JPH08274418A - Printed wiring board structure - Google Patents

Abstract

PURPOSE: To easily divide a printed wiring board and eliminate deflection of a printed wiring board during operation by providing a front-to-rear through hole with different hole diameters in a front and a rear on a dividing line of a printed wiring board structure which is divided and processed to a plurality of product parts or a product part and an unused board part by a hole cut. CONSTITUTION: A plurality of front-to-rear through holes 13, 13,... with different hole diameters in a front and a rear are provided on a dividing line between a product part A and a product part B with hole cuts 12,... between. Reinforcement materials 14, 14,... such as solder or resin which can be filled and removed by heat treatment, for example, are buried in each of the front-to-rear through holes 13, 13,... Deflection of a printed wiring board during operation can be eliminated by burying the reinforcement materials 14, 14... Furthermore, product parts 10A, 10B can be readily divided and processed by bending a board to an outside from a side of a large diameter of the front-to-rear through holes 13, 13,... toward a side of a small diameter thereof.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board structure applied to a plurality of product parts on which electronic parts are mounted, or a printed wiring board divided into a product part and a waste plate part.

[0002]

2. Description of the Related Art A conventional structure of a printed wiring board in which a plurality of product parts on which electronic parts are mounted, or a product part and a waste plate part are separately processed, will be described with reference to FIG.

In FIG. 3, 10 (A) and 10 (B) are product parts in which circuit patterns are formed, and 10 (C), respectively.
Is a discard plate part. Reference numeral 11 is a router processing section, and 12 is a hole cut.

In recent years, various kinds of materials have been taken in printed wiring boards that are divided into these types, and along with this, if the number of hole cuts 12 is increased to facilitate division, the distortion of the printed circuit board during component mounting ( Due to the bending, it is impossible to mount components with high precision, and there is a problem that component mounting becomes impossible if it is forced. Further, if the number of hole cuts 12 is small, there is a problem that substrate stress is concentrated on the hole cuts during transportation and work, resulting in damage to the product part.

[0005]

As described above, in a printed wiring board that is divided into several types in recent years, various materials are being taken, and along with this, the number of hole cuts is increased to facilitate division. However, there is a problem in that the components cannot be mounted with high precision due to the distortion (flexure) of the printed circuit board when the components are mounted, and the components cannot be mounted by force. Further, if the number of hole cuts is small, there is a problem that substrate stress concentrates on the hole cuts during transportation and work, resulting in damage to the product part.

The present invention has been made in view of the above circumstances,
Prevents distortion (deflection) in the printed wiring board in the printed wiring board structure applied to multiple product parts where electronic parts are mounted, or printed wiring boards that are divided into product parts and waste board parts. It is therefore an object of the present invention to provide a printed wiring board structure capable of mounting components with high accuracy and also capable of easily performing division processing without damaging the product part.

[0007]

DISCLOSURE OF THE INVENTION The present invention is a printed wiring board structure which is divided into a product portion and a product portion, or a product portion and a waste board portion.
A groove portion by router processing, a plurality of hole cuts, and a plurality of through holes between the front and back with different hole diameters are provided on the front and back sides. At that time, the reinforcing material is removed.

[0008]

[Function] In a printed wiring board structure that is divided into a product part and a product part, or a product part and a waste plate part, for the purpose of the division process, a hole is cut on the dividing line and the front and back sides have different hole diameters. And a through hole.

Then, a reinforcing material such as solder or resin that can be filled and removed by heat treatment is embedded in the through hole portion between the front and back. The embedding of this reinforcing material eliminates distortion (flexure) of the printed wiring board during work, avoids the inconvenience that components are not mounted properly when mounting components on product parts, and enables highly reliable component mounting. To do.

After component mounting (mounting), the reinforcing material such as solder or resin filled in the front and back through-holes is removed and the product portion is divided. At this time, the product portion can be easily divided by the through hole provided between the front and back sides on the dividing line, and cracks and damages to other portions except the divided portion of the product portion can be avoided.

