JP3884673B2 - Electronic component soldering method and solder coating apparatus - Google Patents

Electronic component soldering method and solder coating apparatus Download PDF

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Publication number
JP3884673B2
JP3884673B2 JP2002137126A JP2002137126A JP3884673B2 JP 3884673 B2 JP3884673 B2 JP 3884673B2 JP 2002137126 A JP2002137126 A JP 2002137126A JP 2002137126 A JP2002137126 A JP 2002137126A JP 3884673 B2 JP3884673 B2 JP 3884673B2
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Japan
Prior art keywords
electronic component
solder
soldering
printing mask
cream
Prior art date
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JP2002137126A
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JP2003332722A (en
Inventor
克巳 水井
義文 窪池
信行 白石
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Cosel Co Ltd
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Cosel Co Ltd
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Description

【０００１】
【発明の属する技術分野】
この発明は、端子を有した電子部品を基板上にハンダ付けするための電子部品のハンダ付け方法とハンダ塗布装置に関する。
【０００２】
【従来の技術】
従来、リフローハンダ付けにおいては、予めクリームハンダを電子部品や回路基板に塗布しておく。その場合のハンダ塗布は、図５に示すように、電子部品を実装する回路基板２のハンダ付け用の電極位置に、透孔３が形成されたハンダ印刷マスク４を回路基板２に重ね、ハンダクリーム５をハンダ印刷マスク４に置いてスキージ６で掻きながら透孔３内にハンダクリーム５を塗布する。これにより回路基板２の透孔３に対応した位置にハンダクリーム５が塗布される。この後、回路基板２からハンダ印刷マスク4を剥がすことにより、回路基板２にハンダクリーム５が残る。
【０００３】
また、回路基板２に実装する電子部品１が、図３（b）に示すように、電子部品1のハンダ付け部９の表面よりも突出した位置に端子８が延びている場合がある。これは、例えば他の電子部品７やその他の基板や金属板に電子部品1のハンダ付け部９をハンダ付けするとともに、電子部品１の端子８を回路基板２の他の電極１２にハンダ付けする場合である。このような電子部品１の電極９にハンダ付け用のハンダクリーム５を塗布するには、端子８を逃がす逃げ凹部１０を有した厚みのあるハンダ印刷マスク１１を用いる。このハンダ印刷マスク１１も印刷用の透孔１３を有する。
【０００４】
まず、図示しない治具に設けた電子部品１をハンダ印刷マスク１１で覆い、電子部品1のハンダ付け部９が露出するように位置させる。この後、ハンダ印刷マスク１１にハンダクリーム５を載せ、スキージ６によりハンダクリーム５を掻き取りながら、ハンダ印刷マスク１１の透孔１３を介して電子部品１の電極９にハンダクリーム５を塗布するものである。
【０００５】
その他、図７に示すように、電子部品１の電極９にハンダクリーム５を直接塗布する特殊なハンダ吹出治具１４を用い、電子部品１の電極９にハンダクリーム５を載せる方法もあった。このハンダ吹出治具１４は、筒内のハンダクリーム５をピストンで押し出すものである。
【０００６】
【発明が解決しようとする課題】
上記従来の技術の前者の場合、厚みのあるハンダ印刷マスク１１の透孔１３にハンダクリーム５が充填されるので、ハンダ印刷マスク１１から電子部品１を取り外すと、厚みのある透孔１３からハンダクリーム５が抜けにくく、電子部品１の電極９にハンダクリーム５が十分に付着しない場合がある。
