JPH0669625A - Mounting method for capacitor - Google Patents
Mounting method for capacitorInfo
- Publication number
- JPH0669625A JPH0669625A JP21992292A JP21992292A JPH0669625A JP H0669625 A JPH0669625 A JP H0669625A JP 21992292 A JP21992292 A JP 21992292A JP 21992292 A JP21992292 A JP 21992292A JP H0669625 A JPH0669625 A JP H0669625A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- printed wiring
- capacitor
- wiring board
- aluminum substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は面実装技術に係り、コン
デンサの実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting technique, and more particularly to a method for mounting a capacitor.
【０００２】[0002]
【従来の技術】ハイブリッドＩＣや面実装技術を用いた
プリント配線基板へのセラミックコンデンサの実装は、
プリント配線基板、セラミック基板、アルミ基板等に直
接半田付けすることにより行われていた。コンデンサの
サイズが、長さ＝２ｍｍ、幅＝１．２５ｍｍ、厚み＝１
ｍｍ程度の比較的小さいものの場合は特に問題はない
が、長さ＝５．７ｍｍ、幅＝２．７ｍｍ、厚み＝１．８
ｍｍ程度と大きいものの場合、アルミ基板或いはプリン
ト配線基板に実装した際に、これら基板とセラミックコ
ンデンサの熱膨張係数が大幅に異なるため、大きな熱ス
トレスが加わるとセラミックコンデンサが割れてしまう
という現象が発生する。2. Description of the Related Art Mounting a ceramic capacitor on a printed wiring board using a hybrid IC or surface mounting technology is
It is performed by directly soldering to a printed wiring board, a ceramic board, an aluminum board, or the like. Capacitor size is length = 2mm, width = 1.25mm, thickness = 1
There is no particular problem in the case of a relatively small size of about mm, but length = 5.7 mm, width = 2.7 mm, thickness = 1.8.
When the size is as large as about mm, when mounted on an aluminum board or a printed wiring board, the coefficient of thermal expansion of these boards and the ceramic capacitors are significantly different, so there is a phenomenon that the ceramic capacitors will crack when large thermal stress is applied. To do.
【０００３】[0003]
【発明が解決しようとする課題】本発明はこのような点
に鑑みなされたもので、例えば、長さ＝５．７ｍｍ、幅
＝２．７ｍｍ、厚み＝１．８ｍｍ程度の大きなサイズの
コンデンサをアルミ基板或いはプリント配線基板に実装
した場合においても、熱膨張係数の大幅な差によりコン
デンサーが割れることのないコンデンサの実装方法を提
供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and for example, a large-sized capacitor having a length of 5.7 mm, a width of 2.7 mm, and a thickness of 1.8 mm is provided. Provided is a method for mounting a capacitor which does not crack even when mounted on an aluminum substrate or a printed wiring board due to a large difference in thermal expansion coefficient.
【０００４】[0004]
【課題を解決するための手段】本発明は上述の課題を解
決するため、セラミックコンデンサをアルミ基板若しく
はプリント配線基板に半田付けにより実装するものにお
いて、開口部を形成し、この開口部を挟んだ両側に前記
セラミックコンデンサの電極部に対応する銅箔パターン
を設けたフレキシブル基板に、前記セラミックコンデン
サを前記開口部を跨ぐように実装した後、このフレキシ
ブル基板を前記アルミ基板若しくはプリント配線基板に
実装してなることを特徴とする。In order to solve the above problems, the present invention mounts a ceramic capacitor on an aluminum substrate or a printed wiring board by soldering, forming an opening and sandwiching the opening. After mounting the ceramic capacitor on the flexible substrate provided with copper foil patterns corresponding to the electrode portions of the ceramic capacitor on both sides so as to straddle the opening, the flexible substrate is mounted on the aluminum substrate or the printed wiring board. It is characterized by
【０００５】[0005]
【作用】以上のように構成したので、本発明によるコン
デンサの実装方法においては、セラミックコンデンサを
フレキシブル基板を介してアルミ基板若しくはプリント
配線基板に実装することにより、セラミックコンデンサ
とアルミ基板若しくはプリント配線基板の熱膨張量の差
は、軟らかく、撓み易いフレキシブル基板にある程度吸
収され、更にこのフレキシブル基板に開口部を形成する
ことにより、前記熱膨張量の差をより確実に吸収するこ
とができる。With the above construction, in the method of mounting a capacitor according to the present invention, the ceramic capacitor is mounted on the aluminum substrate or the printed wiring board through the flexible substrate, so that the ceramic capacitor and the aluminum substrate or the printed wiring board are mounted. The difference in the amount of thermal expansion is absorbed to some extent by the flexible substrate that is soft and easily bent, and by forming an opening in this flexible substrate, the difference in the amount of thermal expansion can be more reliably absorbed.
