JP3391147B2 - Flexible wiring board and method of manufacturing the same - Google Patents

Flexible wiring board and method of manufacturing the same

Info

Publication number
JP3391147B2
JP3391147B2 JP13132795A JP13132795A JP3391147B2 JP 3391147 B2 JP3391147 B2 JP 3391147B2 JP 13132795 A JP13132795 A JP 13132795A JP 13132795 A JP13132795 A JP 13132795A JP 3391147 B2 JP3391147 B2 JP 3391147B2
Authority
JP
Japan
Prior art keywords
screw
film base
wiring board
flexible wiring
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13132795A
Other languages
Japanese (ja)
Other versions
JPH08335752A (en
Inventor
稔 波戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP13132795A priority Critical patent/JP3391147B2/en
Publication of JPH08335752A publication Critical patent/JPH08335752A/en
Application granted granted Critical
Publication of JP3391147B2 publication Critical patent/JP3391147B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は各種電子機器の内部にお
いて、各回路の配線接続に用いられるフレキシブル配線
板およびその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board used for wiring connections of various circuits inside various electronic devices and a method for manufacturing the same.

【0002】[0002]

【従来の技術】近年、機器の小形軽量化、高密度化に対
応するためにフレキシブル配線板が多く使用されるよう
になってきた。このような中において、図3に示すよう
にフレキシブル配線板のフィルムベース31をシャーシ
32などに取り付ける際にビス(ねじ)33などによっ
て取り付けるが、フィルムベース31単体では厚みが薄
く取付けが困難となる。そこで、取付け用の補強板34
をフィルムベース31に両面テープ(接着剤)38によ
り接着しシャーシ32などに取り付ける。この際にビス
取付け孔35を同時加工にて形成するとビス33の締付
け時にビス頭部33aがフィルムベース31を巻き込ん
でしわ36を発生させ、さらにはフィルムベース31の
破損、導体パターン37の切断が多く発生する。
2. Description of the Related Art In recent years, flexible wiring boards have come to be used more and more in order to reduce the size and weight of equipment and increase the density thereof. In such a situation, as shown in FIG. 3, when the film base 31 of the flexible wiring board is attached to the chassis 32 or the like with screws (screws) 33 or the like, the film base 31 alone is thin and difficult to attach. . Therefore, the reinforcing plate 34 for mounting
Is attached to the film base 31 with a double-sided tape (adhesive) 38 and attached to the chassis 32 or the like. At this time, if the screw mounting holes 35 are formed at the same time, the screw head 33a wraps around the film base 31 to generate wrinkles 36 when the screw 33 is tightened, and further the film base 31 is damaged and the conductor pattern 37 is cut. Many occur.

【0003】その対策として、フレキシブル配線板のフ
ィルムベース31に両面テープ(接着剤)38などを貼
付け、図4に示すように、ビス頭部逃げ孔39を加工し
た後に図示していないが両面テープ(接着剤)38の離
形紙を剥がし、ビス取付け孔35の加工された補強板3
4をフィルムベース31に加工されたビス頭部逃げ孔3
9に同芯となるように位置決め接着し、フィルムベース
31にビス頭部33aの影響がないようにビス頭部33
aが直接補強板34を押さえるような構成としている。
As a countermeasure, a double-sided tape (adhesive) 38 or the like is attached to the film base 31 of the flexible wiring board, and as shown in FIG. The release paper of (adhesive) 38 is peeled off, and the reinforcing plate 3 having the screw mounting holes 35 is processed.
4 is a film base 31 and a screw head relief hole 3
9 is positioned and adhered so as to be concentric with each other, so that the screw head 33a is not affected by the screw head 33a on the film base 31.
It is configured such that a directly presses the reinforcing plate 34.

【0004】また、このように構成された従来のフレキ
シブル配線板の取付け部の組立工程を図5に示す。
FIG. 5 shows a process of assembling the mounting portion of the conventional flexible wiring board thus constructed.

【0005】[0005]

