JP2001332849A - Mounting method of surface mounting part in electronic apparatus - Google Patents
Mounting method of surface mounting part in electronic apparatusInfo
- Publication number
- JP2001332849A JP2001332849A JP2000147594A JP2000147594A JP2001332849A JP 2001332849 A JP2001332849 A JP 2001332849A JP 2000147594 A JP2000147594 A JP 2000147594A JP 2000147594 A JP2000147594 A JP 2000147594A JP 2001332849 A JP2001332849 A JP 2001332849A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- copper foil
- lead
- component
- electronic apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器におい
て、電子部品等の表面実装部品をプリント基板の表面に
実装する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a surface mount component such as an electronic component on a surface of a printed circuit board in an electronic device.
【０００２】[0002]
【従来の技術】電子部品等の表面実装部品をプリント基
板の表面に実装するにあたっては、プリント基板に設け
られた平坦な実装用ランドに部品を位置決めし、半田付
けする方法が一般的である。2. Description of the Related Art In mounting surface-mounted components such as electronic components on the surface of a printed circuit board, it is common to position the components on flat mounting lands provided on the printed circuit board and solder them.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
技術においては、表面実装部品を実装する際、実装用ラ
ンドが平坦なため表面実装部品の位置決めが困難であ
り、時間をかけて位置決めしても実装工程で実装部品が
位置ずれを起こすおそれがあった。本発明は、このよう
な問題を解消するためになされたもので、表面実装部品
を実装する際、表面実装部品が位置ずれを起こすことな
く、容易に実装することができる電子機器における表面
実装部品の実装方法を提供することを目的とするもので
ある。However, in the prior art, when mounting a surface mount component, it is difficult to position the surface mount component because the mounting land is flat. In the mounting process, there is a possibility that the mounted components may be displaced. The present invention has been made to solve such a problem, and when mounting a surface-mounted component, the surface-mounted component can be easily mounted without causing a positional shift of the surface-mounted component. It is intended to provide an implementation method of.
【０００４】[0004]
【課題を解決するための手段】上記問題を解決するため
に、本発明は、電子機器における表面実装部品の実装方
法において、プリント基板と、前記プリント基板の表面
に設けた部品実装用ランドとを有するとともに、前記部
品実装用ランドに、表面実装部品のリードの平面方向へ
の移動を抑制すべくリードが接触する部分の銅箔を排除
した銅箔除去部を設け、前記表面実装部品を実装する際
に、前記リードを前記銅箔除去部内に配置するようにし
たものである。In order to solve the above-mentioned problems, the present invention relates to a method for mounting a surface mount component in an electronic device, comprising: a printed board; and a component mounting land provided on the surface of the printed board. In addition, the component mounting land is provided with a copper-foil removing portion that eliminates a copper foil at a portion where the lead comes into contact in order to suppress the movement of the lead of the surface-mounted component in the planar direction, and mounts the surface-mounted component. At this time, the leads are arranged in the copper foil removing portion.
【０００５】[0005]
【発明の実施の形態】以下、本発明の実施例を図に基づ
いて説明する。図１は、本発明の実施例を示す正断面
図、図２は図１を側面から見た側断面図、図３は本発明
の実施例におけるランド形状を示す平面図、図４は半田
付けをした後の状態を示す正断面図である。図におい
て、１はプリント基板、２は前記プリント基板１の表面
に設けられた部品実装用ランド、３は前記ランド２に設
けられた銅箔除去部、４は表面実装部品、４ａは表面実
装部品のリード、５は半田である。前記プリント基板１
に設けられた部品実装用ランド２に、表面実装部品４の
リード４ａよりも若干大きめの銅箔除去部３を設ける。
このようにすることにより、実装用ランド２の銅箔除去
部３には凹凸ができる。この状態で、表面実装部品４の
リード４ａを、前記銅箔除去部３内に配置することによ
り、リード４ａと銅箔除去部３との摩擦係数が高くな
り、表面実装部品４のリード４ａの位置ずれが防止され
る。また、リード４ａに半田付けする際も、図４に示す
ように、前記銅箔除去部３に半田を入れ込むようにすれ
ば半田が逃げることもなく、半田付け作業をきわめて効
率よく行うことができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front sectional view showing an embodiment of the present invention, FIG. 2 is a side sectional view of FIG. 1 viewed from the side, FIG. 3 is a plan view showing a land shape in the embodiment of the present invention, and FIG. It is a front sectional view showing the state after performing. In the figure, 1 is a printed board, 2 is a component mounting land provided on the surface of the printed board 1, 3 is a copper foil removing portion provided on the land 2, 4 is a surface mounted component, and 4a is a surface mounted component. 5 and 5 are solders. The printed circuit board 1
Is provided with a copper foil removing portion 3 which is slightly larger than the lead 4a of the surface mount component 4 on the component mounting land 2 provided.
