembly to a mating part (not shown) are usually taped with adhesive tape 3 as shown in this figure.

Conventionally, in order to assemble such a multi-lead electronic component to a mating component, all of the lead wires are aligned and pushed into their corresponding insertion holes. When a multi-lead component is automatically inserted using such a conventional method, there are technical problems such as missing parts.

(b) Since the lead wire is a flexible member, even if the base of the lead wire is fixed to the correct position on the main body,
It is difficult to maintain the pitch of the tip accurately, and if the pitch of the tip is out of order, insertion errors will occur. As a result, the yield rate p of insertion and mounting is low i0 (b) In order to solve the above problem, it is necessary to provide a means for guiding the tips of all the lead wires to their respective insertion holes. The provided guide means must be retracted when the lead wire is pushed into the t-a source S trench. For this reason, a space for evacuation is required, and it is difficult to arrange the electronic components at a high density. That is, if electronic components are arranged at a high degree, it becomes impossible to insert them using an automatic machine.

e9 Leads provided on electronic components - After passing through the insertion hole of the mating printed circuit board, the leads protrude from the back side of the printed circuit board. In this case, cutting and bending all the lead wires would be of excessive quality and wasteful since the effect of preventing the wires from being pulled out would be obtained. However, it is often inconvenient to leave the protruding lead wires alone.

(2) As mentioned above, if a means for guiding and bending all the leads of a multi-lead electronic component is provided, the automatic insertion machine will become a specialized machine specified by the number of lead wires, and its versatility will be lost. be exposed.

The present invention has been made in view of the above circumstances, and can be carried out using a general-purpose machine, and allows electronic components to be arranged in a high degree of arrangement, while significantly reducing the risk of 4-insertion stress. The purpose of the present invention is to provide a method for inserting lead electronic components.

In order to achieve the above object, a method according to the present invention includes a method of inserting a lead wire of an electronic component in which at least three lead wires are provided in parallel into a hole provided in a mating component. One lead is formed the longest, the other one is formed the second longest, and the other leads In! Make iI even shorter, chuck the main body of the electronic component, align the longest lead wire, insert only its tip into the hole, and then insert the second longest lead wire into the hole. Align the wires and insert only their tips into the holes, then press this electronic component against the mating parts, install all the lead wires on the mating parts, and insert them into the drilled holes. Features.

Next, an embodiment of the method of the present invention will be described with reference to FIGS. 2 to 6.

This embodiment has eight lead wires and is suitable for applying the present invention to the assembly of high-quality electronic parts. Among the 98 Y-domain wires fixed in parallel to the electronic component main body L shown in FIG. Cut off the tip p by length Ld to make length tb. Then, the other six lead wires 2 cm 1.2 cm 2 to 20-5 are shortened to a smaller dimension t0 than the dimension tb in II.

In this embodiment, as described above, one of the lead wires is set to the longest dimension t1, the other one is set to the second longest dimension tb, and the other lead wires are set to the even shorter dimension to.

When the present invention is applied to the T-1i fabric, it is possible to arbitrarily set which lead wire is lengthened by one line and which lead wire is lengthened at the 2nd line. 5 in the same figure is a 19-nt board that is used as a mating 8 item for assembling electronic components, and lead 9 is installed nearby.
Insertion hole 61% corresponding to 2a Insertion hole 6b corresponding to lead wire 2b.

and insertion holes 6 corresponding to lead wires 2C-1 to 2C-6.
It is provided with cm1 to 6cm6.

FIG. 3 shows the electronic component main body 1t gripped by chucks 10.degree. 11 and facing the printed circuit board 5. FIG. Reference numeral 12 denotes a push rod which has a function of pressing the electronic component main body (IT) against the printed wiring board 5.

First, as shown in Figure 184, align the longest lead wire 2a with the insertion hole 6a and chuck it.
: Lower the lead wire 2a and insert the tip of the lead wire 2a into the insertion hole 6a. At this stage, the second longest lead wire 2b is still connected from the printed wiring board 5.

Next, align the lead wire 2b with the second longest lead wire 2b insertion hole 6b at φ. At this time, the tip of the lead wire 21 has already been inserted into the insertion hole 6a, and the nine lead wire 21 is bent by a certain amount, but the lead wire 2a
Length dimension 1. Since L is large and the uninserted portion is at least tb in the state where the second lead wire 2a is aligned, there is no risk of the deformation occurring, and the wire deforms by bending within the elastic range.

The tip of the second longest lead M2b is inserted into the insertion hole 6b and released from the chucks 10 and 11 (FIG. 5).

