WO2014091603A1

WO2014091603A1 - Viscous fluid printing device

Info

Publication number: WO2014091603A1
Application number: PCT/JP2012/082372
Authority: WO
Inventors: ▲ミョウ▼ 張; 泰範亀谷; 立雄蛭川; 桂資太田
Original assignee: 富士機械製造株式会社
Priority date: 2012-12-13
Filing date: 2012-12-13
Publication date: 2014-06-19
Also published as: JP6087376B2; JPWO2014091603A1

Abstract

A viscous fluid printing device for printing a viscous fluid on a circuit board using a squeegee and a mask (86) is provided with a mask adjustment mechanism (94) with which the position of the mask can be adjusted. As a result, the relative positions of the squeegee and the mask can be adjusted and positional shifting between the squeegee and the mask can be appropriately resolved. Moreover, when a cavity substrate is the work object of the viscous fluid printing device, a depression (114) is formed in the mask, making it possible to appropriately align said depression with a protrusion formed on the leading edge of the squeegee using the mask adjustment mechanism. It is thereby possible to appropriately print the viscous fluid on the cavity substrate.

Description

Viscous fluid printing device

The present invention relates to a viscous fluid printing apparatus for printing a viscous fluid on a circuit board using a squeegee and a mask.

When a viscous fluid such as cream solder is printed on a circuit board, the viscous fluid is printed by a squeegee and a mask, that is, mask printing is performed. Specifically, a mask is placed on a circuit board, and a viscous fluid is applied to the mask by a squeegee. A pattern hole is formed in the mask in accordance with a pattern such as a pad of the circuit board, and the viscous fluid is printed on the circuit board through the pattern hole.

As described above, when the viscous fluid is printed on the circuit board by the squeegee and the mask, appropriate printing conditions may be different in a plurality of portions of the circuit board. In such a case, as described in the following patent document, a plurality of squeegees having different hardnesses, materials, and the like are attached to the squeegee holder, and the plurality of squeegees collectively apply to a plurality of portions of the circuit board. Printing with different conditions.

JP-A-3-36032

According to the viscous fluid printing apparatus described in the above patent document, it is possible to perform printing under different conditions collectively on a plurality of portions of the circuit board. However, if the positions of the plurality of squeegees and the masks are misaligned, there is a possibility that printing under different conditions cannot be appropriately performed on the plurality of portions of the circuit board. In addition, when mask printing is performed on a cavity substrate, that is, a substrate on which a recess is formed, if the positions of the squeegee and the mask are misaligned, the viscous fluid may not be printed appropriately on the recess of the cavity substrate. There is. Specifically, the mask corresponding to the cavity substrate has a recess having a shape corresponding to the recess of the circuit board. The squeegee corresponding to the mask has a convex portion having a shape corresponding to the concave portion of the mask. Then, by moving the squeegee so that the convex portion of the squeegee enters the concave portion of the mask, the viscous fluid is printed on the top surface other than the concave portion and the concave portion of the cavity substrate. At this time, if the positions of the convex portion of the squeegee and the concave portion of the mask are shifted, there is a possibility that the viscous fluid cannot be properly printed in the concave portion of the cavity substrate. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a viscous fluid printing apparatus capable of appropriately eliminating the positional deviation between the squeegee and the mask.

In order to solve the above problem, a viscous fluid printing apparatus according to claim 1 of the present application is a viscous fluid printing apparatus that prints a viscous fluid on a circuit board by using a squeegee and a mask, and the viscous fluid printing apparatus includes: And an adjustment mechanism for adjusting a relative position between the squeegee and the mask.

Further, in the viscous fluid printing apparatus according to claim 2, in the viscous fluid printing apparatus according to claim 1, the mask has a concave portion, and the squeegee has a convex portion having a shape corresponding to the concave portion. The adjusting mechanism adjusts a relative position between the convex portion of the squeegee and the concave portion of the mask.

In the viscous fluid printing apparatus according to claim 3, in the viscous fluid printing apparatus according to claim 2, the squeegee includes a pair of slits formed so as to extend upward from both side portions of the convex portion. And is formed of a flexible material.

Further, in the viscous fluid printing apparatus according to claim 4, in the viscous fluid printing apparatus according to any one of claims 1 to 3, the adjustment mechanism has one position of the squeegee and the mask. A first adjusting mechanism that adjusts the direction of the squeegee in the viscous fluid printing direction, and a second adjusting mechanism that adjusts one position of the squeegee and the mask about an axis extending in the vertical direction. It is characterized by having.

Further, in the viscous fluid printing apparatus according to claim 5, in the viscous fluid printing apparatus according to claim 4, the mask has a guideline written so as to extend in an operation direction of the squeegee during viscous fluid printing. It is characterized by that.

Further, in the viscous fluid printing apparatus according to claim 6, in the viscous fluid printing apparatus according to any one of claims 1 to 3, the adjustment mechanism sets the position of the squeegee at the time of viscous fluid printing. It has a 3rd adjustment mechanism which adjusts in the direction which cross | intersects the operation | movement direction of the said squeegee, and a 4th adjustment mechanism which adjusts the position of the said squeegee in the up-down direction.

A viscous fluid printing apparatus according to a seventh aspect is the viscous fluid printing apparatus according to any one of the first to sixth aspects, wherein the controller controls the operation of the adjustment mechanism, the mask, And an imaging device that images the squeegee, wherein the control device controls the operation of the adjustment mechanism based on imaging data of the imaging device.

Further, in the viscous fluid printing apparatus according to claim 8, in the viscous fluid printing apparatus according to any one of claims 1 to 5, the adjustment mechanism adjusts a position of the mask. The viscous fluid printing apparatus includes a substrate adjustment mechanism that adjusts the position of the circuit board, and a control device that controls the operation of the substrate adjustment mechanism and the adjustment mechanism, and the control device includes the substrate adjustment mechanism. After the mask and the circuit board are aligned by at least one of the adjustment mechanism and the adjustment mechanism, the mask and the circuit board are the same according to the position of the squeegee by the substrate adjustment mechanism and the adjustment mechanism. It is characterized by moving in the same direction and in the same amount.

The viscous fluid printing apparatus according to claim 1 includes an adjustment mechanism for adjusting a relative position between the squeegee and the mask. Accordingly, it is possible to appropriately eliminate the positional deviation between the squeegee and the mask, and it is possible to appropriately print the viscous fluid on the circuit board.

