JPH0379478U

JPH0379478U -

Info

Publication number: JPH0379478U
Application number: JP14096689U
Authority: JP
Priority date: 1989-12-04
Filing date: 1989-12-04
Publication date: 1991-08-13

Description

[Brief explanation of the drawing]

第１図ａ及びｂは本考案の一実施例による部品
はんだ付け状態を示す斜視図及び断面図、第２図
ａ及びｂは本実施例に用いるメタルマスク・スク
リーンの全体斜視図及び部分平面図、第３図ａな
いしｅは部品はんだ付け部の各種状態を示す図、
第４図ａ及びｂは本実施例によるはんだ付け部の
温度プロフアイルを示すグラフ及びその部位を示
す図、第５図ａ及びｂは従来のランドパターン形
状による部品はんだ付け状態を示す斜視図及び断
面図である。１，２１……メタルマスク・ランドパターン、
２，２２……プリント基板導体回路面上へのクリ
ームはんだ印刷状態、３，２３……クリームはん
だ上への部品搭載状態、４……余剰クリームはん
だ部分の無い印刷状態、５……メタルマスク・ス
クリーン、６……メタルマスク・スクリーンのラ
ンドパターン形状、７……理想的なはんだ接合状
態、８……部品の立ち、９……部品のずれ、１０
……はんだボールの発生、１１……部品のシヨー
ト、２４……余剰クリームはんだ部分の残る印刷
状態。 1A and 1B are a perspective view and a cross-sectional view showing parts soldered according to an embodiment of the present invention, and FIGS. 2A and 2B are an overall perspective view and a partial plan view of a metal mask/screen used in this embodiment. , FIGS. 3a to 3e are diagrams showing various states of soldering parts,
FIGS. 4a and 4b are graphs showing the temperature profile of the soldered part according to this embodiment and views showing the parts thereof, and FIGS. FIG. 1, 21...metal mask land pattern,
2, 22... Cream solder printed on the printed circuit board conductor circuit surface, 3, 23... Components mounted on the cream solder, 4... Printed state with no excess cream solder, 5... Metal mask/ Screen, 6... Land pattern shape of metal mask/screen, 7... Ideal solder joint condition, 8... Standing of component, 9... Misalignment of component, 10
. . . Occurrence of solder balls, 11. Shorting of parts, 24. Printing state in which excess cream solder remains.

補正平２．３．２０図面の簡単な説明を次のように補正する。明細書第８頁下から６行目乃至４行目の「第４
図ａ及びｂは………を示す図」を「第４図は本実
施例の作用を説明するための図」と訂正する。Amendment 2002.3.20 The brief description of the drawing is amended as follows. "4th line" from the 6th line to the 4th line from the bottom of page 8 of the specification
"Figures a and b are diagrams showing . . ." should be corrected to "Figure 4 is a diagram for explaining the operation of this embodiment."

Claims

[Scope of utility model registration request]

In a metal mask screen for soldering the electrodes of a chip part to the conductor circuit surface of a printed circuit board, the shape of the metal mask land pattern facing the mounting seat of the chip part opened on the screen is semicircular. A metal mask/land pattern shape for a chip component, characterized in that cream solder is printed only on a solder fillet forming portion that faces the electrode portion and includes at least the electrode portion.