JP3009783B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board used for a hybrid integrated circuit or a light-emitting display device.

[0002]

2. Description of the Related Art Generally, when manufacturing a printed wiring board of this kind, as shown in FIGS. 4 to 6, a plurality of printed wiring boards 1 are formed from a material substrate, and the printed wiring boards 1 are connected to each other. A plurality of bonding pads 3 for mounting a semiconductor chip and the like and a plurality of bonding pads 3 on the surface of each printed wiring board 1 are formed on the surface of each printed wiring board 1 in this state. In addition to forming the connection pads 4, a wiring pattern (not shown) for connecting the pads 3 and 4 to each other is formed. A resin coat 5 of a thermosetting synthetic resin is formed on portions except for protecting a wiring pattern, and then a semiconductor chip or an electronic component is mounted on each bonding pad 3 (mounting). After the lead terminals are soldered to the connection pads 4, the connecting piece 2 between the printed wiring boards 1 is moved up and down by a punch A and a cylindrical receiving die B for the punch A. Then, the printed wiring board 1 is cut off by punching and cutting.

[0003]

By the way, in the conventional method of manufacturing a printed wiring board, when a resin coat 5 for protecting a wiring pattern is formed on the surface of each printed wiring board 1, this resin coat is used. 5 is a connecting piece 2 between the printed wiring boards 1.
It is formed so as to extend to the surface of.

Accordingly, the connecting piece 2 is formed by a punch A
When punching and cutting by the receiving die B, a part of the resin coat 5 is subjected to the punching and cutting by applying a punching and cutting impact to the resin coat 5 formed on the surface of the connecting piece 2. Since the peeling of the range coat 5 may damage the wiring pattern on the surface of the printed wiring board 1 due to the partial peeling of the printed wiring board 1 in the portion, if the yield of the product is reduced. There is a problem to say.

In addition, the resin-coated pieces peeled off and dropped from the printed wiring board 1 adversely affect electronic components such as semiconductor chips mounted on the surface of the printed wiring board 1. Is a printed wiring board used for a light-emitting display device in which characters such as numbers are displayed by light emission of a light-emitting diode chip, a resin coat piece generated at the time of punching and cutting the connecting piece enters the display unit. As a result, a foreign matter defect occurs, so that each printed wiring board must be provided with a step of sufficiently cleaning after punching and cutting the connecting piece, and there is a problem that the cost is significantly increased.

An object of the present invention is to provide a manufacturing method which can solve these problems.

[0007]

In order to achieve this technical object, the present invention provides a method of connecting a plurality of printed wiring boards from a material plate to each other via a piece for connecting the printed wiring boards to each other. In the form of punching, a resin coat is formed on the surface of each printed wiring board so as to cover the wiring pattern on the surface, and then the connecting piece is punched out to separate each printed wiring board at both ends thereof. In the method for manufacturing a printed wiring board, the connecting piece is punched along a cutting line of a portion appropriately inserted into the printed wiring board side beyond the edge surface of each printed wiring board at both ends thereof, The resin coat is formed such that its outer peripheral edge is partially penetrated further inside the cutting line at the joint piece. Characterized in that it. "

[0008]

[Operation] A connecting piece for integrally connecting each printed wiring board is cut along a cut line at a portion where the appropriate length is inserted into the printed wiring board side beyond the edge end face of each printed wiring board at both ends. By punching out the connecting piece, it is possible to reliably prevent the occurrence of burrs remaining after punching on the edge end surface of each printed wiring board when punching the connecting piece. When the resin coat for the substrate is formed such that the outer peripheral edge thereof is further inside the cutting line at the joint piece, when the joint piece is punched and cut, the impact at the time of punching and cutting is applied to the resin. Since it is possible to avoid affecting the coat, peeling occurs in the resin coat by punching and cutting of the joint piece It is possible to surely reduce the number of operations.

