JPH08130399A - Method and apparatus for mounting electronic parts on printed circuit board - Google Patents

Abstract

PURPOSE: To reduce the waste of solder by passing leads of electronic parts through via holes of a printed circuit board from its front side, cutting short the leads protruding from its back side, and bending them at their roots. CONSTITUTION: While leads 1a of electronic parts 1 are inserted into via holes 2a of a printed board 2 from its front side 2b, a pushing means 6 is moved to push the parts 1 to the board 2 enough to pass the leads 1a through upper and lower holes 4a and 5a to protrude from the back side 2c of the board 2. A lair cutting plate 5 is slid to cut the protruded leads 1a to a length equal to the thickness of this plate. An upper cutting plate 4 is slid to bend the cut leads 1a at their roots. Thus, solder is neither wasted nor thrown away, but the process can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in the technical field of mounting electronic parts on a printed circuit board, and more particularly to an improvement aimed at simplifying the process and saving resources.

[0002]

2. Description of the Related Art As is well known, printed circuit boards have resistors,
Insertion holes are opened in accordance with the lead wires of capacitors, ICs, and other electronic components, the lead wires of electronic components are inserted into these insertion holes, and the wiring patterns of the lead wires and the back surface of the printed board It is designed to be soldered together.

[0003]

However, conventionally, the lead wire protruding on the back side of the printed circuit board is formed into a solder bath filled with molten solder so that the lead wire does not come out for a long time.
At this time, a large amount of solder adheres to this lead wire, but most of it is cut and discarded, so a large amount of waste is generated and post-processing becomes difficult. Furthermore, after that, a process of soldering the lead wire and the printed circuit board is required, which results in a large waste of resources and time. The present invention seeks to provide a method and apparatus that eliminates these drawbacks.

[0004]

A method of mounting an electronic component on a printed circuit board according to the present invention (hereinafter, mounting method)
Regarding the device and the device (hereinafter referred to as mounting device), referring to the drawings,
explain. This mounting method is used for the lead wire 1a of the electronic component 1.
Is inserted into the insertion hole 2a of the printed circuit board 2 from the front side 2b, the first step of pressing the electronic component 1 onto the printed circuit board 2, the protruding dimension of the lead wire 1a protruding on the back side 2c of the printed circuit board 2 is determined. The second step is to shorten and trim the lead wire 1a, and the third stroke is to bend the protruding and trimmed lead wire 1a at the root of the protrusion.

Next, the mounting device is provided with a processing means 3. The processing means 3 mainly includes an upper blade plate 4 and a lower blade plate 5. Both the upper blade plate 4 and the lower blade plate 5 can slide in parallel to the surface. The upper blade plate 4 is provided with an upper hole 4a for passing the lead wire 1a of the electronic component 1, and the lower blade plate 5 is similarly provided with a lower hole 5a. The side 4 of the upper hole 4a that contacts the printed circuit board 2
A groove 4b and a chamfer 4e are formed in c in the sliding direction.

[0006]

The lead board 1a of each electronic component 1 is inserted into the insertion hole 2a of the printed board 2 from the front side 2b in advance, and the back side 2c is brought into contact with the side 4c.
Through the upper hole 4a and the lower hole 5a. Next, when the lower blade plate 5 is slid, the lead wires 1a are cut and aligned to the length of the thickness of the upper blade plate 4. When the upper blade plate 4 is slid further, the lead wire 1a is bent at a right angle to the sliding direction.

[0007]

[Embodiment] Both the upper blade plate 4 and the lower blade plate 5 are fitted in the frame 3a and slidable in the left-right direction (left-right direction in FIG. 1). The sliding position of the upper blade plate 4 is controlled by the fluid pressure cylinder 4d, and the lower blade plate 5 is controlled by the fluid pressure cylinder 5b. The length of the groove 4b in the left-right direction is determined corresponding to the length of the cut lead wire 1a. In addition, in the embodiment shown in FIG. 1, it should be understood that the lead wire 1a is bent by the leftward movement of the upper blade plate 4 (see FIGS. 2 and 3 above). The fluid pressure cylinders 4d and 5b can be replaced by other linear actuators, cranks, cams, or the like. Although only one electronic component 1 is shown in FIG. 1, a large number of electronic components 1 are usually mounted on the printed circuit board 2 as is well known. Chamfer 4e
Is for easy insertion of the lead wire 1a and for preventing the wire from being damaged when bent.

Reference numeral 6 is a pressing means, which is rotated by a hinge 6a to sponge the electronic component 1 on the printed circuit board 2 into a sponge 6c.
It is configured to be pressed by.

[0009]

【The invention's effect】

(1) Since the lead wires are first cut and aligned to the required short dimension, the solder is wasted as before,
Never throw it away. (2) The soldering process is not required twice as in the past, but only once, and the process can be shortened.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of an embodiment of the present invention.

2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is a sectional view taken along the line III-III of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Lead wire 2 Printed circuit board 2a Insertion hole 2b Front side 2c Back side 3 Processing means 4 Upper blade plate 4a Upper hole 4b Groove 4c Side contacting printed circuit board 5 Lower blade plate 5a Lower hole 6 Holding means

Claims (2)

[Claims] 1. A method of mounting an electronic component on a printed circuit board, the process comprising: pressing a lead wire of the electronic component into an insertion hole of the printed circuit board from the front side.
At this time, a method of mounting an electronic component on the printed circuit board, comprising: a step of cutting the lead wire protruding to the back side of the printed circuit board so that its protruding dimension is short, and a step of bending the protruding lead wire at the root of the projection. 2. An apparatus for mounting an electronic component on a printed circuit board, wherein a lead board of the electronic component is previously inserted into an insertion hole of the printed circuit board from the front side,
A processing means for contacting the back side and processing the lead wire protruding to the back side is provided, and this processing means includes an upper blade plate having an upper hole through which the protruding lead wire passes and a lower hole similarly. A perforated lower blade plate is provided, the lower blade plate is configured to be slidable with respect to the upper blade plate, and the lead wire can be cut by the both blades. A groove and a chamfer are formed in the upper board side of the upper hole in the sliding direction of the upper blade plate so that the lead wire can be bent by this sliding. A device for mounting electronic components on a printed circuit board.