JPH02143493A - Multilayered printed-wiring board for both surface mounting use - Google Patents

Multilayered printed-wiring board for both surface mounting use

Info

Publication number
JPH02143493A
JPH02143493A JP63297637A JP29763788A JPH02143493A JP H02143493 A JPH02143493 A JP H02143493A JP 63297637 A JP63297637 A JP 63297637A JP 29763788 A JP29763788 A JP 29763788A JP H02143493 A JPH02143493 A JP H02143493A
Authority
JP
Japan
Prior art keywords
wiring
pad
wiring board
holes
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63297637A
Other languages
Japanese (ja)
Inventor
Takashi Nakahara
中原　俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63297637A priority Critical patent/JPH02143493A/en
Publication of JPH02143493A publication Critical patent/JPH02143493A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To improve the housing property of a wiring without using a wiring channel by a method wherein element through-holes, each having each pad for wiring use on the surface and rear of a substrate, are moderately arranged in the whole surface of the substrate. CONSTITUTION:Single through-holes 102, each having a pad 103 for wiring use on the surface and rear of a substrate, are moderately dispersed and arranged in the whole surface of the substrate. In case a pad 104a for wiring use on the surface and a pad 104b for wiring use on the rear are connected to each other, wirings are respectively provided between the pad 104a and a pad 103a and between the pad 104b and a pad 103b by each wire 106.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は両面実装用多層プリント配線基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a multilayer printed wiring board for double-sided mounting.

〔従来の技術〕[Conventional technology]

従来のこの種の両面実装用多層プリント配線基板は、第
２図に示すように、多層プリント配線基板２０１の表面
の布線用パッド２０２ａと裏面の布線用パッド２０２ｂ
とを接続するには、布線２０３を通すための機械穴２０
４を１又は複数個設けておき、これらの機械穴を通して
行なっている。As shown in FIG. 2, a conventional double-sided mounting multilayer printed wiring board of this type has a wiring pad 202a on the front surface of a multilayer printed wiring board 201 and a wiring pad 202b on the back surface.
In order to connect the machine hole 20 for passing the wiring 203
4 is provided, and the process is carried out through these mechanical holes.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の両面実装用多層プリント配線基板は、布
線を通すための大きな機械穴を必要とするので、信号配
線用のチャネルが減ってしまい、配線収容性が悪くなっ
てしまうという欠点があった。The conventional multilayer printed wiring board for double-sided mounting described above requires large machine holes for wiring to pass through, which reduces the number of channels for signal wiring and has the drawback of poor wiring accommodation. Ta.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のプリント配線基板は、表裏の実装面にＬＳＩ等
の電気部品を実装する両面実装用多層プリント配線基板
において、 信号パターンと接続されていない単独スルーホールが基
板の全面に配置され、がっ前記単独スルーホールは個々
に、表裏両面に布線用パッドを持つことを特徴とする特 〔実施例〕 次に、本発明について図面を参照して説明する。The printed wiring board of the present invention is a multilayer printed wiring board for double-sided mounting in which electrical components such as LSIs are mounted on the front and back mounting surfaces, and single through holes not connected to signal patterns are arranged on the entire surface of the board. [Example] The present invention will be described below with reference to the drawings.

第１図（Ａ）は本発明の一実施例の断面図であり、１０
１は多層配線プリント基板、１０２は表面に布線用パッ
ド１０３ａ、１０４ａ、裏面に布線用パッド１０３ｂ、
１０４ｂを持つ単独スルーホール、１０５は前記スルー
ホール１０２と布線用パッド１０３を接続している導体
パターンである。FIG. 1(A) is a cross-sectional view of one embodiment of the present invention, with 10
1 is a multilayer wiring printed circuit board, 102 is a wiring pad 103a, 104a on the front surface, a wiring pad 103b on the back surface,
A single through hole 104b is provided, and 105 is a conductive pattern connecting the through hole 102 and the wiring pad 103.

表面の布線用パッド１０４ａと裏面の布線用パッド１０
４ｂ間を接続したい場合、表面の布線用パッド１０４ａ
−１０３ａ問および裏面の布線用パッド１０４ｂ−１０
３ｂ間を線材１０６によって布線する。Wiring pad 104a on the front side and wiring pad 10 on the back side
4b, use the wiring pad 104a on the surface.
- Question 103a and back wiring pad 104b-10
A wire rod 106 is used to wire between 3b.