By doing so, the copper foil removing portion 3 of the mounting land 2 has irregularities. In this state, by arranging the lead 4a of the surface mount component 4 in the copper foil removing section 3, the coefficient of friction between the lead 4a and the copper foil removing section 3 increases, and the lead 4a of the surface mount component 4 Position shift is prevented. Also, when soldering to the lead 4a, as shown in FIG. 4, if the solder is inserted into the copper foil removing portion 3, the solder does not escape and the soldering operation can be performed extremely efficiently. it can.
【０００６】[0006]
【発明の効果】以上述べたように、本発明によれば、次
のような効果がある。 (1) 表面実装部品を実装する際、表面実装部品が位置ず
れを起こすことがないので、表面実装部品の実装を容易
に行うことができ、作業効率を大きく向上させることが
できる。 (2) 表面実装部品のリードに半田付けするにあたって
は、銅箔除去部３に半田を入れ込むようにすれば半田が
逃げるのを防ぐことができ、半田付け作業をきわめて効
率よく行うことができる。As described above, according to the present invention, the following effects can be obtained. (1) When mounting the surface-mounted components, the surface-mounted components do not shift, so that the mounting of the surface-mounted components can be easily performed, and the working efficiency can be greatly improved. (2) When soldering to the lead of the surface mount component, if the solder is inserted into the copper foil removing section 3, the solder can be prevented from escaping, and the soldering operation can be performed extremely efficiently. .
【図１】本発明の実施例を示す正断面図である。FIG. 1 is a front sectional view showing an embodiment of the present invention.
【図２】図１を側面から見た側断面図である。FIG. 2 is a side sectional view of FIG. 1 as viewed from the side.
【図３】本発明の実施例におけるランド形状を示す平面
図である。FIG. 3 is a plan view showing a land shape according to the embodiment of the present invention.
【図４】半田付けをした後の状態を示す正断面図であ
る。FIG. 4 is a front sectional view showing a state after soldering.
１ プリント基板、 ２ 部品実装用ランド、 ３ 銅箔除去部、 ４ 表面実装部品、 ４ａ リード、 ５ 半田 1 printed circuit board, 2 component mounting land, 3 copper foil removal section, 4 surface mount component, 4a lead, 5 solder
Claims (1)
法において、 プリント基板と、前記プリント基板の表面に設けた部品
実装用ランドとを有するとともに、前記部品実装用ラン
ドに、表面実装部品のリードの平面方向への移動を抑制
すべくリードが接触する部分の銅箔を排除した銅箔除去
部を設け、前記表面実装部品を実装する際に、前記リー
ドを前記銅箔除去部内に配置することを特徴とする電子
機器における表面実装部品の実装方法。1. A method for mounting a surface-mounted component in an electronic device, comprising: a printed circuit board; and a component mounting land provided on a surface of the printed circuit board. Providing a copper foil removing portion that eliminates a copper foil in a portion contacted by a lead in order to suppress movement in a planar direction, and disposing the lead in the copper foil removing portion when mounting the surface mount component. A method for mounting surface mount components in electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000147594A JP2001332849A (en) | 2000-05-19 | 2000-05-19 | Mounting method of surface mounting part in electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000147594A JP2001332849A (en) | 2000-05-19 | 2000-05-19 | Mounting method of surface mounting part in electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001332849A true JP2001332849A (en) | 2001-11-30 |
Family
ID=18653757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000147594A Pending JP2001332849A (en) | 2000-05-19 | 2000-05-19 | Mounting method of surface mounting part in electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001332849A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013197565A (en) * | 2012-03-23 | 2013-09-30 | Murata Mfg Co Ltd | Composite module and method of manufacturing the same |
-
2000
- 2000-05-19 JP JP2000147594A patent/JP2001332849A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013197565A (en) * | 2012-03-23 | 2013-09-30 | Murata Mfg Co Ltd | Composite module and method of manufacturing the same |
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