JP2545679Y2 - Land shape for tab terminal of printed circuit board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a land shape for a tab terminal formed on a mounting surface of various printed circuit boards.

[0002]

2. Description of the Related Art FIG. 2 is a partial perspective view showing a state in which a tab terminal 2 is fitted on a conventional printed circuit board 1.
A rectangular land 3 is provided on the solder surface side of the tab terminal mounting position.
A land 4 having the same shape as the rectangular land 3 is formed on the tab terminal mounting surface side.

[0003]

In the conventional tab terminal land shape as shown in FIG. 2, when the solder 5 rises to the component mounting surface land 4 side during the soldering operation, the tab as shown in FIG. Ascending to the upper part of the terminal 2, a large amount of solder 5 adheres to the tab terminal. This is because the area of the land 4 on the component mounting surface side is large. Therefore, it becomes difficult to connect the Faston tab to the tab terminal, so that the solder 4 attached to the tab terminal 2 after the soldering operation has to be removed.

[0004]

According to the present invention, the tab terminal land on the component mounting surface side is formed to have a shape smaller than the land on the solder surface side.
The purpose is to minimize the solder rise to the surface. That is, in a printed circuit board in which tab terminals 2 are mounted on a two-layer printed circuit board 1 having printed wiring on a component mounting surface and a solder surface, a rectangular land 3 is formed on the solder surface side of the tab terminal mounting position. At the same time, on the component mounting surface side, a round land 4 which is extremely small with respect to the surface area of the rectangular land 3 is formed to reduce the rise of solder to the tab terminal. .

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A land for a tab terminal according to the present invention will be described below with reference to FIG. In the land for a tab terminal of the present invention, the land 4 on the component mounting surface side has a round shape that is extremely smaller than the surface area of the rectangular land 3 formed on the solder surface side. Therefore, even if the solder 5 rises to the land 4 on the component mounting surface side during the soldering work, the amount of the solder 5 is small, so that the solder rising to the tab terminal 2 can be suppressed as much as possible, and the solder 5 adheres to the tab terminal 2 after the soldering work. There is no need to perform the work of removing the solder that has been removed.

[0006]

In the conventional land shape, since a large amount of solder adheres to the upper portion of the tab terminal 2, it is necessary to remove excess solder after the soldering operation. However, the shape of the land 4 on the mounting surface side of the present invention has a small area, so that the solder on the land 4 is small, so that the solder can be prevented from adhering to the upper portion of the tab terminal.

[0007]

Other Embodiments In the above embodiment, the land shape of the two-layer printed circuit board 1 is shown, but the same effect can be obtained in a multilayer printed circuit board having printed wiring between the component mounting surface and the soldering surface. Can be obtained.

[0008]

According to the present invention, the land for the tab terminal on the component mounting surface side is formed to be smaller than the land on the solder surface side, so that the solder on the tab terminal 2 can be minimized. The practical effect of eliminating various adverse effects due to solder rising, for example, poor insertion of a tab, is great.

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing a state in which a tab terminal 2 is fitted on a printed board 1 of the present invention.

FIG. 2 is a partial perspective view showing a state in which a tab terminal 2 is fitted on a conventional printed circuit board 1;

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a sectional view taken along line BB of FIG. 2;

[Explanation of symbols]

1 Printed circuit board. 2 Tab terminal. 3 Land on the solder side. 4 Land on the component mounting surface side.
5 Solder.

Claims (1)

(57) [Scope of request for utility model registration] 1. A printed circuit board having a tab terminal 2 mounted on a two-layer printed circuit board 1 having printed wiring on a component mounting surface and a solder surface, wherein a rectangular land is provided on the solder surface side of the tab terminal mounting position. 3, and a round land 4 which is extremely small with respect to the surface area of the rectangular land 3 is formed on the component mounting surface side, so that the rise of the solder to the tab terminal is reduced. Land shape for printed circuit board tab terminals.