JPS59143394A - Multilayer circuit board - Google Patents
Multilayer circuit boardInfo
- Publication number
- JPS59143394A JPS59143394A JP58016057A JP1605783A JPS59143394A JP S59143394 A JPS59143394 A JP S59143394A JP 58016057 A JP58016057 A JP 58016057A JP 1605783 A JP1605783 A JP 1605783A JP S59143394 A JPS59143394 A JP S59143394A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- signal line
- floating signal
- multilayer wiring
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、電子計算機等の電子装置に用いられる多層配
線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a multilayer wiring board used in electronic devices such as computers.
多層配線基板としては、ガラスエポキシ、ポリイミドを
基材とした銅貼り基板を積層したものや、グリーンシー
ト（未焼結セラミック）にパターン印刷し、それを積層
して焼結したセラミック多層配線基板がある。いずれの
多層配線基板であっても、部品実装密度が高（なってく
ると、ディスクリート布線による配線変更は極めて困難
になる。Multilayer wiring boards include those made by laminating copper-clad boards based on glass epoxy or polyimide, and ceramic multilayer wiring boards made by printing patterns on green sheets (unsintered ceramic), laminating them, and sintering them. be. Regardless of the multilayer wiring board, as the component mounting density becomes high, it becomes extremely difficult to change the wiring using discrete wiring.
この問題に対処するために、部品取付はパッドと接続し
ない浮き信号ラインを内層に設け、それをスルーホール
によって部品実装側（表側）の表面層に引き出したセラ
ミック多層配線基板が実願昭５３−６８３８号で提案さ
れている。この多層配線基板は、在来の多層配線基板に
比較すれば配線変更はかなり容易である。しかし、浮ぎ
信号ラインは基板の片面、つまり表側の表面層にしか引
き出されていないため、配線変更個所が局所に集中した
場合に浮き信号ラインを有効に利用できず、配線変更が
困難になることがあった。また、部品を表裏両面に実装
した場合、裏側に取り付けた部品に関する配線変更に浮
き信号う゛インを利用できず、配線変更は極めて困難で
あった。To deal with this problem, a ceramic multilayer wiring board was developed in which a floating signal line that does not connect to the pad for mounting components was provided on the inner layer, and this was brought out to the surface layer on the component mounting side (front side) through a through hole. It is proposed in No. 6838. This multilayer wiring board is considerably easier to change wiring than conventional multilayer wiring boards. However, the floating signal line is only drawn out to one side of the board, that is, the front surface layer, so if the wiring changes are concentrated in a localized area, the floating signal line cannot be used effectively, making it difficult to change the wiring. Something happened. Furthermore, when components are mounted on both the front and back sides, the floating signal line cannot be used to change the wiring for components mounted on the back side, making it extremely difficult to change the wiring.
本発明の目的は、上記従来の多層配線基板よりも配線変
更を容易かつ自由に行い得るようにした多層配線基板を
提供することにある。An object of the present invention is to provide a multilayer wiring board that allows wiring to be changed more easily and freely than the conventional multilayer wiring board described above.
本発明は、浮き信号ラインを表側と裏側の両方の表面層
にスルーホールで引き出すことにより、表裏いずれの側
からでも浮き信号ラインを配線変更に利用できるように
１７、上記の目的を達成しようとするものである。The present invention aims to achieve the above object by drawing out the floating signal line through a through hole in both the front and back surface layers so that the floating signal line can be used for wiring changes from either the front or back side. It is something to do.
本発明の一実施例について、第１図および第２図により
説明する。本実施例の多層配線基板は片面実装用のもの
であり、第１図は部分断面図、第２図は部品実装面（表
側表面層）を示す部分平面図である。An embodiment of the present invention will be described with reference to FIGS. 1 and 2. The multilayer wiring board of this embodiment is for single-sided mounting, and FIG. 1 is a partial sectional view, and FIG. 2 is a partial plan view showing the component mounting surface (front surface layer).
