JPH08335752A - Flexible wiring board and its manufacture - Google Patents
Flexible wiring board and its manufactureInfo
- Publication number
- JPH08335752A JPH08335752A JP13132795A JP13132795A JPH08335752A JP H08335752 A JPH08335752 A JP H08335752A JP 13132795 A JP13132795 A JP 13132795A JP 13132795 A JP13132795 A JP 13132795A JP H08335752 A JPH08335752 A JP H08335752A
- Authority
- JP
- Japan
- Prior art keywords
- film base
- screw
- wiring board
- flexible wiring
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は各種電子機器の内部にお
いて、各回路の配線接続に用いられるフレキシブル配線
板およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board used for wiring connections of various circuits inside various electronic devices and a method for manufacturing the same.
【0002】[0002]
【従来の技術】近年、機器の小形軽量化、高密度化に対
応するためにフレキシブル配線板が多く使用されるよう
になってきた。このような中において、図3に示すよう
にフレキシブル配線板のフィルムベース31をシャーシ
32などに取り付ける際にビス(ねじ)33などによっ
て取り付けるが、フィルムベース31単体では厚みが薄
く取付けが困難となる。そこで、取付け用の補強板34
をフィルムベース31に両面テープ(接着剤)38によ
り接着しシャーシ32などに取り付ける。この際にビス
取付け孔35を同時加工にて形成するとビス33の締付
け時にビス頭部33aがフィルムベース31を巻き込ん
でしわ36を発生させ、さらにはフィルムベース31の
破損、導体パターン37の切断が多く発生する。2. Description of the Related Art In recent years, flexible wiring boards have come to be used more and more in order to reduce the size and weight of equipment and increase the density thereof. In such a situation, as shown in FIG. 3, when the film base 31 of the flexible wiring board is attached to the chassis 32 or the like with screws (screws) 33 or the like, the film base 31 alone is thin and difficult to attach. . Therefore, the reinforcing plate 34 for mounting
Is attached to the film base 31 with a double-sided tape (adhesive) 38 and attached to the chassis 32 or the like. At this time, if the screw mounting holes 35 are formed at the same time, the screw head 33a wraps around the film base 31 to generate wrinkles 36 when the screw 33 is tightened, and further the film base 31 is damaged and the conductor pattern 37 is cut. Many occur.
【0003】その対策として、フレキシブル配線板のフ
ィルムベース31に両面テープ(接着剤)38などを貼
付け、図4に示すように、ビス頭部逃げ孔39を加工し
た後に図示していないが両面テープ(接着剤)38の離
形紙を剥がし、ビス取付け孔35の加工された補強板3
4をフィルムベース31に加工されたビス頭部逃げ孔3
9に同芯となるように位置決め接着し、フィルムベース
31にビス頭部33aの影響がないようにビス頭部33
aが直接補強板34を押さえるような構成としている。As a countermeasure, a double-sided tape (adhesive) 38 or the like is attached to the film base 31 of the flexible wiring board, and as shown in FIG. The release paper of (adhesive) 38 is peeled off, and the reinforcing plate 3 having the screw mounting holes 35 is processed.
4 is a film base 31 and a screw head relief hole 3
9 is positioned and adhered so as to be concentric with each other, so that the screw head 33a is not affected by the screw head 33a on the film base 31.
It is configured such that a directly presses the reinforcing plate 34.
【0004】また、このように構成された従来のフレキ
シブル配線板の取付け部の組立工程を図5に示す。FIG. 5 shows a process of assembling the mounting portion of the conventional flexible wiring board thus constructed.
【0005】[0005]
【発明が解決しようとする課題】しかし、上記従来の対
策を施したフレキシブル配線板においても、図5に示す
ように、ビス取付け部を形成するために、フィルムベー
ス31への両面テープ貼付け、フィルムベース31への
ビス頭部逃げ孔加工、補強板外形と取付け孔加工、補強
板位置決め(同芯とするため貼付け治具への位置決
め)、両面テープ離形紙剥がし・貼付け、と作業工数が
多く、加工金型は、フィルムベース31のビス頭部逃げ
孔加工、補強板外形加工、ビス取付け孔加工、と2〜3
面必要となり、さらにビス頭部逃げ孔39と、ビス取付
け孔35を同芯とするために位置決め治具を用いて組立
を行い費用、工数の増加といった課題があった。However, even in the flexible wiring board on which the above-mentioned conventional measures are taken, as shown in FIG. 5, in order to form a screw attachment portion, a double-sided tape is attached to the film base 31, and a film is attached. A lot of man-hours are required, such as screw head relief hole processing on the base 31, reinforcing plate outer shape and mounting hole processing, reinforcing plate positioning (positioning on the bonding jig to be concentric), double-sided tape release paper peeling / pasting The processing mold is a screw head relief hole processing of the film base 31, a reinforcing plate outer shape processing, a screw mounting hole processing, and 2-3.
