JPH058198A - Method for machining contour of printed board - Google Patents

Abstract

PURPOSE:To get the method for machining a contour of a printed wiring board without albinism of the resin between a reference hole and a contour line during machining the contour of the printed wiring board even if the reference hole is provided near the contour line of the printed circuit board. CONSTITUTION:Plural holes 4 are formed in the vicinity of the reference hole 3 of a printed board 1 so that the center distance between neighbouring holes is shorter than the diameter of the holes and the peripheral surface of the holes is connected continuously at the inside from the extended line of the contour line 2. After that, the printed board is punched by using a press along the contour line 2 by means of a metal die.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board outer shape processing method, and more particularly to a printed wiring board outer shape processing method in which a reference hole is formed near the outer shape line.

[0002]

2. Description of the Related Art Assembling work of a printed wiring board is shifting from manual work to automatic assembly for the purpose of reducing the assembling cost and improving the quality. In particular, most of the assembling work of a printed wiring board adopting a surface mounting method capable of increasing the density is performed by an automatic assembling machine because the parts themselves are small and it is difficult to perform them manually. Many of these automatic assembling machines adopt a method of positioning by inserting a guide pin into a reference hole formed in a printed wiring board.
As shown in (a), the printed wiring board 21 has an outline 22
A reference hole 23 is formed near the. Then, conventionally, when the outer shape of the printed wiring board 21 is processed, as shown in FIG. 2B, a die is pressed along a die punching line 24 formed at the same position as the outer shape line of the printed wiring board 21. I was punching.

[0003]

However, the reference hole 23
Since the resin is formed near the outline, whitening (deterioration) of the resin between the reference hole 23 and the outline 22 occurs during press punching, and the portion is destroyed during the assembly work, which hinders positioning. There was a risk of coming. Reference hole 23 to prevent whitening
If the distance between the external wiring and the outline is increased, the printed wiring board 21
There is a problem that the mountable area of various electronic components is reduced.

The present invention has been made in view of the above problems, and an object thereof is to perform external processing of a printed wiring board even if a reference hole is formed near the external line of the printed wiring board. An object of the present invention is to provide a printed wiring board outer shape processing method which does not cause whitening of resin between the reference hole and the outer shape line.

[0005]

In order to achieve the above object, according to the present invention, a plurality of holes are provided in the vicinity of a reference hole of a printed wiring board, and the center distance between the adjacent holes is smaller than the diameter of the holes. The peripheral surface was formed so as to be continuous inside the extension line of the contour line, and thereafter, punching was performed with a mold along the contour line.

[0006]

When the outer shape of the printed wiring board is processed, a plurality of holes are formed in the vicinity of the reference hole so that the peripheral surface is continuous inside the extension line of the outline line to form a long hole along the outline line. After that, press punching is performed along the outline. Therefore, at the time of punching by press, the die passes through the long hole portion without contacting the printed wiring board at the position corresponding to the reference hole, and in that portion, no pressure is applied to the printed wiring board and the outer shape of the reference hole and the outer shape. The whitening of the resin between the lines is reliably prevented.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. A reference hole 3 is formed in the printed wiring board 1 in the vicinity of the outline (die punching line) 2. At the time of outer shape processing after completion of processes such as through-hole plating, patterning, and solder resist printing, as shown in FIG. 1A, first, the outer shape line 2 of the printed wiring board 1 is provided in the vicinity of the reference hole 3.
A large number of holes 4 having a center on the outer side are formed in a state in which a part of the peripheral surface of each adjacent hole 4 is continuous inside the extension line of the outline 2. As a result, the elongated hole 5 along the outline is formed in the vicinity of the reference hole 3, and the state shown in FIG. 1B is obtained. Next, press punching is performed along the outline 2. At this time, the mold (not shown) shears the printed wiring board 1 along the outline 2, but the portion corresponding to the reference hole 3 has already been cut by the long hole 5, so that the printed wiring board is cut at that portion. The whitening (deterioration) of the resin between the reference hole 3 and the outer shape line 2 is reliably prevented without applying a pressing force to 1. Therefore, even if the distance between the reference hole 3 and the outer shape line 2 is narrow, there is no possibility that the portion will be destroyed, and there will be no hindrance in positioning during assembly work. Further, the continuous portion of the peripheral surface of each hole 4 is somewhat uneven, but since the portion is inside the extension line of the outline 2, the portion interferes when the printed wiring board 1 is housed in a case or the like. It never happens.

[0008]

As described above in detail, according to the present invention, even if the reference hole is formed near the outline of the printed wiring board so as not to reduce the mountable area of the electronic component, the external processing of the printed wiring board is performed. In this case, it is possible to reliably prevent whitening (deterioration) of the resin between the reference hole and the outer shape line, and there is no fear that the part will be damaged during assembly work and positioning will not be hindered.

[Brief description of drawings]

FIG. 1 is a schematic view showing an outline processing procedure of an embodiment embodying the present invention.

FIG. 2A is a partial plan view of a printed wiring board, and FIG.
FIG. 6 is a schematic diagram illustrating a conventional outer shape processing method.

[Explanation of symbols]

1 ... Printed wiring board, 2 ... Outline line, 3 ... Reference hole, 4 ...
Holes, 5 ... long holes.

Claims (1)

Claims: 1. A plurality of holes (4) are provided in the vicinity of a reference hole (3) of a printed wiring board (1), and the center distance between adjacent holes (4) is the diameter of the holes (4). A printed wiring characterized in that it is smaller and its peripheral surface is continuous inside the extension line of the contour line (2), and then punching is performed with a die along the contour line (2). Board external processing method.