JP2005251857A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To appropriately mount an electronic component on a printed circuit board by preventing the positional deviations of the terminals of the component from the terminal fixing section of the circuit board. <P>SOLUTION: The printed circuit board 100 is provided with a plurality of oval pads P to which the terminals 11 of the mounted electronic component 10 are brought into contact and fixed. The pads P are provided on at least two radiating lines passing through the mounting center C of the component 10, and arranged to face each other on both sides of the mounting center C so that the lengthwise directions of the pads P may lie upon each radial line. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a printed circuit board for mounting an electronic component such as an LSI and a method for manufacturing the printed circuit board.

Conventionally, a printed circuit board on which electronic parts such as LSI (Large Scale Integration) are mounted is known, and pin-type terminals of the electronic parts are inserted into the printed circuit board, and a predetermined adhesive such as solder paste A hole is formed for fixing the terminal via the pin.
In recent years, in order to support high-density mounting, BGA (Ball Grid Array) type electronic components having ball type terminals instead of pin type terminals have been developed. In a printed circuit board for components, a pad such as a copper foil is formed at a portion where a terminal of an electronic component abuts (for example, refer to Patent Document 1).

Furthermore, for example, an automatic mounting apparatus is used for mounting electronic components on the printed circuit board. In this case, the component mounting position and the component center position (mounting center) on the printed circuit board are set and registered in the automatic mounting apparatus. According to this, the electronic components are mounted.
JP-A-8-78807

By the way, in order to adjust the error of the position where the terminal fixing part such as the hole and the pad is formed on the printed circuit board, and to increase the contact area of the pad in order to improve the connection strength with the terminal, the dimension of the terminal fixing part Need to be larger. Here, it is conceivable to make the shape of the terminal adhering portion circular, but in order to prevent interference between the terminal adhering portions, there is a limit to the area expansion, which is not appropriate. For this reason, in a printed circuit board for mounting an electronic component in which a plurality of terminals are formed on each side across the center, the terminal fixing portion has a substantially oval shape or a substantially rectangular shape, and the longitudinal direction thereof is an electron. The terminal fixing portion is formed so as to be substantially parallel to the direction extending over the both edge portions of the component. Thereby, the freedom degree of the wiring design on a printed circuit board can be improved.
However, in the case of the above-described printed circuit board, since the terminal fixing portion is disposed substantially in parallel, the contact position of the terminal of the electronic component is likely to shift in the longitudinal direction of the terminal fixing portion when mounting the electronic component, There is a problem that the mounting cannot be performed properly.

  An object of the present invention is to provide a printed circuit board and a printed circuit board manufacturing method capable of preventing the positional displacement of the terminals of the electronic component with respect to the terminal fixing portion of the printed circuit board and thereby appropriately mounting the electronic component. Is to provide.

The printed circuit board (100, 200, 300, 400, 500, 600, 700) of the invention according to claim 1 is, for example, as shown in FIG.
Provided with a plurality of substantially oval or substantially rectangular terminal fixing portions (for example, pads P) to which the terminals (11) of the electronic component (10) to be mounted are contacted or inserted to fix the terminals,
The terminal fixing portion is provided on at least two radiations passing through the mounting center (C) of the electronic component, and is opposed to the mounting center so that the longitudinal direction of the terminal fixing portion substantially overlaps each radiation. Are arranged.

According to the first aspect of the present invention, the substantially oval or substantially rectangular terminal fixing portion is provided on at least two radiations passing through the mounting center of the electronic component, and the terminal fixing portion of each of the radiations is provided. Since they are arranged facing each other across the mounting center so that their longitudinal directions overlap, the terminals are fixed to these terminal fixing parts, and a self-alignment effect that draws electronic components to the mounting center occurs. Thus, it is possible to suppress both the positional deviation of the terminal with respect to the predetermined direction of the printed circuit board and the positional deviation with respect to the direction orthogonal to the predetermined direction.
As described above, it is possible to prevent the position of the terminal of the electronic component from being displaced with respect to the terminal fixing portion of the printed circuit board, thereby appropriately mounting the electronic component.