第１図（Ｂ）は本実施例の平面図を示したものである。FIG. 1(B) shows a plan view of this embodiment.

本図に示す様に、布線用パッド１０３を表裏に持つ単独
スルーホール１０２を基板の全面に適度に分散して配置
しておく。As shown in this figure, individual through holes 102 having wiring pads 103 on the front and back sides are appropriately distributed and arranged over the entire surface of the board.

単独スルーホール１０２は、布線を通す必要がないため
、通常の信号用スルーホールと同一サイズでよい。The individual through-hole 102 does not need to pass a wire through, so it may be the same size as a normal signal through-hole.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、表裏に布線用パッドを持
つ単独スルーホールを基板の全面に適度に配置しておく
ことにより、表裏間の布線を容易に行うことができ、前
記単独スルーホールは第２図に示した機械穴のように布
線を通す必要がないため、通常の信号用スルーホールの
同一のサイズでよいので配線チャネルを殺すことなく配
線収容性の良い多層プリント配線基板を提供することが
できる。As explained above, the present invention makes it possible to easily conduct wiring between the front and back sides by properly arranging individual through holes having wiring pads on the front and back sides of the board, and Unlike the mechanical holes shown in Figure 2, the holes do not require wiring to pass through, so they can be the same size as normal signal through holes, allowing for a multilayer printed wiring board with good wiring accommodation without destroying the wiring channels. can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（Ａ）は本発明の一実施例を示す断面図、第１図
（Ｂ）は本実施例の平面図、第２図は従来例の断面図で
ある。 １０１．２０１・・・多層プリント配線基板、１０２・
・・単独スルーホール、１０３，１０４，２０２・・・
布線用パッド、１０５・・・導体パターン、１０６・・
・布線用線材、２０３・・・布線、２０４・・・機械穴
。FIG. 1(A) is a sectional view showing one embodiment of the present invention, FIG. 1(B) is a plan view of this embodiment, and FIG. 2 is a sectional view of a conventional example. 101.201...Multilayer printed wiring board, 102.
・Single through hole, 103, 104, 202...
Wiring pad, 105... Conductor pattern, 106...
・Wire rod for wiring, 203... Wiring, 204... Machine hole.

Claims (1)

【特許請求の範囲】[Claims] 表裏の実装面にＬＳＩ等の電気部品を実装する両面実装
用多層プリント配線基板において、信号パターンと接続
されていない単独スルーホールが基板の全面に配置され
、かつ前記単独スルーホールは個々に、表裏両面に布線
用パッドを持つことを特徴とする両面実装用多層プリン
ト配線基板。In a multilayer printed wiring board for double-sided mounting in which electrical components such as LSI are mounted on the front and back mounting surfaces, individual through holes that are not connected to signal patterns are arranged on the entire surface of the board, and the individual through holes are individually arranged on the front and back sides. A multilayer printed wiring board for double-sided mounting, characterized by having wiring pads on both sides.
JP63297637A 1988-11-24 1988-11-24 Multilayered printed-wiring board for both surface mounting use Pending JPH02143493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63297637A JPH02143493A (en) 1988-11-24 1988-11-24 Multilayered printed-wiring board for both surface mounting use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63297637A JPH02143493A (en) 1988-11-24 1988-11-24 Multilayered printed-wiring board for both surface mounting use

Publications (1)

Publication Number Publication Date
JPH02143493A true JPH02143493A (en) 1990-06-01

Family

ID=17849157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63297637A Pending JPH02143493A (en) 1988-11-24 1988-11-24 Multilayered printed-wiring board for both surface mounting use

Country Status (1)

Country Link
JP (1) JPH02143493A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143394A (en) * 1983-02-04 1984-08-16 株式会社日立製作所 Multilayer circuit board
JPS61272999A (en) * 1985-05-29 1986-12-03 株式会社日立製作所 Printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143394A (en) * 1983-02-04 1984-08-16 株式会社日立製作所 Multilayer circuit board
JPS61272999A (en) * 1985-05-29 1986-12-03 株式会社日立製作所 Printed circuit board

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