【０００６】[0006]
【実施例】以下、図面に基づいて本発明による実施例を
詳細に説明する。図１は本発明によるコンデンサの実装
方法の一実施例であるフレキシブル基板の要部平面図で
あり、図２は本発明によるコンデンサの実装方法の一実
施例の要部断面図である。図において、１はアルミ基板
若しくはプリント配線基板で、このアルミ基板若しくは
プリント配線基板１には銅箔パターン７が設けられてい
る。２はポリアミド系のフレキシブル基板２で、このフ
レキシブル基板２の両側に設けた接続ランド部９と前記
銅箔パターン７が半田付けされて、半田部分８を形成し
ている。また、前記フレキシブル基板２には、開口部５
を形成し、この開口部５を挟んだ両側にセラミックコン
デンサ３の電極部１０に対応するように前記接続ランド
部９と繋がった銅箔パターンからなる電極ランド部４を
設けてある。セラミックコンデンサ３はこの開口部５を
跨ぐようにして両側の電極ランド部４に半田付けされ
て、半田部分６を形成している。セラミックコンデンサ
３をアルミ基板若しくはプリント配線基板１に実装する
には、まずフレキシブル基板２の電極ランド部４をメタ
ルマスクを用いて半田印刷処理し、セラミックコンデン
サ３の電極部１０を前記フレキシブル基板２に設けた開
口部５を跨ぐようにして、対応して設けた電極ランド部
４に搭載した後、リフローにより半田付け処理を行う。
さらに、アルミ基板若しくはプリント配線基板１の銅箔
パターン部７の所要部分をメタルマスクを用いて半田印
刷処理し、前記のセラミックコンデンサ３が実装された
フレキシブル基板２の接続ランド部９を前記銅箔パター
ン部７に搭載した後、リフローにより半田付け処理を行
う。セラミックコンデンサ３を開口部５を形成したフレ
キシブル基板２を介してアルミ基板若しくはプリント配
線基板１に実装することにより、アルミ基板若しくはプ
リン配線基板１は、セラミックコンデンサ３の熱膨張係
数の２．５〜３．５倍の熱膨張係数を有しているが、こ
の熱膨張係数の差はフレキシブル基板２によって吸収さ
れる。Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view of a main part of a flexible substrate which is an embodiment of a method for mounting a capacitor according to the present invention, and FIG. 2 is a cross-sectional view of a main part of an embodiment of a method for mounting a capacitor according to the present invention. In the figure, 1 is an aluminum substrate or a printed wiring board, and a copper foil pattern 7 is provided on the aluminum substrate or the printed wiring board 1. Reference numeral 2 is a polyamide-based flexible substrate 2, and the connection land portions 9 provided on both sides of the flexible substrate 2 and the copper foil pattern 7 are soldered to form a solder portion 8. In addition, the flexible substrate 2 has an opening 5
And the electrode land portions 4 made of a copper foil pattern connected to the connection land portions 9 are provided on both sides of the opening 5 so as to correspond to the electrode portions 10 of the ceramic capacitor 3. The ceramic capacitor 3 is soldered to the electrode lands 4 on both sides so as to straddle the opening 5 to form a solder portion 6. To mount the ceramic capacitor 3 on the aluminum substrate or the printed wiring board 1, first, the electrode land portion 4 of the flexible substrate 2 is solder-printed using a metal mask, and the electrode portion 10 of the ceramic capacitor 3 is mounted on the flexible substrate 2. After being mounted on the corresponding electrode land portion 4 so as to straddle the provided opening portion 5, soldering processing is performed by reflow.
Further, a required portion of the copper foil pattern portion 7 of the aluminum substrate or the printed wiring board 1 is solder-printed using a metal mask, and the connection land portion 9 of the flexible substrate 2 on which the ceramic capacitor 3 is mounted is connected to the copper foil. After mounting on the pattern portion 7, a soldering process is performed by reflow. By mounting the ceramic capacitor 3 on the aluminum substrate or the printed wiring board 1 through the flexible substrate 2 having the opening 5, the aluminum substrate or the printed wiring board 1 has a coefficient of thermal expansion of 2.5 to 5% of that of the ceramic capacitor 3. Although it has a thermal expansion coefficient of 3.5 times, the difference in the thermal expansion coefficient is absorbed by the flexible substrate 2.
