JP2000123893A - Right angle connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce cross talks even if a pitch of pin contacts is small by forming signal patterns wired in response to the adjacent respective pin contacts in separate layers. SOLUTION: Among L-shaped signal pin contacts 2 to 9 arranged in parallel on the two sides of a base board 1, 2 and 6 are connected by an inclined signal pattern S1, and 4 and 8 are connected by an inclined signal pattern S3. On the reverse of the base board 1, among the signal pin contacts 2 to 9, the contacts 3, 7 are connected by an inclined signal pattern S2, and the contacts 5, 9 are connected by an inclined signal pattern S4. The signal patterns S1, S3 and the signal patterns S2, S4 are alternately wired on one surface and the other surface of the base board 1. An adjacent distance of the signal patterns to a pitch P of the signal pin contacts 2 to 9 becomes 2P, and when the signal patterns are formed in a multilayer shape, the adjacent distance can be expanded further.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a right angle connector, and more particularly to a right angle connector with reduced crosstalk.

[0002]

2. Description of the Related Art As a conventional technique, Japanese Patent No. 262343 is known.
No. 5 (issued on June 25, 1997), the main points of the equal-length right-angle connector are shown in FIGS.
This will be described with reference to FIG.

As shown in FIGS. 10 and 11, an equal-length right-angle connector includes three substrates 5 made of an insulating material.
It is constituted by superposition of 0, 60 and 70. Four signal patterns 51 are provided on both sides of the central substrate 50, and each signal pattern 51 is composed of three substrates 50, 6.
Four through holes 53 opened stepwise at 0,70
It is electrically connected by plating applied inside.
The eight through holes 55 opened in parallel to the two sides of the three substrates 50, 60, and 70 are plated to attach signal pin contacts.
Eight through holes 57 are formed in the two substrates 50, 60, and 70 in parallel with two sides in order to attach a ground pin contact.

[0004] Ground patterns 71 are provided on the outer surfaces of the substrates 60 and 70 on both sides, and these ground patterns 71 are connected by plated-through holes.

FIGS. 12 and 13 show a state in which an L-shaped signal pin contact 48 is attached to each through-hole 55 and an L-shaped ground pin contact 49 is attached to each through-hole 57.

[0006]

In the conventional equal-length right-angle connector, since the purpose of distributing the signal pattern and the ground pattern in multiple layers is to make the electrical path the same length, the pitch of each pin contact is reduced. When the width becomes narrow, the distance between adjacent patterns becomes small, so that the crosstalk increases.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the drawbacks of the conventional equal-length right-angle connector and to provide a right-angle connector capable of reducing crosstalk even when the pitch of pin contacts is narrow. is there.

[0008]

The present invention employs the following means to solve the above-mentioned problems.

1. In a right angle connector including a multilayer substrate, a number of pin contacts, and a signal pattern for electrically connecting the two pin contacts, a signal pattern to be wired corresponding to each of the adjacent pin contacts is formed. A right angle connector that is formed on separate layers to reduce crosstalk.

[0010] 2. 2. The right-angle connector according to claim 1, wherein signal patterns to be wired corresponding to the respective pin contacts are arranged for each layer.

3. 3. The right angle connector according to 1 or 2, wherein a ground pattern is arranged between two signal patterns wired in correspondence with the adjacent pin contacts.

4. 3. The right angle connector according to 1 or 2, wherein a ground layer is arranged between each layer of the signal pattern to be wired corresponding to each of the pin contacts.

5. The right angle connector according to any one of the above items 1 to 4, wherein ground layers are provided on both surfaces of the multilayer substrate.

6. 6. The right angle connector according to any one of 1 to 5, wherein each signal pattern to be wired corresponding to each of the pin contacts has an equal length.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a right angle connector with reduced crosstalk according to an embodiment of the present invention.
This will be described with reference to FIGS.

As shown in FIG. 5, the right angle connector is formed by superposing three insulating substrates 1, 11, 31.

First, a signal pattern will be described with reference to FIGS. FIG. 2 shows the central substrate 1 in FIG.
Is shown. In FIG. 1 showing the left surface of the substrate 1 of FIG.
The two sides of the L-shaped signal pin contacts 2-9 provided in parallel to, 2 and signal pattern S ₁ to 6 and is inclined
Are connected by, also 4 and the 8 are connected by a signal pattern S ₃ inclined. In Figure 3 shows the right surface of the substrate 1 of Figure 2, of the signal pin contacts 2-9, 3 and 7 and are connected by signal pattern S ₂ inclined, also signal pattern 5 and the 9 is inclined It is connected by S _4. That is, the signal patterns S ₁ , S
₃ and S ₂ and S ₄ are alternately wired on one surface of the substrate 1 and the other surface. With such a configuration, the distance between adjacent signal patterns becomes 2P (twice) the pitch P of the signal pin contacts, so that crosstalk is reduced. Similarly, the signal patterns S ₁ and S ₄ are arranged on the left surface of the substrate 1, the signal patterns S ₂ and S ₅ are arranged on the right surface of the substrate 1, and the signal patterns S ₃ and S ₆ are arranged on the right surface of the substrate 31. If provided, the distance between adjacent signal patterns is three times the pitch of the signal pin contacts. By design, the distance between adjacent signal patterns can be increased many times the pitch of the signal pin contacts.

