JPH10242627A - Solder land for printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder land for satisfactorily soldering by preventing blocking of a long hole with solder in the case of dip soldering, and inserting a thin plate-like metal piece into the hole. SOLUTION: The solder land 6 comprises a main land 6a provided at one long side 4a side of a long hole 4, and a sub-land 6b extended from the land 6a along one short side 4c and detoured and formed at the other long side 4b side. In the case of dip soldering, the land 6 is circulated at the hole 4 and not formed. In this case, since tension of the solder is obliquely applied on the hole 4 between the lands 6a and 6b, blocking of the hole 4 due to disconnection of the solder is prevented. In the case of inserting a thin plate-like metal piece 7 into the hole 4 and soldering it, the solder is detoured from the land 6a to the land 6b and adhered to the entire periphery of the piece 7 to obtain high strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder land of a printed wiring board having a long hole on a board surface for inserting a metal piece.

[0002]

2. Description of the Related Art Circuit boards are used in electric appliances. When manufacturing a circuit board, metal pins of a plurality of electronic components are inserted into a plurality of round holes formed in a printed wiring board on which wiring is printed, and the board surface of the printed wiring board on which the metal pins are protruded. Is immersed in a bath containing molten solder melted by a heater, and a plurality of metal pins are collectively soldered.

By the way, in the case of circuit components protruding from the board surface of a printed wiring board, thin metal pieces are formed in order to increase the soldering area and increase the mounting strength. After the above-described immersion soldering, this metal piece is inserted into a long hole having a solder land all around, and soldering is performed.

[0004]

However, FIG. 4 (A)
As shown in FIG. 4, when the solder lands 31 are provided on the entire circumference of the long hole 30, when immersion soldering is performed, FIG.
As shown in (B), the slot 30 may be closed by the tension of the solder 32 attached to the solder land 31.

[0005] In order to prevent the obstruction of the long hole 30, when a solder land 41 is formed on a half circumference of the long hole 30 as shown in FIG. However, when the metal piece 43 is inserted into the long hole 30 and soldered, there is a problem that the solder does not easily turn to the side without the solder land 41, so that a solder defect is likely to occur and the strength is low. Was.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art, and it is intended to prevent a long hole from being blocked by solder during immersion soldering, and to provide a thin plate-like metal piece in the long hole. It is an object of the present invention to provide a solder land in which good soldering has been enabled by inserting a solder land.

[0007]

In order to achieve the above object, depending on the solder land of the printed wiring board of the present invention, a main land formed along one long side of the long hole and a long side of the long hole are provided. And a sub-land extending from the main land along one of the short sides connecting. Also,
The auxiliary land is formed so as to extend around the other long side of the long hole.

During immersion soldering of a printed circuit board,
The solder that has adhered to the solder lands is cut well,
Prevents obstruction of long holes. When a metal piece is inserted into a long hole and soldered, the solder wraps around from the main land to the sub-land, and the solder adheres not only to the metal piece surface on the main land side, but also to the metal piece surface on the sub-land side. As a result, a strong strength is obtained.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 shows an example of a printed wiring board provided with the solder lands of the present invention. Each portion of the printed wiring board 2 has a round hole 3 for inserting a round bar-shaped metal pin such as an electronic component, and a thin metal piece 7 provided in a large component such as a synchro switch component or a battery holder.
And a plurality of long holes 4 for inserting the same. Solder lands 5 and 6 are formed around the round hole 3 and the long hole 4 respectively.

The printed wiring board 2 is immersed and soldered after inserting pins of electronic components and the like into the round holes 3 and attaching the pins. Since the solder land 5 is provided on the entire circumference of the round hole 3, the solder is attached to the entire circumference of the pin inserted into the round hole 3.

As shown in FIG. 1, the outline of the long hole 4 has long sides 4a, 4b and arc-shaped short sides 4c, 4d connected thereto.
It is composed of Solder land 6 has one long side 4
It comprises a main land 6a provided on the side a, and a sub-land 6b extending along one short side 4c and extending around the other long side 4b.

The manner in which an electronic component having a thin metal piece is soldered to a printed wiring board having a solder land having the above configuration will be described below with reference to FIG. When a pin such as an electronic component is inserted into the round hole 3 and immersion soldering is performed, the solder 10 adheres to the solder land 6, but the solder land 6 is not provided around the long hole 4, Since the tension of 10 is obliquely applied by the main land 6a and the sub-land 6b and the solder 10 is cut on the long hole 4,
The obstruction of the slot 4 by immersion soldering is prevented.

Next, a metal piece 7 is inserted into the long hole 4 and soldered. The solder 10 adheres to the main land 6a and the sub-land 6b. Since the sub-land 6b is formed so as to extend around the other long side 4b, the surface of the metal piece 7 in which the solder 10 is inserted into the long hole 4 on the main land 6a side is, of course, the sub-land 6b.
It also wraps around the b-side surface, and sufficient strength can be obtained.

FIG. 3 shows another shape of the solder land of the present invention. The solder lands 16 are arranged such that the upper and lower sides of the main land 16a provided on one long side 4a side of the long hole 4 are short sides 4c and 4d.
And the sub lands 16b and 16c are formed by wrapping around the other long side 4b side, and the same effects as described above can be obtained.

The auxiliary land is formed by extending a main land provided on one long side of the long hole along the short side of the long hole and wrapping around the other long side. Absent. It may be formed to extend in a direction away from the other long side.

[0016]

As described above, according to the present invention, the main land extending along one long side of the long hole and the main land extending along one short side connecting the long sides of the long hole are provided. Since the solder lands are formed with the auxiliary lands formed by soldering, the solder attached to the solder lands during the immersion soldering of the printed wiring board is cut well, and the long holes are not blocked. When inserted and soldered, the solder wraps around from the main land to the sub-land, and the solder adheres not only to the surface of the metal piece on the main land side but also to the surface of the metal piece on the sub-land side, resulting in strong strength. can get.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a solder land according to the present invention.

FIG. 2 is a plan view of a printed wiring board provided with a solder land according to the present invention.

FIG. 3 is another explanatory view of the solder land of the present invention.

FIG. 4 is an explanatory view of a conventional solder land.

FIG. 5 is another explanatory view of a conventional solder land.

[Explanation of symbols]

 2 printed wiring board 4 long hole 4a, 4b long side 4c, 4d short side 6 solder land 6a main land 6b sub land 7 metal piece

Claims (2)

[Claims] 1. A printed circuit board having a long hole in a substrate surface, which is subjected to immersion soldering, and then a thin metal piece inserted into the long hole of the printed circuit board is soldered. In the land, a main land formed along one long side of the long hole and a sub land formed extending from the main land along one of short sides connecting the long sides of the long hole. Features solder lands on printed wiring boards. 2. The device according to claim 1, wherein the sub-land is formed so as to extend around the other long side of the long hole.
Solder land of the printed wiring board described.