JP3086464U - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a solder from rising from a hole provided in a substrate main body to a component surface of the substrate main body at the time of dipping, and to prevent a defect due to the dip from occurring. Provided is a printed circuit board that can be reduced. SOLUTION: A small hole 9 for inserting both ends of a jumper wire 8 in a printed circuit board in which solder does not come up at the time of dipping of the circuit board body 1 from holes 6 and 7 formed in the circuit board body 1, An appropriate number of jumper wires 8 which are inserted into the small holes 9 by a self-inserting machine so as to bridge over the upper portions of the portions 6 and 7. , 7 from the upper side toward the component mounting surface 1a of the substrate body 1, and furthermore, there is no land for soldering around the small hole 9, so that the number of The jumper wires 8 are all pulled out and removed.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a printed circuit board in which solder does not rise from a hole formed in the board body when the board body is dipped.

[0002]

[Prior art]

 Conventionally, when a hole is formed in a printed circuit board, there has been a problem that solder enters into the component mounting surface side of the substrate body from the hole during dipping, resulting in an inconvenient state. For this purpose, in the past, for example, a perforation was formed in a portion of the substrate body where a hole was to be formed, and after dipping, an unnecessary portion was removed from the perforation to form a hole. There was a problem that was troublesome.

Further, Japanese Patent Application Laid-Open No. 57-190398 describes a method of processing a printed circuit board. As shown in FIG. 6, FIG. 6 and the like, a lid provided with a handle of the same size and size as the holes 116, 117, 118 is formed in the holes 116, 117, 118 projecting from the printed circuit board 111 constituting the electric circuit. A first step of fitting the substrates 119, 120, and 122, and a dip soldering to the printed board 111 in which the lid substrates 119, 120, and 122 are fitted in the holes 116, 117, and 118 in the first step. It comprises two steps and a third step of removing the lid substrates 119, 120, 122 by holding the handles from the holes 116, 117, 118 of the printed circuit board 111 after the dip soldering. However, in this case, since the lid substrates 119, 120, and 122 must be formed in conformity with the shapes of the holes 116, 117, and 118, the number of components increases accordingly, and the holes 116, 117, and 118 also increase. However, there is a problem that it takes time and effort to mount the lid substrates 119, 120 and 122 on the cover.

Further, a printed circuit board 201 is described in Japanese Patent Application Laid-Open No. 57-56986. As shown in FIGS. 8 (a), (b), (c), and (d), a conductive circuit pattern is formed on at least one surface, and a through hole 202 for inserting a lead wire of an electronic component is provided. In this case, the solder-dipless hole 207 in the through hole 202 is formed in a semi-drilled hole state so that the punched portion 208 can be easily separated by pressing. However, in this case, it is difficult to make the punched portion 208 into a half-hole state, and there is a problem that the punched portion 208 is easy to be removed at the time of dipping. There was a problem that it was not possible to keep the same.

[0005]

[Problems to be solved by the invention]

 The present invention solves the conventional problem described above, and by using a simple structure, it is possible to prevent solder from rising from the holes provided in the board body to the component surface of the board body at the time of dipping, thereby making it possible to achieve a defect due to the dip. It is an object of the present invention to provide a printed circuit board that can reduce the occurrence of the problem.

[0006]

[Means for Solving the Problems]

 The present invention has been proposed to solve the above problems, and the invention described in claim 1 is based on the fact that the solder rises from a hole formed in the substrate body when the substrate body is dipped. In the printed circuit board which does not come into contact, a small hole for inserting both ends of the jumper wire, and an appropriate number of the jumper wires which are self-inserted into the small hole by a self-inserting machine so as to bridge over the upper side of the hole portion, The jumper wire is used to prevent the solder from rising upward from the hole toward the component mounting surface of the board body when the board body is dipped, and to have a land around the small hole for soldering. The arrangement is characterized in that the jumper wires of the appropriate number are all pulled out and removed after the dip by not providing the same.

