JPH0295271U - - Google Patents
Info
- Publication number
- JPH0295271U JPH0295271U JP267989U JP267989U JPH0295271U JP H0295271 U JPH0295271 U JP H0295271U JP 267989 U JP267989 U JP 267989U JP 267989 U JP267989 U JP 267989U JP H0295271 U JPH0295271 U JP H0295271U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- terminal
- width
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図及び第２図は、それぞれ、本考案に係る
１つの例、従来例における、プリント基板上の端
子を示す図である。第３図は従来のプリント基板
に回路を実装したときのその導電接続部の断面図
、第４図は本考案に係るプリント基板に回路を実
装したときのその導電接続部の断面図である。
１ａ，１ｂはプリント基板の端子、２は回路の
端子ピン、３はフラツトパツケージ、４は半田、
５はプリント基板である。
FIG. 1 and FIG. 2 are diagrams showing terminals on a printed circuit board in one example according to the present invention and in a conventional example, respectively. FIG. 3 is a sectional view of a conductive connection portion when a circuit is mounted on a conventional printed circuit board, and FIG. 4 is a sectional view of a conductive connection portion when a circuit is mounted on a printed circuit board according to the present invention. 1a and 1b are printed circuit board terminals, 2 is a circuit terminal pin, 3 is a flat package, 4 is solder,
5 is a printed circuit board.
Claims (1)
子の根本部の幅が先端部の幅より狭くなつている
ことを特徴とするプリント基板。 (2) 請求項１記載のプリント基板に、半田によ
つて該プリント基板と導電接続された回路を実装
してなる、実装されたプリント基板。[Claims for Utility Model Registration] (1) A printed circuit board having a terminal, characterized in that the width of the base portion of the terminal is narrower than the width of the tip portion. (2) A printed circuit board mounted on the printed circuit board according to claim 1, wherein a circuit conductively connected to the printed circuit board by solder is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP267989U JPH0295271U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP267989U JPH0295271U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295271U true JPH0295271U (en) | 1990-07-30 |
Family
ID=31203658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP267989U Pending JPH0295271U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295271U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190665A (en) * | 2000-12-22 | 2002-07-05 | Ibiden Co Ltd | Manufacturing method of printed-wiring board |
| JP2017069333A (en) * | 2015-09-29 | 2017-04-06 | ファナック株式会社 | Printed circuit board |
-
1989
- 1989-01-17 JP JP267989U patent/JPH0295271U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002190665A (en) * | 2000-12-22 | 2002-07-05 | Ibiden Co Ltd | Manufacturing method of printed-wiring board |
| JP2017069333A (en) * | 2015-09-29 | 2017-04-06 | ファナック株式会社 | Printed circuit board |
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