JPH08167772A - Preliminary soldering method of surface mount electronic parts - Google Patents
Preliminary soldering method of surface mount electronic partsInfo
- Publication number
- JPH08167772A JPH08167772A JP6310195A JP31019594A JPH08167772A JP H08167772 A JPH08167772 A JP H08167772A JP 6310195 A JP6310195 A JP 6310195A JP 31019594 A JP31019594 A JP 31019594A JP H08167772 A JPH08167772 A JP H08167772A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- soldering
- flat plate
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は表面実装電子部品のリー
ド先端部に予備はんだをする予備はんだ付け方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pre-soldering method for pre-soldering lead tips of surface-mounted electronic components.
【０００２】[0002]
【従来の技術】従来の表面実装電子部品リード部への予
備はんだ方法としては、特開平４−３３２１９１号公
報，特開平１−２７０３９１号公報に記載の以下の方法
がある。2. Description of the Related Art As a conventional method for pre-soldering to a lead portion of a surface mount electronic component, there are the following methods described in JP-A-4-332191 and JP-A-1-270391.
【０００３】（１）表面実装電子部品のリードよりもは
んだ濡れが悪い平板部材上に、表面実装電子部品のリー
ドピッチにあわせて開口穴を設けたマスクを使用し、印
刷機等によりクリームはんだを印刷、クリームはんだ上
に表面実装電子部品のリードを搭載、加熱させることに
よりはんだを表面実装電子部品のリード先端に予備はん
だする。(1) Cream solder is applied by a printing machine or the like using a mask in which opening holes are provided in accordance with the lead pitch of surface-mounted electronic components on a flat plate member in which the solder wettability is worse than the leads of surface-mounted electronic components. The leads of the surface mount electronic component are mounted on the printing and cream solder, and the solder is pre-soldered on the tip of the lead of the surface mount electronic component by heating.
【０００４】（２）表面実装電子部品のリードよりもは
んだ濡れが悪い平板部材の表面に該表面実装電子部品の
各リードに対応する部分に開口穴を設けたマスクを電解
はんだメッキ処理にて接合した平板プレートの開口穴に
クリームはんだを充填、クリームはんだ上に表面実装電
子部品のリードを搭載、加熱させることによりはんだを
表面実装電子部品のリード先端に予備はんだする。(2) A mask in which opening holes are provided at portions corresponding to the leads of the surface-mounted electronic component on the surface of the flat plate member having poorer solder wettability than the leads of the surface-mounted electronic component is joined by electrolytic solder plating. The opening holes of the flat plate are filled with cream solder, the leads of the surface mount electronic component are mounted on the cream solder, and the solder is pre-soldered by heating the leads of the surface mount electronic component.
【０００５】[0005]
【発明が解決しようとする課題】かかる従来の方法にお
いては、次のような課題がある。The conventional method has the following problems.
【０００６】（１）マスクによるクリームはんだ供給方
法のため、マスク版抜け性低下により定量的にクリーム
はんだを供給することが困難である。(1) Since the cream solder supply method uses a mask, it is difficult to quantitatively supply the cream solder due to a decrease in mask plate removal property.
【０００７】（２）平面プレートにクリームはんだを印
刷した際の周辺温度・湿度によるはんだダレ、表面実装
電子部品リード部へ予備はんだをする際のはんだ加熱に
よるはんだダレ等により、はんだブリッジが多発する。(2) Solder bridges frequently occur due to solder sagging due to ambient temperature and humidity when cream solder is printed on a flat plate, and solder sagging due to solder heating during preliminary soldering to the surface mounting electronic component leads. .
【０００８】（３）平板部材とマスクを電解はんだメッ
キにて接合した平板プレートを使用するため、はんだ溶
解時、平板部材とマスクが剥離することがある。(3) Since the flat plate is used in which the flat plate member and the mask are joined by electrolytic solder plating, the flat plate member and the mask may be separated when the solder is melted.
【０００９】[0009]
【課題を解決するための手段】表面実装電子部品のリー
ドよりもはんだ濡れが悪く、かつ熱変形が少ない平板部
材もしくは平板樹脂材の表面に、レーザ加工等により表
面実装電子部品リードピッチに合わせ凹加工（凹加工寸
法は、リード成形時のバラツキ、はんだ供給量を考慮し
作成）を施した平板プレートを使用するので、はんだ溶
解時の熱により剥離することはない。また、平板プレー
トの凹加工部にクリームはんだを充填させ予備はんだ付
けさせることにより、定量はんだ供給ができるとともに
はんだブリッジが発生しなくなる。[Means for Solving the Problems] The surface of a flat plate member or a flat plate resin material, which has poorer solder wetting than the leads of a surface mount electronic component and has less thermal deformation, is recessed to the lead pitch of the surface mount electronic component by laser processing or the like. Since the flat plate that has been processed (the concave processing size was created in consideration of variations in lead molding and solder supply amount) is used, it does not peel off due to heat during solder melting. In addition, by filling the concave portion of the flat plate with cream solder and pre-soldering, a fixed amount of solder can be supplied and a solder bridge does not occur.
