JPS61191059A - Block substrate and manufacture thereof - Google Patents

Block substrate and manufacture thereof

Info

Publication number
JPS61191059A
JPS61191059A JP3241285A JP3241285A JPS61191059A JP S61191059 A JPS61191059 A JP S61191059A JP 3241285 A JP3241285 A JP 3241285A JP 3241285 A JP3241285 A JP 3241285A JP S61191059 A JPS61191059 A JP S61191059A
Authority
JP
Japan
Prior art keywords
pins
tape
leg
substrate
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3241285A
Other languages
Japanese (ja)
Inventor
Hideya Kobayashi
英也 小林
Shinichi Shimada
島田　新一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP3241285A priority Critical patent/JPS61191059A/en
Publication of JPS61191059A publication Critical patent/JPS61191059A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE:To facilitate attaching work of a block substrate to a mother board, by providing leg pins at two facing sides of the substrate, and attaching tape on a plurality of the leg pins, which are provided at right angles with respect to the substrate. CONSTITUTION:A plurality of leg pins 2 are provided at two facing sides of a block substrate 1 at right angles with respect to the substrate. Tape 8 is attached along the leg pins 2. Before leg pin parts 7 are attached to a block substrate main body 1, frames 6 and 6' are cut from the leg pin part 7 along cutting lines 9 and 9'. When the leg pins 2 are inserted into holes 5 provided in a mother board 4, the leg pins are put in the holes 5 until the lower end of the tape 8 is contacted with the surface of the mother board 4. Therefore the height of the block substrate main body 1 with respect to the mother board 4 becomes constant, and two-storied mounting can be performed.

Description

【発明の詳細な説明】 Ａ　産業上の利用分野 本発明は半導体装置のブロック基板、特にその足ピンお
よびその製造方法に＠する。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a block substrate of a semiconductor device, particularly its leg pins and a manufacturing method thereof.

Ｂ　発明のａＳ 本発明のブロック基板は核基板の相対向する二つの辺の
各々に設けられ、上記基板に対して基板から直角方向に
ある複数個の足ピンがテープで相互ＫＷ１合される。足
ピンがテープで補ｊされているので１足ピンをマザーボ
ードに設ゆられた孔に挿入する作業が容易となる。上記
テープは両側にフレーム部、中間に足ピン部を有するリ
ードフレームの足ピン部に付着させられる。その後両側
のフレーム部を切断し１足ピンをブロック基［Ｋ取り付
ける際にも、足ピンがテープで結合されているので１作
業は容易である。B. aS of the Invention The block substrate of the present invention is provided on each of two opposing sides of the core substrate, and a plurality of foot pins in a direction perpendicular to the substrate are connected to each other with tape. Since the foot pins are supplemented with tape, it is easy to insert the single foot pin into the hole provided on the motherboard. The tape is attached to a foot pin portion of a lead frame having frame portions on both sides and a foot pin portion in the middle. After that, when cutting the frame parts on both sides and attaching the one-leg pin to the block base, the operation is easy because the leg pins are connected with tape.

Ｃ従来の技術 従来のブロック基板に取り付けられる足ピンは。C Conventional technology The foot pins are attached to a conventional block board.

板金の打抜き材（リードフレーム）または丸や角線材で
形成されている。第４図はブロック基板の斜視図で１図
中ｌはブロック基板の本体、２は足ピン、３はブロック
基板上に取り付けられた電子部品を表わすｉ 第４図に見られるように１足ピン相互の間には。It is made of sheet metal punching (lead frame) or round or square wire. Figure 4 is a perspective view of the block board. In Figure 1, l represents the main body of the block board, 2 represents the leg pins, and 3 represents the electronic components mounted on the block board. between each other.

それらが共通のブロック基板の本体に取り付けられてい
ることを除いて１機械的な結合は何もなく。1. There is no mechanical coupling except that they are attached to the body of a common block board.

第５図に示すよう忙、第４図に示すブロック基板をマザ
ーボード４忙取り付けるＫは１足ピン２を曾ザーボード
４　Ｋ＆ｆｆられた孔５に挿入しなければならない。As shown in FIG. 5, the block board shown in FIG. 4 must be attached to the motherboard 4 by inserting one pin 2 into the hole 5 in the motherboard 4.

Ｄ　発明が解決しようとする問題点 しかしこの工程には沢山の手間がかかり、また品質が安
定しないという欠点があった。さらＫ。D. Problems that the invention aims to solve However, this process requires a lot of effort and has the disadvantage that the quality is not stable. Sara K.

このような足ピンは搬送する際の変形に対しても不利で
あり、特別のマカジンを考慮する必要が有った。Such foot pins are also disadvantageous against deformation during transportation, and special machining needs to be considered.

本発明の第１の目的は１丈夫で、取扱いに便利な足ピン
を有するブロック基板を提供することである。A first object of the present invention is to provide a block substrate with leg pins that is durable and convenient to handle.

