JPS63124595A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a through hole in a printed wiring board, and the entrance or exit of the through hole can be improved by providing a through hole that is sometimes drilled diagonally with respect to the board surface. The present invention relates to a printed wiring board suitable for realizing a true signal path on the opposite side of the board.

[Conventional technology]

Regarding conventional printed wiring boards,
As in the No. 517 publication, the through holes for connecting 1M were perpendicular to the substrate surface.

In other words, the conventional through-hole has the structure shown in Fig. 2(a) and (b), where (,) is a perspective view perpendicular to the substrate surface, and (b) is a diagram of the through-hole shown in (a). A sectional view taken along line Xl-X2 taken along the center in the X direction is shown. Figure 2 (
In a), 20 is a part of the wiring route in the Y direction on one side that is visible when viewed perpendicular to the board surface, and 22.23 is a through hole for passing the route 20 from one side of the board to the other side. The outer diameter and inner diameter of the hole are shown, and 21 indicates a part of the wiring route in the Signals are at the same potential on one side and the other side of the substrate at the hole position, and different signals cannot be passed through the through-hole position. Therefore, wiring can be done by drilling through holes diagonally to the board surface and creating a true signal path at the same position on the opposite side of the through hole entrance or exit, but this needs to be considered. It had not been done.

[Problem that the invention seeks to solve]

In the above-mentioned prior art, the through holes are drilled perpendicularly to the substrate surface, so the same signal is generated at both surfaces of the substrate where the through holes are located. Therefore, consideration has not been given to using the through-hole position to pass multiple signal paths, and if the true signal can pass through one side and the other side of the through-hole position, the wiring route of the true signal can be determined. There was a problem with the wiring.

An object of the present invention is to increase the degree of freedom in wiring by allowing true signals to pass through the same position on the opposite side of the entrance or exit of a through hole, thereby improving the connection efficiency.

[Means for solving problems]

In order to achieve the above object, the through holes are formed obliquely to the substrate surface, thereby creating a difference in the coordinate positions of the entrance and exit of the through holes on the substrate surface. As a result, the entrance and the same position on the opposite side of the through-hole, and the same position on the opposite side between the outlet and the through-hole are shielded from each other by the board, so the purpose is achieved by allowing the true signal to pass through. .

[Effect]

By penetrating the substrate, whether perpendicular to the substrate surface or obliquely, the through hole can reach the opposite surface, and a signal path spanning between wiring layers can be realized. When a through hole is diagonally drilled on the board surface, the coordinate positions of the entrance and exit of the through hole on the board are different, so the positions on the opposite side of the entrance and exit can be used for other purposes, allowing true signals to pass through. can do.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to through-hole structural diagrams in FIGS. 1 and 7, and wiring route diagrams in FIGS. 3, 4, 5, and 6.

Figures 1(a) and 1(b) show the structure of a through hole according to the present invention, where (a) is a perspective view perpendicular to the substrate surface, and Figure 1(b) is the same as that shown in (a). This is an XI-X2 cross-sectional view taken in the X direction through the center of the through hole. In Fig. 1(a), 10 is a part of the wiring route in the Y direction as seen perpendicular to the board surface, and 12.13 is route 1o.
The outer diameter and inner diameter of a through hole for penetrating from one side of the board to the other side are shown. 11 is X on the other side of the board
14.15 is the outer diameter and inner diameter of the through hole on the other side of the board. 16° and 17 indicate the outer diameter and inner diameter of the through hole inside the substrate. FIG. 1(b) is a cross section of FIG. 1(a), showing the above-mentioned sections 11 to 17 and a cross section 18 of the substrate.

According to the present invention, since the through hole is installed diagonally as shown in FIG. 1, the same position on the opposite side of the cutting board surface of the through keel is insulated by the substrate material 18, so that the true signal The route 19°2o can be passed. This example will be explained with reference to FIGS. 3(a) and 3(b). In FIG. 3(a), component pins, through holes, and signal lines are set on grid points 31. In FIG. In the figure, a signal line 33 on the front surface and a signal line 34 on the back surface are connected via a conventional through hole 32, and in a situation where through holes 35 such as component pin holes are respectively installed on the grid 31, If there are 37 connection requests, the route can no longer be found. Therefore, as shown in FIG. 3(b), according to the present invention, through holes are installed diagonally at positions 38 and 39 so as to pass through 40, so that the signal 33 in FIG. 3(a) is routed through 33'.

Change it to 40 and connect it to 34, which leaves 3
A path 41 connecting pins 36 and 37 via the surface at position 9 can be realized. In addition, by installing the through holes according to the present invention in a 45° direction on the grid, it is possible to meet the connection requirements for component pins 43 and 44 in the situation where grid points 41 and through holes 42 are already present as shown in FIG. , through holes are connected between grid points 45 and 46, and component pins 47.
For connection request of 48, set the through keel at lattice point 49°5
By installing it so as to connect the 0 positions, it is possible to wire two signals, which cannot be achieved with conventional through-holes.

If the through hole according to the present invention can be realized by shifting the interval between the population side and the exit side by an arbitrary distance, the degree of freedom in connection can be further improved. That is, the grid 51 in FIG. Through holes 52 for component pins etc. installed on the grid. In an existing situation where signal paths 53 and 54 realized using conventional through-holes 54 are used, 58 is required to connect between 56° and 57 points M (separated by 2 or more grids) where component pins, etc. should be connected. When the through hole according to the present invention is penetrated, if constraints based on the physical distance or design specifications between the through hole 52 and the conventional through hole 54 and the through hole 58 according to the present embodiment are observed, This makes it possible to satisfy connection requests between and 57. This means that any arbitrary positions on the board can be connected, and the lattice point 6 shown in Fig.
The through hole 65 according to the present invention can also meet requests for connection between the metric component pin 63 and the signal end point 64, etc., which can be mounted on the same. Moreover, if the present invention is applied to a multilayer board as shown in FIG. 7, the inner layer 72 sandwiched between one surface ff71. As the number of substrates 74 that separate layers increases, the distance between surface layers increases, and in high-density substrates where signal delay time must be considered, the signal path can be shortened by making the through holes 75 diagonal. There are advantages such as being able to

〔Effect of the invention〕

According to the present invention, the same position on the opposite side of the entrance or exit of the through hole can be used for other purposes. This increases the degree of freedom in wiring, and even if a route could not be realized in the past, the route number may be found, and the result rate can be improved. Further, in a double-sided mounting board, if the component terminals on both sides to be connected are connected using the through-hole according to the present invention, a wiring route can be realized with the shortest distance, and the delay time can be minimized.

[Brief explanation of the drawing]

FIG. 1 and FIG. 7 are structural diagrams of one embodiment of the present invention, and FIG.
The figure is a structural diagram of a conventional through hole, and FIGS. 3 to 6 are wiring route diagrams showing an embodiment of the present invention. 12... Outer diameter of the through hole on the front side, 13... Inner diameter of the through hole on the front side, 14... Outer diameter of the through hole on the back side, 15... Inner diameter of the through hole on the back side, 16.
...The position in the board of the line connecting the outer diameter of the through hole on the front side and the back side, 17...The position in the board of the line connecting the inner diameter of the through hole on the front side and the back side.

Claims (1)

[Claims] 1. A through hole is provided at any point of the XY lattice point,
In a printed wiring board that has multiple wiring layers via an insulating layer, if a through hole made perpendicular to the board surface to connect the wiring layers becomes an obstacle and the wiring path cannot be realized, the entrance or exit position of the through hole 1. A printed wiring board characterized in that a wiring route is realized by providing diagonal through holes that are shifted by one grid in the X or Y direction.