Further, in the viscous fluid printing apparatus according to claim 2, the relative position between the convex part of the squeegee and the concave part of the mask is adjusted by the adjusting mechanism. Thereby, the convex part of the squeegee and the concave part of the mask can be suitably aligned, and the viscous fluid can be appropriately printed on the concave part of the cavity substrate.

In the viscous fluid printing apparatus according to claim 3, the squeegee is formed of a flexible material, and the squeegee is formed with a pair of slits so as to extend upward from both sides of the convex portion. Has been. This slit makes it easy for the convex part of the squeegee or the part other than the convex part to bend, and the tip of the squeegee easily comes into contact with the mask. Thereby, it becomes possible to appropriately print the viscous fluid on the concave portion of the cavity substrate and the top surface other than the concave portion.

Further, in the viscous fluid printing apparatus according to claim 4, the position of one of the squeegee and the mask is adjusted by the adjustment mechanism in a direction that intersects the operation direction of the squeegee during viscous fluid printing. Accordingly, the squeegee and the mask can be relatively moved to arbitrary positions, and the positional deviation between the squeegee and the mask can be appropriately eliminated. Further, the position of one of the squeegee and the mask is adjusted around the axis extending in the vertical direction by the adjusting mechanism. Accordingly, for example, when mask printing is performed on the cavity substrate, the squeegee can be moved along the edge of the concave portion of the mask, and printing on the concave portion of the cavity substrate can be appropriately performed.

Further, in the viscous fluid printing apparatus according to claim 5, the guideline is written on the mask so as to extend in the operation direction of the squeegee at the time of viscous fluid printing. Thereby, for example, the operator can adjust the position of one of the squeegee and the mask around an axis extending in the vertical direction with reference to the guideline.

Further, in the viscous fluid printing apparatus according to claim 6, the position of the squeegee is adjusted by the adjustment mechanism in a direction intersecting with the operation direction of the squeegee during the viscous fluid printing. As a result, the squeegee can be moved to an arbitrary position, and the positional deviation between the squeegee and the mask can be appropriately eliminated. Further, the position of the squeegee is adjusted in the vertical direction by the adjusting mechanism. Thereby, it becomes possible to press the front-end | tip part of a squeegee against a mask, and it becomes possible to perform mask printing appropriately.

In the viscous fluid printing apparatus according to the seventh aspect, the mask and the squeegee are imaged by the imaging device, and the operation of the adjusting mechanism is controlled based on the imaging data. Thereby, it is possible to automatically eliminate the positional deviation between the squeegee and the mask.

In the viscous fluid printing apparatus according to claim 8, the adjustment mechanism adjusts the position of the mask, and the operation of the substrate adjustment mechanism and the adjustment mechanism for adjusting the position of the circuit board is controlled by the control device. Is done. Then, the control device aligns the mask and the circuit board by at least one of the substrate adjustment mechanism and the adjustment mechanism, and then adjusts the mask and circuit board according to the position of the squeegee by the substrate adjustment mechanism and the adjustment mechanism. Are moved in the same direction and by the same amount. After the alignment between the squeegee and the mask, the alignment between the mask and the circuit board is performed, and the position between the squeegee and the mask may be shifted. In such a case, the squeegee, the mask, and the circuit board can be aligned in the vertical direction by moving the mask and the circuit board in the same direction and by the same amount according to the position of the squeegee.

It is a side view which shows the main body frame which comprises the solder printer which is an Example of this invention. It is a top view which shows the conveying apparatus provided in the main body frame shown in FIG. It is a perspective view which shows the moving apparatus and imaging device which are provided in the main body frame shown in FIG. It is a top view which shows the mask holding | maintenance apparatus provided in the main body frame shown in FIG. It is a top view which shows the squeegee apparatus provided in the main body frame shown in FIG. It is sectional drawing which shows the squeegee and the cavity board | substrate of the state in which the viscous fluid is printed on the recessed part of a cavity board | substrate. It is sectional drawing which shows the squeegee and the cavity board | substrate of the state in which the viscous fluid is printed on the top surface of a cavity board | substrate. It is a block diagram which shows the control apparatus with which a solder printer is provided. It is a top view which shows the mask holding | maintenance apparatus with which the solder printer of a modification is provided.

Hereinafter, examples and modifications of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of solder printer>
1 to 5 show an apparatus constituting a solder printer 10 according to an embodiment of the present invention. Specifically, the solder printing machine 10 includes a main frame 12, a conveyance device 14, an imaging device moving device (hereinafter sometimes abbreviated as “moving device”) 16, an imaging device 18, a mask holding device 20, and a squeegee device 22. Has been. FIG. 1 is a view showing the main frame 12 from a side view. FIG. 2 is a view showing the transfer device 14 disposed on the main frame 12 from a viewpoint from above. FIG. 3 is a perspective view showing the moving device 16 and the imaging device 18. FIG. 4 is a view showing the mask holding device 20 disposed on the main frame 12 from a viewpoint from above. FIG. 5 is a view showing the squeegee device 22 from a viewpoint from above.

As shown in FIG. 1, the main frame 12 has a first frame portion 30, a second frame portion 32, a third frame portion 34, and a fourth frame portion 36, and four frame portions 30, 32, 34. , 36 are stacked in a separated state. Specifically, the first frame portion 30 is disposed at the lowest position. The second frame portion 32 is disposed on four first pillars 38 (only two are shown in the drawing) erected at the four corners of the first frame portion 30. The third frame portion 34 is disposed on four second pillars 40 (only two are shown in the figure) erected at the four corners of the second frame portion 32. The fourth frame portion 36 is disposed on four third pillars 42 (only two are shown in the drawing) erected at the four corners of the third frame portion 34.

Further, as shown in FIG. 2, the second frame portion 32 is composed of a pair of girders 44 and a pair of beams 46, and is generally frame-shaped. Similarly to the second frame portion 32, the first frame portion 30, the third frame portion 34, and the fourth frame portion 36 are also a pair of digits (only one is shown in FIG. 1) 48, 50, 52, It is composed of a pair of beams (not shown) and is generally frame-shaped. In the following description, the extending direction of the beam 46 is referred to as the X-axis direction, and the extending direction of the

girders

44, 48, 50, and 52 is referred to as the Y-axis direction. Furthermore, the direction perpendicular to the X-axis direction and the Y-axis direction, that is, the vertical direction is referred to as the Z-axis direction.