本発明の第２の目的は、そのような足ピンを有するブロ
ック基板を製造するための方法を提供することである。A second object of the invention is to provide a method for manufacturing a block substrate with such foot pins.

Ｅ　問題点を解決するための手段 上記第１の目的を達成するため釦１本発Ｆ９ＪＫよるブ
ロック基板は、基板の相対向する二つの辺の各々に設ゆ
られ、上記基板に対して基板から直角方向にある複数個
の足ピン忙亘ってその少なくとも一方の側に付着させら
れたテープを有することを要旨とする。E. Means for solving the problem In order to achieve the first objective above, a block board based on the F9JK with one button is installed on each of two opposing sides of the board, The gist is to have a plurality of perpendicular leg pins with a tape attached to at least one side thereof.

上記第２の目的を達成するために１本発明によるブロッ
ク基板の製造方法は１両側にフレーム部。In order to achieve the above second object, a method for manufacturing a block substrate according to the present invention includes a frame part on both sides.

中間に足ピン部を有するシードフレームの足ピン部にテ
ーピングを施す工程と１両側のフレーム部を切断し、テ
ープによって結合された足ピン部をブロック基板に取り
付ける工程とを含んでいる。The method includes the steps of taping the foot pin portions of a seed frame having a foot pin portion in the middle, and cutting the frame portions on both sides and attaching the foot pin portions connected with tape to the block substrate.

Ｆ　作用 ブロック基板の各辺に設けられている複数個の足ピンが
テープによって補強されているので１足ピンをマザーボ
ードにあけられた孔に挿入する際作業が容易となる。F. The plurality of foot pins provided on each side of the functional block board are reinforced with tape, making it easier to insert the single foot pin into the hole drilled in the motherboard.

以下に１図面を参照しながら、実施例を用いて本発明を
一層詳ＭＫａ明するが、それらは例示に過ぎず１本発明
の枠を越えることなしｋいろいろな変形や改良があり得
ることは勿論である。The present invention will be explained in more detail below using examples with reference to the drawings, but these are merely illustrative and do not go beyond the scope of the present invention.It is understood that various modifications and improvements may be made. Of course.

Ｇ　実施例 第１図は本発明によるブロック基板の一実施例の製造で
使用されるリードフレームの斜視図で。G. Embodiment FIG. 1 is a perspective view of a lead frame used in manufacturing an embodiment of a block substrate according to the present invention.

図中６，６′はフレーム、７はフレーム６と６１の間に
形成されている足ピン部、８は足ピｙ部忙貼り付けられ
たテープである。テープ８は足ピン部７の一方の側のみ
にあってもよいが、望ましくは足ピン部７の両１１４１
１設けられる。このとき両方のテープは四−材質であっ
てもよいが、異なっていてもよい。テープは熱圧着また
は接着によって付着させられる。In the figure, 6 and 6' are frames, 7 is a foot pin portion formed between the frames 6 and 61, and 8 is a tape attached to the foot pin y portion. The tape 8 may be on only one side of the foot pin part 7, but preferably on both sides 1141 of the foot pin part 7.
1 will be provided. In this case, both tapes may be made of four materials, but they may also be of different materials. The tape is applied by thermocompression or adhesive.

テーピングは有利には第２図に示す装置を用いて行なわ
れる。テーピングが済んでいないリードフレームは供給
リールｌＯから繰り出され熱圧着（または接着）機１１
を通過させられ、そこでテープリール１２．１２’から
送られて来るテープによって表離から挿まれ、そこでそ
れらは互に熱圧着または接着させられる。そのようにテ
ーピングされたリードフレームは案内ロール１３．１３
’によって尋かれ。Taping is advantageously carried out using the apparatus shown in FIG. The lead frame that has not been taped is fed out from the supply reel lO and transferred to a thermocompression bonding (or bonding) machine 11.
, where they are interleaved from each other by tape coming from tape reel 12, 12', where they are thermo-pressed or glued together. The lead frame so taped has guide rolls 13.13
asked by '.

巻取りリール１４に巻き取られる。It is wound up on a take-up reel 14.

足ピン部７をブロック基板本体１に取り付ける前に、７
Ｌ／−Ａ６，６’は第１図の切＠＠９．　９’ＩＣ沿っ
て足ピン部７から切り離される。足ピン２はテープ８に
よって互に結合されているので、その取扱いは容易であ
る。それらの足ピン２は所足の工程によってブロック基
板本体ｌに取り付けられ。Before attaching the foot pin part 7 to the block board main body 1,
L/-A6, 6' is cut @@9 in Figure 1. It is separated from the leg pin part 7 along 9'IC. Since the foot pins 2 are connected to each other by the tape 8, their handling is easy. These foot pins 2 are attached to the block substrate main body l by a necessary foot process.

テープ８は足ピン２の取付は後そのままＩ／ｃ残される
ことも取り去られることもできる。The tape 8 can be left on the I/C after attachment of the foot pin 2 or can be removed.