両図において、５は内層（信号層）に設けられた信号ラ
インであり、スルーホール４によって基板の表側と裏側
の表面層に引き出され、補修用パッド３と接続される。In both figures, 5 is a signal line provided in the inner layer (signal layer), which is led out to the front and back surface layers of the substrate through through holes 4 and connected to the repair pads 3.
表側の表面層（部品実装面）には部品１を取り付けるた
めの部品取付はパッド２が図示のように設げられ、これ
は対応する補修用パッド３と接続される。A component attachment pad 2 for attaching a component 1 is provided on the front surface layer (component mounting surface) as shown in the figure, and this is connected to a corresponding repair pad 3.
８は内層（信号層）に設けられた浮き信号ラインであり
、いずれの部品取付はパッド２とも接続されない。各浮
き信号ライン８はスルーホール７によって表側と裏側の
表面層に引き出され、補修用パッド６と接続される。本
実施例では、少なくとも１部の浮き信号ライン８は特定
の部品実装領域の両側にスルーホール７で引き出されて
いる。Reference numeral 8 denotes a floating signal line provided on the inner layer (signal layer), and none of the component attachments is connected to the pad 2. Each floating signal line 8 is drawn out to the front and back surface layers by a through hole 7 and connected to a repair pad 6. In this embodiment, at least a portion of the floating signal line 8 is drawn out through a through hole 7 on both sides of a specific component mounting area.
第１図、第２図で浮き信号ライン８は内層に設けられて
いるが、スペースが許せば、表又は裏の表面層に設けて
もよい。勿論この場合もスルーホールによって表側と裏
側の表面層に引き出される。Although the floating signal line 8 is provided on the inner layer in FIGS. 1 and 2, it may be provided on the front or back surface layer if space permits. Of course, in this case as well, it is drawn out to the front and back surface layers by the through holes.
ある部品１のあるリードの配線を変更する必要が生じた
場合、そのリードが接続されている部品取付はパッド２
とスルーホール４との接続ラインを、そのスルーホール
４と補修用パッド３との間においてナイフで剥離したり
、レーザで溶断することにより切断する。そして、当該
補修用パッド３と、適当な浮き信号ライン８と接続され
ている補修用バッド６とを布線して接続する。このよう
な作業を行うことにより、浮き信号ライン８を利用して
配線変更を容易に行うことができる。しかも、浮き信号
ライン８は表裏両面に引き出されているので、上記の布
線作業を表側と裏側のいずれにおいても行うことができ
、布線の集中により浮き信号ライン８の一部を有効に利
用できな（なるという事態は殆んど回避できる。即ち、
配線変更の自由度が従来よりも大幅に向上し、またその
作業も容易になる。If it becomes necessary to change the wiring of a certain lead of a certain part 1, the part to which that lead is connected must be mounted on pad 2.
The connection line between the through hole 4 and the through hole 4 is cut by peeling it off with a knife or by cutting it with a laser between the through hole 4 and the repair pad 3. Then, the repair pad 3 and the repair pad 6 connected to an appropriate floating signal line 8 are wired and connected. By performing such work, wiring can be easily changed using the floating signal line 8. Moreover, since the floating signal line 8 is drawn out on both the front and back sides, the wiring work described above can be performed on either the front side or the back side, and by concentrating the wiring, a part of the floating signal line 8 can be used effectively. Most situations where this is not possible can be avoided, i.e.,
The degree of freedom in changing wiring is significantly improved compared to the conventional method, and the work is also easier.