【発明が解決しようとする課題】しかし、上記従来の対
策を施したフレキシブル配線板においても、図5に示す
ように、ビス取付け部を形成するために、フィルムベー
ス31への両面テープ貼付け、フィルムベース31への
ビス頭部逃げ孔加工、補強板外形と取付け孔加工、補強
板位置決め(同芯とするため貼付け治具への位置決
め)、両面テープ離形紙剥がし・貼付け、と作業工数が
多く、加工金型は、フィルムベース31のビス頭部逃げ
孔加工、補強板外形加工、ビス取付け孔加工、と2〜3
面必要となり、さらにビス頭部逃げ孔39と、ビス取付
け孔35を同芯とするために位置決め治具を用いて組立
を行い費用、工数の増加といった課題があった。
However, even in the flexible wiring board on which the above-mentioned conventional measures are taken, as shown in FIG. 5, in order to form a screw attachment portion, a double-sided tape is attached to the film base 31, and a film is attached. A lot of man-hours are required, such as screw head relief hole processing on the base 31, reinforcing plate outer shape and mounting hole processing, reinforcing plate positioning (positioning on the bonding jig to be concentric), double-sided tape release paper peeling / pasting The processing mold is a screw head relief hole processing of the film base 31, a reinforcing plate outer shape processing, a screw mounting hole processing, and 2-3.
However, there is a problem in that the screw head escape hole 39 and the screw mounting hole 35 are concentric with each other by using a positioning jig for assembly, and the cost and man-hour increase.

【0006】本発明はこのような従来の課題を解決する
もので、作業工数を低減し安価で高性能なフレキシブル
配線板およびその製造方法を提供することを目的とする
ものである。
The present invention is intended to solve such conventional problems, and an object of the present invention is to provide an inexpensive and high-performance flexible wiring board with reduced man-hours and a method for manufacturing the same.

【0007】[0007]

【課題を解決するための手段】上記課題を解決する本発
明のフレキシブル配線板は、導体パターンが形成された
フィルムベースと、このフィルムベースのどちらか一方
の面に接着された補強板と、前記フィルムベースと前記
補強板の同位置に設けられたビス取付け孔と、前記フィ
ルムベース上に設けられた前記ビス取付け孔と同芯で
スのビス頭部の径より大径のスリットを設けると共に、
このスリットの内側と外側のフィルムベース間に前記ビ
スの締め付け力によって分離されるつなぎ部を少なくと
も一ヶ所以上設けた構成としたものである。
The flexible wiring board of the present invention to solve the above problems SUMMARY OF THE INVENTION comprises a <br/> film base conductor pattern is formed, reinforced adhered to either side of the film base plate and, bi at the and the film base and screw mounting holes provided at the same position of the reinforcing plate, the screw mounting hole coaxial with and provided on the film base
While providing a slit with a diameter larger than the diameter of the screw head ,
Between the film base inside and outside this slit,
The joints that are separated by the tightening force of the
Also, the configuration is provided in one or more places .

【0008】[0008]

【作用】上記構成のフレキシブル配線板においては、
ィルムベース上にビス頭部の径より大径のスリットを設
けると共に、このスリットの内側と外側のフィルムベー
ス間にビスの締め付け力によって分離されるつなぎ部を
設けたことにより、ビスの締付け時にビス頭部によって
締付けられる箇所は、スリットの外側のフィルムベース
の導体パターンより分離されるため、フィルムベースの
破損、導体パターンの切断の発生をなくすこととなる。
[Action] In the flexible wiring board of the above-described configuration, full
A slit with a diameter larger than the diameter of the screw head is installed on the film base.
In addition, the film base inside and outside this slit
The connecting part that is separated by the tightening force of the screw between the spaces
By providing the screw, the portion tightened by the screw head at the time of tightening the screw is separated from the conductor pattern of the film base on the outside of the slit , so that the film base is not damaged and the conductor pattern is not cut.

【0009】[0009]

【実施例】以下、本発明の一実施例のフレキシブル配線
板について図面を参照しながら説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible wiring board according to an embodiment of the present invention will be described below with reference to the drawings.

【0010】図1に示すように、本実施例のフレキシブ
ル配線板は、フィルムベース1と、フィルムベース1上
に形成された導体パターン2と、フィルムベース1のど
ちらか一方の面に両面テープ(粘着剤)3で接着された
補強板4と、フィルムベース1と補強板4の同位置に設
けられたビス取付け孔5と、フィルムベース1上に設け
られたビス取付け孔5と同芯でビス頭部6の径より大径
のスリット7を備えている。この際に、スリット7はフ
ィルムベース1側より、両面テープ(粘着剤)3まで施
されており、つなぎ部10は内側のフィルムベース1a
がかろうじて保持される幅でつながっている。
As shown in FIG. 1, the flexible wiring board of this embodiment has a film base 1, a conductor pattern 2 formed on the film base 1, and a double-sided tape ( Reinforcement plate 4 adhered with adhesive 3, screw attachment hole 5 provided at the same position of film base 1 and reinforcement plate 4, and screw attachment hole 5 provided on film base 1 with the same screw A slit 7 having a diameter larger than that of the head 6 is provided. At this time, the slit 7 is provided from the film base 1 side to the double-sided tape (adhesive) 3, and the joint portion 10 is the inner film base 1a.
Are connected by a width that is barely held.