According to a second aspect of the present invention, in a printed circuit board in which solder does not come up during the dipping of the board main body from the hole formed in the board main body, the hole is closed above the hole. In this way, a suitable number of jumper wires are wrapped around and both ends of the jumper wires are attached to the board body. With this jumper wire, when the board body is dipped, the solder rises upward from the hole toward the component mounting surface of the board body. It is characterized in that the jumper wires are appropriately pulled out and removed after the dip. The invention according to claim 3 is characterized in that the hole is provided in the substrate main body and provided for fixing the substrate main body, a mechanism, or the like to a housing or the like. The invention as set forth in claim 4 is characterized in that lands are not provided at locations at both ends of the jumper wire that come out on the back side of the substrate body. The invention according to claim 5 is characterized in that the jumper wire is obtained by cutting off unnecessary portions of the linear leg portions on both sides of the electric component.

[0008]

[Embodiment of the invention]

 Hereinafter, embodiments of the printed circuit board according to the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view of a component mounting surface of a printed circuit board according to an embodiment of the present invention, FIG. 2 is an enlarged plan view of a main part thereof, FIG. 3 is a back view showing a dip surface of the printed circuit board shown in FIG. FIG. 4 is an enlarged back view of the main part.

As shown in FIG. 1, the printed board according to the present embodiment has a plurality of electrical components 2, 3, 4, and 5 mounted on a component mounting surface 1a of a board body 1 and a housing or the like. A plurality of holes 6, 6, 6, 7, 7 are provided for attachment to the vehicle. As shown in FIGS. 2, 3, and 4, a plurality of jumper wires 8 having both ends inserted in the vicinity of the hole edges of these holes 6, 6, 6, 7, 7 respectively. Small holes 9 are formed, and two jumper wires 8 are self-inserted into these small holes 9 by a self-inserting machine so as to bridge over the upper portions of the holes 6, 6, 6, 7, 7. . Further, as shown in FIGS. 3 and 4, no lands for soldering are provided in the small holes 9 at the peripheral portions of both ends of the jumper wire 8 protruding to the back surface 1b side of the substrate main body 1.

By doing so, the solder that is going to rise from the holes 6, 6, 6, 7, 7 to the component mounting surface 1 a at the time of dipping of the board main body 1 is removed from these holes 6, 6, 6, 6. Each of the two jumper wires 8 bridged around 7, 7 prevents the ascending to the component mounting surface 1a. Therefore, it has a simple structure in which the jumper wire 8 is simply laid over the holes 6, 6, 6, 7, and 7, and when the substrate is dipped from the holes 6, 6, 6, 7, 7 provided in the substrate body 1, It is possible to prevent solder from rising on the component mounting surface 1a of the substrate body 1 and to reduce occurrence of defects due to dip. Moreover, since these jumper wires 8 are not soldered, they can be easily pulled out and removed after dipping. In the above-described embodiment, two jumper wires 8 are wrapped around the holes 6, 6, 6, 7, and 7. However, one jumper may be used depending on the size and shape of the hole. It goes without saying that a wire 8 or three or more jumper wires 8 may be crossed.

FIG. 5 is an explanatory diagram showing a state in which a linear leg of an electric component made of a resistor is cut and used as a jumper wire. As shown in FIG. 5, by cutting unnecessary portions of the linear legs 10a and 10a of the electric component 10 made of a resistor and using the cut portions as the jumper wires 8, it is not necessary to separately prepare the jumper wires 8. Therefore, it is not necessary to purchase the jumper wire 8 and the cost can be reduced.

[0012]

[Effect of the invention]

 As described above, the invention according to claim 1 is directed to a printed circuit board in which solder does not come up when a board is dipped from a hole formed in the board body. It has a small hole to be inserted, and an appropriate number of jumper wires that are inserted into the small hole by the self-inserting machine so as to bridge the upper side of the hole, and this jumper wire allows the solder to pass through this hole when the board body is dipped. Make sure that it does not rise upward toward the component mounting surface of the board body.Moreover, there is no land for soldering around the small holes, and after dip, all the appropriate number of jumper wires are pulled out. As described above, the following effects can be obtained.