As shown in FIG. 2, the transport device 14 is disposed on the second frame portion 32 and includes two

conveyor devices

54 and 56. The two

conveyor devices

54 and 56 are arranged so as to be parallel to each other and extend in the X-axis direction, and are supported by a pair of girders 44 at both ends. Each of the

conveyor devices

54 and 56 conveys the circuit board in the X-axis direction by driving an electromagnetic motor (see FIG. 8) 58. A substrate holding device 60 is disposed below the conveyor device 56, and the circuit board is fixedly held by the substrate holding device 60 at a predetermined position. Further, an elevating device (see FIG. 8) 62 for elevating the substrate holding device 60 is disposed below the substrate holding device 60. As a result, the circuit board held by the board holding device 60 can be raised and lowered.

The moving device 16 has a pair of guide rails 70, a Y-axis slider 72, and an X-axis slider 74, as shown in FIG. The pair of guide rails 70 are disposed on the pair of girders 50 of the third frame portion 34 so as to extend in the Y-axis direction. The Y-axis slider 72 is placed on a pair of guide rails 70 and is slidable in the Y-axis direction. Then, the Y-axis slider 72 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 8) 76. The Y-axis slider 72 holds an X-axis slider 74, and the X-axis slider 74 is slidable in the X-axis direction. The X-axis slider 74 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 8) 78. The imaging device 18 is attached to the X-axis slider 74. With such a structure, the moving device 16 moves the imaging device 18 to an arbitrary position.

The imaging device 18 includes a first mark camera 80 and a second mark camera (see FIG. 8) 82. The first mark camera 80 is arranged facing upward, and images the printing mask (see FIG. 4) 86 held by the mask holding device 20 and the squeegee (see FIG. 6) 88 of the squeegee device 22. To do. On the other hand, the second mark camera 82 is arranged facing downward, and images the circuit board held by the board holding device 60.

The mask holding device 20 is a device for holding the printing mask 86, and has a pair of brackets 90, a bracket adjustment mechanism (see FIG. 8) 92, and a mask adjustment mechanism 94 as shown in FIG. ing. The bracket 90 is a longitudinal member having a generally L-shaped cross section, and includes a bottom portion 96 and a standing portion 98. The pair of brackets 90 are disposed on the pair of girders 52 of the fourth frame portion 36 with the bottom 96 facing each other. Each bracket 90 is disposed on the beam 52 via a bracket adjustment mechanism 92. Since the bracket adjustment mechanism 92 is described in detail in Japanese Patent Application Laid-Open No. 2011-230353, detailed description is omitted, but the position of the pair of brackets 90 is adjusted.

Further, the printing mask 86 is held by the mask frame 100, and the printing mask 86 is held by holding the mask frame 100 by the pair of brackets 90. Specifically, both side portions of the mask frame 100 are placed on the bottom portions 96 of the pair of brackets 90. A bending member 102 made of a flexible material is attached to the side surface of one standing portion 98 of the pair of brackets 90. On the other hand, a mask adjustment mechanism 94 is provided on the other of the pair of brackets 90. The mask adjustment mechanism 94 has a pair of solenoids 104, and the pair of solenoids 104 is disposed in the standing portion 98 with the tip end portion of the plunger 106 protruding above the bottom portion 96. ing. Each solenoid 104 can adjust the protruding amount of the plunger 106. With such a structure, both sides of the mask frame 100 are placed on the bottoms 96 of the pair of brackets 90, and the plungers 106 of the solenoids 104 are protruded so that the mask frame 100 and the flexible members 102. Thereby, the printing mask 86 is fixedly held by the pair of brackets 90 together with the mask frame 100.

In the mask holding device 20, the position of the mask frame 100, that is, the position of the printing mask 86 can be adjusted by adjusting the protruding amount of the plunger 106. Specifically, for example, by increasing the protrusion amount of the plunger 106 of the pair of solenoids 104 by the same amount, the printing mask 86 moves in the right direction in the figure. On the other hand, by reducing the protruding amount of the plunger 106 of the pair of solenoids 104 by the same amount, the printing mask 86 moves to the left in the drawing. As described above, by adjusting the protrusion amount of the plunger 106, the position of the printing mask 86 can be adjusted in the X-axis direction. Further, for example, by increasing the protruding amount of one plunger 106 of the pair of solenoids 104 and decreasing the protruding amount of the other plunger 106, the printing mask 86 rotates around an axis extending in the vertical direction. Thereby, the position of the printing mask 86 can be adjusted around the Z axis.

Also, the bracket adjustment mechanism 92 can adjust the position of the pair of brackets 90 as described above. For this reason, the position of the printing mask 86 held by the pair of brackets 90 is adjusted by the bracket adjustment mechanism 92. Thus, in the mask holding device 20, the position of the printing mask 86 can be adjusted by any of the bracket adjustment mechanism 92 and the mask adjustment mechanism 94. However, the bracket adjustment mechanism 92 adjusts the printing mask 86 integrally with the bracket 90, but the mask adjustment mechanism 94 adjusts the relative position of the printing mask 86 with respect to the bracket 90.

In the printing mask 86, the central portion thereof is a printing area 110 on which solder printing is performed, and a plurality of through holes 112 are formed in the printing area 110. The printing mask 86 is used when solder printing is performed on the cavity substrate, and a concave portion 114 is formed on the upper surface of the printing mask 86. As shown in FIG. 6, the recess 114 has a shape protruding downward on the lower surface of the printing mask 86 and is fitted into the recess 118 of the cavity substrate 116. As a result, the concave portion 114 of the printing mask 86 is in close contact with the concave portion 118 of the cavity substrate 116, and the flat plate portion 120 other than the concave portion 114 of the printing mask 86 is in close contact with the top surface 122 of the cavity substrate 116.

Further, as shown in FIG. 4, a squeegee device 22 is fixed on the upper surface of the mask holding device 20. As shown in FIG. 5, the squeegee device 22 includes a main body 130, a squeegee moving device 132, and a squeegee 88. The main body 130 is generally a U-shaped flat plate member, and is divided into two arm portions 134 and a connecting portion 136. The main body portion 130 is fixed to the upper surfaces of the pair of brackets 90 of the mask holding device 20 with two arm portions 134.