【０００７】
また上記従来の技術のハンダ吹出具１４を用いる場合、個々の小さな電子部品１個１個にハンダクリーム１８を載せる必要があり、作業の工数がかかり、自動化が難しく量産される電子部品の実装には利用できないものであった。
【０００８】
この発明は上記従来の問題点に鑑みてなされたものであり、簡単な構成で効率良く正確にハンダ付け用のハンダ塗布が可能な電子部品のハンダ付け方法とハンダ塗布装置を提供することを目的とする。
【０００９】
【課題を解決するための手段】
この発明は、電子部品のハンダ付け部よりも突出した突出部を有する電子部品を、他の電子部品や基板その他電極等により回路基板表面から突出した位置にハンダ付けする電子部品のハンダ付け方法であって、上記電子部品の突出部の先端が位置する逃げ凹部と、この逃げ凹部の近傍で所定方向に延びた凹溝と、この凹溝底部に沿って形成され上記電子部品のハンダ付け部が露出可能な複数の透孔とを備えたハンダ印刷マスクを用いる電子部品のハンダ付け方法である。まず、このハンダ印刷マスクの透孔から複数の電子部品のハンダ付け部が露出するように各電子部品を上記ハンダ印刷マスクで覆い、上記凹溝内にハンダクリームを載せ、上記凹溝の幅内に嵌合する掻き取り部を有したスキージを上記凹溝の長手方向に移動させて、上記電子部品のハンダ付け部にハンダクリームを塗布するものである。
【００１０】
またこの発明は、電子部品のハンダ付け部よりも突出した突出部を有する電子部品を、他の電子部品や基板その他電極等により回路基板表面から突出した位置にハンダ付けするために、上記電子部品のハンダ付け部にハンダクリームを塗布するハンダ塗布装置であって、上記電子部品の突出部の先端が位置する逃げ凹部と、この逃げ凹部の近傍で所定方向に延びた凹溝と、この凹溝底部に沿って形成され上記電子部品のハンダ付け部が露出可能な複数の透孔とを備えたハンダ印刷マスクを備え、上記凹溝の幅内に嵌合し移動可能な掻き取り部を有したスキージから成るハンダ塗布装置である。
【００１１】
上記ハンダ印刷マスクの透孔は、ハンダクリームが通過可能なメッシュパターンから成る。上記スキージは、上記ハンダ印刷マスクの凹溝の幅とほぼ等しい幅に形成され、先端部から突出した掻き取り部を備える。
【００１２】
【発明の実施の形態】
以下、この発明の実施形態について図面に基づいて説明する。図１、図２はこの発明の一実施形態を示すもので、この実施形態のハンダ塗布装置は、電子部品１を図示しない治具に並べ、電子部品１のハンダ付け部９が露出する透孔２０と、電子部品１の突出部である端子８の先端が位置する逃げ凹部２２と、この逃げ凹部２２の近傍で所定方向に延びた凹溝２４とを備えたハンダ印刷マスク２６を備える。この透孔２０は複数並んで設けられ、この並設方向は逃げ凹部２２と干渉しない方向であり、複数の逃げ凹部２２と凹溝２４は平行に位置している。ハンダ印刷マスク２６の透孔２０には、ハンダクリーム５が通過可能な図示しないメッシュパターンが設けられている。さらに、凹溝２４の幅内に嵌合し移動可能な掻き取り部３２を有した、略凸字状のスキージ３０を有している。
【００１３】
この実施形態のハンダ付け方法は、図１に示すように、電子部品１をハンダ付け部９を上にして所定の図示しない治具に並べ、電子部品１のハンダ付け部９が透孔２０から露出するようにハンダ印刷マスク２６を電子部品１の上に被せる。このとき、電子部品１の端子８の先端部は、ハンダ印刷マスク２６の逃げ凹部２２内に位置する。
【００１４】
この状態で、図２に示すように、ハンダ印刷マスク２６の凹溝２４内にハンダクリーム５を盛り、スキージ３０の掻き取り部３２をハンダ印刷マスク２６の凹溝２４に嵌合し、凹溝２４に沿ってスキージ３０を移動させる。
【００１５】
これにより、ハンダクリーム５は、凹溝２４の透孔２０内に充填され、電子部品１のハンダ付け部９に塗布される。この後、ハンダ印刷用マスク２６を電子部品１から離す。このとき、ハンダ印刷マスク２６の透孔２０は浅いので、電子部品１のハンダ付け部９の付着力の方が強く透孔２０にハンダクリーム５が残ることがない。
【００１６】
また、この電子部品１をハンダ付けする回路基板２の所定の電極２８には、上述の図５に示すような方法でハンダクリーム５を塗布する。そして、図４に示すように、回路基板２に実装される他の電子部品７の電極２７を所定の電極２８上のハンダクリーム５に重ねるように載せる。さらに、電子部品７の所定の電極２９上に電子部品１のハンダ付け部９のクリームハンダ５を対面させ、重ねる。この状態で、電子部品１の端子８は回路基板２の所定位置の電極１２上のクリームハンダ５に当接する。そして、リフロー炉を通過させてハンダクリーム５を溶融し、冷却し固めてハンダ付けが完了する。