However, there is a problem that the screw head escape hole 39 and the screw mounting hole 35 are concentric with each other, and a positioning jig is used for assembly to increase costs and man-hours.
【0006】本発明はこのような従来の課題を解決する
もので、作業工数を低減し安価で高性能なフレキシブル
配線板およびその製造方法を提供することを目的とする
ものである。The present invention is intended to solve such conventional problems, and an object of the present invention is to provide an inexpensive and high-performance flexible wiring board with reduced man-hours and a method for manufacturing the same.
【0007】[0007]
【課題を解決するための手段】上記課題を解決する本発
明のフレキシブル配線板は、フィルムベースと、このフ
ィルムベース上に形成された導体パターンと、前記フィ
ルムベースのどちらか一方の面に接着された補強板と、
前記フィルムベースと前記補強板の同位置に設けられた
ビス取付け孔と、前記フィルムベース上に設けられた前
記ビス取付け孔と同芯でビス頭部の径より大径のスリッ
トを前記フィルムベース側より接着層に至るまで備えた
構成としたものである。A flexible wiring board of the present invention which solves the above-mentioned problems is adhered to either one surface of a film base, a conductor pattern formed on the film base, and the film base. Reinforcing plate,
A screw mounting hole provided at the same position of the film base and the reinforcing plate, and a slit concentric with the screw mounting hole provided on the film base and having a diameter larger than the diameter of the screw head are provided on the film base side. The structure further includes an adhesive layer.
【0008】[0008]
【作用】上記構成のフレキシブル配線板においては、ビ
スの締付け時にビス頭部によって締付けられる箇所は、
スリットにてフィルムベースの導体パターンより分離さ
れるため、フィルムベースの破損、導体パターンの切断
の発生をなくすこととなる。In the flexible wiring board having the above-mentioned structure, when the screw is tightened, the portion tightened by the screw head is
Since it is separated from the conductor pattern of the film base by the slit, breakage of the film base and cutting of the conductor pattern are eliminated.
【0009】[0009]
【実施例】以下、本発明の一実施例のフレキシブル配線
板について図面を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible wiring board according to an embodiment of the present invention will be described below with reference to the drawings.
【0010】図1に示すように、本実施例のフレキシブ
ル配線板は、フィルムベース1と、フィルムベース1上
に形成された導体パターン2と、フィルムベース1のど
ちらか一方の面に両面テープ(粘着剤)3で接着された
補強板4と、フィルムベース1と補強板4の同位置に設
けられたビス取付け孔5と、フィルムベース1上に設け
られたビス取付け孔5と同芯でビス頭部6の径より大径
のスリット7を備えている。この際に、スリット7はフ
ィルムベース1側より、両面テープ(粘着剤)3まで施
されており、つなぎ部10は内側のフィルムベース1a
がかろうじて保持される幅でつながっている。As shown in FIG. 1, the flexible wiring board of this embodiment has a film base 1, a conductor pattern 2 formed on the film base 1, and a double-sided tape ( Reinforcement plate 4 adhered with adhesive 3, screw attachment hole 5 provided at the same position of film base 1 and reinforcement plate 4, and screw attachment hole 5 provided on film base 1 with the same screw A slit 7 having a diameter larger than that of the head 6 is provided. At this time, the slit 7 is provided from the film base 1 side to the double-sided tape (adhesive) 3, and the joint portion 10 is the inner film base 1a.
Are connected by a width that is barely held.
【0011】以上のように構成されたフレキシブル配線
板のフィルムベース1を、シャーシ8に取り付ける場
合、ビス(ネジ)9によって締め付けられる。この際、
ビス(ネジ)9の頭部6はフィルムベース1に設けられ
たスリット7を介して補強板4を押さえ付けるため、ビ
ス(ネジ)9の締付け力によってスリット7の外側と内
側のフィルムベース1と1aをつなぐつなぎ部10が破
損し、スリット7の内側のフィルムベース1aがその外
側のフィルムベース1と分離される。このことによって
フィルムベース1上に設けられた導体パターン2には力
が加わることがなく、導体パターン2の破損や切断を防
ぐことができる。When the film base 1 of the flexible wiring board constructed as described above is attached to the chassis 8, it is tightened by screws (screws) 9. On this occasion,
Since the head 6 of the screw (screw) 9 presses the reinforcing plate 4 via the slit 7 provided in the film base 1, the tightening force of the screw (screw) 9 causes the film base 1 on the outside and inside of the slit 7. The joint portion 10 connecting the 1a is broken, and the film base 1a inside the slit 7 is separated from the film base 1 outside thereof. As a result, no force is applied to the conductor pattern 2 provided on the film base 1, and damage or cutting of the conductor pattern 2 can be prevented.