The squeegee moving device 132 has a pair of guide rails 138, a slide part 140, and an electromagnetic motor (see FIG. 8) 142. The pair of guide rails 138 are disposed on the upper surfaces of the two arm portions 134 so as to extend in the Y axis direction, and the slide portion 140 can be slid in the Y axis direction by the pair of guide rails 138. It is supported by. Then, the slide unit 140 slides in the Y-axis direction by driving the electromagnetic motor 142.

The squeegee 88 is held on the lower surface of the slide portion 140 with its tip portion extending downward. The squeegee 88 is held so as to be movable in the X-axis direction, and is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 8) 146. Further, the squeegee 88 is held so as to be movable in the vertical direction, and is moved to an arbitrary position in the Z-axis direction by driving an electromagnetic motor (see FIG. 8) 148.

Further, the squeegee 88 is formed of a flexible material and generally has a flat plate shape. At the lower end of the squeegee 88, as shown in FIG. The width of the convex portion 150 is slightly smaller than the inner dimension of the concave portion 114 of the printing mask 86 in the X-axis direction, and the convex portion 150 can be inserted into the concave portion 114.

Further, the squeegee 88 is also formed with a pair of slits 152 so as to extend upward from both side portions of the convex portion 150, and the protruding amount of the convex portion 150 downward is approximately the same as the depth of the concave portion 114. ing. Thereby, when the convex portion 150 is inserted into the concave portion 114, the tip portion of the convex portion 150 comes into contact with the bottom surface of the concave portion 114 of the printing mask 86, and the tip portion other than the convex portion 150 of the squeegee 88 (hereinafter referred to as the convex portion 150). 154 may contact the flat plate portion 120 of the printing mask 86.

Specifically, when the protruding amount of the convex portion 150 is shorter than the depth of the concave portion 114, the flat tip portion 154 contacts the flat plate portion 120 and bends when the convex portion 150 is inserted into the concave portion 114. . At this time, the flat front end portion 154 is suitably bent by the pair of slits 152, so that the front end portion of the convex portion 150 appropriately contacts the bottom surface of the concave portion 114. On the other hand, when the protruding amount of the convex portion 150 is longer than the depth of the concave portion 114, the convex portion 150 comes into contact with the bottom surface of the concave portion 114 and bends when the convex portion 150 is inserted into the concave portion 114. At this time, the flat tip portion 154 appropriately contacts the flat plate portion 120 because the convex portion 150 is suitably bent by the pair of slits 152. Thereby, it becomes possible to appropriately perform squeezing simultaneously on the concave portion 114 and the flat plate portion 120 of the printing mask 86.

Further, when squeezing is performed only on the portion of the printing mask 86 that does not have the concave portion 114, that is, on the flat plate portion 120 of the printing mask 86, the convex portion 150 bends, thereby causing the convex portion 150 and the flat tip portion to be bent. 154 contacts the flat plate portion 120. Specifically, for example, as shown in FIG. 7, when the squeegee 88 is moving toward the recess 114, squeezing is performed only on the flat plate portion 120. At this time, the convex portion 150 is greatly bent by the pair of slits 152 and appropriately contacts the flat plate portion 120. On the other hand, the flat front end portion 154 also appropriately contacts the flat plate portion 120 because the convex portion 150 is greatly bent. As a result, it is possible to perform appropriate squeezing even in the portion of the printing mask 86 where there is no recess 114. Therefore, according to the squeegee 88 in which the convex portion 150 and the slit 152 are formed, appropriate squeezing can be performed collectively on the entire flat plate portion 120 and the concave portion 114 without replacing the squeegee or the like. It has become.

Further, the solder printer 10 includes a control device 160 as shown in FIG. The control device 160 includes a controller 162 and a plurality of drive circuits 164. The plurality of drive circuits 164 are connected to the

electromagnetic motors

58, 76, 78, 142, 146, 148, the substrate holding device 60, the lifting device 62, the bracket adjustment mechanism 92, and the solenoid 104. The controller 162 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 164. Thereby, the operation of the transport device 14, the moving device 16, and the like is controlled by the controller 162. The controller 162 is also connected to the image processing device 166. The image processing device 166 processes image data obtained by the first mark camera 80 and the second mark camera 82. Thereby, the controller 162 can obtain various information based on the image data.

<Printing by solder printer>
In the solder printer 10, as described above, appropriate squeezing is performed collectively on the entire flat plate portion 120 and the concave portion 114 of the printing mask 86 by the squeegee 88 in which the convex portion 150 and the slit 152 are formed. It is possible. That is, the cream solder can be collectively printed on the top surface 122 and the recess 118 of the cavity substrate 116 by the squeegee 88 and the printing mask 86.

Specifically, first, the imaging device 18 moves below the squeegee 88 according to a command from the controller 162. Then, both ends of the squeegee 88 are imaged by the first mark camera 80, and the imaged data is processed by the image processing device 166. As a result, the controller 162 acquires the position of the squeegee 88 in the X-axis direction. Data regarding the position of the convex portion 150 in the squeegee 88 is input to the controller 162, and the position of the convex portion 150 in the X-axis direction is calculated based on the data. Note that when the squeegee 88 is imaged, the mask frame 100, that is, the printing mask 86 is not held by the mask holding device 20.

Next, the operator places the mask frame 100 to which the printing mask 86 is attached on the bottom 96 of the pair of brackets 90. Then, the controller 162 controls the operation of the pair of solenoids 104 and causes the plungers 106 of the pair of solenoids 104 to protrude. As a result, the mask frame 100 is sandwiched and fixed between the distal end portion of the plunger 106 and the bending member 102.

Subsequently, in order to acquire the position of the printing mask 86 fixed in the mask holding device 20, a mask reference mark (not shown) written on the printing mask 86 is imaged by the first mark camera 80, and the imaging data is obtained. Is processed by the image processing device 166. As a result, the controller 162 acquires information about the position of the printing mask 86, specifically, the position in the X-axis direction, the position in the Y-axis direction, and the angle around the Z-axis. The controller 162 is input with data related to the position of the concave portion 114 in the printing mask 86, and the position of the concave portion 114 is calculated based on the data.

