JP2008091776A - Printed board unit, combined printed board unit, method for manufacturing printed board unit, method for manufacturing combined printed board unit, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed board unit or combined printed board unit which has excellent electric characteristics at high frequency and high reliability, to provide a method for manufacturing the printed board unit or method for manufacturing the combined printed board unit in which a positioning and surface mounting of an electric wire component can be self-aligningly and easily carried out at a high accuracy, and to provide an electric apparatus mounting the printed board unit or combined printed board unit. <P>SOLUTION: The printed board unit 1 comprises a printed board 10 having a signal terminal 11 for the surface mounting, and an electric wire component 20 having an electric wire 21 formed with an electric wire terminal 22 for the surface mounting connected to the signal terminal 11. A surface mounting assisting member 30 for assisting in mounting the electric wire component 20 to the printed board 10, and the electric wire component 20 are positioned for locking. The surface mounting assisting member 30 has an assisting member board 31 which abuts on the electric wire component 20 for locking, and a connecting part 32 which is connected to a mounting board 15 on a face opposite to the mounting board 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a printed circuit board unit in which a printed circuit board and an electric wire component are connected and a manufacturing method thereof, a set printed circuit board unit in which two printed circuit boards are connected by an electric wire component, a manufacturing method thereof, and a printed circuit board unit / an assembled printed circuit board unit. The present invention relates to an electronic device equipped with.

  In electronic devices that support high-frequency wireless signals such as mobile phones, wire components that can be electromagnetically shielded and compatible with high frequency by wiring three-dimensionally between printed circuit boards in order to reduce size and weight and achieve high-density mounting. The application of has increased.

  Conventionally, an electric wire component having a connector such as an electric wire with a connector, a coaxial electric wire with a connector, or a flexible substrate with a connector has been applied to the connection between the printed board and the printed board. Further, as a connector to which a connector is not applied, a rigid flex substrate in which a flexible substrate and a rigid substrate are combined is used.

  The state of application of the conventional electric wire parts will be described with reference to FIGS.

  9A and 9B are explanatory views for explaining a printed circuit board unit according to Conventional Example 1. FIG. 9A is a plan view, FIG. 9B is a side view taken along arrow B in FIG. 9A, and FIG. It is a side view in the state where electric wire parts were bent according to arrow Rot.

  A printed circuit board unit (assembled printed circuit board unit) in which the printed circuit boards 110 are connected to each other by an electric wire component 120, and the electric wire component 120 is constituted by an electric wire with a connector provided with a connector 125 and a coaxial electric wire with a connector.

  10A and 10B are explanatory views for explaining a printed circuit board unit according to Conventional Example 2. FIG. 10A is a plan view, FIG. 10B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow Rot.

  This is a printed circuit board unit (assembled printed circuit board unit) in which the printed circuit boards 210 are connected to each other by an electric wire component 220, and the electric wire component 220 is constituted by a flexible substrate with a connector provided with a connector 225.

  11A and 11B are explanatory diagrams for explaining a printed circuit board unit according to Conventional Example 3. FIG. 11A is a plan view, FIG. 11B is a side view taken along arrow B in FIG. 11A, and FIG. It is a side view in the state where electric wire parts were bent according to arrow Rot.

  A printed circuit board unit (assembled printed circuit board unit) in which the printed circuit boards 310 are connected to each other by an electric wire component 320. The printed circuit board 310 is formed of a rigid printed circuit board (rigid portion). ). That is, the printed circuit board unit is composed of a rigid flex printed circuit board.

  When connecting with a connector-attached cable, a connector-equipped coaxial cable (conventional example 1), or a connector-equipped flexible board (conventional example 2), the electrical connection is unstable because the electrical connection is made by contact of the connector. Therefore, there was a problem in reliability. Further, since the connector is mechanically fitted and connected, there is a problem that the mechanical strength of the connection becomes unstable.

  When connecting with a flexible board with connectors and a flex part (conventional example 3), the pattern width and pattern interval will vary due to the etching process that forms the flexible board, resulting in unstable electrical characteristics at high frequencies. was there. Further, since the entire circumference of the signal pattern cannot be surrounded by the shielding pattern structurally, there is a problem in the electromagnetic shielding performance. Moreover, since the inner layer structure of the rigid part and the structure of the flex part are formed of an integral conductor or insulator, there is a problem that the electrical performance and mechanical performance at the flex part cannot be given the highest priority.

  In addition, there are cases where electric wire components are inserted and connected to through-holes on printed circuit boards, but at present, most of the mounting of components on printed circuit boards is surface mounting, and a dedicated machine for automatically mounting inserted components. There was a problem that would be necessary. Further, it is conceivable to manually insert the electric wire parts into the through holes, but there is a problem that it takes more time than necessary. Further, when a coaxial cable is inserted, there is a problem that a necessary connection cannot be made by simply inserting and soldering since the cable has a double structure.

