JPH0515469U - Solder printing structure - Google Patents
Solder printing structureInfo
- Publication number
- JPH0515469U JPH0515469U JP6187691U JP6187691U JPH0515469U JP H0515469 U JPH0515469 U JP H0515469U JP 6187691 U JP6187691 U JP 6187691U JP 6187691 U JP6187691 U JP 6187691U JP H0515469 U JPH0515469 U JP H0515469U
- Authority
- JP
- Japan
- Prior art keywords
- solder printing
- solder
- divided
- printing structure
- conductor land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 導体ランド部の中央部で、搭載部品の長手方
向に所要の幅の空白部を設け、２分割した半田印刷を形
成するような半田印刷構造。
【構成】 表面実装基板の導体ランド部１の上に、メタ
ルマスクを用いての半田印刷処理により２分割した半田
印刷部２を形成する。チップ部品の本体３の電極部４
は、導体ランド部の中央部に設けられた空白部を跨がる
ように２分割した半田印刷部２に搭載され、リフロー処
理により半田付けされる。
(57) [Summary] [Purpose] A solder printing structure in which a blank portion having a required width is provided in the central portion of a conductor land portion in the longitudinal direction of a mounted component to form solder printing divided into two. [Structure] On a conductor land portion 1 of a surface mounting substrate, a solder printing portion 2 divided into two is formed by a solder printing process using a metal mask. Electrode part 4 of body 3 of chip component
Is mounted on the solder printing unit 2 which is divided into two so as to straddle the blank portion provided in the central portion of the conductor land portion, and is soldered by the reflow process.
Description
【０００１】[0001]
本考案は半田印刷構造に係わり、半田印刷を形成するものに関する。 The present invention relates to a solder printing structure, and relates to a method for forming solder printing.
【０００２】[0002]
チップコンデンサ、チップ抵抗器などのように部品本体に電極を持つ表面実装 部品（チップ部品）の半田付けは、図２に示すように導体ランド部１の全面に半 田印刷処理を行い、半田印刷部１２に電極部４を置くようにチップ部品本体３を 搭載し、リフロー処理を行って半田付けを行っている。ところが、図３に示すよ うに半田の表面張力や半田フラックスから発生するガス等の影響により、チップ 部品本体３が一対の導体ランド部１のいずれか片側にて浮き上がり起立するる現 象（マンハッタン現象）が生じ、半田付け不良となる場合がある。 As shown in Fig. 2, soldering of surface mount components (chip components) such as chip capacitors and chip resistors that have electrodes on the component body is performed by solder printing on the entire surface of the conductor land 1. The chip component body 3 is mounted so that the electrode portion 4 is placed on the portion 12, and reflow processing is performed to perform soldering. However, as shown in FIG. 3, due to the influence of the surface tension of the solder and the gas generated from the solder flux, the chip component body 3 floats up on either side of the pair of conductor lands 1 (the Manhattan phenomenon). ) May occur, resulting in poor soldering.
【０００３】[0003]
本考案はこのような点に鑑みなされたもので、マンハッタン現象の発生を防止 するような半田印刷構造を提供するものである。 The present invention has been made in view of the above circumstances, and provides a solder printing structure capable of preventing the occurrence of the Manhattan phenomenon.
【０００４】[0004]
本考案は上述の課題を解決するために、導体ランド部の中央部で、搭載する部 品の長手方向に所要の幅の空白部を設け、２分割した半田印刷を形成するような 半田印刷構造を提供する。 In order to solve the above problems, the present invention provides a solder printing structure in which a blank portion having a required width is provided in the central portion of a conductor land portion in the longitudinal direction of a component to be mounted to form solder printing divided into two. I will provide a.
【０００５】[0005]
以上のように構成したので、本考案による半田印刷構造においては、２分割し た半田印刷を形成することにより、半田の表面張力の発生する箇所が分散し且つ 小さくなり、また半田フラックスから発生するガスの発生を低減出来るためマン ハッタン現象を防止することができる。 With the above-described structure, in the solder printing structure according to the present invention, by forming the solder printing divided into two, the places where the surface tension of the solder is generated are dispersed and reduced, and the solder flux is generated from the solder flux. Since the generation of gas can be reduced, the Manhattan phenomenon can be prevented.
【０００６】[0006]
以下、図面において本考案による半田印刷構造の実施例を詳細に説明する。図 １は本考案による半田印刷構造の一実施例の要部構成図である。図において、１ は表面実装基板の導体ランド部で、メタルマスク等を用いて半田印刷処理が行わ れて、導体ランド部１の中央部で、搭載する部品の長手方向に所要の幅の空白部 が設けられ、２分割した半田印刷部２が形成される。チップ部品本体３の電極部 ４は、上記空白部を跨がるように２分割された半田印刷部２に搭載され、しかる 後、リフロー処理を行うことにより半田付けされる。 Hereinafter, an embodiment of a solder printing structure according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view of a main part of an embodiment of a solder printing structure according to the present invention. In the figure, reference numeral 1 denotes a conductor land portion of a surface mount board, which is subjected to a solder printing process using a metal mask or the like and is a central portion of the conductor land portion 1 and is a blank portion having a required width in a longitudinal direction of a mounted component Is provided, and the solder printing portion 2 divided into two is formed. The electrode part 4 of the chip component body 3 is mounted on the solder printing part 2 which is divided into two so as to straddle the blank part, and then soldered by performing a reflow process.
【０００７】[0007]
以上説明したように、本考案による半田印刷構造においては、半田表面張力の 発生する箇所が分散し且つ小さくなり、また半田フラックスから発生するガスの 発生を低減することができるため、部品の立上がり、すなわちマンハッタン現象 を防止することが出来る。 As described above, in the solder printing structure according to the present invention, the places where the solder surface tension is generated are dispersed and small, and the generation of the gas generated from the solder flux can be reduced. That is, the Manhattan phenomenon can be prevented.
【図１】本考案による半田印刷構造の一実施例の要部構
成図である。FIG. 1 is a schematic view of a main part of an embodiment of a solder printing structure according to the present invention.
【図２】従来から使用されている半田印刷構造の一実施
例の要部構成図である。FIG. 2 is a main part configuration diagram of an example of a solder printing structure which has been conventionally used.
【図３】従来の半田印刷構造において発生するマンハッ
タン現象の要部構成図である。FIG. 3 is a main part configuration diagram of a Manhattan phenomenon that occurs in a conventional solder printing structure.
１ 導体ランド部 ２ 半田印刷部 ３ チップ部品本体 ４ 電極部 ５ 半田部 ６ 表面実装基板 1 Conductor Land 2 Solder Print 3 Chip Component Body 4 Electrode 5 Solder 6 Surface Mounted Board
Claims (1)
の長手方向に所要の幅の空白部を設け、２分割した半田
印刷を形成することを特徴とする半田印刷構造。1. A solder printing structure characterized in that a blank portion having a required width is provided in a central portion of a conductor land portion in a longitudinal direction of a component to be mounted, and solder printing divided into two is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187691U JPH0515469U (en) | 1991-08-06 | 1991-08-06 | Solder printing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187691U JPH0515469U (en) | 1991-08-06 | 1991-08-06 | Solder printing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0515469U true JPH0515469U (en) | 1993-02-26 |
Family
ID=13183775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6187691U Pending JPH0515469U (en) | 1991-08-06 | 1991-08-06 | Solder printing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0515469U (en) |
-
1991
- 1991-08-06 JP JP6187691U patent/JPH0515469U/en active Pending
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