【００１０】[0010]
【作用】表面実装電子部品のリードよりもはんだ濡れが
悪く、かつ熱変形が少ない平板部材もしくは平板樹脂材
の表面に、凹加工を施した平板プレートを使用すること
により、クリームはんだを充填した際に、クリームはん
だ間にしきりができるのでクリームはんだダレの影響を
受けない。さらに、はんだ濡れが悪い材質の平板プレー
トを使用するので、全てのクリームはんだはリード側に
供給される。[Function] When cream solder is filled by using a flat plate having a concave surface formed on the surface of a flat plate member or a flat plate resin material that has poorer solder wetting than the leads of surface mounted electronic components and less thermal deformation Moreover, since there is a gap between the cream solder, it is not affected by the cream solder sag. Further, since the flat plate made of a material having poor solder wettability is used, all the cream solder is supplied to the lead side.
【００１１】[0011]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１２】図１は本発明方法にて使用する凹加工を施
した平板プレートの構造図である。FIG. 1 is a structural diagram of a flat plate having a recess for use in the method of the present invention.
【００１３】図２は本発明実施例の工程説明図である。
同図において、凹加工２を施した平板プレート１は、は
んだ濡れ性が悪く、かつ熱変形の少ないセラミック材料
を使用、表面実装電子部品４のリードピッチ・供給はん
だ量を考慮して凹加工２をした平板プレート１である
（図２（Ａ））。FIG. 2 is a process explanatory view of the embodiment of the present invention.
In the figure, the flat plate 1 on which the concave processing 2 has been performed uses a ceramic material having poor solder wettability and less thermal deformation. The concave processing 2 is performed in consideration of the lead pitch and the amount of supplied solder of the surface mount electronic component 4. It is the flat plate 1 which carried out (FIG. 2 (A)).
【００１４】印刷機にて平面プレート１の凹加工部２に
クリームはんだ３を充填（図２（Ｂ））、半自動部品搭
載機にてクリームはんだ３上に表面実装電子部品４を搭
載させ、クリームはんだ３とリード５を接触させる（図
２（Ｃ））。The concave portion 2 of the flat plate 1 is filled with the cream solder 3 by a printing machine (FIG. 2B), and the surface mount electronic component 4 is mounted on the cream solder 3 by the semi-automatic component mounting machine to obtain the cream. The solder 3 and the lead 5 are brought into contact with each other (FIG. 2 (C)).
【００１５】ホットエアーによる加熱により、クリーム
はんだ３を表面実装電子部品４のリード３先端に予備は
んだ付け６を行う（図２（Ｄ））。Preliminary soldering 6 of the cream solder 3 to the tips of the leads 3 of the surface-mounted electronic component 4 is performed by heating with hot air (FIG. 2D).
【００１６】[0016]
【発明の効果】本発明の予備はんだ供給方法はマスクレ
スによるはんだ供給方法であり、マスク版抜け性低下に
よるはんだ量のバラツキを皆無にすることができるとい
う効果がある。さらに、定量はんだを表面実装電子部品
のリード先端に予備はんだすることにより、プリント配
線板へのはんだ付け時のはんだ修正を減少させるという
効果がある。The pre-solder supply method of the present invention is a maskless solder supply method, and has an effect that it is possible to eliminate variations in the amount of solder due to a reduction in mask plate dropout property. Further, by pre-soldering a fixed amount of solder to the leads of the surface-mounted electronic components, there is an effect of reducing the solder correction at the time of soldering to the printed wiring board.
【図１】本発明方法にて使用する凹加工を施した平板プ
レートの構造図である。FIG. 1 is a structural diagram of a flat plate having a concave shape used in the method of the present invention.
【図２】（Ａ）〜（Ｄ）は本発明の実施例の工程説明図
である。2A to 2D are process explanatory views of an embodiment of the present invention.
１…平板プレート、 ２…凹加工部、 ３…クリ
ームはんだ、４…表面実装電子部品、 ５…リード、
６…予備はんだ。DESCRIPTION OF SYMBOLS 1 ... Flat plate, 2 ... Recessed part, 3 ... Cream solder, 4 ... Surface mount electronic component, 5 ... Lead,
6 ... Preliminary solder.