  When surface-mounting a wire component on a printed circuit board, the cable part of the wire component is soft and comes into contact with the printed circuit board, generating a moving frictional force. There was a problem of difficulty. Further, since the cable portion of the electric wire component is soft and the entire electric wire component cannot be floated with respect to the solder of the connecting portion, there is a problem that the operation due to the self-aligned contraction force is hindered. Further, since the number of terminals is small with respect to the weight of the electric wire component, there is a problem that sufficient self-alignment power cannot be obtained.

  In addition, lead-free solder, which is required to be adopted as an environmental measure, has a problem that the self-alignment shrinkage force is small because the surface tension is small, and sufficient self-alignment power cannot be obtained.

Patent Document 1 discloses a technique for performing self-alignment (self-alignment) by self-alignment contraction force using surface tension at the time of melting of solder paste.
Japanese Utility Model Publication No. 7-42960

  The present invention has been made in view of such a situation, and by using a surface-mounted printed circuit board as an electric wire terminal for surface mounting, a highly reliable printed circuit board unit having excellent electrical characteristics at high frequency or An object is to provide a printed circuit board unit.

  Further, the present invention locks the electric wire component to the surface mounting auxiliary member, and positions the electric wire component by placing the surface mounting auxiliary member on which the electric wire component is locked on the mounting substrate juxtaposed on the printed circuit board. Another object of the present invention is to provide a printed circuit board unit manufacturing method or a set printed circuit board unit manufacturing method capable of easily performing surface mounting in a self-aligned manner with high accuracy.

  Another object of the present invention is to provide a highly reliable electronic device having excellent electrical characteristics at high frequencies by mounting the printed circuit board unit or the assembled printed circuit board unit according to the present invention to provide an electronic device. And

  The printed circuit board unit according to the present invention is a printed circuit board unit including a printed circuit board having a signal terminal and an electric wire component having an electric wire terminal connected to the signal terminal, wherein the signal terminal and the electric wire terminal are surface-mounted. The electric wire terminal is surface-mounted on the signal terminal.

  With this configuration, the connection between the printed circuit board (signal terminal) and the electric wire component (electric wire terminal) is aligned with high accuracy, excellent electrical characteristics and mechanical strength, and high reliability can be realized.

  Moreover, the assembled printed circuit board unit according to the present invention includes two printed circuit boards each having a signal terminal, and an electric wire component having an electric wire terminal connected to the signal terminal of each of the two printed circuit boards. The signal terminal and the wire terminal are for surface mounting, and the wire terminal is surface-mounted on the signal terminal.

  With this configuration, the connection between the two printed circuit boards (signal terminals) and the wire components (wire terminals) that connect them is aligned with high accuracy, and the electrical characteristics and mechanical strength are excellent, and high reliability is achieved. Can do.

  In addition, a printed circuit board unit manufacturing method according to the present invention manufactures a printed circuit board unit including a printed circuit board having a signal terminal for surface mounting and an electric wire component having an electric wire terminal connected to the signal terminal by surface mounting. A method for manufacturing a printed circuit board unit, comprising: a wire component locking step of locking the wire component to a surface mounting auxiliary member that assists surface mounting of the wire component; and the surface mounting auxiliary member in which the wire component is locked Auxiliary member placement step of placing the electric wire terminal on the placement substrate juxtaposed on the printed circuit board in correspondence with the position where the wire terminal is connected to the signal terminal, and the surface mounting auxiliary member as described above And a wire component mounting step of mounting the wire terminal on the printed circuit board in a state of being mounted on the printed circuit board.

  With this configuration, it is possible to easily perform positioning and surface mounting of wire components (wire terminals) on a printed circuit board (signal terminals) in a simple process with high accuracy and with high electrical characteristics and mechanical strength. And a highly reliable printed circuit board unit can be manufactured with high productivity.

  The printed circuit board unit manufacturing method according to the present invention includes an auxiliary member removing step of removing the surface mount auxiliary member after the electric wire component mounting step.

  With this configuration, the electric wire component can be accurately surface-mounted on the printed board with high accuracy, and the original function as the electric wire component can be reliably performed.

  In the printed circuit board unit manufacturing method according to the present invention, the mounting board is removed in the auxiliary member removing step.

  With this configuration, a printed circuit board unit can be manufactured with high productivity.

  Moreover, in the printed circuit board unit manufacturing method according to the present invention, the surface mounting auxiliary member includes an auxiliary member substrate that supports the electric wire component, and the auxiliary member substrate is disposed in front of a surface facing the mounting substrate. It has the connection part connected with the board | substrate for description.

  With this configuration, it is possible to easily and reliably position the electric wire component on the printed circuit board (signal terminal) with high accuracy by generating a self-aligning contraction force by the connecting portion.

  In the printed circuit board unit manufacturing method according to the present invention, the auxiliary member substrate has a temporary fixing portion that temporarily fixes the electric wire component on a surface facing the electric wire component.

  With this configuration, the electric wire component can be easily positioned with high accuracy on the auxiliary member substrate (printed substrate), and the surface mounting auxiliary member can be easily removed.

  In the printed circuit board unit manufacturing method according to the present invention, the temporary fixing portion is formed of an adhesive tape.

  With this configuration, the electric wire component can be temporarily fixed to the surface mounting auxiliary member with a simple and inexpensive configuration, and the manufacturing process can be simplified.