The controller 162 further calculates the amount of deviation between the convex portion 150 and the concave portion 114 in the X-axis direction based on the position of the convex portion 150 in the X-axis direction and the position of the concave portion 114 in the X-axis direction. Then, the controller 162 controls the operation of the solenoid 104 and adjusts the protruding amount of the plunger 106 so that the calculated deviation amount becomes zero. Thereby, the convex part 150 and the concave part 114 can be matched in the X-axis direction. However, when the squeegee 88 does not operate in parallel with the edge of the recess 114, the protrusion 150 and the recess 114 are displaced in the X-axis direction as the squeegee 88 operates. For this reason, the operation of the solenoid 104 is further controlled to operate the squeegee 88 in parallel with the edge of the recess 114.

Specifically, the angle around the Z-axis acquired when the printing mask 86 is imaged is an angle formed by the extending direction of the edge contacting the bracket 90 of the printing mask 86 and the Y-axis direction. The operation direction is the Y-axis direction. That is, the angle around the Z axis is an angle formed by the direction in which the edge of the recess 114 extends and the direction in which the squeegee 88 operates. Therefore, the controller 162 controls the operation of the solenoid 104 and adjusts the protruding amount of the plunger 106 so that the angle around the Z axis is 0 ° with respect to the operation direction of the squeegee 88. As a result, the direction in which the edge of the concave portion 114 extends coincides with the operation direction of the squeegee 88, and it is possible to suppress the deviation in the X-axis direction between the convex portion 150 and the concave portion 114 accompanying the operation of the squeegee 88. In this way, by controlling the operation of the solenoid 104, the relative position between the printing mask 86 and the squeegee 88 is adjusted, and the alignment between the concave portion 114 of the printing mask 86 and the convex portion 150 of the squeegee 88 is adjusted. Done.

Next, alignment between the printing mask 86 and the cavity substrate 116 is performed according to a command from the controller 162. Specifically, in order to acquire the position of the cavity substrate 116 held by the substrate holding device 60, a substrate reference mark (not shown) marked on the cavity substrate 116 is imaged by the second mark camera 82, and the imaged data is imaged. Processing is performed by the processing device 166. As a result, the controller 162 acquires information on the position of the cavity substrate 116, and based on the position information of the cavity substrate 116 and the position information of the printing mask 86, the relative relationship between the cavity substrate 116 and the printing mask 86 is obtained. Calculate the amount of misalignment. Then, the controller 162 controls the operation of the bracket adjustment mechanism 92 so that the amount of deviation between the cavity substrate 116 and the printing mask 86 becomes zero, and adjusts the position of the bracket 90 that holds the printing mask 86. Thereby, alignment of the printing mask 86 and the cavity substrate 116 is performed.

Note that, as described above, the squeegee device 22 is fixed to the bracket 90, and the squeegee device 22 also moves as the bracket 90 moves. For this reason, even if the position of the bracket 90 is adjusted by the bracket adjustment mechanism 92, the relative positions of the printing mask 86 and the squeegee 88 do not change. That is, the alignment between the printing mask 86 and the cavity substrate 116 is performed in a state where the relative position between the printing mask 86 and the squeegee 88 is maintained.

When the alignment between the printing mask 86 and the cavity substrate 116 is performed, the operation of the moving device 16 is controlled, and the imaging device 18 is retracted from between the printing mask 86 and the cavity substrate 116. Then, the operation of the lifting device 62 is controlled, and the cavity substrate 116 is moved upward. Thus, the cavity substrate 116 and the printing mask 86 are stacked in a state where the concave portion 118 of the cavity substrate 116 and the concave portion 114 of the printing mask 86 coincide with each other.

Subsequently, the operation of the electromagnetic motor 142 is controlled, the squeegee 88 is moved in the Y-axis direction, and cream solder is applied onto the printing mask 86 by the squeegee 88. Thus, cream solder is filled in all the through holes 112 of the printing mask 86, and the cream solder filled in the through holes 112 adheres to the recesses 118 and the top surface 122 of the cavity substrate 116.

Then, the operation of the lifting device 62 is controlled, and the cavity substrate 116 is moved downward, whereby the printing mask 86 is removed from the cavity substrate 116. As a result, cream solder is printed on the recess 118 and the top surface 122 of the cavity substrate 116, and the cream solder printing operation is completed.

As described above, in the solder printer 10, the alignment between the concave portion 114 of the printing mask 86 and the convex portion 150 of the squeegee 88 is preferably performed, and the alignment between the printing mask 86 and the cavity substrate 116 is preferably performed. Has been done. As a result, it is possible to perform cream solder printing on the concave portion 118 and the top surface 122 of the cavity substrate 116 at the same time and appropriately perform the batch printing operation.

<Modification 1>
Further, in the above embodiment, the position of the concave portion 114 of the printing mask 86 and the convex portion 150 of the squeegee 88 is adjusted by adjusting the position of the printing mask 86 by the mask adjusting mechanism 94, that is, the pair of solenoids 104. The alignment of the concave portion 114 of the printing mask 86 and the convex portion 150 of the squeegee 88 may be performed by adjusting the position of the squeegee 88.

Specifically, as in the above embodiment, the position of the convex portion 150 of the squeegee 88 in the X-axis direction and the position of the concave portion 114 of the printing mask 86 in the X-axis direction are acquired, and the convex portion 150 and the concave portion 114 are acquired. Is calculated in the X-axis direction. Further, the mask frame 100 to which the printing mask 86 is attached is also sandwiched and fixed by the distal end portion of the plunger 106 and the bending member 102 as in the above embodiment. Then, the controller 162 controls the operation of the electromagnetic motor 146 and adjusts the squeegee 88 in the X-axis direction so that the calculated deviation amount becomes zero. Thereby, it is possible to align the convex portion 150 and the concave portion 114 in the X-axis direction. Further, the operation of the electromagnetic motor 148 is controlled to move the squeegee 88 downward. Thus, even when the protrusion amount of the convex portion 150 of the squeegee 88 and the depth of the concave portion 114 of the printing mask 86 are different, the convex portion 150 is brought into contact with the bottom surface of the concave portion 114 and the flat tip portion 154 is flattened. It becomes possible to make the part 120 contact.

