JPS5488083A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5488083A
JPS5488083A JP15678977A JP15678977A JPS5488083A JP S5488083 A JPS5488083 A JP S5488083A JP 15678977 A JP15678977 A JP 15678977A JP 15678977 A JP15678977 A JP 15678977A JP S5488083 A JPS5488083 A JP S5488083A
Authority
JP
Japan
Prior art keywords
wafer
mask
exposed
reference line
chip mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15678977A
Other languages
Japanese (ja)
Inventor
Takayuki Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15678977A priority Critical patent/JPS5488083A/en
Publication of JPS5488083A publication Critical patent/JPS5488083A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make easy the mask alignment and the detection of chip mark, by forming the reference line in prarllel with the facet of wafer on the mask in advance, in placing the mask on a given position on the wafer.
CONSTITUTION: The reference line 14 is formed on the position on the mask 11 corresponding to the facet of the wafer 12. In aligning the mask 11 and the wafer 12, when the reference line 14 and the faset 16 are made parallel, the position toward Y direction of the chip mark 13 in each chip is within slight error range, and the chip mark 13 can be detected by only scanning the pattern over somewhat broader range only toward X before the objective pattern is exposed with electron beams. Accordingly, in detecting the chip mark 13 with electron beams, very narrow range can be scanned and exposed, and the region on the wafer to form the circuit can not be exposed.
COPYRIGHT: (C)1979,JPO&Japio
JP15678977A 1977-12-26 1977-12-26 Manufacture for semiconductor device Pending JPS5488083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15678977A JPS5488083A (en) 1977-12-26 1977-12-26 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15678977A JPS5488083A (en) 1977-12-26 1977-12-26 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5488083A true JPS5488083A (en) 1979-07-12

Family

ID=15635333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15678977A Pending JPS5488083A (en) 1977-12-26 1977-12-26 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5488083A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014091603A1 (en) * 2012-12-13 2017-01-05 富士機械製造株式会社 Viscous fluid printing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014091603A1 (en) * 2012-12-13 2017-01-05 富士機械製造株式会社 Viscous fluid printing device

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