【0012】同時に加工面では、図2に示すように、フ
ィルムベース1への両面テープ貼り、フィルムベース1
へのビス(ネジ)頭部逃げスリット加工、両面テープ離
形紙剥がし、補強板貼付け、フレキシブル配線板外形・
ビス(ネジ)取付け孔加工、の5工程で製造することが
できる。At the same time, in terms of the processed surface, as shown in FIG.
Screw (screw) head relief slit processing, double-sided tape release paper peeling, reinforcing plate attachment, flexible wiring board outline /
It can be manufactured in 5 steps: screw (screw) mounting hole processing.
【0013】あるいは、ビス(ネジ)頭部逃げスリット
加工を、フレキシブル配線板外形・ビス(ネジ)取付け
孔加工をトムソン金型を用いてスリット7とビス取付け
孔5の加工を刃物の高さに差を持たせることによって同
時加工を行えば4工程となり、金型面数低減、作業工数
低減となる。Alternatively, the screw (screw) head relief slit processing is performed, and the flexible wiring board outer shape and screw (screw) mounting hole processing is performed by using a Thomson die to process the slit 7 and the screw mounting hole 5 to the height of the cutting tool. If the simultaneous processing is performed by giving a difference, it becomes four steps, which reduces the number of mold surfaces and the number of work steps.
【0014】さらに上記工程にて組立を行う際には、ス
リット7とビス取付け孔5を同時加工できるため、補強
板4のフィルムベース1に貼付ける精度はさほど必要が
ないため貼付け治具も不要となる。Further, when assembling in the above process, since the slit 7 and the screw mounting hole 5 can be simultaneously processed, the accuracy of sticking the reinforcing plate 4 to the film base 1 is not so required, so that no sticking jig is required. Becomes
【0015】なお、上記実施例ではスリット7の加工は
フィルムベース1と両面テープ3の両方に施す構成とし
たが、両面テープ(粘着剤)3の強度が弱い場合には、
両面テープ(粘着剤)3までスリット7がなくても同様
な効果が得られるものであることを付け加えておく。In the above embodiment, the slit 7 is processed on both the film base 1 and the double-sided tape 3, but when the strength of the double-sided tape (adhesive) 3 is weak,
It should be added that even if the double-sided tape (adhesive) 3 does not have the slit 7, the same effect can be obtained.
【0016】[0016]
【発明の効果】以上の説明より明らかなように本発明の
フレキシブル配線板およびその製造方法によれば、電子
機器内部において各回路の配線接続に用いられるフレキ
シブル配線板に対して、ベースフィルムに補強板貼付け
後にビス(ネジ)頭部逃げスリット加工をフレキシブル
配線板外形加工と同時に行え、作業工数を低減し安価で
高性能なフレキシブル配線板を提供することができるも
のである。As is apparent from the above description, according to the flexible wiring board and the manufacturing method thereof of the present invention, the flexible wiring board used for wiring connection of each circuit inside the electronic device is reinforced by the base film. The screw (screw) head relief slit processing can be performed simultaneously with the flexible wiring board outer shape processing after the boards are attached, and it is possible to provide an inexpensive and high-performance flexible wiring board with a reduced number of work steps.
【図1】(a)本発明の一実施例のフレキシブル配線板
の平面図 (b)(a)のA−A’断面図FIG. 1A is a plan view of a flexible wiring board according to an embodiment of the present invention. FIG. 1B is a sectional view taken along line AA ′ of FIG.
【図2】同フレキシブル配線板の組立工程図[Fig. 2] Assembly process drawing of the flexible wiring board
【図3】(a)従来のフレキシブル配線板の平面図 (b)(a)のB−B’断面図FIG. 3A is a plan view of a conventional flexible wiring board, and FIG. 3B is a sectional view taken along line B-B ′ of FIG.
【図4】(a)従来のビス巻き込み対策を実施したフレ
キシブル配線板の平面図 (b)(a)のC−C’断面図FIG. 4A is a plan view of a conventional flexible wiring board in which measures against screw entrainment have been implemented, and FIG. 4B is a sectional view taken along line CC ′ of FIG. 4A.