Then, after the position adjustment of the squeegee 88 is performed, the operation of the bracket adjustment mechanism 92 is controlled in the same manner as in the above embodiment, and the alignment between the printing mask 86 and the cavity substrate 116 is performed. As a result, the positions of the printing mask 86, the squeegee 88, and the cavity substrate 116 can be aligned in the vertical direction, and the cream solder can be collectively printed on the recess 118 and the top surface 122 of the cavity substrate 116. It is possible to appropriately perform the batch printing operation.

<Modification 2>
Further, in the above embodiment, the adjustment of the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86 is performed by the operation of the mask adjusting mechanism 94, but it can also be performed manually by the operator. . Since the solder printer capable of manually adjusting the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86 has the same configuration as the solder printer 10 except for the mask holding device 170, Only the mask holding device 170 is shown in FIG. 9, and the mask holding device 170 will be described. However, since the mask holding device 170 has the same configuration as that of the mask holding device 20 except for the mask adjustment mechanism 172, the same reference numerals are used for the components having the same functions as those of the mask holding device 20, and the description thereof is omitted. Or simply.

The mask adjustment mechanism 172 has a pair of adjustment screws 174. The adjustment screw 174 is disposed in the standing portion 98 of the bracket 90, and the tip portion projects above the bottom portion 96. Then, the operator can adjust the protrusion amount by rotating the adjustment screw 174 around the axis. Thereby, the relative position of the printing mask 86 with respect to the mask holding device 170, that is, the relative position of the printing mask 86 with respect to the squeegee 88 is adjusted.

In addition, a pair of guide lines 176 used when adjusting the position of the printing mask 86 is written on the upper surface of the printing mask 86 held by the mask holding device 170. The length between the pair of guide lines 176 is the same as the length of the squeegee 88, that is, the dimension in the direction in which the squeegee 88 extends (hereinafter sometimes referred to as “squeegee axis direction”). Then, the operator adjusts the pair of adjustment screws 174, aligns one end of the squeegee 88 with one of the pair of guide lines 176, and aligns the other end of the squeegee 88 with the other of the pair of guide lines 176. The convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86 can be aligned in the X-axis direction.

Each guide line 176 is written so as to extend in the operation direction of the squeegee 88 during cream solder printing, that is, in the Y-axis direction, and is parallel to the direction in which the edge of the recess 114 of the printing mask 86 extends. . Therefore, the operator adjusts the pair of adjusting screws 174 so that the squeegee axis direction and the guide line 176 intersect at right angles, so that the extending direction of the edge of the recess 114 and the operating direction of the squeegee 88 are preferably matched. It becomes possible to make it. As described above, in the mask holding device 170, the operator can manually and suitably adjust the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86.

<Modification 3>
Moreover, in the said Example, although the squeegee apparatus 22 is being fixed to the mask holding | maintenance apparatus 20, and the squeegee apparatus 22 and the mask holding | maintenance apparatus 20 move integrally, squeegee apparatus 22 and mask holding | maintenance are carried out. The device 20 may be separated. Therefore, a solder printer in which the squeegee device 22 and the mask holding device 20 are separated is adopted as the solder printer of the third modification. Since the solder printing machine of Modification 3 has substantially the same configuration as the solder printing machine 10 except that the squeegee device 22 and the mask holding device 20 are separated, the illustration and description of the configuration are omitted. The same reference numerals as those of the solder printer 10 are used. However, the substrate holding device 60 according to the modified example 3 can not only hold the circuit board but also adjust the position of the held circuit board in a controllable manner.

In the solder printing machine according to the third modification, the position of the convex portion 150 of the squeegee 88 in the X-axis direction is acquired as in the above embodiment. Further, the mask frame 100 to which the printing mask 86 is attached is also sandwiched and fixed by the distal end portion of the plunger 106 and the bending member 102 as in the above embodiment. Then, the position of the concave portion 114 of the printing mask 86 in the X-axis direction is acquired, and the amount of deviation in the X-axis direction between the convex portion 150 and the concave portion 114 is calculated. Further, the angle around the Z axis of the printing mask 86 is acquired, and the amount of deviation of the angle of the printing mask 86 with respect to the operation direction of the squeegee 88 is also calculated. The controller 162 controls the operation of the mask adjustment mechanism 94, that is, the pair of solenoids 104, and moves the printing mask 86 in the X-axis direction and the Z-axis direction so that the calculated displacement amount becomes zero. adjust. Thereby, it is possible to align the convex portion 150 and the concave portion 114 at an angle around the X-axis direction and the Z-axis.

Further, in the solder printing machine according to the third modification, the position of the cavity substrate 116 and the position of the printing mask 86 are acquired and the amount of deviation between the cavity substrate 116 and the printing mask 86 is calculated as in the above embodiment. The Then, the controller 162 controls the operation of the substrate holding device 60 and adjusts the position of the cavity substrate 116 so that the deviation amount between the cavity substrate 116 and the printing mask 86 becomes zero. Thereby, alignment of the printing mask 86 and the cavity substrate 116 is performed.

As described above, even in the solder printing machine in which the squeegee device 22 and the mask holding device 20 are separated, the printing mask 86, the squeegee 88, and the cavity substrate 116 can be aligned, and the cavity substrate 116 is recessed. It is possible to perform cream solder printing on the 118 and the top surface 122 in a lump and appropriately perform the lump printing operation.

Further, in the solder printing machine according to the third modification, after the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86 are aligned at an angle about the X axis direction and the Z axis by the pair of solenoids 104, the above-described implementation is performed. Similarly to the example, the operation of the bracket adjustment mechanism 92 may be controlled to align the printing mask 86 and the cavity substrate 116. However, since the squeegee device 22 and the mask holding device 20 are separated from each other in the solder printing machine according to the third modification, only the printing mask 86 is moved by the operation of the bracket adjustment mechanism 92 and the convex portion 150 of the squeegee 88 is moved. And the recess 114 of the printing mask 86 are displaced in the X-axis direction.

Therefore, in such a case, the operation of the substrate holding device 60 and the bracket adjustment mechanism 92 is controlled, and the printing mask 86 and the cavity substrate 116 are moved in the same direction, the same amount, and the same angle, The printing mask 86, the squeegee 88, and the cavity substrate 116 are aligned.