Claims (1)
れが悪く、かつ熱変形が少ない平板部材もしくは平板樹
脂材の表面に、レーザ加工等により凹加工を施した平板
プレートの凹加工部にクリームはんだを充填、表面実装
電子部品のリードをクリームはんだ上に搭載させ、ホッ
トエアー等の加熱にて表面実装電子部品のリード先端部
に予備はんだ付けをする方法。Claim: What is claimed is: 1. A cream is applied to a recessed portion of a flat plate in which the surface of a flat plate member or a flat plate resin material, which has poorer solder wetting than the leads of surface-mounted electronic components and has less thermal deformation, is recessed by laser processing or the like. A method in which the solder is filled, the leads of the surface mount electronic component are mounted on the cream solder, and the tip of the lead of the surface mount electronic component is pre-soldered by heating with hot air or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6310195A JPH08167772A (en) | 1994-12-14 | 1994-12-14 | Preliminary soldering method of surface mount electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6310195A JPH08167772A (en) | 1994-12-14 | 1994-12-14 | Preliminary soldering method of surface mount electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08167772A true JPH08167772A (en) | 1996-06-25 |
Family
ID=18002322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6310195A Pending JPH08167772A (en) | 1994-12-14 | 1994-12-14 | Preliminary soldering method of surface mount electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08167772A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2789225A1 (en) * | 1999-02-02 | 2000-08-04 | Thomson Csf | Surface mountable integrated circuit, useful as a ball pin grid array surface mounted device for an electronic card, comprises low melting alloy balls soldered around ends of connection pins |
| EP1077482A3 (en) * | 1999-08-19 | 2001-12-19 | Shinko Electric Industries Co. Ltd. | Semiconductor contacting device |
| WO2002007208A1 (en) * | 2000-07-18 | 2002-01-24 | Atmel Grenoble S.A. | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| CN111162013A (en) * | 2020-01-06 | 2020-05-15 | 张正 | Semiconductor packaging structure and manufacturing method of semiconductor package |
-
1994
- 1994-12-14 JP JP6310195A patent/JPH08167772A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2789225A1 (en) * | 1999-02-02 | 2000-08-04 | Thomson Csf | Surface mountable integrated circuit, useful as a ball pin grid array surface mounted device for an electronic card, comprises low melting alloy balls soldered around ends of connection pins |
| EP1077482A3 (en) * | 1999-08-19 | 2001-12-19 | Shinko Electric Industries Co. Ltd. | Semiconductor contacting device |
| WO2002007208A1 (en) * | 2000-07-18 | 2002-01-24 | Atmel Grenoble S.A. | Method for making an integrated circuit capable of being surface-mounted and resulting circuit |
| US6989591B1 (en) * | 2000-07-18 | 2006-01-24 | Atmel Grenoble S.A. | Method for making an integrated circuit of the surface-mount type and resulting circuit |
| CN111162013A (en) * | 2020-01-06 | 2020-05-15 | 张正 | Semiconductor packaging structure and manufacturing method of semiconductor package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5400953A (en) | Method of printing a bonding agent | |
| JPH08167772A (en) | Preliminary soldering method of surface mount electronic parts | |
| JPH09321425A (en) | Mounting method for chip-type electronic component | |
| JPH0955565A (en) | Printed wiring board | |
| JPH04314389A (en) | Electric component soldering method | |
| JPH04242943A (en) | Method for supplying solder to bump electrode | |
| JPH0927678A (en) | Method of mounting component on printed wiring board | |
| JP2588558B2 (en) | How to mount surface mount components on printed wiring boards | |
| JPH0738246A (en) | Soldering method and molding solder used therein | |
| JPH05212852A (en) | Cream solder supplying mechanism | |
| JPH066023A (en) | Electronic part mounting method | |
| JPH06169165A (en) | Soldering method | |
| JP3905355B2 (en) | Mounting method of chip parts | |
| JPH08236921A (en) | Method for soldering electronic parts | |
| JP3891310B2 (en) | Electronic component and mounting method thereof | |
| JPH0722742A (en) | Soldering method for printed wiring board | |
| JPH05283587A (en) | Soldering method of multiple-lead element | |
| JPH07170049A (en) | Mounting structure of surface mounting component and method thereof | |
| JPS6261395A (en) | Mounting method for part | |
| JPS6225900Y2 (en) | ||
| JPS62188397A (en) | Printed circuit board for chip-type parts | |
| JPH0272699A (en) | Method for soldering lead electrode and lead wire in hybrid integrated circuit | |
| JP2842425B2 (en) | Multi-terminal component mounting method | |
| JPH05175645A (en) | Soldering device for electronic component | |
| JPH03194994A (en) | Solder-connecting method for surface mounting ic package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050128 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050218 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |