JPH042065U - - Google Patents
Info
- Publication number
- JPH042065U JPH042065U JP4270490U JP4270490U JPH042065U JP H042065 U JPH042065 U JP H042065U JP 4270490 U JP4270490 U JP 4270490U JP 4270490 U JP4270490 U JP 4270490U JP H042065 U JPH042065 U JP H042065U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solder
- prevention means
- adhesion prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案に係るプリント基板の平面図、
第２図ははんだ付着後の第１図のＡ−Ａ線断面図
、第３図はプリント基板にリード端子をはんだ付
けした状態の第１図のＢ−Ｂ線断面図、第４図は
リード端子の斜視図、第５図は別実施例の平面図
、第６図ははんだ付着後の第５図のＣ−Ｃ線断面
図、第７図はプリント基板にリード端子をはんだ
付けした状態の第５図のＤ−Ｄ線断面図、第８図
は従来技術のプリント基板の平面図、第９図はは
んだ付着後の第８図のＰ−Ｐ線断面図、第１０図
ははんだ付着後の第８図のＲ−Ｒ線断面図である
。
１，１０……プリント基板、２，１１……ラン
ドパターン、３……リード端子、４……はんだ、
１２……ソルダレジスト。
FIG. 1 is a plan view of a printed circuit board according to the present invention;
Figure 2 is a sectional view taken along the line A-A in Figure 1 after soldering has been applied, Figure 3 is a sectional view taken along the line B-B in Figure 1 with the lead terminals soldered to the printed circuit board, and Figure 4 is the lead terminal. Figure 5 is a perspective view of the terminal, Figure 5 is a plan view of another embodiment, Figure 6 is a sectional view taken along the line C-C in Figure 5 after soldering, and Figure 7 is a diagram showing the state in which the lead terminal is soldered to the printed circuit board. FIG. 5 is a sectional view taken along the line D-D in FIG. 5, FIG. 8 is a plan view of a conventional printed circuit board, FIG. 9 is a sectional view taken along the line P-P in FIG. 8 after solder is attached, and FIG. 10 is after solder is attached. FIG. 8 is a sectional view taken along line RR in FIG. 1, 10... Printed circuit board, 2, 11... Land pattern, 3... Lead terminal, 4... Solder,
12...Solder resist.
Claims (1)
んだ付けされるランドパターンを形成するプリン
ト基板において、前記端部側から前記リード端子
を装着する方向に沿つて前記リード端子が前記プ
リント基板に接触する基板部分にはんだ付着防止
手段を構成したことを特徴とするプリント基板。 (2) はんだ付着防止手段が、前記接触する基板
部分にプリントパターンを形成しないランドパタ
ーンを形成した請求項１記載のプリント基板。 (3) はんだ付着防止手段が、前記接触する基板
部分にはんだが付着しないソルダレジストを被覆
した請求項１記載のプリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board that forms a land pattern to which lead terminals are soldered, which are sandwiched between the ends of the printed circuit board, the lead terminals are attached from the end side along the direction in which the lead terminals are attached. A printed circuit board, characterized in that a solder adhesion prevention means is provided on a portion of the circuit board where a lead terminal contacts the printed circuit board. (2) The printed circuit board according to claim 1, wherein the solder adhesion prevention means forms a land pattern in which no printed pattern is formed on the contacting substrate portion. (3) The printed circuit board according to claim 1, wherein the solder adhesion prevention means coats the contacting portion of the board with a solder resist to which solder does not adhere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270490U JPH042065U (en) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270490U JPH042065U (en) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042065U true JPH042065U (en) | 1992-01-09 |
Family
ID=31554481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4270490U Pending JPH042065U (en) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042065U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864273A (en) * | 1994-08-22 | 1996-03-08 | Nippondenso Co Ltd | Connector pin connecting apparatus and assembling method therefor |
-
1990
- 1990-04-20 JP JP4270490U patent/JPH042065U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864273A (en) * | 1994-08-22 | 1996-03-08 | Nippondenso Co Ltd | Connector pin connecting apparatus and assembling method therefor |