[0013] That is, the structure is simple, in which a jumper wire is passed over a hole provided in the substrate main body. When the substrate is dipped from the hole provided in the substrate main body by the jumper wire passed over the hole. It is possible to prevent solder from rising on the component surface of the main body, thereby reducing the occurrence of defects due to dip. Moreover, since the jumper wire can be attached to the board body simply by inserting the jumper wire into the small hole provided in the board body by a self-inserting machine, the jumper wire can be easily attached without trouble. Furthermore, since there are no lands around the small holes for soldering, the parts inserted into the small holes at both ends of this jumper wire are not soldered at the time of dipping, and The wire can be easily pulled out and removed.

According to a second aspect of the present invention, there is provided a printed circuit board in which solder does not come up during the dipping of the board main body from the hole formed in the board main body. Attach the appropriate number of jumper wires to the board body and attach both ends to the board body.This jumper wire prevents the solder from rising upward from this hole toward the component mounting surface of the board body when the board body is dipped. After dip, all the jumper wires are pulled out and removed as appropriate, so that the following effects are obtained. In other words, it has a simple structure in which a jumper wire is simply passed over the hole provided in the board main body. It is possible to prevent the solder from rising and to reduce the occurrence of defects due to dip.

According to a third aspect of the present invention, since the hole is provided in the substrate main body and provided for fixing the substrate main body, the mechanism, and the like to the housing or the like, the jumper wire is inserted after the dip. After removal, the board body, mechanism, etc. can be easily attached and fixed to the housing or the like in this hole. In the invention according to claim 4, no land is provided at a position on both sides of the jumper wire protruding from the back surface side of the board body, so that the portions inserted into the small holes at both ends of the jumper wire at the time of dipping are used. This jumper wire can be easily pulled out and removed after the board body is dipped without soldering. In the invention according to claim 5, since the jumper wire is obtained by cutting out unnecessary portions of the linear leg portions on both sides of the electric component, it is not necessary to separately prepare a jumper wire. There is no need to purchase, and costs can be reduced.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a component mounting surface of a printed circuit board according to an embodiment.

FIG. 2 is an enlarged plan view of a main part thereof.

FIG. 3 is a rear view showing a dip surface of the printed circuit board shown in FIG. 1;

FIG. 4 is an enlarged back view of the main part.

FIG. 5 is an explanatory diagram showing a state in which a linear leg of an electric component made of a resistor is cut and used as a jumper wire.

FIG. 6 is a perspective view of a printed board and a lid board on which a conventional printed board processing method is performed.

FIG. 7 is a perspective view of a state in which a cover substrate is fitted in a hole of the printed circuit board shown in FIG. 6;

FIGS. 8A and 8B are plan views showing a printed circuit board used for describing a conventional printed circuit board.
(C) is a cross-sectional view of the main part in the half-empty state, and (d) is a cross-sectional view of the main part showing the half-hollow state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board main body 1a Component mounting surface 1b Back surface Plurality of electric components Plural holes Jumper wire Small holes Electric components 10a Linear legs

Claims (5)

[Utility model registration claims] 1. A printed circuit board in which solder does not come up during dipping of a board body from a hole formed in the board body, and a small hole for inserting both ends of a jumper wire and an upper side of the hole. An appropriate number of the jumper wires are inserted into the small holes by a self-inserting machine so that the solder passes through the holes from the holes toward the component mounting surface of the board body when the board body is dipped. In addition, it is characterized in that the appropriate number of jumper wires are pulled out and removed after dipping by not providing a land for soldering around the small hole. Printed circuit board. 2. A printed circuit board in which solder does not come out of a hole formed in a substrate main body during dipping of the substrate main body, an appropriate number of jumper wires are formed above the hole so as to cover the hole. It is configured such that the solder does not come up from the hole toward the component mounting surface of the board body when the board body is dipped by the jumper wire, and the both ends are attached to the board body. A printed circuit board, wherein all of the appropriate number of jumper wires are pulled out and removed. 3. The print according to claim 2, wherein the hole is provided in the substrate main body and provided for fixing the substrate main body, a mechanism, and the like to a housing or the like. substrate. 4. The printed circuit board according to claim 2, wherein lands are not provided at positions at both ends of the jumper wire that come out on the back surface side of the board main body. 5. The printed circuit board according to claim 2, wherein said jumper wire is obtained by cutting off unnecessary portions of linear legs on both sides of an electric component.