【0011】以上のように構成されたフレキシブル配線
板のフィルムベース1を、シャーシ8に取り付ける場
合、ビス(ネジ)9によって締め付けられる。この際、
ビス(ネジ)9の頭部6はスリット7が設けられたフィ
ルムベース1を介して補強板4を押さえ付けるため、ビ
ス(ネジ)9の締付け力によってスリット7の外側と内
側のフィルムベース1と1aをつなぐつなぎ部10が破
損し、スリット7の内側のフィルムベース1aがその外
側のフィルムベース1と分離される。このことによって
フィルムベース1上のスリット7の外側に設けられた導
体パターン2には力が加わることがなく、導体パターン
2の破損や切断を防ぐことができる。
When the film base 1 of the flexible wiring board constructed as described above is attached to the chassis 8, it is tightened by screws (screws) 9. On this occasion,
Since the head portion 6 of the screw (screw) 9 presses the reinforcing plate 4 via the film base 1 provided with the slit 7, the tightening force of the screw (screw) 9 causes the head portion 6 of the outside and the inside of the slit 7 to be tightened. The joint portion 10 connecting the film bases 1 and 1a is broken, and the film base 1a inside the slit 7 is separated from the film base 1 outside thereof. As a result, no force is applied to the conductor pattern 2 provided on the outside of the slit 7 on the film base 1, and damage or cutting of the conductor pattern 2 can be prevented.

【0012】同時に加工面では、図2に示すように、フ
ィルムベース1への両面テープ貼り、フィルムベース1
へのビス(ネジ)頭部逃げスリット加工、両面テープ離
形紙剥がし、補強板貼付け、フレキシブル配線板外形・
ビス(ネジ)取付け孔加工、の5工程で製造することが
できる。
At the same time, in terms of the processed surface, as shown in FIG.
Screw (screw) head relief slit processing, double-sided tape release paper peeling, reinforcing plate attachment, flexible wiring board outline /
It can be manufactured in 5 steps: screw (screw) mounting hole processing.

【0013】あるいは、ビス(ネジ)頭部逃げスリット
加工を、フレキシブル配線板外形・ビス(ネジ)取付け
孔加工をトムソン金型を用いてスリット7とビス取付け
孔5の加工を刃物の高さに差を持たせることによって同
時加工を行えば4工程となり、金型面数低減、作業工数
低減となる。
Alternatively, the screw (screw) head relief slit processing is performed, and the flexible wiring board outer shape and screw (screw) mounting hole processing is performed by using a Thomson die to process the slit 7 and the screw mounting hole 5 to the height of the cutting tool. If the simultaneous processing is performed by giving a difference, it becomes four steps, which reduces the number of mold surfaces and the number of work steps.

【0014】さらに上記工程にて組立を行う際には、ス
リット7とビス取付け孔5を同時加工できるため、補強
板4のフィルムベース1に貼付ける精度はさほど必要が
ないため貼付け治具も不要となる。
Further, when assembling in the above steps, since the slit 7 and the screw mounting hole 5 can be simultaneously processed, the accuracy of sticking the reinforcing plate 4 to the film base 1 is not so required, so that no sticking jig is required. Becomes

【0015】なお、上記実施例ではスリット7の加工は
フィルムベース1と両面テープ3の両方に施す構成とし
たが、両面テープ(粘着剤)3の強度が弱い場合には、
両面テープ(粘着剤)3までスリット7がなくても同様
な効果が得られるものであることを付け加えておく。
In the above embodiment, the slit 7 is processed on both the film base 1 and the double-sided tape 3, but when the strength of the double-sided tape (adhesive) 3 is weak,
It should be added that even if the double-sided tape (adhesive) 3 does not have the slit 7, the same effect can be obtained.

【0016】[0016]

【発明の効果】以上の説明より明らかなように本発明の
フレキシブル配線板およびその製造方法によれば、電子
機器内部において各回路の配線接続に用いられるフレキ
シブル配線板に対して、ベースフィルムに補強板貼付け
後にビス(ネジ)頭部逃げスリット加工をフレキシブル
配線板外形加工と同時に行え、作業工数を低減し安価で
高性能なフレキシブル配線板を提供することができるも
のである。
As is apparent from the above description, according to the flexible wiring board and the manufacturing method thereof of the present invention, the flexible wiring board used for wiring connection of each circuit inside the electronic device is reinforced by the base film. The screw (screw) head relief slit processing can be performed simultaneously with the flexible wiring board outer shape processing after the boards are attached, and it is possible to provide an inexpensive and high-performance flexible wiring board with a reduced number of work steps.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)本発明の一実施例のフレキシブル配線板
の平面図 (b)(a)のA−A’断面図
FIG. 1A is a plan view of a flexible wiring board according to an embodiment of the present invention, and FIG. 1B is a sectional view taken along line AA ′ of FIG.