第３図はマザーボード４に取り付けられた本発明による
ブロック基板を足ピン取付は孔５に沿って切断した斜視
図で示す。正は足ピン２をブロック基板本体ＩＫ取り付
けるために圧入されたはんだ、　１６は足ピン２をマザ
ーボード４に電気的機械的に接続するためのはんだを表
わす。FIG. 3 shows a block board according to the present invention attached to the motherboard 4 in a perspective view cut along the hole 5 for attaching the leg pins. 16 represents solder press-fitted to attach the foot pins 2 to the block board main body IK, and 16 represents solder for electrically and mechanically connecting the foot pins 2 to the motherboard 4.

第３図に容易に見られるよ５に１足ピン２をマザーボー
ド４に設けられた孔５に挿入するとき。As can be easily seen in FIG. 3, when one foot pin 2 is inserted into the hole 5 provided in the motherboard 4.

足ピンは、テープ８の下端がマザーボード４０表面に接
するようＫなるまで、孔５に挿入される。The foot pins are inserted into the holes 5 until the lower end of the tape 8 comes into contact with the surface of the motherboard 40.

したがってブロック基板本体ｌのマザーボード４に対す
る高さが一定し、２階だて実装が可能となＨ発明の詳細 な説明した通り１本発明によれば１足ピンが互に結合さ
れているので、その取扱いが容易で。Therefore, the height of the block board main body l relative to the motherboard 4 is constant, and mounting on two floors is possible.As explained in detail in the invention H, according to the invention, the pins of each leg are connected to each other, so Its handling is easy.

ブロック基板本体に取り付ける際にも、そのようにして
形成されたブロック基板をマザーボードに取り付ける際
にも作業が容易になる。さら忙、２階だけ実装も可能と
なる・The work becomes easier both when attaching the block board to the main body of the block board and when attaching the thus formed block board to the motherboard. Even more busy, implementation is possible only on the second floor.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明によるブロック基板の製造で使用されろ
リードフレームの斜視図、第２図は本発明によるブロッ
ク基板の製造に使用されるテーピング機の平面図、第３
図はマザーボードに取り付けられた本発明によるブロッ
ク基板の斜視図、第４図は従来のブロック基板の斜視図
、１１ｇ５図は従来の１０ツク基板をマザーボードに取
り付ける王権を示す斜視図である。 ｌ・・・ブロック基板本体、２・・・足ピン、３・−電
子部品、４・・・マザーボード、５・・・孔、６．６’
・・・フレーム、７・・・建ピン部、８・・・テープ、
９．９’・・・切断線、　１０・・・供給リール、１１
・・・熱圧着または接着機。 １２、　１２’・・・テープリール、　１３．１３’・
−・案内ロール、１４・・・巻取り゛リール、１５，１
６・−・はんだ。FIG. 1 is a perspective view of a lead frame used in manufacturing a block substrate according to the present invention, FIG. 2 is a plan view of a taping machine used in manufacturing a block substrate according to the present invention, and FIG.
The figure is a perspective view of a block board according to the present invention attached to a motherboard, FIG. 4 is a perspective view of a conventional block board, and FIG. l...Block board body, 2...leg pin, 3--electronic components, 4...motherboard, 5...hole, 6.6'
... Frame, 7... Standing pin part, 8... Tape,
9.9'... Cutting line, 10... Supply reel, 11
...Thermocompression bonding or gluing machine. 12, 12'... tape reel, 13.13'.
- Guide roll, 14... Take-up reel, 15, 1
6.--Solder.

Claims (2)

【特許請求の範囲】[Claims] （１）（ａ）基板の相対向する二つの辺の各々に設けら
れ、上記基板に対して基板から直角方向にある複数個の
足ピンに亘つてその少なくとも一方の側に付着させられ
たテープ を有することを特徴とするブロック基板。(1) (a) A tape provided on each of two opposing sides of the board and attached to at least one side of the board across a plurality of foot pins in a direction perpendicular to the board. A block substrate characterized by having. （２）（ａ）両側フレーム部、中間に足ピン部を有する
リードフレームの足ピン部にテーピングを施す工程、お
よび （ｂ）両側のフレーム部を切断し、テープによつて結合
された足ピン部をブロック基板に取り付ける工程 を含むことを特徴とするブロック基板の製造方法。(2) (a) A step of taping the foot pins of a lead frame that has frame portions on both sides and a foot pin portion in the middle, and (b) Cutting the frame portions on both sides and connecting the foot pins with tape. 1. A method for manufacturing a block substrate, comprising the step of attaching a part to a block substrate.
JP3241285A 1985-02-20 1985-02-20 Block substrate and manufacture thereof Pending JPS61191059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3241285A JPS61191059A (en) 1985-02-20 1985-02-20 Block substrate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3241285A JPS61191059A (en) 1985-02-20 1985-02-20 Block substrate and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS61191059A true JPS61191059A (en) 1986-08-25

Family

ID=12358235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3241285A Pending JPS61191059A (en) 1985-02-20 1985-02-20 Block substrate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS61191059A (en)

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