  Moreover, in the printed circuit board unit manufacturing method according to the present invention, the connecting portion is composed of an auxiliary soldering land disposed on the auxiliary member substrate, and the auxiliary soldering land is used as the mounting substrate described above. It is characterized by being soldered to.

  With this configuration, the self-alignment shrinkage force between the connecting portion and the mounting substrate can be easily generated using the surface tension of the solder, so that the surface mounting auxiliary member can be self-aligned with a simple and inexpensive configuration. Thus, the electric wire component can be easily and reliably positioned (surface mounted) with respect to the printed circuit board.

  Moreover, in the printed circuit board unit manufacturing method according to the present invention, the mounting board is formed together with the printed circuit board, extends from the printed circuit board, and is held by a holding unit.

  With this configuration, since the surface mounting auxiliary member can be arranged on the mounting board formed together with the printed board, the surface mounting auxiliary member can be arranged easily and with high productivity.

  In the printed circuit board unit manufacturing method according to the present invention, the mounting board is disposed between the two printed circuit boards arranged side by side.

  With this configuration, it is possible to secure a stable mounting substrate, and thus it is possible to manufacture a printed circuit board unit with high productivity.

  In the printed circuit board unit manufacturing method according to the present invention, the mounting board includes a connecting soldering land to be soldered to the auxiliary soldering land.

  With this configuration, the self-alignment contraction force due to the surface tension of the solder is generated reliably, and the positioning of the surface mounting auxiliary member and the mounting board is performed easily and reliably, and the wire terminal and the signal terminal are accurately connected. It becomes possible to do.

  Moreover, the assembled printed circuit board unit manufacturing method according to the present invention includes two printed circuit boards each having a signal terminal for surface mounting, and an electric wire terminal connected to the signal terminal of each of the two printed circuit boards by surface mounting. A printed circuit board unit manufacturing method for manufacturing a printed circuit board unit comprising an electric wire component, wherein the printed circuit board unit manufacturing method according to the present invention is used.

  With this configuration, it is possible to easily and highly accurately manufacture a printed circuit board unit having excellent electrical characteristics and mechanical strength and high reliability.

  The electronic device according to the present invention is an electronic device equipped with a printed circuit board unit in which a printed circuit board and an electric wire component are connected, and the printed circuit board unit is the printed circuit board unit or the assembled printed circuit board unit according to the present invention. It is characterized by being.

  With this configuration, since an inexpensive and highly reliable printed circuit board unit or assembled printed circuit board unit is mounted, an inexpensive and highly reliable electronic device is obtained.

  According to the printed circuit board unit and the assembled printed circuit board unit according to the present invention, the signal terminal of the printed circuit board and the wire terminal of the electric wire component are for surface mounting, and the electric wire terminal is surface mounted on the signal terminal. Connection with high accuracy, excellent electrical characteristics and mechanical strength, and high reliability can be achieved.

  Moreover, according to the printed circuit board unit manufacturing method and the assembled printed circuit board unit manufacturing method according to the present invention, the surface mounting auxiliary member on which the electric wire component is locked is mounted on the mounting substrate juxtaposed on the printed circuit board. There is an effect that positioning and surface mounting of the electric wire component (electric wire terminal) with respect to the printed circuit board (signal terminal) can be easily performed with high accuracy in a self-aligning manner.

  In addition, according to the electronic apparatus according to the present invention, since an inexpensive and highly reliable printed board unit and assembled printed board unit are mounted, it is possible to provide an inexpensive and highly reliable electronic apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
A printed circuit board unit, an assembled printed circuit board unit, and a manufacturing method thereof according to Embodiment 1 of the present invention will be described with reference to FIGS.

  FIG. 1 is an explanatory view for explaining a method of manufacturing a printed circuit board unit and a set printed circuit board unit according to Embodiment 1 of the present invention, in which an electric wire component is locked to a surface mounting auxiliary member and surface-mounted on the printed circuit board. It is a top view which shows a state roughly. FIG. 2 is a side view showing a state seen from the arrow X direction of FIG. FIG. 3 is a plan view showing a state in which the printed circuit board unit and the assembled printed circuit board unit are completed by removing the surface mounting auxiliary member shown in FIG. FIG. 4 is a side view showing a state seen from the arrow X direction of FIG.

  A printed circuit board unit 1 according to the present invention includes a printed circuit board 10 and an electric wire component 20. Further, the assembled printed circuit board unit 2 according to the present invention connects the two printed circuit boards 10 (printed circuit boards 10f and 10s. When there is no need to distinguish between them, the printed circuit board 10 may be used) to connect them. It is comprised with the electric wire component 20. FIG. Further, the printed circuit board 10 in the manufacturing process is configured to be held by a holding unit 16 formed together with the printed circuit board 10 and connected to the mounting board 15 at an appropriate position.