Specifically, the controller 162 stores the operation amount and the operation direction of the bracket adjustment mechanism 92 used when the printing mask 86 and the cavity substrate 116 are aligned. Then, after only the printing mask 86 is moved by the operation of the bracket adjustment mechanism 92, the operation of the substrate holding device 60 and the bracket adjustment mechanism 92 is controlled, so that the operation direction is opposite to the stored operation direction. The printing mask 86 and the cavity substrate 116 are moved in the same amount and at the same angle as the stored operation amount. As a result, the printing mask 86, the squeegee 88, and the cavity substrate 116 are aligned.

When only the printing mask 86 is moved by the operation of the bracket adjusting mechanism 92 and the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86 are displaced in the X-axis direction, the position adjustment of the squeegee 88 is performed. It is possible to adjust the position of the convex portion 150 and the concave portion 114. Specifically, the operation amount and the operation direction of the bracket adjustment mechanism 92 used when aligning the printing mask 86 and the cavity substrate 116 are stored in the controller 162. Then, the operation amount in the X-axis direction is extracted from the stored operation amount and operation direction. Then, after only the printing mask 86 is moved by the operation of the bracket adjustment mechanism 92, the operation of the electromagnetic motor 146 is controlled so that the extracted operation amount in the X-axis direction becomes zero. As a result, the convex portion 150 and the concave portion 114 coincide with each other in the X-axis direction, and the printing mask 86, the squeegee 88, and the cavity substrate 116 are aligned.

<Modification 4>
In the third modification, the mask adjustment mechanism 94 aligns the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86, but printing is also performed by a solder printer that does not include the mask adjustment mechanism 94. The mask 86, the squeegee 88, and the cavity substrate 116 can be aligned. Therefore, a solder printer that does not include the mask adjustment mechanism 94 is employed as the solder printer of the fourth modification. The solder printing machine of the modification 4 has substantially the same configuration as the solder printing machine of the modification 3 except that the mask adjustment mechanism 94 is not provided. The same reference numerals as those of the printing press 10 are used.

In the solder printing machine of Modification 4, the position of the convex portion 150 of the squeegee 88 in the X-axis direction is acquired as in the above embodiment. Further, the mask frame 100 to which the printing mask 86 is attached is also sandwiched and fixed by the distal end portion of the plunger 106 and the bending member 102 as in the above embodiment. Then, the position of the concave portion 114 of the printing mask 86 in the X-axis direction is acquired, and the amount of deviation in the X-axis direction between the convex portion 150 and the concave portion 114 is calculated. Further, the angle around the Z axis of the printing mask 86 is acquired, and the amount of deviation of the angle of the printing mask 86 with respect to the operation direction of the squeegee 88 is also calculated. Then, the controller 162 controls the operation of the bracket adjustment mechanism 92 and adjusts the printing mask 86 around the X-axis direction and the Z-axis so that the calculated shift amount becomes zero. Thereby, it is possible to align the convex portion 150 and the concave portion 114 at an angle around the X-axis direction and the Z-axis.

Further, in the solder printing machine according to the modified example 4, the position of the cavity substrate 116 and the position of the printing mask 86 are acquired, and the amount of deviation between the cavity substrate 116 and the printing mask 86 is calculated, as in the above embodiment. The Then, the controller 162 controls the operation of the substrate holding device 60 and adjusts the position of the cavity substrate 116 so that the deviation amount between the cavity substrate 116 and the printing mask 86 becomes zero. Thereby, alignment of the printing mask 86 and the cavity substrate 116 is performed.

As described above, even in a solder printing machine not provided with the mask adjusting mechanism 94, the printing mask 86, the squeegee 88, and the cavity substrate 116 can be aligned, and the recess 118 and the top surface of the cavity substrate 116 can be aligned. It is possible to perform cream solder printing on 122 in a batch and appropriately perform the batch printing operation.

<Modification 5>
In Modification 3 or Modification 4, the position of the printing mask 86 is adjusted to align the convex portion 150 of the squeegee 88 and the concave portion 114 of the printing mask 86. Even in a solder printer that cannot adjust the position of the mask 86 for printing, for example, a solder printer that does not include the bracket adjusting mechanism 92 and the mask adjusting mechanism 94, the printing mask 86, the squeegee 88, and the cavity substrate 116 are aligned. Is possible. Therefore, a solder printer that does not include the bracket adjusting mechanism 92 and the mask adjusting mechanism 94 is employed as the solder printer of the fifth modification. The solder printing machine of Modification 5 has substantially the same configuration as the solder printing machine of Modification 3 except that the bracket adjustment mechanism 92 and the mask adjustment mechanism 94 are not provided. Omitted and the same reference numerals as those of the solder printer 10 are used.

In the solder printing machine according to the fifth modified example, the position of the convex portion 150 of the squeegee 88 in the X-axis direction and the position of the concave portion 114 of the printing mask 86 in the X-axis direction are acquired and the convex portion is obtained. The amount of deviation in the X-axis direction between 150 and the recess 114 is calculated. Further, the mask frame 100 to which the printing mask 86 is attached is also sandwiched and fixed by the distal end portion of the plunger 106 and the bending member 102 as in the above embodiment. Then, the controller 162 controls the operation of the electromagnetic motor 146 and adjusts the squeegee 88 in the X-axis direction so that the calculated deviation amount becomes zero. Thereby, it is possible to align the convex portion 150 and the concave portion 114 in the X-axis direction.

Also, in the solder printing machine according to the fifth modification, the position of the cavity substrate 116 and the position of the printing mask 86 are acquired and the amount of deviation between the cavity substrate 116 and the printing mask 86 is calculated as in the above embodiment. The Then, the controller 162 controls the operation of the substrate holding device 60 and adjusts the position of the cavity substrate 116 so that the deviation amount between the cavity substrate 116 and the printing mask 86 becomes zero. Thereby, alignment of the printing mask 86 and the cavity substrate 116 is performed.

As described above, even in a solder printing machine in which the bracket adjustment mechanism 92 and the mask adjustment mechanism 94 are not provided, the printing mask 86, the squeegee 88, and the cavity substrate 116 can be aligned. It is possible to perform cream solder printing on the concave portion 118 and the top surface 122 in a lump and to appropriately perform the lump printing operation.