また、部品１を跨いで配線するような配線変更が必要と
なる場合もあるが、これを布線のみで行おうとすると、
布線距離が長くなるため単線の使用が許されず、布線作
業の工数が増加し、またＮＣ機器による作業自動化が困
難になる。しかし本実施例では、部品実装領域の両側に
浮き信号ライン８を引き出しているため、部品１を跨ぐ
ような配線も補修パッド３．６間の布線と浮き信号ライ
ン８により行うことができ、布線距離を十分に短縮でき
るから、単線を用いて布線を能率良（行うことができる
ようになり、また布線作業の自動化も容易になる。また
迂回させることな（最短距離で配線することができ、信
号遅延等の面でも有利である。Also, it may be necessary to change the wiring such as wiring across part 1, but if you try to do this with only wiring,
Since the wiring distance becomes long, the use of single wire is not allowed, the number of man-hours for wiring work increases, and it becomes difficult to automate the work using NC equipment. However, in this embodiment, since the floating signal lines 8 are drawn out on both sides of the component mounting area, wiring that straddles the component 1 can be performed using the wiring between the repair pads 3 and 6 and the floating signal lines 8. Since the wiring distance can be sufficiently shortened, it becomes possible to perform wiring efficiently using a single wire, and automation of the wiring work is also easy. This is advantageous in terms of signal delay, etc.
本発明の他の実施例を第３図ないし第５図により説明す
る。第３図は多層配線基板の概略部分断面図、第４図は
その表側表面層を示す部分平面図、第５図は裏側表面層
を示ず部分平面図であり、各図において第１図および第
２図と同等部分は同符号を付しである。Another embodiment of the present invention will be described with reference to FIGS. 3 to 5. 3 is a schematic partial cross-sectional view of the multilayer wiring board, FIG. 4 is a partial plan view showing the front surface layer, and FIG. 5 is a partial plan view not showing the back surface layer. Components equivalent to those in FIG. 2 are given the same reference numerals.
本実施例は両面実装用であり、部品１を取り付けるため
の部品取付はパッド２とその補修用バッド３は表側と裏
側の両方の表面層に設けられている。これ以外は前実施
例と同様である。This embodiment is for double-sided mounting, and pads 2 and repair pads 3 for mounting components 1 are provided on both the front and back surface layers. Other than this, this embodiment is the same as the previous embodiment.
本実施例においても、表側または裏側に実装された部品
１相互の配線変更を浮き信号ライン８を利用して容易に
行うことができることは明らかである。また、表側に実
装された部品１と裏側に実装された部品１との間の配線
変更も、浮き信号ライン８を利用して容易に行うことが
できることも明らかである。It is clear that in this embodiment as well, the floating signal lines 8 can be used to easily change the wiring between the components 1 mounted on the front side or the back side. It is also clear that the floating signal line 8 can be used to easily change the wiring between the component 1 mounted on the front side and the component 1 mounted on the back side.
尚、前記各実施例では一方向の浮き信号ラインのみ設け
ているが、２以上の方向の浮き信号ラインを設けるよう
にしてもよい。また本発明は、ガラスエポキシ、ポリイ
ミドを基材とした多層配線基板、セラミックを基材とし
た多層配線基板のいずれにも適用できる。In each of the embodiments described above, only floating signal lines in one direction are provided, but floating signal lines in two or more directions may be provided. Further, the present invention can be applied to any of multilayer wiring boards made of glass epoxy or polyimide as a base material, and multilayer wiring boards made of ceramic as a base material.
以上の説明から明らかなように、本発明によれば、基板
の両面で配線変更のための布線を行うことかやきるので
、浮き信号ラインを最大限に利用して配線変更を従来よ
りも容易かつ自由に行うことができ、また従来極めて困
難であった両面実装における配線変更も浮き信号ライン
を利用して容易に行うことができる等、多大の効果を得
られる。As is clear from the above description, according to the present invention, it is possible to perform wiring changes on both sides of the board, so the floating signal lines can be utilized to the maximum and wiring changes can be made more easily than before. This can be done easily and freely, and the floating signal line can be used to easily change the wiring in double-sided mounting, which was extremely difficult in the past, resulting in many effects.
