JPS6453545A - Semiconductor substrate having alignment mark and alignment using said mark - Google Patents
Semiconductor substrate having alignment mark and alignment using said markInfo
- Publication number
- JPS6453545A JPS6453545A JP62210606A JP21060687A JPS6453545A JP S6453545 A JPS6453545 A JP S6453545A JP 62210606 A JP62210606 A JP 62210606A JP 21060687 A JP21060687 A JP 21060687A JP S6453545 A JPS6453545 A JP S6453545A
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- alignment marks
- mark
- wafer
- marks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To correct a position to be aligned by a method wherein, in a semiconductor substrate where an alignment mark used for alignment of a wafer with a reticle has been formed, at least three alignment marks are arranged inside a region on the water to be aligned with the reticle. CONSTITUTION:Four wafer alignment marks 6a, 6b, 6c, 6d are arranged symmetrically; however, it is enough if at least three or more wafer alignment marks are arranged inside one shot on a wafer. The alignment marks refer to the marks with which both a position in X coordinates and a position in Y coordinates can be identified by referring to one mark. Accordingly, if the alignment marks for X coordinates use are separated from those for Y coordinates use, at least three marks are required for X use and for Y use, respectively. It is preferable that a position of the wafer alignment marks is away from the center of a shot from a viewpoint that an error in a reduction magnification and an error in a reticle rotation are measured; the measuring accuracy of the errors is enhanced. In addition, the wafer alignment marks are situated at an edge inside the shot, it becomes easy to manufacture a reticle of a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62210606A JPS6453545A (en) | 1987-08-25 | 1987-08-25 | Semiconductor substrate having alignment mark and alignment using said mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62210606A JPS6453545A (en) | 1987-08-25 | 1987-08-25 | Semiconductor substrate having alignment mark and alignment using said mark |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6453545A true JPS6453545A (en) | 1989-03-01 |
Family
ID=16592109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62210606A Pending JPS6453545A (en) | 1987-08-25 | 1987-08-25 | Semiconductor substrate having alignment mark and alignment using said mark |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453545A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122473A (en) * | 1993-10-21 | 1995-05-12 | Nikon Corp | Exposure method |
| JPH0875542A (en) * | 1994-09-05 | 1996-03-22 | Otsuka Denshi Kk | Method for measuring quantity of light for display pixel, and method and apparatus for inspecting display screen |
| JP2020506433A (en) * | 2017-02-03 | 2020-02-27 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Pattern placement correction method |
-
1987
- 1987-08-25 JP JP62210606A patent/JPS6453545A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122473A (en) * | 1993-10-21 | 1995-05-12 | Nikon Corp | Exposure method |
| JPH0875542A (en) * | 1994-09-05 | 1996-03-22 | Otsuka Denshi Kk | Method for measuring quantity of light for display pixel, and method and apparatus for inspecting display screen |
| JP2020506433A (en) * | 2017-02-03 | 2020-02-27 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Pattern placement correction method |
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