  The printed circuit board 10 has a wiring pattern formed on the surface, and has a signal terminal 11 and a board shield terminal 12 as a part of the wiring pattern. The electric wire component 20 has an electric wire 21, and the electric wire 21 has an electric wire terminal 22 connected to the signal terminal 11. The electric wires 21 are arranged side by side in a flat plate shape in order to use a general conducting wire whose conductor is covered with an insulator for surface mounting.

  The electric wire 21 is not limited to a general conductive wire (single wire, stranded wire), and may be any type of electric wire such as a coaxial electric wire, a flat electric wire, or a film-like electric wire using a flexible substrate. Moreover, it is preferable that it is as a strip | belt shape which connected the some electric wire 21 mutually, and was integrated, or the film shape which formed the some electric wire 21 simultaneously on the film board | substrate. Since the electric wire 21 is used, it is possible to ensure excellent electrical characteristics with respect to high frequencies.

  The signal terminal 11 and the wire terminal 22 are configured for surface mounting, and the wire terminal 22 is surface-mounted on the signal terminal 11. Moreover, the electric wire component 20 is made into the structure which can make the surface mounting by converging the electric wire 21. FIG. That is, the wire terminal 22 as the terminal of the wire 21 is packaged and fixed in a planar shape (for example, a package by a resin mold) by the wire converging portion 23, and is disposed in a planar shape corresponding to the signal terminal 11. Soldered with solder 11s.

  The electric wire converging part 23 has an electric wire shield terminal 24 for securing the shield of the electric wire 21, and the electric wire shield terminal 24 is soldered to the board shield terminal 12 formed at a corresponding position of the printed board 10 with solder 12 s. It is. Since the board shield terminal 12 is arranged close to the electric wire terminal 22, it is possible to eliminate the electromagnetic influence from the outside and to obtain a highly reliable printed board unit 1 and assembled printed board unit 2. Moreover, since the wire shield terminal 24 is formed integrally with the wire converging portion 23, the mechanical strength of the wire component 20 can be secured and the reliability can be improved.

  In the printed circuit board unit 1 and the assembled printed circuit board unit 2 according to the present embodiment, since the printed circuit board 10 and the electric wire component 20 are connected by surface mounting, they can be easily connected with high accuracy in a self-aligning manner. Thus, the electrical characteristics and mechanical strength are excellent, and high reliability can be ensured.

  Next, a printed circuit board unit manufacturing method and a printed circuit board unit manufacturing method for manufacturing the printed circuit board unit 1 and the assembled printed circuit board unit 2 will be described.

  The mounting substrate 15 is held by a holding portion 16 that is formed together with the printed substrate 10 and extended from the printed substrate 10. The printed board 10, the mounting board 15, and the holding unit 16 can be formed simultaneously in the same process, and the mounting board 15 is juxtaposed with the printed board 10. The mounting board 15 is appropriately formed between the printed board 10f and the printed board 10s so as to include a position where the electric wire component 20 is disposed.

  Since the mounting board 15 arranged between the juxtaposed printed boards 10 has good stability, the printed board unit 1 and the assembled printed board unit 2 can be manufactured with high productivity and high reliability. Become. Further, since the surface mounting auxiliary member 30 can be arranged on the mounting board 15 formed together with the printed board 10, the surface mounting auxiliary member 30 can be arranged easily and with high productivity.

  First, the surface mounting auxiliary member 30 that assists the surface mounting of the electric wire component 20 and the electric wire component 20 are positioned and locked (electric wire component locking step). The surface mounting auxiliary member 30 includes an auxiliary member substrate 31 and a connecting portion 32. The auxiliary member substrate 31 contacts and locks the electric wire component 20 (the electric wire 21). The connecting portion 32 is formed on the surface of the auxiliary member substrate 31 that faces the mounting substrate 15 and is connected to the mounting substrate 15. That is, the auxiliary member substrate 31 is configured to support the electric wire component 20 and define the position.

  The positioning of the electric wire component 20 and the surface mounting auxiliary member 30 can be easily performed by forming appropriate position marks on both the electric wire component 20 (electric wire 21) and the surface mounting auxiliary member 30. For locking the electric wire component 20 and the surface mounting auxiliary member 30, various locking means such as an adhesive tape (described later), screws, clips, and the like can be used.

  On the mounting board 15, soldering lands 17 for connection that can be formed together with the signal terminals 11, the board shield terminals 12, and the like are arranged in correspondence with the connection portions 32. The connecting portion 32 is preferably configured as an auxiliary soldering land, and the connecting soldering land 17 is preferably soldered to the auxiliary soldering land.

  Before the surface mounting auxiliary member 30 is placed on the placement board 15, a solder paste is previously applied to the printed board 10 (signal terminals 11 and board shield terminals 12) and the placement board 15 (connection soldering lands 17). Apply (solder paste application process). Moreover, it is preferable to apply a solder paste to the connecting portion 32 (auxiliary soldering land) in advance.

  After applying the solder paste to the signal terminal 11, the board shield terminal 12, the connecting soldering land 17, and the connecting portion 32, the wire terminal 22 connects the surface mounting auxiliary member 30 to which the wire component 20 is locked to the signal terminal 11. It mounts on the mounting board | substrate 15 juxtaposed to the printed circuit board 10 corresponding to the position to be performed (auxiliary member mounting process).