【００１７】
この実施形態のハンダ付け方法とハンダ塗布装置によれば、電子部品１のハンダ付け部９よりも突出した端子８があっても、ハンダ印刷用マスク２８は、端子８の逃げ凹部２２により端子８が邪魔にならず、凹溝２４により透孔２０の深さが浅く形成され、ハンダクリーム５が必要以上に厚く電子部品１のハンダ付け部９に塗布されることがない。従って、電子部品１とハンダ印刷マスク２６を容易に分離することができ、ハンダクリーム５の塗布量を均一化し、ハンダ付け品質を向上させることができる。また、クリームハンダ５の塗布工程を容易に自動化することができ、作業効率を大幅に向上させることができる。
【００１８】
なお、この発明の電子部品のハンダ付け方法は、上記実施形態に限定されるものではなく、凹溝２４の幅や深さ、透孔２０の大きさや深さは適宜設定されるものである。回路基板上の凸状部は、他の電子部品７以外に他の基板や金属、その他の電極でも良い。
【００１９】
【発明の効果】
この発明の電子部品のハンダ付け方法とハンダ塗布装置によれば、ハンダ付け作業を容易に効率よく行うことができる。特にハンダ印刷マスクにハンダクリームが付着しにくく、ハンダ量を均一にすることができ、ハンダ付け品質も大きく向上させることができる。また、自動化も容易であり、大量のハンダ塗布作業を効率良く行うことができる。
【図面の簡単な説明】
【図１】この発明の一実施形態の電子部品のハンダ付け方法を示す縦断面図である。
【図２】この発明の一実施形態の電子部品のハンダ付け方法を示す平面（ａ）と側面図（ｂ）である。
【図３】この発明に関する電子部品をハンダ付けした状態を示す平面（ａ）と側面図（ｂ）である。
【図４】この発明に関する電子部品をハンダ付けする状態を示す側面図である。
【図５】従来の電子部品のハンダ付け方法の工程を示す断面図である。
【図６】従来の電子部品の他のハンダ付け方法のハンダ塗布装置を示す断面図である。
【図７】従来の電子部品のさらに他のハンダ付け方法のハンダ塗布装置を示す側面図である。
【符号の説明】
１ 電子部品
２ 回路基板
５ ハンダクリーム
２０ 透孔
２２ 逃げ凹部
２４ 凹溝
２６ ハンダ印刷マスク
３０ スキージ
３２ 掻き取り部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component soldering method and a solder coating apparatus for soldering an electronic component having a terminal onto a substrate.
[0002]
[Prior art]
Conventionally, in reflow soldering, cream solder is applied in advance to an electronic component or a circuit board. In this case, as shown in FIG. 5, the solder printing mask 4 in which the through holes 3 are formed is overlapped on the circuit board 2 at the position of the soldering electrode of the circuit board 2 on which the electronic component is mounted. The cream 5 is placed on the solder printing mask 4 and the solder cream 5 is applied in the through holes 3 while being scratched with the squeegee 6. As a result, the solder cream 5 is applied at a position corresponding to the through hole 3 of the circuit board 2. Thereafter, the solder printing mask 4 is peeled off from the circuit board 2 to leave the solder cream 5 on the circuit board 2.