Incidentally, in the above-described embodiments and modifications, the solder printer 10 is an example of a viscous fluid printing apparatus. The imaging device 18 is an example of an imaging device. The substrate holding device 60 is an example of a substrate adjustment mechanism. The printing mask 86 is an example of a mask, and the concave portion 114 of the printing mask 86 is an example of a concave portion. The squeegee 88 is an example of a squeegee, and the convex portion 150 and the slit 152 of the squeegee 88 are an example of a convex portion and a slit. The bracket adjustment mechanism 92, the mask adjustment mechanism 94, and the mask adjustment mechanism 172 are examples of the adjustment mechanism, the first adjustment mechanism, and the second adjustment mechanism. The electromagnetic motor 146 is an example of an adjustment mechanism and a third adjustment mechanism. The electromagnetic motor 148 is an example of an adjustment mechanism and a fourth adjustment mechanism. The control device 160 is an example of a control device. The guideline 176 is an example of a guideline.

In addition, this invention is not limited to the said Example and modification, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment and modification, the cavity substrate 116 is employed as the circuit substrate to be worked. However, it is also possible to employ a substrate having only a step instead of the cavity. In this case, a stepped portion having a shape corresponding to the stepped portion of the substrate is formed on the printing mask, and a stepped portion having a shape corresponding to the stepped portion of the printing mask is formed on the squeegee. Then, the operations of the bracket adjustment mechanism 92, the mask adjustment mechanism 94, the electromagnetic motor 146, and the like are controlled so that the step portion of the printing mask and the step portion of the squeegee are aligned in the X-axis direction.

It is also possible to adopt a circuit board in which no recesses or steps are formed, that is, a flat circuit board. The flat circuit board employs a flat printing mask. The relative positions of the flat printing mask and the squeegee are determined by the bracket adjustment mechanism 92, the mask adjustment mechanism 94, the electromagnetic motor 146, and the like. May be adjusted. Specifically, for example, a printing operation is performed at a specific position on a flat circuit board with a squeegee having a relatively high hardness, and a printing operation is performed at a position different from the specific position with a squeegee having a relatively low hardness. Think about the case. In such a case, the relative position between the position of the mask corresponding to the specific position of the circuit board and the position of the relatively hard squeegee is adjusted. Then, the relative position between the position of the mask corresponding to a position different from the specific position and the position of the squeegee having a relatively low hardness is adjusted. Accordingly, it is possible to perform a printing operation with a plurality of squeegees having different hardnesses on one circuit board.

The present invention is also applicable to a case where a printing operation is performed on a flat circuit board using a general squeegee in which the entire squeegee has the same hardness and a flat printing mask. That is, when aligning a general squeegee with a flat mask, the operations of the bracket adjustment mechanism 92, the mask adjustment mechanism 94, the electromagnetic motor 146, and the like may be controlled. At this time, the positioning of the printing area 110 and the squeegee is automatically or manually performed, so that it is possible to reliably apply the solder cream to the printing area 110 and to prevent inadvertent printing mistakes. Become. Furthermore, since the relative positions of the squeegee and the mask are recognized, even if the operator installs the wrong length squeegee on the main body 130, it is possible to notice a mounting mistake.

Further, in the above embodiment, the adjustment of the squeegee 88 in the X-axis direction and the Z-axis direction is automatically performed by the operation of the

electromagnetic motors

146, 148, but manually performed by an operator using an adjustment screw or the like. Is possible.

10: Solder printer (viscous fluid printing device) 18: Imaging device 60: Substrate holding device (substrate adjustment mechanism) 86: Printing mask 88: Squeegee 92: Bracket adjustment mechanism (adjustment mechanism) (first adjustment mechanism) (No. 1) 2 adjustment mechanism) 94: mask adjustment mechanism (adjustment mechanism) (first adjustment mechanism) (second adjustment mechanism) 114: recess 146: electromagnetic motor (adjustment mechanism) (third adjustment mechanism) 148: electromagnetic motor (adjustment mechanism) (Fourth adjustment mechanism) 150: convex part 152: slit 160: control device 172: mask adjustment mechanism (adjustment mechanism) (first adjustment mechanism) (second adjustment mechanism) 176: guideline

Claims

A viscous fluid printing apparatus for printing a viscous fluid on a circuit board by a squeegee and a mask,
The viscous fluid printing apparatus is
A viscous fluid printing apparatus comprising: an adjustment mechanism for adjusting a relative position between the squeegee and the mask.
The mask has a recess;
The squeegee has a convex portion having a shape corresponding to the concave portion,
The adjustment mechanism is
The viscous fluid printing apparatus according to claim 1, wherein a relative position between the convex portion of the squeegee and the concave portion of the mask is adjusted.
The squeegee is
The viscous fluid printing apparatus according to claim 2, wherein the viscous fluid printing apparatus includes a pair of slits formed to extend upward from both side portions of the convex portion, and is formed of a flexible material.
The adjustment mechanism is
A first adjustment mechanism that adjusts one position of the squeegee and the mask in a direction that intersects the operation direction of the squeegee during viscous fluid printing;
The viscous fluid printing according to any one of claims 1 to 3, further comprising: a second adjustment mechanism that adjusts one position of the squeegee and the mask around an axis extending in a vertical direction. apparatus.
The mask is
The viscous fluid printing apparatus according to claim 4, further comprising a guideline written so as to extend in an operation direction of the squeegee during viscous fluid printing.
The adjustment mechanism is
A third adjustment mechanism that adjusts the position of the squeegee in a direction that intersects the direction of operation of the squeegee during viscous fluid printing;
The viscous fluid printing apparatus according to claim 1, further comprising a fourth adjustment mechanism that adjusts a position of the squeegee in a vertical direction.
The viscous fluid printing apparatus is
A control device for controlling the operation of the adjustment mechanism;
An imaging device for imaging the mask and the squeegee;
The control device is
The viscous fluid printing apparatus according to claim 1, wherein the operation of the adjustment mechanism is controlled based on imaging data of the imaging apparatus.
The adjusting mechanism adjusts the position of the mask;
The viscous fluid printing apparatus is
A board adjusting mechanism for adjusting the position of the circuit board;
A control device for controlling the operation of the substrate adjustment mechanism and the adjustment mechanism;
The control device is
After aligning the mask and the circuit board by at least one of the substrate adjustment mechanism and the adjustment mechanism, the mask and the circuit are adjusted according to the position of the squeegee by the substrate adjustment mechanism and the adjustment mechanism. 6. The viscous fluid printing apparatus according to claim 1, wherein the substrate is moved in the same direction and by the same amount.