  In a state where the surface mounting auxiliary member 30 is placed on the placement board 15, the wire terminals 22 are surface-mounted on the printed board 10 (signal terminals 11) (wire component mounting step). That is, in a state where the electric wire component 20, the surface mounting auxiliary member 30, and the mounting substrate 15 are arranged so as to overlap each other, heat treatment is performed on the printed circuit board 10 to reflow the solder. By solder reflow, the wire terminal 22 of the locked wire component 20 can be aligned with the signal terminal 11 (printed circuit board 10) in a self-aligned manner and connected (surface mounted).

  The applied solder paste generates a self-alignment contraction force that serves as a self-alignment power based on the surface tension of the solder melted by the reflow of the solder. In particular, since the connecting portion 32 (auxiliary soldering land) and the connecting soldering land 17 are configured to have a larger area than the signal terminal 11, a large surface tension can be obtained. Therefore, even when lead-free solder is used as an environmental measure, a large self-aligned shrinkage force can be obtained, and lead-free solder can be applied.

  That is, since the connecting portion 32 (auxiliary soldering land) is soldered and adsorbed to the mounting substrate 15 (connecting soldering land 17) via the solder 17s, the connecting portion 32 (auxiliary soldering). The self-aligned contraction force between the land and the mounting substrate 15 (the connecting soldering land 17) can be easily generated with a simple and inexpensive configuration.

  By soldering the connecting portion 32 (auxiliary soldering land) and the mounting substrate 15 (connecting soldering land 17), the surface mounting auxiliary member 30 (as a result, the electric wire component 20) is mounted on the mounting substrate 15. (As a result, it is possible to align with the printed circuit board 10 in a self-aligning manner. Therefore, the electric wire component 20 (electric wire terminal 22) can be easily and reliably positioned with high accuracy and self-alignment with respect to the printed circuit board 10 (signal terminal 11).

  After the electric wire component mounting step, the surface mounting auxiliary member 30 is removed (auxiliary member removing step), and the printed circuit board unit 1 and the assembled printed circuit board unit 2 are completed. By removing the surface mounting auxiliary member 30, it is possible to reliably perform the original function as the electric wire component 20.

  Moreover, it is preferable to remove the mounting substrate 15 together with the surface mounting auxiliary member 30 in the auxiliary member removing step. The mounting substrate 15 can be separated and removed from the printed circuit board 10 by cutting along the cutting line CL corresponding to the separation hole 16 h formed in the holding portion 16. The cutting can be performed by an appropriate die punching process or a manual process. It is preferable from the viewpoint of process simplification that the surface mounting auxiliary member 30 is separated from the electric wire component 20 by cutting the mounting substrate 15 from the printed circuit board 10 along the cutting line CL and then removing the mounting substrate 15. .

  That is, the printed circuit board unit 1 and the assembled printed circuit board unit 1 with high productivity can be obtained by removing the mounting board 15 and the surface mounting auxiliary member 30 which are not necessary in the printed circuit board unit 1 and the assembled printed circuit board unit 2 as finished products. 2 (FIG. 3, FIG. 4) is manufactured.

  As described above, according to the present embodiment, it is possible to easily perform positioning and surface mounting of the electric wire component 20 on the printed circuit board 10 with high accuracy, with a simple process, excellent electrical characteristics and mechanical strength, and reliability. The printed circuit board unit 1 and the assembled printed circuit board unit 2 can be manufactured with high productivity.

  Moreover, it becomes easy to make the electric wire 21 into a coaxial electric wire, and it can connect the coaxial electric wire to the printed circuit board 10, and can comprise the printed circuit board unit 1 and the assembly printed circuit board unit 2 excellent in the electrical property of high frequency.

  In addition, since it is possible to apply lead-free solder, it is possible to obtain the printed circuit board unit 1 and the assembled printed circuit board unit 2 having environment-friendly specifications.

<Embodiment 2>
A printed circuit board unit, an assembled printed circuit board unit, and a manufacturing method thereof according to Embodiment 2 of the present invention will be described with reference to FIGS. Differences from the first embodiment will be mainly described.

  FIG. 5 is a plan view schematically showing a state in which a plurality of printed circuit board units and assembled printed circuit board units according to Embodiment 2 of the present invention are formed on a base material printed circuit board. FIG. 6 is a plan view showing a state in which the printed circuit board unit and the assembled printed circuit board unit shown in FIG. 5 are cut from the base material printed circuit board and completed.

  In the present embodiment, four printed circuit boards 10 are arranged on the base material printed circuit board 40, and two printed circuit board units 2 are configured with two printed circuit boards 10 in pairs. A holding portion 16 is formed between the base material printed board 40 and the printed board 10, and a placement board 15 is arranged between the paired printed boards 10. As in the first embodiment, a holding unit 16 is disposed between the printed board 10 and the mounting board 15. In FIG. 5, the surface mounting auxiliary member 30 is not shown.