【０００７】[0007]
【発明の効果】以上に説明したように、本発明によるコ
ンデンサの実装方法においては、セラミックコンデンサ
をフレキシブル基板を介してアルミ基板若しくはプリン
ト配線基板に実装することにより、セラミックコンデン
サとアルミ基板若しくはプリント配線基板の熱膨張量の
差は、軟らかく、撓み易いフレキシブル基板にある程度
吸収され、更にこのフレキシブル基板に開口部を形成す
ることにより、前記熱膨張量の差をより確実に吸収する
ことができので、熱ストレスによるセラミックコンデン
サの割れを防止することができる。As described above, in the method of mounting a capacitor according to the present invention, the ceramic capacitor is mounted on the aluminum substrate or the printed wiring board through the flexible substrate, so that the ceramic capacitor and the aluminum substrate or the printed wiring are mounted. The difference in the amount of thermal expansion of the substrate is soft and is absorbed to some extent by the flexible substrate that is easily bent, and by forming an opening in this flexible substrate, the difference in the amount of thermal expansion can be more reliably absorbed. It is possible to prevent the ceramic capacitor from cracking due to thermal stress.
【図１】本発明によるコンデンサの実装方法の一実施例
であるフレキシブル基板の要部平面図である。FIG. 1 is a plan view of a main part of a flexible substrate which is an embodiment of a method of mounting a capacitor according to the present invention.
【図２】本発明によるコンデンサの実装方法の一実施例
の要部断面図である。FIG. 2 is a cross-sectional view of essential parts of an embodiment of a method for mounting a capacitor according to the present invention.
１ アルミ基板若しくはプリント配線基板 ２ フレキシブル基板 ３ セラミックコンデンサ ４ 電極ランド部 ５ 開口部 ６ 半田部分 ７ 銅箔パターン ８ 半田部分 ９ 接続ランド部 １０ 電極部 1 Aluminum Board or Printed Wiring Board 2 Flexible Board 3 Ceramic Capacitor 4 Electrode Land 5 Opening 6 Solder Part 7 Copper Foil Pattern 8 Solder Part 9 Connection Land 10 Electrode
Claims (1)
くはプリント配線基板に半田付けにより実装するものに
おいて、開口部を形成し、この開口部を挟んだ両側に前
記セラミックコンデンサの電極部に対応する銅箔パター
ンを設けたフレキシブル基板に、前記セラミックコンデ
ンサを前記開口部を跨ぐように実装した後、このフレキ
シブル基板を前記アルミ基板若しくはプリント配線基板
に実装してなることを特徴とするコンデンサの実装方
法。1. A ceramic capacitor mounted on an aluminum substrate or a printed wiring board by soldering, an opening is formed, and a copper foil pattern corresponding to an electrode portion of the ceramic capacitor is formed on both sides of the opening. A method for mounting a capacitor, comprising: mounting the ceramic capacitor on a provided flexible substrate so as to straddle the opening, and then mounting the flexible substrate on the aluminum substrate or a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21992292A JPH0669625A (en) | 1992-08-19 | 1992-08-19 | Mounting method for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21992292A JPH0669625A (en) | 1992-08-19 | 1992-08-19 | Mounting method for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0669625A true JPH0669625A (en) | 1994-03-11 |
Family
ID=16743127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21992292A Pending JPH0669625A (en) | 1992-08-19 | 1992-08-19 | Mounting method for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0669625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011086197A1 (en) | 2010-12-20 | 2012-06-21 | Denso Corporation | ARRANGEMENT STRUCTURE FOR A CHIP TYPE ELECTRICAL ELEMENT AND ELECTRICAL ELEMENT OF THE CHIP TYPE ON A FLEXIBLE PLATINE |
| DE10218071B4 (en) * | 2001-04-25 | 2014-06-12 | Mitsubishi Denki K.K. | Capacitor module and this semiconductor device using |
-
1992
- 1992-08-19 JP JP21992292A patent/JPH0669625A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10218071B4 (en) * | 2001-04-25 | 2014-06-12 | Mitsubishi Denki K.K. | Capacitor module and this semiconductor device using |
| DE102011086197A1 (en) | 2010-12-20 | 2012-06-21 | Denso Corporation | ARRANGEMENT STRUCTURE FOR A CHIP TYPE ELECTRICAL ELEMENT AND ELECTRICAL ELEMENT OF THE CHIP TYPE ON A FLEXIBLE PLATINE |
| US8901686B2 (en) | 2010-12-20 | 2014-12-02 | Denso Corporation | Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board |
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