【図5】同フレキシブル配線板の組立工程図FIG. 5: Assembly process diagram of the flexible wiring board
1 フィルムベース 2 導体パターン 3 両面テープ 4 補強板 5 ビス取付け孔 6 ビス頭部 7 スリット 9 ビス 10 つなぎ部 1 Film base 2 Conductor pattern 3 Double-sided tape 4 Reinforcing plate 5 Screw mounting hole 6 Screw head 7 Slit 9 Screw 10 Connecting part
Claims (4)
上に形成された導体パターンと、前記フィルムベースの
どちらか一方の面に接着層を介して接着された補強板
と、前記フィルムベースと前記補強板の同位置に設けら
れたビス取付け孔と、前記フィルムベース上に設けられ
た前記ビス取付け孔と同芯でビス頭部の径より大径のス
リットを備えたフレキシブル配線板。1. A film base, a conductor pattern formed on the film base, a reinforcing plate adhered to either surface of the film base via an adhesive layer, the film base and the reinforcing plate. A flexible wiring board having a screw mounting hole provided at the same position and a slit concentric with the screw mounting hole provided on the film base and having a diameter larger than the screw head diameter.
のフィルムベース間をつなぐつなぎ部を少なくとも一ヵ
所以上備えた請求項1記載のフレキシブル配線板。2. The flexible wiring board according to claim 1, wherein the slit is provided with at least one connecting portion for connecting the film bases inside and outside the slit.
層まで施されたものである請求項1または2記載のフレ
キシブル配線板。3. The flexible wiring board according to claim 1, wherein the film base has slits provided up to the adhesive layer.
し、このフィルムベースのどちらか一方の面に接着層を
介して補強板を貼付けた後、ビス取付け用の貫通孔、な
らびに前記ビス取付け孔と同芯でビス頭部の径より大径
のスリットをフィルムベース側より接着層まで設ける請
求項1〜3いずれか記載のフレキシブル配線板の製造方
法。4. A conductor pattern is formed on a film base, and a reinforcing plate is attached to either surface of the film base via an adhesive layer, and then a through hole for screw attachment and the screw attachment hole are formed. 4. The method for manufacturing a flexible wiring board according to claim 1, wherein a slit having a diameter larger than the diameter of the screw head is concentrically provided from the film base side to the adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13132795A JP3391147B2 (en) | 1995-04-04 | 1995-05-30 | Flexible wiring board and method of manufacturing the same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7-78718 | 1995-04-04 | ||
JP7871895 | 1995-04-04 | ||
JP13132795A JP3391147B2 (en) | 1995-04-04 | 1995-05-30 | Flexible wiring board and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08335752A true JPH08335752A (en) | 1996-12-17 |
JP3391147B2 JP3391147B2 (en) | 2003-03-31 |
Family
ID=26419777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13132795A Expired - Fee Related JP3391147B2 (en) | 1995-04-04 | 1995-05-30 | Flexible wiring board and method of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3391147B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019362A (en) * | 2004-06-30 | 2006-01-19 | Sanyo Electric Co Ltd | Circuit module |
JP2006041410A (en) * | 2004-07-30 | 2006-02-09 | Sanyo Electric Co Ltd | Circuit module and electronic equipment |
JP2013138157A (en) * | 2011-12-28 | 2013-07-11 | Kyocer Slc Technologies Corp | Wiring board and probe card using the same |
-
1995
- 1995-05-30 JP JP13132795A patent/JP3391147B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019362A (en) * | 2004-06-30 | 2006-01-19 | Sanyo Electric Co Ltd | Circuit module |
JP4514530B2 (en) * | 2004-06-30 | 2010-07-28 | 三洋電機株式会社 | Circuit modules and precision equipment built into precision equipment |
JP2006041410A (en) * | 2004-07-30 | 2006-02-09 | Sanyo Electric Co Ltd | Circuit module and electronic equipment |
JP4636827B2 (en) * | 2004-07-30 | 2011-02-23 | 三洋電機株式会社 | Circuit module |
JP2013138157A (en) * | 2011-12-28 | 2013-07-11 | Kyocer Slc Technologies Corp | Wiring board and probe card using the same |
US9157932B2 (en) | 2011-12-28 | 2015-10-13 | KYOCERA Circuit Solutions, Inc. | Wiring board and probe card using the same |
Also Published As
Publication number | Publication date |
---|---|
JP3391147B2 (en) | 2003-03-31 |
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