  After the surface mounting of the signal terminal 11 and the electric wire terminal 22 is finished, the holding unit 16 is cut to separate the printed circuit board 10 from the base material printed circuit board 40 (discarding unit 41). Substrate unit 2 (FIG. 6) is formed. The discarding part 41 is configured to surround the periphery of the printed circuit board 10 in a frame shape, and is configured to ensure the accuracy and strength of the printed circuit board 10. Moreover, the mounting substrate 15 can improve productivity and reduce costs by diverting the discarding portion 41.

  According to the present embodiment, a large number of printed circuit boards 10 can be arranged to form a plurality of set printed circuit board units 2 (printed circuit board units 1), so that productivity can be improved. The assembled printed circuit board unit 2 may be configured to include three or more printed circuit boards 10 and two or more electric wire components 20. That is, the assembled printed circuit board unit 2 only needs to include at least two printed circuit boards 10 and at least one electric wire component 20 that connects them.

<Embodiment 3>
Based on FIG. 7, the printed circuit board unit, the assembled printed circuit board unit, and the manufacturing method thereof according to Embodiment 3 of the present invention will be described. Differences from the first and second embodiments will be mainly described.

  7A and 7B are explanatory views for explaining a surface mounting auxiliary member used when manufacturing the printed circuit board unit and the assembled printed circuit board unit according to the third embodiment of the present invention. FIG. 7A is a plan view, and FIG. The side view at the arrow X of (A) when it is set as Example 1, (C) is the side view at the arrow X of (A) when it is set as Example 2. FIG.

  The surface mounting auxiliary member 30 includes the auxiliary member substrate 31 and the connecting portion 32 as described in the first and second embodiments. A temporary fixing portion 33 is formed on the surface on which the auxiliary member substrate 31 abuts against the electric wire 21. The temporary fixing portion 33 can be a member having a structure that is appropriately attached to the electric wire 21. Since the temporary fixing configuration is adopted, the electric wire component 20 can be easily positioned with high accuracy on the auxiliary member substrate 31 (surface mounting auxiliary member 30), and the surface mounting auxiliary member 30 can be easily removed.

  In the present embodiment, an adhesive tape is applied as the temporary fixing portion 33. That is, an adhesive tape is affixed to the auxiliary member substrate 31, and the electric wire 21 is easily locked. By applying the adhesive tape, the electric wire 21 (electric wire component 20) can be easily locked to the auxiliary member substrate 31 with high accuracy by an inexpensive configuration, and the surface mounting auxiliary member 30 is easily removed (auxiliary member removing step). Thus, the manufacturing process can be simplified, and the manufacturing process can be made inexpensively and with good productivity. In addition to the adhesive tape, for example, a combination of minute irregularities may be applied.

  In Example 1 (FIG. 1B), the auxiliary member substrate 31 is formed of a metal plate. Accordingly, the connecting portion 32 is configured as an auxiliary soldering land 32a in which the metal plate is exposed by using the resin film 34 having a pattern opposite to that of the connecting portion 32 as a mask. The resin film 34 can be formed of, for example, a solder resist. In other words, since the auxiliary member substrate 31 is a metal plate, the connection portion 32 cannot be formed by soldering to the entire surface unless a mask is applied. Therefore, the portion other than the connection portion 32 is not attached with solder.

  In Example 2 (FIG. (C)), the auxiliary member substrate 31 is formed of a resin base material. Accordingly, the connecting portion 32 is configured as an auxiliary soldering land 32b patterned with a metal film. That is, since the auxiliary member substrate 31 is a resin base material, the auxiliary soldering land 32b for soldering is formed of a metal film. As a metal film, it is possible to apply the copper foil applied with a normal printed circuit board as it is.

  In addition, since it becomes possible to ensure flatness by comprising the auxiliary member board | substrate 31 with a metal plate and a resin base material, the flatness of the electric wire component 20 is ensured and positioning with respect to the printed circuit board 10 of the electric wire component 20 is ensured. Can be performed with high accuracy.

<Embodiment 4>
Based on FIG. 8, the manufacturing method (manufacturing process) of the printed circuit board unit and the assembled printed circuit board unit according to Embodiment 4 of the present invention will be described. Since the basic configuration is the same as that of the first to third embodiments, the description thereof will be omitted as appropriate.

  FIG. 8 is a flowchart showing the flow of the manufacturing process in the method for manufacturing the printed circuit board unit and the assembled printed circuit board unit according to Embodiment 4 of the present invention.

Step S1:
The printed circuit board 10 is prepared (printed circuit board preparation process). The printed circuit board 10 can be in the form of the base material printed circuit board 40 shown in the second embodiment, for example. A thing in which the soldering land 17 for connection is previously formed is applied to the discard portion 41 corresponding to the mounting substrate 15. The connecting soldering lands 17 can be formed simultaneously with the wiring pattern (not shown), the signal terminals 11 and the board shield terminals 12 formed on the printed board 10. As described above, the wire component 20 can be positioned in a self-aligned manner with respect to the printed circuit board 10 by the connecting soldering lands 17.

  In addition, for example, the present invention can be applied to a double-sided rigid printed circuit board and other printed circuit boards. Similar processing steps are possible.

Step S2:
After step S1, the electric wire component 20 is prepared (electric wire component preparation step).

  For example, the electric wire component 22 which can respond to surface mounting is prepared by connecting the electric wire terminal 22 corresponding to surface mounting to the electric wire 21, and resin-sealing the electric wire terminal 22 and forming the electric wire convergence part 23.

Step S3:
After step S2, the surface mounting auxiliary member 30 is attached to the electric wire component 20 (electric wire component locking step).

  For example, the temporary fixing portion 33 attached to the surface of the auxiliary member substrate 31 constituting the surface mounting auxiliary member 30 is positioned and attached to the electric wire component 20. The auxiliary member substrate 31 is preliminarily formed with connecting portions 32 (auxiliary soldering lands 32a and 32b).

  In addition, the surface mounting auxiliary member 30 can be attached to the electric wire component 20 in advance in the electric wire component preparation step.

Step S4:
After step S3, a solder paste is applied to the printed circuit board 10 (signal terminal 11, board shield terminal 12) and the mounting board 15 (connection soldering land 17) (solder paste application process).

  The solder paste can be applied by applying screen printing, for example.

Step S5:
After step S <b> 4, the signal terminal 11 and the electric wire terminal 22 are visually aligned, and the surface mounting auxiliary member 30 is placed on the placement board 15. That is, the surface mounting auxiliary member 30 to which the electric wire component 20 is locked is placed on the placement board 15 juxtaposed on the printed board 10 in correspondence with the position where the electric wire terminal 22 is connected to the signal terminal 11 (auxiliary. Member placing step).

  By the auxiliary member placing step, the connecting portion 32 (auxiliary soldering lands 32a, 32b) of the surface mounting auxiliary member 30 is aligned with the placement substrate 15 (the connecting soldering land 17), and the electric wire component 20 Is mounted on the printed circuit board 10 and the mounting substrate 15.

  The surface mounting auxiliary member 30 is configured to be easily removable after the electric wire component 20 is mounted on the printed circuit board 10.

Step S6:
After step S5, in a state where the surface mounting auxiliary member 30 is placed on the placement board 15, the whole of the base material printed board 40 is accommodated in, for example, a reflow furnace and subjected to heat treatment to reflow the solder, and the electric wire component 20 (electric wire terminal 22, electric wire shield terminal 24) is surface-mounted on printed circuit board 10 (signal terminal 11, substrate shield terminal 12) (electric wire component mounting step).

  By reflowing the solder, a self-alignment contraction force due to the surface tension of the molten solder acts between the connecting soldering land 17 and the auxiliary soldering lands 32a and 32b. The electric wire component 20 can be positioned and connected to the printed circuit board 10 in a self-aligning manner as power for alignment.

Step S7:
After step S6, the discarded portion 41 of the base material printed board 40 is removed (a discarded portion removing step). Removal of the discarding portion 41 can be appropriately performed by, for example, die punching or manual processing. In addition, when removing the discard part 41, it is preferable to set it as the process of removing the surface mounting auxiliary member 30 together.

  Through the above steps S1 to S7, the highly reliable printed circuit board unit 1 or the assembled printed circuit board unit 2 that secures electrical characteristics and mechanical strength can be easily manufactured with high productivity.

<Embodiment 5>
The electronic device (not shown) according to the present embodiment is an electronic device on which the printed circuit board unit 1 or the assembled printed circuit board unit 2 according to the first to fourth embodiments is mounted.

  In other words, an electronic apparatus including a printed circuit board unit in which a printed circuit board and an electric wire component are connected, and the printed circuit board unit 1 in which the printed circuit board 10 as the printed circuit board and the electric wire component 20 as the electric cable component are connected, or the assembly print The electronic device is equipped with the substrate unit 2.

  With this configuration, it is possible to provide an inexpensive and highly reliable electronic device with excellent electrical characteristics at high frequencies because it is equipped with a printed board unit or assembled printed circuit board unit that has excellent electrical characteristics at high frequencies and is inexpensive and highly reliable. be able to.

  Note that electronic devices include communication terminals such as mobile phones that are required to have excellent electrical characteristics at high frequencies and to be small and light.

It is explanatory drawing explaining the manufacturing method of the printed circuit board unit which concerns on Embodiment 1 of this invention, and a set printed circuit board unit, and is the state which latched the electric wire component to the surface mounting auxiliary member, and was surface-mounted on the printed circuit board. FIG. It is a side view which shows the state seen from the arrow X direction of FIG. It is a top view which shows the state which removed the surface mounting auxiliary member shown in FIG. 1, and completed the printed circuit board unit and the assembly printed circuit board unit. It is a side view which shows the state seen from the arrow X direction of FIG. FIG. 6 is a plan view schematically showing a state in which a plurality of printed circuit board units and assembled printed circuit board units according to Embodiment 2 of the present invention are formed on a base material printed circuit board. FIG. 6 is a plan view showing a state where the printed board unit and the assembled printed board unit shown in FIG. 5 are cut from a base printed board and completed. It is explanatory drawing explaining the surface mounting auxiliary member used when manufacturing the printed circuit board unit and assembled printed circuit board unit which concern on Embodiment 3 of this invention, (A) is a top view, (B) is Example 1 and FIG. (A) is a side view at arrow X, and (C) is a side view at arrow X in (A) when Example 2 is used. It is a flowchart which shows the flow of the manufacturing process in the manufacturing method of the printed circuit board unit which concerns on Embodiment 4 of this invention, and a set printed circuit board unit. It is explanatory drawing explaining the printed circuit board unit which concerns on the prior art example 1, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is the arrow Rot of (B). It is a side view in the state where electric wire parts were bent according to. It is explanatory drawing explaining the printed circuit board unit which concerns on the prior art example 2, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is the arrow Rot in (B). It is a side view in the state where electric wire parts were bent according to. It is explanatory drawing explaining the printed circuit board unit which concerns on the prior art example 3, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is the arrow Rot of (B). It is a side view in the state where electric wire parts were bent according to.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board unit 2 Set printed circuit board unit 10, 10f, 10s Printed circuit board 11 Signal terminal 11s Solder 12 Board shield terminal 12s Solder 15 Mounting board 16 Holding part 16h Separation hole 17 Soldering land for connection 17s Solder 20 Electric wire component 21 Electric wire 22 Electric wire terminal 23 Electric wire converging portion 24 Electric wire shield terminal 30 Surface mount auxiliary member 31 Auxiliary member substrate 32 Connecting portion 32a Auxiliary soldering land 32b Auxiliary soldering land 33 Temporary fixing portion (adhesive tape)
40 Base material printed circuit board 41 Discarded part CL Cutting line

Claims (14)

A printed circuit board unit comprising a printed circuit board having a signal terminal and an electric wire component having an electric wire terminal connected to the signal terminal,
The printed circuit board unit, wherein the signal terminal and the wire terminal are for surface mounting, and the wire terminal is surface-mounted on the signal terminal. A printed circuit board unit comprising two printed circuit boards each having a signal terminal and an electric wire component having an electric wire terminal connected to the signal terminal of each of the two printed circuit boards,
The assembled printed circuit board unit, wherein the signal terminal and the wire terminal are for surface mounting, and the wire terminal is surface-mounted on the signal terminal. A printed circuit board unit manufacturing method for manufacturing a printed circuit board unit comprising a printed circuit board having a signal terminal for surface mounting and an electric wire component having an electric wire terminal connected to the signal terminal by surface mounting,
An electric wire component locking step of locking the electric wire component to a surface mounting auxiliary member for assisting surface mounting of the electric wire component;
Auxiliary member placement step of placing the surface mount auxiliary member, on which the electric wire component is locked, on a placement substrate juxtaposed on the printed circuit board in correspondence with a position where the electric wire terminal is connected to the signal terminal. When,
A printed circuit board unit manufacturing method comprising: an electric wire component mounting step of mounting the surface of the electric wire terminal on the printed circuit board in a state where the surface mounting auxiliary member is mounted on the mounting board.   The printed circuit board unit manufacturing method according to claim 3, further comprising an auxiliary member removing step of removing the surface mounting auxiliary member after the electric wire component mounting step.   The printed circuit board unit manufacturing method according to claim 4, wherein the mounting board is removed in the auxiliary member removing step.   The surface mounting auxiliary member has an auxiliary member substrate that supports the electric wire component, and the auxiliary member substrate has a connecting portion that is connected to the mounting substrate on a surface facing the mounting substrate. The method for manufacturing a printed circuit board unit according to claim 3, wherein:   The printed circuit board unit manufacturing method according to claim 6, wherein the auxiliary member substrate has a temporary fixing portion that temporarily fixes the electric wire component on a surface facing the electric wire component.   The method for manufacturing a printed circuit board unit according to claim 7, wherein the temporary fixing portion is made of an adhesive tape.   The connecting portion is constituted by an auxiliary soldering land disposed on the auxiliary member substrate, and the auxiliary soldering land is soldered to the mounting substrate. The printed circuit board unit manufacturing method according to any one of claims 6 to 8.   The printed circuit board according to any one of claims 3 to 9, wherein the mounting board is formed together with the printed board, extends from the printed board, and is held by a holding unit. Unit manufacturing method.   The printed circuit board unit manufacturing method according to claim 10, wherein the placement board is disposed between the two printed boards placed side by side.   The printed circuit board unit manufacturing method according to any one of claims 9 to 11, wherein the mounting board includes a connecting soldering land to be soldered to the auxiliary soldering land. . A set printed board for manufacturing a set printed board unit comprising two printed boards each having a signal terminal for surface mounting, and a wire component having a wire terminal connected to the signal terminal of each of the two printed boards by surface mounting A substrate unit manufacturing method comprising:
13. A printed circuit board unit manufacturing method comprising the printed circuit board unit manufacturing method according to claim 3.   An electronic device including a printed circuit board unit in which a printed circuit board and an electric wire component are connected, wherein the printed circuit board unit is the printed circuit board unit according to claim 1 or the assembled printed circuit board unit according to claim 2. Electronic equipment characterized by

Images