The invention according to claim 2 is the printed circuit board according to claim 1, for example, as shown in FIGS.
The terminals (11, 21, 31) are formed in a ball shape,
The terminal fixing portion (pad P) is a pad with which the ball-type terminal is brought into contact.

  According to the second aspect of the present invention, it is obvious that the same effect as the first aspect of the invention can be obtained. In particular, the terminal fixing portion is a pad with which a ball-type terminal of an electronic component is contacted. Therefore, the so-called BGA (Ball Grid Array) type electronic component can be suitably prevented from being displaced, and the electronic component can be mounted appropriately.

The invention according to claim 3 is the printed circuit board according to claim 1, for example, as shown in FIGS.
The terminals (61, 71) are formed in a pin shape,
The terminal adhering portion (hole H) is a hole into which the pin-type terminal is inserted.

  According to the third aspect of the present invention, it is possible to obtain the same effect as the first aspect of the invention. In particular, the terminal fixing portion is a hole into which a pin-type terminal of an electronic component is inserted. Since it is a part, the position shift of the electronic component which has a pin-type terminal can be prevented suitably, and the said electronic component can be mounted appropriately.

For example, as shown in FIG. 6 and FIG.
Printed circuit board (600) having a plurality of substantially oval or substantially rectangular terminal fixing portions (for example, hole portions H) to which the terminals (61) of the electronic component (60) to be mounted are brought into contact or inserted to be fixed. ) Manufacturing method,
Forming the terminal fixing portion on the substrate G so as to face each other across the mounting center on at least two radiations passing through the mounting center (C) of the electronic component so that the longitudinal directions thereof substantially overlap each other. It is a feature.

According to the fourth aspect of the present invention, it is possible to manufacture a printed circuit board provided with a terminal fixing portion that produces a self-alignment effect that draws an electronic component toward the mounting center. That is, a substantially oval or substantially rectangular terminal fixing portion is provided on at least two radiations that pass through the mounting center of the electronic component, and the mounting center is such that the longitudinal direction of the terminal fixing portion substantially overlaps each radiation. Since the terminals are fixed to these terminal fixing portions, both the positional deviation of the terminal with respect to the predetermined direction of the printed circuit board and the positional deviation with respect to the direction orthogonal to the predetermined direction are fixed. Can be suppressed.
As described above, it is possible to prevent the position of the terminal of the electronic component from being displaced relative to the terminal fixing portion of the printed circuit board, and thus it is possible to provide a printed circuit board capable of appropriately mounting the electronic component.

According to the first aspect of the present invention, when the terminal is fixed to the terminal fixing portion, a self-alignment effect is generated such that the electronic component is drawn toward the mounting center, and the terminal with respect to the predetermined direction of the printed circuit board. Both misalignment and misalignment with respect to a direction orthogonal to the predetermined direction can be suppressed.
As described above, it is possible to prevent the position of the terminal of the electronic component from being displaced with respect to the terminal fixing portion of the printed circuit board, thereby appropriately mounting the electronic component.

  According to the second aspect of the present invention, it is possible to suitably prevent positional deviation of a so-called BGA (Ball Grid Array) type electronic component, and it is possible to appropriately mount the electronic component.

  According to the third aspect of the present invention, it is possible to suitably prevent positional deviation of an electronic component having a pin-type terminal, and it is possible to appropriately mount the electronic component.

According to the fourth aspect of the present invention, it is possible to manufacture a printed circuit board provided with a terminal fixing portion that produces a self-alignment effect that draws an electronic component toward the mounting center. That is, by fixing the terminal to the terminal fixing portion, it is possible to suppress both the positional deviation of the terminal with respect to the predetermined direction of the printed circuit board and the positional deviation with respect to the direction orthogonal to the predetermined direction.
As described above, it is possible to prevent the position of the terminal of the electronic component from being displaced relative to the terminal fixing portion of the printed circuit board, and thus it is possible to provide a printed circuit board capable of appropriately mounting the electronic component.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.