[0003]
Further, as shown in FIG. 3B, the terminal 8 may extend to a position where the electronic component 1 mounted on the circuit board 2 protrudes from the surface of the soldering portion 9 of the electronic component 1. For example, the soldering portion 9 of the electronic component 1 is soldered to another electronic component 7, another substrate, or a metal plate, and the terminal 8 of the electronic component 1 is soldered to the other electrode 12 of the circuit board 2. Is the case. In order to apply the soldering cream 5 to the electrodes 9 of such an electronic component 1, a thick solder printing mask 11 having a relief recess 10 for allowing the terminals 8 to escape is used. This solder printing mask 11 also has through holes 13 for printing.
[0004]
First, the electronic component 1 provided on a jig (not shown) is covered with the solder printing mask 11 and positioned so that the soldering portion 9 of the electronic component 1 is exposed. Thereafter, the solder cream 5 is placed on the solder printing mask 11, and the solder cream 5 is applied to the electrodes 9 of the electronic component 1 through the through holes 13 of the solder printing mask 11 while scraping the solder cream 5 with the squeegee 6. It is.
[0005]
In addition, as shown in FIG. 7, there is a method of placing the solder cream 5 on the electrode 9 of the electronic component 1 using a special solder blowing jig 14 that directly applies the solder cream 5 to the electrode 9 of the electronic component 1. The solder blowing jig 14 pushes out the solder cream 5 in the cylinder with a piston.
[0006]
[Problems to be solved by the invention]
In the former case of the prior art, the solder cream 5 is filled in the through hole 13 of the thick solder printing mask 11, and therefore, when the electronic component 1 is removed from the solder printing mask 11, the solder from the thick through hole 13 is soldered. The cream 5 is difficult to come off, and the solder cream 5 may not sufficiently adhere to the electrode 9 of the electronic component 1.
[0007]
In addition, when using the solder blow tool 14 of the above-described conventional technology, it is necessary to place the solder cream 18 on each small electronic component one by one, which requires man-hours for work and is difficult to automate for mounting electronic components that are mass-produced. Was not available.
[0008]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and an object thereof is to provide a soldering method and a solder coating apparatus for an electronic component that can perform solder coating for soldering efficiently and accurately with a simple configuration. And
[0009]
[Means for Solving the Problems]
The present invention relates to a soldering method for an electronic component in which an electronic component having a protruding portion protruding from a soldered portion of the electronic component is soldered to a position protruding from the circuit board surface by another electronic component, a substrate, or other electrodes. A relief recess where the tip of the protruding portion of the electronic component is located, a groove extending in a predetermined direction near the relief recess, and a soldering portion of the electronic component formed along the bottom of the recess An electronic component soldering method using a solder printing mask having a plurality of exposed through holes. First, each electronic component is covered with the solder printing mask so that the soldered portions of the plurality of electronic components are exposed from the through holes of the solder printing mask, solder cream is placed in the concave groove, and the width of the concave groove is A squeegee having a scraping part that fits into the groove is moved in the longitudinal direction of the concave groove, and solder cream is applied to the soldering part of the electronic component.
[0010]
The present invention also provides an electronic component having a protruding portion that protrudes from a soldered portion of the electronic component in order to solder the electronic component to a position protruding from the circuit board surface by another electronic component, a substrate, or other electrodes. A solder application device for applying solder cream to a soldering portion of the electronic component, wherein a relief recess where the tip of the protruding portion of the electronic component is located, a recess extending in a predetermined direction near the escape recess, and the recess A solder printing mask provided with a plurality of through holes formed along the bottom and capable of exposing the soldering portion of the electronic component, and having a scraping portion that fits and moves within the width of the groove. This is a solder coating device comprising a squeegee.
[0011]
The through holes of the solder printing mask are made of a mesh pattern through which solder cream can pass. The squeegee is formed to have a width substantially equal to the width of the concave groove of the solder printing mask, and includes a scraping portion protruding from the tip portion.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show an embodiment of the present invention. A solder coating apparatus according to this embodiment arranges electronic components 1 on a jig (not shown) and exposes a soldered portion 9 of the electronic components 1. 20, a solder printing mask 26 having a relief recess 22 where the tip of the terminal 8, which is a protrusion of the electronic component 1, is located, and a recess 24 extending in a predetermined direction near the relief recess 22. A plurality of the through holes 20 are provided side by side, and the parallel arrangement direction is a direction that does not interfere with the escape recess 22, and the plurality of escape recesses 22 and the recesses 24 are positioned in parallel. The through hole 20 of the solder printing mask 26 is provided with a mesh pattern (not shown) through which the solder cream 5 can pass. Furthermore, it has a substantially convex squeegee 30 having a scraping portion 32 that fits and moves within the width of the concave groove 24.
