JPH0295272U - - Google Patents
Info
- Publication number
- JPH0295272U JPH0295272U JP268089U JP268089U JPH0295272U JP H0295272 U JPH0295272 U JP H0295272U JP 268089 U JP268089 U JP 268089U JP 268089 U JP268089 U JP 268089U JP H0295272 U JPH0295272 U JP H0295272U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- terminals
- width
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000006071 cream Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図、第2図は本考案に係るプリント基板に
回路を実装する際の半田形状を制御するための印
刷マスクとプリント基板上の端子の位置関係を表
わす概略図である。第3図及び第4図は、それぞ
れ、基板端子とそれに印刷された半田の様子を表
わす概略図及び、それに回路の端子ピンをマウン
ト、リフローした状態を表わす図であり、aは本
考案に係る1つの例、bは従来例である。1a,
1bは半田、2はプリント基板の端子、3は基板
、4は回路の端子ピン、5は本考案の半田印刷に
用いるマスクの開口部である。
1 and 2 are schematic diagrams showing the positional relationship between a printing mask for controlling the solder shape when mounting a circuit on a printed circuit board according to the present invention and terminals on the printed circuit board. FIGS. 3 and 4 are a schematic diagram showing a circuit board terminal and solder printed on it, and a diagram showing a state in which a terminal pin of a circuit is mounted and reflowed, respectively; One example, b, is a conventional example. 1a,
1b is solder, 2 is a terminal of a printed circuit board, 3 is a board, 4 is a terminal pin of a circuit, and 5 is an opening of a mask used for solder printing of the present invention.
Claims (1)
リント基板において、上記半田が印刷されたクリ
ーム半田であり、該端子の根本部の上の半田の幅
が先端部の上の半田の幅より狭くなつていること
を特徴とするプリント基板。 (2) 端子を有し、その端子を介して導電接続さ
れた回路を実装されたプリント基板において、上
記半田が印刷されたクリーム半田であり、上記半
田の根本部の幅が先端部の幅より狭くなつている
ことを特徴とする実装されたプリント基板。[Scope of Claim for Utility Model Registration] (1) In a printed circuit board having terminals and solder provided on the terminals, the solder is printed cream solder, and the width of the solder above the root part of the terminals is A printed circuit board characterized in that the width of the solder is narrower than the width of the solder on the tip. (2) In a printed circuit board that has terminals and is mounted with a circuit conductively connected through the terminals, the solder is printed cream solder, and the width of the base of the solder is wider than the width of the tip. A mounted printed circuit board characterized by narrowing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP268089U JPH0295272U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP268089U JPH0295272U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0295272U true JPH0295272U (en) | 1990-07-30 |
Family
ID=31203660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP268089U Pending JPH0295272U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0295272U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190665A (en) * | 2000-12-22 | 2002-07-05 | Ibiden Co Ltd | Manufacturing method of printed-wiring board |
-
1989
- 1989-01-17 JP JP268089U patent/JPH0295272U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190665A (en) * | 2000-12-22 | 2002-07-05 | Ibiden Co Ltd | Manufacturing method of printed-wiring board |
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