[First embodiment]
FIG. 1 is a partially omitted plan view schematically showing a printed circuit board 100 exemplified as a first embodiment to which the present invention is applied. In FIG. 1, the outer shape of the electronic component 10 and the terminal 11 are indicated by broken lines, and the electronic component 10 is seen through.
The printed circuit board 100 of the present embodiment is for mounting an electronic component (not shown) such as an LSI (Large Scale Integration), for example, and on the surface of the printed circuit board 100, as shown in FIG. An ellipse-shaped pad that contacts the terminals 11 corresponding to each terminal 11 of the BGA (Ball Grid Array) type electronic component 10 having the ball-shaped terminals 11 and is fixed via a predetermined fixing agent. A plurality of (terminal fixing portions) P are provided.
That is, the printed circuit board 100 on which the substantially center C1 of the electronic component 10 is overlapped so that the electronic component 10 having the plurality of terminals 11 formed on the respective sides across the substantially center C1 can be mounted. The same number of pads P as the terminals 11 (for example, 15 pads on each side) are formed on each side (for example, the left and right sides in FIG. 1) sandwiching 100 mounting centers C. More specifically, each pad P is provided on a plurality of radiations (three are indicated by dotted lines in FIG. 1) passing through the mounting center C, and the longitudinal direction of the pads P substantially overlaps each radiation. In this way, they are arranged to face each other across the mounting center C.

  Here, each pad P is comprised from the material which has electroconductivity at least, and is specifically comprised from the copper foil etc. Furthermore, the dimensions of each pad P may be appropriately changed according to, for example, the dimensions of the terminals 11 of the electronic component 10 and the printed circuit board 100.

Further, the arrangement, the number, the shape, and the like of the pad P on the printed circuit board 100 may be arbitrarily changed as appropriate.
Below, the modification of the printed circuit board 100 of 1st embodiment is demonstrated.
Here, FIGS. 2 to 5 schematically show the printed circuit boards of the respective modifications. 2 and 3, the external shapes of the electronic components 20 and 30 and the terminals 21 and 31 are indicated by broken lines, and the electronic components 20 and 30 are seen through.

<Modification 1>
As shown in FIG. 2, in the printed circuit board 200 of the first modification, a plurality (15 in FIG. 2, for example) are respectively provided on the upper and lower sides in addition to the left and right sides sandwiching the mounting center C. .., So that the electronic component 20 provided with a plurality of terminals 21 on each of the upper, lower, left and right sides of the substantially center C2 can be mounted.

<Modification 2>
As shown in FIG. 3, the printed circuit board 300 according to the second modification is provided on each of a plurality of ball-type terminals 31,... Arranged on the back surface side of the BGA-type electronic component 30 at a substantially equal interval in a lattice shape. Correspondingly, pads P,... Are formed on the surface of the printed circuit board 300. Even in this printed circuit board 300, the pads are arranged in substantially the same arrangement as in the above-described embodiment, that is, on at least two radiations passing through the mounting center C where the substantial center C3 of the electronic component 30 is superimposed. A plurality of pads P are arranged facing each other across the mounting center C so that the longitudinal directions of P overlap.

<Modification 3>
As shown in FIG. 4, the printed circuit board 400 of Modification 3 has a pad P formed in a substantially rectangular shape, and further has a pin-type terminal 41 extending from the side end surface portion. For example, a QFP (Quad Flat Package) type or PLCC (Plastic Leaded Chip Carrier) type electronic component 40 can be mounted. Even in this printed circuit board 400, a plurality of pads P,... Are arranged with substantially the same arrangement configuration as in the above-described embodiment. Specifically, the printed board 400 is substantially annular with a mounting center C (not shown) as the center. They are arranged side by side.

<Modification 4>
As shown in FIG. 5, the printed circuit board 500 according to the modified example 4 includes the pads P having substantially the same shape as that of the modified example 3. For example, the outer shape is formed in a substantially rectangular parallelepiped shape. An SOP (Small Outline Package) type or TSOP (Thin Small Outline Package) type electronic component 50 in which a pin type terminal 51 extends from the end face portion can be mounted.