Here, when the foil of the pattern is called a layer and a ground layer is inserted between the signal layers, the crosstalk between them can be electromagnetically shielded. Further, when a ground pattern is arranged between signal patterns in the same layer, crosstalk between the signal patterns can be electromagnetically shielded.

The signal pin contacts 2 to 9 are fixed to the substrate 1 by means such as soldering or press fitting. In addition, eight ground through holes 10 are opened in parallel with two sides of the substrate 1.

Next, FIG.
This will be described with reference to FIG. Left substrate 11 in FIG.
As shown in FIG. 4, eight L-shaped ground pin contacts 12 to 19 are fixed in parallel to two sides by means such as soldering or press fitting. On the ground plane 20 on the left side of FIG. 5 of the substrate 11, eight signal lands 21 for signals are provided in parallel with the two sides.
2 is open. The right substrate 31 in FIG.
It is configured similarly to the substrate 11. The ground pin contact on the left side of the substrate 11 and the ground pin contact on the right side of the substrate 31 are electrically connected to each other through the ground through holes of the substrates 11, 1, and 31.

The appearance of an embodiment of the present invention will be described with reference to FIGS. The connector is completed by performing a resist process on the ground surface 20 of the substrate 11 and the ground surface 20 of the substrate 31. FIG. 8 shows three substrates 1, 11,
31 shows a state in which they are superimposed. In FIG. 7, ground pin contacts 12 to 19 are provided on the surface of the substrate 11.
On the back surface of the substrate 11, signal pin contacts 2 to 9 are provided.
Each is provided. In FIG. 9, the signal pin contacts 6 to 9 and the ground pin contacts 16 to 1
9 is mounted on the printed circuit board 40, and has signal pin contacts 2 to 5 and ground pin contacts 12 to
15 is fitted with a mating socket.

[0022]

As is apparent from the above description, according to the present invention, since the signal patterns are distributed in multiple layers, the distance between adjacent signal patterns can be increased, so that the crosstalk is reduced. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a left side view of a central substrate among three superimposed substrates in a right-angle connector with reduced crosstalk according to an embodiment of the present invention.

FIG. 2 is a front view of the substrate at the center.

FIG. 3 is a right side view of the center substrate.

FIG. 4 is a left side view of the substrate superimposed on the left side of the central substrate. However, it shows a state before the resist processing is performed.

FIG. 5 is a sectional view of the connector.

FIG. 6 is a right side view of the substrate superimposed on the right side of the central substrate. However, it shows a state before the resist processing is performed.

FIG. 7 is a left side view of the connector.

FIG. 8 is a front view of the connector.

FIG. 9 is a right side view showing a state where the connector is mounted on a printed circuit board.

FIG. 10 is a side view of a conventional isometric right angle connector before being assembled.

11 is a sectional view taken along line AA in FIG.

FIG. 12 is a side view of a conventional isometric right angle connector.

FIG. 13 is a sectional view taken along line BB in FIG. 12;

[Explanation of symbols]

REFERENCE SIGNS LIST 1 board 2-9 signal pin contact 10 ground through hole 11 board 12-19 ground pin contact 20 ground plane 21 signal land 22 signal through hole 31 board 40 printed board S ₁ -S ₄ signal pattern

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Masahiro Yamauchi 5-7-1 Shiba, Minato-ku, Tokyo F-term in NEC Corporation (reference) 5E021 FA05 FA11 FB02 FC20 5E023 AA04 BB21 CC22 EE02 GG02 HH30

Claims (6)

[Claims] 1. A multi-layer substrate, a plurality of pin contacts,
In a right angle connector comprising a signal pattern for electrically connecting between two pin contacts, a signal pattern to be wired corresponding to each of the adjacent pin contacts is formed on a separate layer, and a crosstalk is formed. Right-angle connector characterized by reducing 2. The right angle connector according to claim 1, wherein signal patterns to be wired corresponding to the respective pin contacts are arranged for each layer. 3. The right-angle connector according to claim 1, wherein a ground pattern is arranged between two signal patterns to be wired corresponding to the adjacent pin contacts. 4. The right-angle connector according to claim 1, wherein a ground layer is provided between each layer of the signal pattern to be wired corresponding to each of the pin contacts. 5. The right angle connector according to claim 1, wherein ground layers are provided on both surfaces of the multilayer board. 6. The right angle connector according to claim 1, wherein each signal pattern to be wired corresponding to each of said pin contacts has an equal length.