[0011]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the dividing line (router processing line) in FIG. 1, and FIG. 3 is a divided printed wiring board to which the present invention is applied. It is a top view which shows an example.

In the figure, 10 (A) and 10 (B) are product parts on which circuit patterns are formed respectively, 11 is a router processing part, and 12 is a hole cut.

.. are through-holes provided on the dividing line (on the router processing line) and having different hole diameters on the front and back sides. Here, on the router processing portion 11, a plurality of hole cuts 12 are formed. , 12 are provided in a state of being sandwiched.

.. are the through holes 13 between the front and back sides,
It is a reinforcing material such as solder or resin that is embedded in 13, ...

1 and 2, the product section 10
On the dividing line between (A) and the product part 10 (B), a plurality of through holes 13, 13, between the front and back having different hole diameters are provided with a hole cut 12, ... sandwiched between the front and back. Each of the through holes 13, 13, ... Reinforcing material 14, 14, such as solder or resin, which can be filled and removed by heat treatment, for example.
... is embedded.

By embedding the reinforcing materials 14, 14, ..., Distortion (deflection) of the printed wiring board at the time of work is eliminated, and the inconvenience that the components are not properly mounted at the time of mounting the components on the product part is avoided.

After mounting (mounting) the components on the product parts 10 (A), 10 (B), the reinforcing materials 14, 14 ... Filled in the front and back through holes 13, 13 ,. , The product parts 10 (A), 10 (B) are divided.

During this division processing, front and back through holes 13, 1 are formed.
The product portion 10 is formed by bending outward from the surface with the larger diameter of 3 ... toward the surface with the smaller diameter.
(A), 10 (B) can be easily divided, and the stress due to the bending does not excessively apply to other parts of the product such as the hole cut 12, so the product 10 (A), 10 (B)
It is possible to avoid cracks, damages, etc. in other portions except the divided portion of (B).

In the above-described embodiment, the hole cuts 12, 12 are formed on the dividing line between the product section 10 (A) and the product section 10 (B).
A plurality of through-holes 13, 13 having different hole diameters on the front and back sides are provided with sandwiching ..., but a plurality of holes not penetrating the front surface or the back surface may be provided on the dividing line. .

[0021]

As described above in detail, according to the present invention, a printed wiring applied to a printed wiring board which is divided into a product portion on which electronic parts are mounted and a product portion, or a product portion and a discarding plate portion. In the board structure, it is possible to prevent distortion (deflection) in the printed wiring board and mount parts with high accuracy, and to avoid damage to the product part and easily perform division processing. Structure can be provided.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the division line (on the router processing line) in FIG.

FIG. 3 is a plan view showing an example of division of a printed wiring board to which the present invention is applied.

[Explanation of symbols]

10 (A), 10 (B) ... Product part, 10 (C) ... Discarding plate part, 11 ... Router processing part, 12 ... Hole cut, 13
... front and back through holes, 14 ... reinforcing material.

Claims (6)

[Claims] 1. A printed wiring board structure which is divided into a plurality of product parts or a product part and a waste plate part, and a plurality of front and back holes having different hole diameters on the front and back are provided on a dividing line of the printed wiring board. A printed wiring board structure characterized by being provided with holes. 2. A printed wiring board structure which is divided into a plurality of product parts or a product part and a waste plate part, wherein a groove part by router processing and a plurality of hole cuts are formed on a dividing line of the printed wiring board. And a plurality of through holes between the front and back having different hole diameters on the front and back. 3. The printed wiring board according to claim 1, wherein the through-holes between the front and back are filled with a reinforcing material to reinforce the divided board portion, and the reinforcing material is removed when dividing the board. Construction. 4. The printed wiring board structure according to claim 3, wherein a reinforcing material that can be filled and removed by heat treatment is used. 5. The printed wiring board structure according to claim 4, wherein solder or resin is used as the reinforcing material that can be filled and removed by heat treatment. 6. A printed wiring board structure which is divided into a plurality of product parts or a product part and a waste board part, and a plurality of parts which are impermeable to the front surface or the back surface on the dividing lines of the printed wiring board. A printed wiring board structure characterized by being provided with holes.