[0013]
In the soldering method of this embodiment, as shown in FIG. 1, the electronic components 1 are arranged in a predetermined jig (not shown) with the soldering portion 9 facing upward, and the soldering portion 9 of the electronic component 1 is opened from the through hole 20. A solder printing mask 26 is placed on the electronic component 1 so as to be exposed. At this time, the tip of the terminal 8 of the electronic component 1 is located in the relief recess 22 of the solder printing mask 26.
[0014]
In this state, as shown in FIG. 2, the solder cream 5 is placed in the concave groove 24 of the solder printing mask 26, and the scraping portion 32 of the squeegee 30 is fitted into the concave groove 24 of the solder printing mask 26. The squeegee 30 is moved along 24.
[0015]
Thereby, the solder cream 5 is filled in the through hole 20 of the concave groove 24 and applied to the soldering portion 9 of the electronic component 1. Thereafter, the solder printing mask 26 is separated from the electronic component 1. At this time, since the through hole 20 of the solder printing mask 26 is shallow, the adhesive force of the soldering portion 9 of the electronic component 1 is stronger, and the solder cream 5 does not remain in the through hole 20.
[0016]
Further, the solder cream 5 is applied to the predetermined electrode 28 of the circuit board 2 to which the electronic component 1 is soldered by the method shown in FIG. Then, as shown in FIG. 4, the electrodes 27 of other electronic components 7 mounted on the circuit board 2 are placed on the solder cream 5 on the predetermined electrodes 28 so as to overlap. Furthermore, the cream solder 5 of the soldering part 9 of the electronic component 1 is made to face and overlap on the predetermined electrode 29 of the electronic component 7. In this state, the terminal 8 of the electronic component 1 comes into contact with the cream solder 5 on the electrode 12 at a predetermined position of the circuit board 2. Then, the solder cream 5 is melted by passing through a reflow furnace, cooled and solidified to complete the soldering.
[0017]
According to the soldering method and the solder coating apparatus of this embodiment, even if the terminal 8 protrudes from the soldering portion 9 of the electronic component 1, the solder printing mask 28 is connected to the terminal 8 by the relief recess 22 of the terminal 8. Is not obstructed, and the depth of the through hole 20 is formed by the concave groove 24 so that the solder cream 5 is thicker than necessary and is not applied to the soldering portion 9 of the electronic component 1. Therefore, the electronic component 1 and the solder printing mask 26 can be easily separated, the application amount of the solder cream 5 can be made uniform, and the soldering quality can be improved. Moreover, the application | coating process of the cream solder 5 can be automated easily, and work efficiency can be improved significantly.
[0018]
In addition, the soldering method of the electronic component of this invention is not limited to the said embodiment, The width | variety and depth of the ditch | groove 24, and the magnitude | size and depth of the through-hole 20 are set suitably. The convex portions on the circuit board may be other boards, metals, or other electrodes besides the other electronic components 7.
[0019]
【The invention's effect】
According to the electronic component soldering method and the solder coating apparatus of the present invention, the soldering operation can be performed easily and efficiently. In particular, the solder cream does not easily adhere to the solder printing mask, the amount of solder can be made uniform, and the soldering quality can be greatly improved. Further, automation is easy, and a large amount of solder application work can be performed efficiently.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a method of soldering an electronic component according to an embodiment of the present invention.
2A and 2B are a plan view and a side view showing a method of soldering an electronic component according to an embodiment of the present invention.
FIGS. 3A and 3B are a plan view (a) and a side view (b) showing a state where the electronic component according to the present invention is soldered.
FIG. 4 is a side view showing a state in which an electronic component according to the present invention is soldered.
FIG. 5 is a cross-sectional view showing steps of a conventional electronic component soldering method.
