JPS62188397A - Printed circuit board for chip-type parts - Google Patents
Printed circuit board for chip-type partsInfo
- Publication number
- JPS62188397A JPS62188397A JP2880286A JP2880286A JPS62188397A JP S62188397 A JPS62188397 A JP S62188397A JP 2880286 A JP2880286 A JP 2880286A JP 2880286 A JP2880286 A JP 2880286A JP S62188397 A JPS62188397 A JP S62188397A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- solder
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000006071 cream Substances 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はチップ部品を搭載する面実装基板に・関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface mount board on which chip components are mounted.
〔従来の技術〕１５ 従来のチップ部品搭載用基板ｖｃ、２６いては、基。[Prior art] 15 Conventional chip component mounting board VC, 26, and base.
板とチップ部品間で良好な半田付品質が得られ。Good soldering quality can be obtained between the board and chip components.
るようリフローパッド形状に種々の工夫がなさ。Various improvements have been made to the shape of the reflow pad.
れている。しかし基板上に印刷されたクリーム。It is. But the cream printed on the board.
半田のパッドからのはみ出しにより発生する半。。Half caused by solder protruding from the pad. .
田ボールについては配慮されていなかった。 。No consideration was given to the ball. .
この種の基板として関連するものに例えば実。For example, this kind of substrate is related to real.
開昭６０−２８７５号、実開昭６０−１５７７２゜号な
どがあげられる。Examples include 1982-2875 and Utility Model 60-15772°.
〔発明が解決しようとする問題点〕 ５上記の
従来技術においてはクリーム半田を印。[Problems to be solved by the invention] 5. In the above prior art, cream solder is used as a mark.
刷した上に、チップ部品を押しつけて搭載した。The chip components were pressed onto the printed surface and mounted.
時にクリーム半田がただれてリフローパッドよ゛りはみ
出し、これが溶融時、半田の表面張力に・より半田ボー
ルとなることについて配慮がされ１０ておらず、この半
田ボールが他の部品の下に入・りこみショートを起こす
可能性があった。Sometimes the cream solder sag and protrude beyond the reflow pad, and when it melts, the surface tension of the solder causes it to become a solder ball. No consideration has been given to this, and this solder ball can get under other parts or become a solder ball. There was a possibility that a short circuit could occur.
本発明の目的は、上記半田ボールの発生を抑・制する印
刷回路板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board that suppresses the generation of solder balls.
〔問題を解決するための手段〕１゜ 上記目的は、チップ部品のリフローパッドに。[Means to solve the problem] 1゜ The above purpose is for reflow pads for chip components.
連続しかつチップ部品の外周にそって冗長リフ。Continuous and redundant riffs along the perimeter of the chip component.
ローパッドを設けることにより、達成される。。This is achieved by providing a low pad. .
出したクリーム半田は次の溶融工程において加゛熱溶融
するが、溶融半田の性質上、出来るだけ。The cream solder that comes out will be heated and melted in the next melting process, but due to the nature of molten solder, it will be melted as much as possible.
表面積を小さくしようとして球状になり部品の。The parts become spherical in an attempt to reduce the surface area.
沿面を移動し、加熱が終った時点で半田ボール。The solder ball moves along the creeping surface and when it finishes heating.
としてチップ部品側面に残ることがある。上記５に対し
、はみ出したクリーム半田が溶融した時。It may remain on the side of the chip component. Regarding 5 above, when the protruding cream solder melts.
その近傍に溶着出来る冗長パッドを設けておけ“ば半田
ボールとして残ることがない。If a redundant pad that can be welded is provided in the vicinity, no solder balls will remain.
以下、本発明の一実施例について図面を用い１０て説明
する。第１図（Ｌ：Ｌ）は印刷基板６上のり・フローパ
ッド３上にクリーム半田５を印刷しそ・の上にチップ部
品１を搭載した場合の平面図、・第１図（ｂ）はその正
面図を示す。第２図は従・来例の平面図である。
１５本発明によれば、パッド６上に
印刷されたり。Hereinafter, one embodiment of the present invention will be described with reference to the drawings. Figure 1 (L:L) is a plan view of the case where the chip component 1 is mounted on the printed circuit board 6 and the solder cream 5 printed on the flow pad 3, and Figure 1 (b) is the A front view is shown. FIG. 2 is a plan view of the conventional/conventional example.
15 According to the present invention, it is printed on the pad 6.
リーム半田５上にチップ部品１を搭載した場合。When chip component 1 is mounted on ream solder 5.
押しつけられることによりはみ出したクリーム。Cream that protrudes from being pressed.
半田は、次のりフロ一工程により溶融し、球状。The solder is melted in the next glue flow step and becomes spherical.
になり移動するが、リフローパッド３に連続し。It moves, but it continues to reflow pad 3.
かつチップ部品１の外周にそって設けた冗長り。and redundancy provided along the outer periphery of the chip component 1.
フローパッド４に溶着し半田ボールとして単独。Weld to flow pad 4 and stand alone as a solder ball.
で残ることがないという効果がある。This has the effect of not leaving any residue behind.
本発明によれば、クリームハンダのはみ出し５による半
田ボールの発生を防ぐことが出来るた。According to the present invention, it is possible to prevent the generation of solder balls due to the overflowing cream solder 5.
め洗浄工程を簡略化出来るという効果がある。。This has the effect of simplifying the cleaning process. .
第１図（α）は本発明の一実施例の平面図、。
第１図（ｂ）は同様の正面図、第２図は従来例１００平
面図である。
１・・・チップ部品、３・・・リフローパッド、４・・
・・冗長リフローパッド、５・・・クリームハンダ、６
・・・・印刷回路板。
第 １ 区
（υ）
あ２呂FIG. 1 (α) is a plan view of an embodiment of the present invention. FIG. 1(b) is a similar front view, and FIG. 2 is a plan view of the conventional example 100. 1...Chip parts, 3...Reflow pad, 4...
...Redundant reflow pad, 5...Cream solder, 6
...Printed circuit board. 1st Ward (υ) A2ro
Claims (1)
田上にチップ部品を搭載し半田を溶融することにより半
田付を行うチップ部品印刷回路板において、前記リフロ
ーパッドに連続しかつ該チップ部品の外周に沿つて冗長
リフローパツドを設けたことを特徴とするチップ部品用
印刷回路板。In a chip component printed circuit board in which a chip component is mounted on cream solder printed on a reflow pad on a printed circuit board and soldered by melting the solder, a component that is continuous with the reflow pad and along the outer periphery of the chip component A printed circuit board for chip components, characterized in that a redundant reflow pad is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2880286A JPS62188397A (en) | 1986-02-14 | 1986-02-14 | Printed circuit board for chip-type parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2880286A JPS62188397A (en) | 1986-02-14 | 1986-02-14 | Printed circuit board for chip-type parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62188397A true JPS62188397A (en) | 1987-08-17 |
Family
ID=12258556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2880286A Pending JPS62188397A (en) | 1986-02-14 | 1986-02-14 | Printed circuit board for chip-type parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62188397A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0365276U (en) * | 1989-10-30 | 1991-06-25 | ||
| JP2009521333A (en) * | 2005-12-21 | 2009-06-04 | アンゲヴァイン，ファイエ | Die cutting machine |
-
1986
- 1986-02-14 JP JP2880286A patent/JPS62188397A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0365276U (en) * | 1989-10-30 | 1991-06-25 | ||
| JP2009521333A (en) * | 2005-12-21 | 2009-06-04 | アンゲヴァイン，ファイエ | Die cutting machine |
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