As described above, according to the printed circuit boards 100, 200, 300, 400, and 500 having the above-described configuration, the substantially elliptical or substantially rectangular pad P is substantially at the center of the electronic component 10 (20, 30, 40, 50). C1 (C2, C3) are provided on at least two radiations that pass through the mounting center C where they are overlapped, and are arranged to face each other across the mounting center C so that the longitudinal direction of the pad substantially overlaps each radiation. Therefore, when the terminals 11 (21, 31, 41, 51) are fixed to these pads P, a self-alignment effect that the electronic component 10 is attracted to the mounting center C is generated. The positional deviation of the printed circuit board 100 with respect to a predetermined direction (for example, the horizontal direction in FIG. 1) and a direction orthogonal to the predetermined direction (for example, the vertical direction in FIG. 1) The deviation of both positional deviation can be suppressed.
As described above, it is possible to prevent the positional deviation of the terminal 11 of the electronic component 10 with respect to the pad P of the printed circuit board 100, and thus the electronic component 10 can be mounted appropriately.

[Second Embodiment]
FIG. 6 is a partially omitted plan view schematically showing a printed board 600 exemplified as a second embodiment to which the present invention is applied. In FIG. 6, the outer shape of the electronic component 60 and the terminal 61 are indicated by broken lines, and the electronic component 60 is seen through.
As shown in FIG. 6, the printed circuit board 600 of the present embodiment has a hole H that penetrates the printed circuit board 600 on the front and back as a terminal fixed part to which the terminal 61 of the electronic component 60 is fixed. A plurality of terminals 61 are provided corresponding to the terminals 61.
That is, in the printed circuit board 600, as in the first embodiment, the electronic component is placed on each side (for example, the left and right sides in FIG. 6) sandwiching the mounting center C where the substantially center C6 of the electronic component 60 is superimposed. As many as 60 terminals 61 (for example, 5 holes on each side) are formed. The arrangement of the holes H is the same as that in the first embodiment.
Further, a thin film (described later; see FIGS. 8 and 9) made of a conductive material is formed on the edge and inner side surface of the hole H. Furthermore, the dimension of each hole H may be changed as appropriate according to the dimension of the terminal 61 of the electronic component 60 and the printed circuit board 600, for example.

In addition, arrangement | positioning, the number, shape, etc. in the printed circuit board of the hole H can be arbitrarily changed arbitrarily.
That is, as shown in FIG. 7, in the printed circuit board 700 of the modified example 5, in addition to the left and right sides sandwiching the mounting center C, a plurality of pieces are also provided on the upper and lower sides (for example, 5 pieces in FIG. )), And the electronic component 71 provided with a plurality of terminals 71 on each of the upper, lower, left and right sides with respect to the substantially center C7 can be mounted.
In FIG. 7, the outer shape of the electronic component 70 and the terminal 71 are indicated by broken lines, and the electronic component 70 is seen through.

  As described above, according to the printed circuit board 600 (700) having the above-described configuration, the terminal fixing portion is the hole H into which the pin type terminal 61 (71) is inserted. The positional shift of the component 60 can be suitably prevented, and the electronic component 60 can be mounted appropriately.

  In the second embodiment, the hole H has a structure penetrating the printed circuit board 600 (700) on the front and back surfaces, but is not limited to this. For example, the surface of the printed circuit board 600 is used. It may be a so-called half-through hole having a structure with a predetermined depth.

Next, a method for manufacturing a printed circuit board will be described with reference to FIGS.
In the following description, the printed circuit board 600 in which the hole H is formed as the terminal fixing portion will be exemplified and the manufacturing method thereof will be described.
Here, FIGS. 8 and 9 are diagrams for explaining each step of the method of manufacturing the printed circuit board 600. FIG.

First, a predetermined metal, for example, a thin film M1 such as copper is formed on the front and back surfaces of a glass substrate G having a predetermined size (see FIG. 8A).
Next, a hole H penetrating through the substrate G on the front and back sides is formed in the substrate G on which the copper thin film M1 is formed so that a predetermined position of a conductor pattern described later is formed (see FIG. 8B). Specifically, the electronic components (not shown) to be mounted are opposed to each other across the mounting center so that the longitudinal direction overlaps the radiation passing through the mounting center of the board G where the approximate centers of the electronic components (not shown) are overlapped. A hole H is formed in

  Subsequently, electrolytic copper plating (chemical copper plating) M2 is formed on the entire surface of the substrate G (see FIG. 8C). Thereby, electrolytic copper plating M2 is performed on the inner side surface of the hole H, and the copper thin film M1 on the front surface side of the substrate G and the copper thin film M2 on the back surface side are electrically connected.