FIG. 6 is a cross-sectional view showing a solder coating apparatus of another soldering method for a conventional electronic component.
FIG. 7 is a side view showing a solder coating device of still another soldering method for a conventional electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component 2 Circuit board 5 Solder cream 20 Through-hole 22 Escape recessed part 24 Recessed groove 26 Solder printing mask 30 Squeegee 32 Scraping part

Claims (4)

電子部品のハンダ付け部よりも突出した突出部を有する電子部品を、回路基板表面から突出した位置にハンダ付けする電子部品のハンダ付け方法において、上記電子部品の突出部の先端が位置する逃げ凹部と、この逃げ凹部の近傍で所定方向に延びた凹溝と、この凹溝底部に沿って形成され上記電子部品のハンダ付け部が露出可能な複数の透孔とを備えたハンダ印刷マスクを用い、このハンダ印刷マスクの透孔から複数の電子部品のハンダ付け部が露出するように各電子部品を上記ハンダ印刷マスクで覆い、上記凹溝内にハンダクリームを乗せ、上記凹溝の幅内に嵌合する掻き取り部を有したスキージを上記凹溝の長手方向に移動させて、上記電子部品のハンダ付け部にハンダクリームを塗布することを特徴とする電子部品のハンダ付け方法。In the electronic component soldering method for soldering an electronic component having a protruding portion protruding from the soldered portion of the electronic component to a position protruding from the circuit board surface, the relief recess in which the tip of the protruding portion of the electronic component is located And a concave printing groove extending in a predetermined direction in the vicinity of the relief concave portion, and a plurality of through holes formed along the bottom of the concave groove and capable of exposing the soldering portion of the electronic component. Cover each electronic component with the solder printing mask so that the soldered portions of the plurality of electronic components are exposed from the through holes of the solder printing mask, place solder cream in the concave groove, and within the width of the concave groove. A method of soldering an electronic component, wherein a solder cream is applied to a soldering portion of the electronic component by moving a squeegee having a scraping portion to be fitted in a longitudinal direction of the concave groove. 電子部品のハンダ付け部よりも突出した突出部を有する電子部品を、回路基板表面から突出した位置にハンダ付けするために、上記電子部品のハンダ付け部にハンダクリームを塗布するハンダ塗布装置において、上記電子部品の突出部の先端が位置する逃げ凹部と、この逃げ凹部の近傍で所定方向に延びた凹溝と、この凹溝底部に沿って形成され上記電子部品のハンダ付け部が露出可能な複数の透孔とを備えたハンダ印刷マスクを備え、上記凹溝の幅内に嵌合し移動可能な掻き取り部を有したスキージから成ることを特徴とするハンダ塗布装置。In the solder coating apparatus for applying solder cream to the soldered portion of the electronic component in order to solder the electronic component having the protruding portion protruding from the soldered portion of the electronic component to a position protruding from the circuit board surface, An escape recess where the tip of the protrusion of the electronic component is located, a recess extending in a predetermined direction near the escape recess, and a soldered portion of the electronic component formed along the bottom of the recess can be exposed. A solder coating apparatus comprising a solder printing mask having a plurality of through holes, and comprising a squeegee having a scraping portion that fits and moves within the width of the groove. 上記ハンダ印刷マスクの透孔は、ハンダクリームが通過可能なメッシュパターンから成ることを特徴とする請求項２記載のハンダ塗布装置。3. The solder coating apparatus according to claim 2, wherein the through hole of the solder printing mask comprises a mesh pattern through which solder cream can pass. 上記スキージは、上記ハンダ印刷マスクの凹溝の幅とほぼ等しい幅に、先端部から突出した掻き取り部を備えたことを特徴とする請求項２記載のハンダ塗布装置。3. The solder coating apparatus according to claim 2, wherein the squeegee includes a scraping portion that protrudes from the tip portion so as to have a width substantially equal to the width of the concave groove of the solder printing mask.
JP2002137126A 2002-05-13 2002-05-13 Electronic component soldering method and solder coating apparatus Expired - Fee Related JP3884673B2 (en)

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