【図2】同フレキシブル配線板の組立工程図[Fig. 2] Assembly process drawing of the flexible wiring board

【図3】(a)従来のフレキシブル配線板の平面図 (b)(a)のB−B’断面図FIG. 3A is a plan view of a conventional flexible wiring board. (B) B-B 'sectional view of (a)

【図4】(a)従来のビス巻き込み対策を実施したフレ
キシブル配線板の平面図 (b)(a)のC−C’断面図
FIG. 4 (a) is a plan view of a conventional flexible wiring board in which measures against screw entrainment have been implemented, and FIG.

【図5】同フレキシブル配線板の組立工程図FIG. 5: Assembly process diagram of the flexible wiring board

【符号の説明】[Explanation of symbols]

1 フィルムベース 2 導体パターン 3 両面テープ 4 補強板 5 ビス取付け孔 6 ビス頭部 7 スリット 9 ビス 10 つなぎ部 1 film base 2 conductor pattern 3 double-sided tape 4 Reinforcement plate 5 screw mounting holes 6 screw head 7 slits 9 screws 10 joints

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ビスによって締め付けられ取り付けられ
るフレキシブル配線板であって、導体パターンが形成さ
れたフィルムベースと、このフィルムベースのどちらか
一方の面に接着層を介して接着された補強板と、前記フ
ィルムベースと前記補強板の同位置に設けられたビス取
付け孔と、前記フィルムベース上に設けられた前記ビス
取付け孔と同芯で前記ビスのビス頭部の径より大径のス
リットを設けると共に、このスリットの内側と外側のフ
ィルムベース間に前記ビスの締め付け力によって分離さ
れるつなぎ部を少なくとも一ヶ所以上設けたフレキシブ
ル配線板。
1. A flexible wiring board tightened with screws and attached, comprising: a film base on which a conductor pattern is formed; and a reinforcing plate adhered to either one surface of the film base via an adhesive layer. A screw mounting hole provided at the same position of the film base and the reinforcing plate, and a slit having a diameter larger than the screw head diameter of the screw concentric with the screw mounting hole provided on the film base. At the same time, a flexible wiring board is provided with at least one connecting portion which is separated by the tightening force of the screw between the film bases inside and outside the slit.
【請求項2】 フィルムベースに設けたスリットが接着
層まで施されたものである請求項1記載のフレキシブル
配線板。
2. The flexible wiring board according to claim 1, wherein the slit provided in the film base is formed up to the adhesive layer.
【請求項3】 フィルムベース上に導体パターンを形成
し、このフィルムベースのどちらか一方の面に接着層を
介して補強を貼付けた後、ビス取付け用の貫通孔、な
らびに前記ビス取付け孔と同芯でビス頭部の径より大径
のスリットとつなぎ部をフィルムベース側より接着層ま
で設ける請求項1または2記載のフレキシブル配線板の
製造方法。
3. A conductor pattern is formed on a film base, and a reinforcing plate is attached to one surface of the film base via an adhesive layer, and then a through hole for screw attachment and the screw attachment hole are formed. The method for manufacturing a flexible wiring board according to claim 1 or 2, wherein a slit having a diameter larger than the diameter of the screw head and a connecting portion are concentrically provided from the film base side to the adhesive layer.
JP13132795A 1995-04-04 1995-05-30 Flexible wiring board and method of manufacturing the same Expired - Fee Related JP3391147B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13132795A JP3391147B2 (en) 1995-04-04 1995-05-30 Flexible wiring board and method of manufacturing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7-78718 1995-04-04
JP7871895 1995-04-04
JP13132795A JP3391147B2 (en) 1995-04-04 1995-05-30 Flexible wiring board and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH08335752A JPH08335752A (en) 1996-12-17
JP3391147B2 true JP3391147B2 (en) 2003-03-31

Family

ID=26419777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13132795A Expired - Fee Related JP3391147B2 (en) 1995-04-04 1995-05-30 Flexible wiring board and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP3391147B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514530B2 (en) * 2004-06-30 2010-07-28 三洋電機株式会社 Circuit modules and precision equipment built into precision equipment
JP4636827B2 (en) * 2004-07-30 2011-02-23 三洋電機株式会社 Circuit module
JP5797548B2 (en) 2011-12-28 2015-10-21 京セラサーキットソリューションズ株式会社 Wiring board and probe card using the same

Also Published As

Publication number Publication date
JPH08335752A (en) 1996-12-17

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