The electronic component main body 1, which is no longer subjected to the gripping force of the chucks 10 and 11, is supported by the two already inserted lead wires 2m and 2b. In this state, the electronic component main body 1 is directly faced to the printed wiring board 5, and the remaining 96 boards II 2C-1 to 2C-1 have insertion holes of 6cm1, respectively.
Directly facing ~6cm6.

As mentioned earlier, the lead wire is a flexible member, so even if the root part is fixed to the electronic component body l at the correct pitch, it is not practical in the conventional technology to hold the tip part at the correct pitch. The top was not easy. However, according to the method of the present invention, six lead wires of 2 cm 1 to 2 cm
Since the tip is cut short, the pitch of the tip can be maintained more easily than in the conventional method.

In addition, when the tips of the six uninserted lead wires 2cm1 to 2cm6 approach the surface of the printed wiring board 50 and are in good condition, the length of the uninserted portions of the already inserted leads 1i2a and 2b is approximately tc (short or φ Only the length of the lead wires) remains, so in case there are two lead wires (2 m + 2 b)
Even if there is slight deformation at the tip, the effect will be significantly reduced.

As described above, the six lead wires 2C-1 to 2C-6 are automatically aligned, so when the push rod 12i is operated and pushed toward the electronic component body 1t-printed wiring board 5, all The lead wires are inserted into the corresponding insertion holes up to their roots.

As can be easily understood from FIG. 6, the only two lead wires protruding from the back surface of the printed wiring board 5 in the inserted state are the longest lead wire 2a and the second longest lead wire 9b. There are 6 short lead wires of 2 cm 1 to 2 cm.
Since m2 does not require post-treatment, the number of assembly steps is reduced.

As is clear from the above operation, when the method of the present invention is applied, there is no need to provide a means for guiding the lead wire between the electronic component main body 1 and the i-electronic component (printed circuit board 5). No hole space is required for retracting the guide means. Therefore, it is possible to assemble electronic components even when they are arranged close to other components in a high density arrangement, and it is particularly suitable for assembly using an automatic machine. Also, as mentioned above, the one longer lead wire 2& and the second longest lead wire 2b
are aligned with the corresponding insertion holes 6 m + 6 b (details will be described later), so there is no risk of insertion errors, and other short or Vh') - wires 2 cm 1 ~
2cm6 is automatically inserted into the insertion hole 6cm1~6 as mentioned above.
Since it is directly facing cm6, there is no risk of insertion errors.

Figure 7 shows that when implementing the above method, the lead wire is 2 m.
FIG. 6 is a diagram showing an example of a lead position detection device configured to automatically perform +2b positioning.

Prism 20at installed rj facing the lead wire 2-3,
The lens 21 m connects the p lead wire 2h (D) to the imaging surface of the TV camera 22&.Similarly, the image of the lead lI 20b is focused to the imaging surface of the TV camera 22b via the prism 20b and the lens 21b. TV camera na
Based on the Eirin signal output of +Z2b, the lead wires 2a * 2b are connected by the measuring device fl1140 and the processing device (equipment).
The position of the tip is detected as a rectangular coordinate value in a horizontal plane and is input to an automatic control device K (details will be described later).

Figure 8 shows multi-lead electronic component glue applied to the method of the present invention.
It is a round machine designed to be inserted and assembled into a printed wiring board.

M is a component insertion device, and D is a component supply device.

The above-mentioned component supply device has a plurality of component supply units C arranged in a row, and is provided with a conveyance section Bt- which carries the multi-lead electronic components supplied from the component supply units onto a conveyance bar (H) and sends them to the insertion device. .

The insertion device M is provided with a delivery device @F that receives and takes the multi-lead electronic component from the above-mentioned conveyance ball (N) and delivers it to the insertion head E. The four insertion heads E, which receive multi-lead electronic components from the above-mentioned delivery device F, are arranged in a cross shape, and are rotated by the automatic control device K via the index section Gt to the a position shown in the figure. →b position→
It has a structure in which the position can be sequentially changed by 90° in the direction from the C position to the d position, and the above-mentioned position a is a receiving position for a multi-lead electronic component.

A lead cutting device Ht- is placed opposite the position b of the insertion head E.
It is a provision. This lead cutting device H is controlled by automatic control device KK.
Therefore, it is activated and has the function of shortening the leads of a multi-lead electronic component as shown in FIG. 2, for example.

A measuring device Jt is provided opposite the insertion head EoC position. This measuring device J is activated by an automatic control device KK to determine the longest lead wire position of a multi-lead electronic component held in the insertion head E and the second! It is equipped with a function to measure μ lead wire position and t. Its basic structure is shown in Figure 7.

5 is a printed wiring board set on the positioning device, and 6 is an insertion hole for a lead wire. The above positioning device is mounted on a rail in the X direction to which the pedestal PK is fixed.
A direction table 31, and two pulse motors fixed to the OX direction table 31 and mounted on a rail filter in the Y direction, provided with a 7'l-Y direction table &, and operated by an automatic control@scissors tK. (not shown) for positioning operation in the px and x directions.

The multi-lead electronic component attached to the printed circuit board 5 is marked by the insertion head E at position a by the transfer device IF, rotated together with the insertion head E to position b, and the lead wires are cut as specified by the cutting device HK. Rotate with the insertion head E at position 0ll11t and insert the measuring device JIC.
Therefore, the position of the two lead wires, the longest and second, is fILt-
be measured.

A reference position is set in advance for each of the two lead wires in the OIIJ fixing device J, and a deviation from this reference position is detected and input to the automatic control device fkK. The automatic control device stores the above deviation and moves the positioning device Lt-X and Y directions so as to cancel out this deviation and make it zero.

The insertion head E has the chuck ILI, 11. shown in FIGS. 3 to 6. and a push rod 12t, and is equipped with an automatically controlled p iron system K as shown in Fig. 3 to Fig. 6 1
The device is operated as follows, and each lead wire position of the multi-lead component is inserted into the insertion hole of the printed wiring board 5. When the insertion is finished, the excess length of the two lead wires is cut off using a cutting and bending device (not shown) provided below the first wiring board 5, and the remaining ends are bent. The electronic component body is fixed to the printed wiring board.

As can be easily understood from the above-mentioned operation, when an automatic insertion device is configured to use the method of the present invention, positioning for inserting the lead wire (same as lead wire 2a in the above embodiment) is required. It is enough to follow 2b),
In addition, it is sufficient to cut the excess length of the lead wire after insertion and bend the stump of the two lead wires. Therefore, the automatic wire insertion device configured as described above can have the versatility to handle multi-lead electronic components containing any number of Q17 wires, including three wires or more. Furthermore, for the same reason, by using the method of the present invention, it is possible to easily assemble multi-lead electronic components using a general-purpose machine configured for two-lead electronic components.

As explained above, in the present invention, among the lead wires fixed to a multi-lead electronic component, one lead wire is formed to be the longest, the other one is formed to be the second longest, and the other lead wires are formed to be seven. Make it even shorter, chuck the main body part of the child part, align the longest lead wire, and connect its tip St.
Insert the electronic component into the first hole, then align the second longest lead wire and insert its tip into the hole, then press this electronic component against the mating component and attach all the lead wires to the mating component. By inserting it into the hole, a general-purpose v
By using & to securely insert multi-lead electronic components into the insertion holes provided in the lead mating component, there is significantly less risk of insertion errors, and in addition, electronic components can be arranged in high density. assembly.

[Brief explanation of the drawing]

, Fig. 1 is an external view showing an example of a multi-lead electronic component, Fig. 2 is an explanatory diagram of a state in which the leads of a multi-lead electronic component are reduced by 'Q; JD by applying the method of the present invention, and Fig. 3. FIG. 6 is an explanatory diagram of the operating procedure of the method of the present invention, and FIG. 7 is an illustration of the lead position detection device constructed for use in the method of the present invention.
A! 1i11 FIG. 8 is a perspective view of a well-constructed automatic machine for assembling multi-lead electronic components using the method of the present invention. l...Electronic component body, 2...Lead wire, 2a...
The longest lead wire, 2b...the second longest lead wire,
2a-1a 2cmg~2cm6...Other lead wires, 5...Printed wiring board as an example of mating component, 6...Insertion hole, 6m + 6b + 6cm1
~6cm6...Insertion hole, 10, 11...Chuck, 12...Pushing rod% 20 a + 20 b...
Prism, 21 m + 21 b” lens, Z2
a + 22 b”・TV camera,・30,32
Rail, 31...X-direction table,...Y-direction table. Agent Attorney, Physician Tadashi Akimoto Figure 1 Figure 2 Figure 3 TA Figure 5 Figure 6 Figure 7 Figure 8

Claims (1)

[Claims] In a method of inserting at least three lead wires of an electronic component arranged in rows in a row into a hole provided in a mating component, one of the lead wires is formed to be the longest t-1;
The other lead wire is made second longest, the other lead wires are made shorter, the main body of the electronic component is chucked, the one longer lead wire is aligned, and the tip is connected to the other part. Next, align the second longest lead wire and insert its tip into the hole of the mating component, then press this electronic component against the mating component and connect all the lead wires to the mating component. A method for inserting a multi-lead electronic component, the method comprising inserting the multi-lead electronic component into a provided hole.