JPH0634283U - Capacitor mounting structure - Google Patents

Abstract

(57) [Summary] [Purpose] A ceramic capacitor mounting structure in which a ceramic capacitor is mounted on a substrate made of aluminum or the like, and the ceramic capacitor is mounted so as to straddle a slit provided on the substrate made of aluminum or the like. [Structure] 1 is a substrate made of aluminum or the like, a conductor land portion 2 is provided on the upper surface of the substrate 1 made of aluminum or the like, and further, at a position facing an intermediate portion of both electrode portions of a ceramic capacitor described later, Slits 3 perpendicular to the longitudinal direction of the ceramic capacitor are provided, 4 is a ceramic capacitor, and electrode portions 5 are provided on both sides of the ceramic capacitor 4.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to surface mounting technology, and relates to a mounting structure of a ceramic capacitor.

[0002]

[Prior art]

 Mounting of a ceramic capacitor on a printed wiring board using a hybrid IC or surface mounting technology has been performed by directly soldering to a printed wiring board, a ceramic substrate, an aluminum substrate or the like. If the size of the capacitor is relatively small, such as length = 2 mm, width = 1.25 mm, thickness = 1 mm, there is no particular problem, but length = 5.7 mm, width = 2.7 mm, thickness = 1. In the case of a large size of about 8 mm, when mounted on an aluminum board or a printed wiring board, the coefficient of thermal expansion of these boards and the ceramic capacitors are significantly different, so that a large thermal stress will cause the ceramic capacitors to crack. Occurs.

[0003]

[Problems to be solved by the device]

 The present invention has been made in view of such a point. For example, a large capacitor having a length of 5.7 mm, a width of 2.7 mm, and a thickness of 1.8 mm is mounted on an aluminum substrate or a printed wiring board. Even in such a case, it is possible to provide a ceramic capacitor mounting structure in which the capacitor does not crack due to a large difference in thermal expansion coefficient.

[0004]

[Means for Solving the Problems]

 In order to solve the above problems, the present invention comprises a ceramic capacitor having electrode portions on both ends and a substrate made of aluminum or the like having conductor lands on the upper surface. A slit perpendicular to the longitudinal direction of the ceramic capacitor is provided at a position facing the middle portion of both electrode parts, and the electrode part of the ceramic capacitor is formed so as to straddle the slit A and is made of a conductor such as aluminum. It is characterized by being mounted on the land part.

[0005]

[Action]

 With the above structure, in the mounting structure of the ceramic capacitor according to the present invention, the slits are provided on the substrate of aluminum or the like facing the intermediate portion of the electrode portion of the ceramic capacitor, so that Since the difference in the amount of thermal expansion of the substrate is absorbed by the slit, it is possible to prevent the ceramic capacitor from cracking due to thermal stress.

[0006]

【Example】

 Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. 1 is a plan view of an essential part of an embodiment of a mounting structure of a ceramic capacitor according to the present invention, and FIG. 2 is a plan view of an essential part of another embodiment of a mounting structure of a ceramic capacitor of the present invention. In the figure, 1 is a substrate made of aluminum or the like, a conductor land portion 2 is provided on the upper surface of the substrate 1 made of aluminum or the like, and a position facing an intermediate portion of both electrode portions of the ceramic capacitor described later. The slit 3 is provided at a right angle to the longitudinal direction of the ceramic capacitor, and 4 is a ceramic capacitor, and the electrode portions 5 are provided on both sides of the ceramic capacitor 4. In addition to the slits 3 provided on the substrate 1 made of aluminum or the like, by providing equivalent slits 6 on the outer sides of both electrode portions 5 of the ceramic capacitor 4, the same or higher effect is expected. You can do it. In order to mount the ceramic capacitor 4 on the substrate 1 made of aluminum or the like, first, a required portion of the conductor land portion 2 of the substrate 1 made of aluminum or the like is solder-printed using a metal mask, and both electrode portions of the ceramic capacitor 4 described above are printed. 5 is mounted on the conductor land portion 2 so as to straddle the slit 3 provided on the substrate 1 made of aluminum or the like, and then soldered by reflow treatment.

[0007]

[Effect of device]

 As described above, in the mounting structure of the ceramic capacitor according to the present invention, by providing the slit on the substrate of aluminum or the like facing the intermediate portion of the electrode part of the ceramic capacitor, the ceramic capacitor and the substrate of aluminum or the like are separated. Since the difference in the amount of thermal expansion is absorbed by the slit, it is possible to prevent the ceramic capacitor from cracking due to thermal stress.

[Brief description of drawings]

FIG. 1 is a plan view of an essential part of an embodiment of a method of mounting a capacitor according to the present invention.

FIG. 2 is a plan view of an essential part of another embodiment of a method for mounting a capacitor according to the present invention.

[Explanation of symbols]

 1 Substrate such as aluminum 2 Conductor land part 3 Slit 4 Ceramic capacitor 5 Electrode part 6 Slit

Claims (2)

[Scope of utility model registration request] 1. A ceramic capacitor having electrode portions provided on both ends thereof, and a substrate made of aluminum or the like having conductor land portions provided on an upper surface thereof. The substrate is made of aluminum or the like, and is provided at an intermediate portion between both electrode portions of the ceramic capacitor. A slit perpendicular to the longitudinal direction of the ceramic capacitor is provided at an opposing position, and the electrode portion of the ceramic capacitor is mounted on the conductor land portion of the substrate such as the aluminum so as to straddle the slit A. The mounting structure of the capacitor. 2. The capacitor mounting structure according to claim 1, wherein a slit is provided on the substrate made of aluminum or the like outside the electrode portion of the ceramic capacitor.