Next, in forming a conductor pattern on the surface of the substrate G, a resist layer R such as a laminated photosensitive film is formed on a portion other than the conductor pattern in order to form a solder plating M3 for inhibiting etching described later on the surface of the substrate G. (See FIG. 8D). Here, the resist layer R may be formed using a screen printing technique.
Subsequently, solder plating M3 is applied to the substrate G (see FIG. 9A). As a result, the solder plating M3 is formed only on the portion of the substrate G other than the portion where the resist layer R is formed.

Thereafter, the resist layer R of the substrate G is removed (see FIG. 9B), and subsequently, the electrolytic copper plating M2 and the copper laminated on the portions other than the portion where the solder plating M3 is formed by etching. The thin film M1 is removed (see FIG. 9C).
Next, by removing the solder plating M3 of the substrate G (see FIG. 9D), a printed circuit board 600 having a conductor pattern formed on the surface of the substrate G is obtained.
According to the printed circuit board 600 manufactured by such a manufacturing method, as in the first and second embodiments, the terminal is fixed to the hole H, so that the electronic component 60 is placed at the mounting center C. As a result, a self-alignment effect that can be drawn is generated, and the positional deviation of the terminal 61 of the electronic component 60 with respect to the hole H of the printed circuit board 600 can be prevented. Therefore, the electronic component 60 can be properly mounted.

  After manufacturing, if necessary, a solder resist may be applied to protect the conductor pattern, a predetermined plating may be applied to protect the hole H, and a predetermined character or the like is printed. You may do it.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, the electronic components mounted on the printed circuit board 100 or the like are not limited to those exemplified above, and any electronic components may be used as long as they have terminals that can be fixed to terminal fixing portions such as pads P and hole portions H. There may be.

1 is a partially omitted plan view schematically showing a printed circuit board exemplified as a first embodiment to which the present invention is applied. FIG. 6 is a partially omitted plan view schematically showing Modification 1 of the printed circuit board according to the first embodiment. FIG. 6 is a partially omitted plan view schematically showing Modification Example 2 of the printed circuit board of the first embodiment. FIG. 6 is a partially omitted perspective view schematically showing Modification Example 3 of the printed circuit board according to the first embodiment. FIG. 6 is a partially omitted perspective view schematically showing Modification Example 4 of the printed circuit board according to the first embodiment. It is a partially omitted plan view schematically showing a printed circuit board exemplified as a second embodiment to which the present invention is applied. FIG. 10 is a partially omitted plan view schematically showing a modified example 5 of the printed circuit board of the second embodiment. It is a figure for demonstrating each process of the manufacturing method of the printed circuit board of 2nd embodiment. It is a figure which shows the continuation of the manufacturing method of the printed circuit board of FIG.

Explanation of symbols

100, 200, 300, 400, 500, 600, 700 Printed circuit board G Board P Pad (terminal fixing part)
H Hole (terminal fixing part)
C Mounting center 10, 20, 30, 40, 50, 60, 70 Electronic components 11, 21, 31, 41, 51, 61, 71 Terminals

Claims (4)

A plurality of substantially oval or substantially rectangular terminal fixing portions to which the terminals of the electronic component to be mounted are contacted or inserted to be fixed;
The terminal fixing portion is provided on at least two radiations that pass through the mounting center of the electronic component, and is arranged to face each other with the mounting center interposed therebetween so that the longitudinal direction of the terminal fixing portion substantially overlaps each radiation. Printed circuit board. The terminal is formed in a ball shape,
The printed circuit board according to claim 1, wherein the terminal fixing portion is a pad with which the ball-type terminal is brought into contact. The terminal is formed in a pin shape,
The printed circuit board according to claim 1, wherein the terminal fixing portion is a hole portion into which the pin-type terminal is inserted. A method of manufacturing a printed circuit board comprising a plurality of substantially oval or substantially rectangular terminal fixing portions to which terminals of electronic components to be mounted are contacted or inserted to fix the terminals,
The terminal fixing portion is formed on a substrate so as to face each other across the mounting center on at least two radiations passing through the mounting center of the electronic component so that their longitudinal directions substantially overlap each other. A method for manufacturing a substrate.

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