[0009]

Therefore, according to the present invention, when manufacturing a printed wiring board provided with a resin coat for protecting the wiring pattern, it is possible to prevent the wiring pattern from being damaged by peeling of the resin coat. Under the condition that no residual burrs are generated on the end face, the resin can be reliably reduced, the yield rate of the product can be greatly improved, and the resin that has been peeled off can be reduced. This has the effect of reliably preventing adverse effects on electronic components such as semiconductor chips due to the coated pieces.

In addition, by making the outer peripheral edge of the resin coat partially intrude at the joint piece, the area of the surface of each printed wiring board where the resin coat is to be formed is removed. It is possible to increase the outer peripheral edge of the coat as compared with the case where the outer peripheral edge extends inside the entire length of the coat. -It also has the effect of reducing weight.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
Will be described.

In this figure, reference numeral 11 denotes a printed wiring board made of a fiber reinforced synthetic resin such as glass epoxy resin. The printed wiring board 11 is integrally connected via a connecting piece 12 to a plurality of the printed wiring boards. It is formed by punching from a large material substrate in a connected state.

A plurality of bonding pads 13 and a plurality of connection pads 14 for mounting a semiconductor chip or a semiconductor component on the surface of each printed wiring board 11.
And a wiring pattern (not shown) for connecting the pads 13 and 14 to each other.

Next, a resin coat 15 made of a thermosetting synthetic resin is formed on the surface of each of the printed wiring boards 11 except for the pads 13 and 14.

Then, each of the bonding pads 13
The semiconductor chip or the electronic component is mounted on the part, and the lead terminal is soldered to the part of each connection pad part 14, and then the part of the connecting piece 12 connecting the printed wiring boards 11 to each other, By punching and cutting with a punch A that moves up and down and a cylindrical receiving die B corresponding to the punch A, the printed circuit board 1 is cut off.

At the time of punching and cutting each connecting piece 12 by the punch A and the receiving die B, the cutting lines A1 and A2 at both ends thereof are moved beyond the edge surfaces 11a and 11b of each printed wiring board 11 to the printed wiring board side. Is located at a portion where only the appropriate dimension S has entered, which is relatively small.
Edge surface 11a, 11b in each printed wiring board 11
Therefore, it is possible to reliably prevent the occurrence of burrs remaining after punching.

When the resin coat 15 is formed on the surface of each of the printed wiring boards 11, the resin coat 15 is placed such that its outer peripheral edge is further inward of the cutting lines A1 and A2 at the connecting piece 12. Is formed so as to partially enter only a relatively small dimension E.

This makes it possible to prevent the impact of the punching and cutting from being applied to the resin coat 15 when punching and cutting each of the connecting pieces 12. The occurrence of peeling due to cutting can be reliably reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is an enlarged sectional view taken along line III-III of FIG. 1;

FIG. 4 is a perspective view of a printed wiring board according to a conventional method.

FIG. 5 is an enlarged sectional view taken along line VV of FIG. 4;

FIG. 6 is an enlarged sectional view taken along line VI-VI of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Printed wiring board 11a, 11b Edge face of printed wiring board 12 Connecting piece 13 Bonding pad 14 Connection pad 15 Resin coat A Punch for punching B Receiving die for punching and cutting A1, A2 Cutting line

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/00 H05K 3/28

Claims (1)

(57) [Claims] 1. A method of manufacturing a printed circuit board comprising the steps of:
Each printed wiring board is connected together via a connecting piece
Punched in the form of connection, each of these printed circuit boards
Resin that covers the wiring pattern on the surface
A coat is formed, and the connecting piece is then placed on both ends.
Punching to separate each printed circuit board
In the method for manufacturing a printed wiring board as described above, the connecting piece is provided with each printed wiring board at both ends thereof.
Exceeds the edge surface and enters the printed wiring board side with appropriate dimensions
While punching along the cutting line of the part
Place the outer periphery of the resin coat on the joint piece
Partly inside the cutting line.
A method for manufacturing a printed wiring board, characterized in that the printed wiring board is formed as described above.