第１図は本発明の第１実施例を示す部分断面図、第２図
は同第１実施例の表側表面層を示す部分平面図、第３図
は本発明の第２実施例を示す部分断面図、第４図は同第
２実施例の表側表面層を示す部分断面図、第５図は同第
２実施例の裏側表面層を示す部分断面図である。
１・・・部品、 ２・・・部品取付はパッド、 ３
，６・・・ｍ（ｌｌ用パッド、 ４．７・・・スルー
ホール、訃・・信号ライン、 ８・・・浮き信号ライ
ン。FIG. 1 is a partial cross-sectional view showing a first embodiment of the present invention, FIG. 2 is a partial plan view showing a front surface layer of the first embodiment, and FIG. 3 is a partial cross-sectional view showing a second embodiment of the present invention. 4 is a partial sectional view showing the front surface layer of the second embodiment, and FIG. 5 is a partial sectional view showing the back surface layer of the second embodiment. 1... Parts, 2... Parts mounting pad, 3
, 6...m (ll pad, 4.7...Through hole, Death...signal line, 8...Floating signal line.
Claims (2)
とも接続しない浮き信号ラインを内層または表面層に設
け、該浮き信号ラインをスルーホールを介して該表側お
よび裏側表面層に引き出したことを特徴とする多層配線
基板。(1) When mounting components on either the front or back surface layer, a floating signal line that is not connected to the pad is provided on the inner layer or surface layer, and the floating signal line is drawn out to the front and back surface layers via a through hole. A multilayer wiring board featuring:
品実装領域の両側に引き出したことを特徴とする特許請
求の範囲第１項記載の多層配線基板。(2) A multilayer wiring board according to claim 1, characterized in that a few (at least some) floating signal lines are drawn out to both sides of a corresponding component mounting area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016057A JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016057A JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143394A true JPS59143394A (en) | 1984-08-16 |
| JPH053160B2 JPH053160B2 (en) | 1993-01-14 |
Family
ID=11905945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58016057A Granted JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143394A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225437A (en) * | 1985-07-25 | 1987-02-03 | Nec Corp | Multilayer interconnection substrate |
| JPS63102399A (en) * | 1986-10-20 | 1988-05-07 | 富士通株式会社 | Multilayer printed interconnection board |
| JPH02143493A (en) * | 1988-11-24 | 1990-06-01 | Nec Corp | Multilayered printed-wiring board for both surface mounting use |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735374U (en) * | 1993-11-04 | 1995-06-27 | キタノ製作株式会社 | Container with cooking completion indication |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145062A (en) * | 1977-05-23 | 1978-12-16 | Fujitsu Ltd | Wiring substrate easily capable of modifying wiring |
| JPS55103793A (en) * | 1979-01-31 | 1980-08-08 | Nippon Electric Co | Through hole printed circuit board |
| JPS56114395A (en) * | 1980-02-13 | 1981-09-08 | Nippon Electric Co | Multilayer printed board |
| JPS5752949U (en) * | 1980-09-12 | 1982-03-27 | ||
| JPS5758798U (en) * | 1980-09-24 | 1982-04-07 |
-
1983
- 1983-02-04 JP JP58016057A patent/JPS59143394A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145062A (en) * | 1977-05-23 | 1978-12-16 | Fujitsu Ltd | Wiring substrate easily capable of modifying wiring |
| JPS55103793A (en) * | 1979-01-31 | 1980-08-08 | Nippon Electric Co | Through hole printed circuit board |
| JPS56114395A (en) * | 1980-02-13 | 1981-09-08 | Nippon Electric Co | Multilayer printed board |
| JPS5752949U (en) * | 1980-09-12 | 1982-03-27 | ||
| JPS5758798U (en) * | 1980-09-24 | 1982-04-07 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225437A (en) * | 1985-07-25 | 1987-02-03 | Nec Corp | Multilayer interconnection substrate |
| JPS63102399A (en) * | 1986-10-20 | 1988-05-07 | 富士通株式会社 | Multilayer printed interconnection board |
| JPH02143493A (en) * | 1988-11-24 | 1990-06-01 | Nec Corp | Multilayered printed-wiring board for both surface mounting use |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH053160B2 (en) | 1993-01-14 |
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