JPH10190185A - Wiring pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a patterned surface by eliminating the need of drawing around a wiring pattern on the patterned surface by wiring wires having a common connecting destination through a conductive plated provided on a parts mounting surface. SOLUTION: A wiring board 10 is constituted in a one-sided substrate having a parts mounting surface for mounting the electronic parts 30, such as the microcomputer, etc., at high density on one side and a patterned surface constituted of wiring patterns, lands, etc., on the other side. On the parts mounting surface, parts inserting holes 14 into which pins 32 which become the lead sections of the parts 30 and conductive plate inserting holes 18 into which the conductive plate inserting sections 22 of a conductive plate 20 are inserted are provided. The conductive plate 20 is composed of a platy conductive material, such as copper, iron, etc., and interposed between the parts 30 and wiring board 10 by passing the pawl-like inserting sections 22 provided at four corners through the holes 18. The lands of pins 32 having a common connecting destination and the lands 15 for the conductive plate 20 are integrally formed. These wire are wired through the plate 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern of a single-sided wiring board used for electric and electronic equipment.

[0002]

2. Description of the Related Art In a wiring board for electric and electronic equipment,
Wiring boards such as double-sided boards and multi-layer boards have become widespread due to the demand for high-density mounting of mounted components. However, there are still many cases where wiring boards are formed of conventional single-sided boards. As is well known, a single-sided board is one in which a wiring pattern is routed on one of the front and back surfaces of a wiring board, and mounted components are mainly arranged on the other surface on which the wiring pattern is mounted. FIG. 4 shows a conventional single-sided board on which high-density components such as a microcomputer are mounted, and FIG. 5 shows a wiring pattern formed on the other surface of the wiring board.

In FIG. 4, one surface (component mounting surface) of a wiring board 10 has a component insertion hole 14 through which a pin 32 of an electronic component 30 such as a microcomputer is inserted and penetrated, and the electronic component 30 is inserted into the component insertion hole 14. After the pins 32 are inserted, the other surface of the wiring board 10 is soldered to perform conduction with the wiring pattern and physical connection with the wiring board.

A wiring pattern provided on the other surface (pattern surface) of the wiring board 10 is as shown in FIG. In FIG. 5, the pins 32 of the electronic component 30 protrude from the center of each of the electronic component lands 12 formed by the ends of the wiring pattern 16, and wiring is performed to an arbitrary component through the wiring pattern 16. In the case where a common connection destination is determined for some pins, such as an earth line, a power supply line, and a signal line, the wiring pattern from each electronic component land 12 is routed as a common line 17 and It is a general board design procedure to connect these components as one wiring pattern.

[0005]

However, the above-described wiring pattern has the following problems. First, since the common line 17 is routed, the wiring pattern 16 from another pin 32 is restricted as shown in FIG. That is, in FIG. 5, the common line 17 is another wiring pattern for connecting the electronic component lands 12 in the downward direction.
16 cannot be derived downward. As a countermeasure, the common line 17 can be separated and formed as a plurality of wiring patterns.However, at the time of high-density wiring, the wiring pattern is more advantageous in design and miniaturization of the wiring board itself, and such a measure is not practical. Absent.

As another means, the wiring pattern on the pattern surface can be reduced by wiring the common line 17 and other wiring patterns 16 with jumper wires provided on the component mounting surface. Electronic component 30 and wiring board
Since a jumper wire or the like enters into the gap between the electronic component 30 and the component mounting surface of the electronic component 30, the electronic component 30 may be detached, floated, or tilted, thereby causing a problem.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a wiring pattern of a wiring board which can be easily designed, and at the same time, can reliably mount components and obtain wiring.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a high-density electronic component is mounted, one surface is a component mounting surface for mounting a high-density electronic component such as a microcomputer, and the other surface is a wiring pattern. A conductive plate is disposed between the electronic component and the component mounting surface of the wiring substrate on a single-sided substrate having a pattern surface composed of a land or a land, and the conductive plate penetrates the wiring substrate and is soldered to the pattern surface. A possible conductive plate insertion portion is provided, and on the pattern surface of the wiring board, a land for an electronic component to which pins of the electronic component are soldered and a land for a conductive plate to which the conductive plate insertion portion is soldered are provided. The wiring pattern is characterized in that, among the pins, lands that can be conducted through a common line are in conduction with the lands for the conducting plate. The common line may be an earth line, or a power line or a signal line.

[0009]

1 is a perspective view of a wiring board according to an embodiment of the present invention. FIG. 2 is a half sectional side view of the wiring board shown in FIG. FIG. 3 shows the pattern surface of the substrate. In FIGS. 1 and 2, the wiring board 10 is a single-sided board having one surface as a component mounting surface for mounting a high-density electronic component 30 such as a microcomputer and the other surface as a pattern surface composed of wiring patterns and lands. I have. On the component mounting surface, a pin 32 serving as a lead portion of the electronic component 30 is provided.
Are provided, and a conductive plate insertion hole 18 into which a conductive plate insertion portion 22 of a conductive plate 20 described later is inserted. The conductive plate 20 is made of a conductive material such as copper or iron in a plate shape, and a conductive plate insertion portion 22 provided like a nail near the four corners is inserted through the conductive plate insertion hole 18 to penetrate the electronic component 30 and the wiring board. It is sandwiched between 10.

[0010] The pattern surface of the wiring board 10 thus formed is as shown in FIG. According to FIG. 3, a land for electronic components is provided around each pin 32.
The conductive plate lands 13 are provided around the conductive plate insertion portion 22 and the conductive plate insertion portion 22, and the wiring patterns 16 drawn from these lands are arbitrarily routed. Here, as shown in FIG. 3, the lands of the pins 32 having a common connection destination are integrated with the lands 14 for the conductive plate. That is, the upper left, lower left, and lower right conductive plate lands 14 of FIG. 3 are integrated with the lands of the common connection destination.

In the wiring pattern formed as described above, wiring having a common connection destination is performed via the conductive plate 20 provided on the component mounting surface. Therefore, it is not necessary to route the wiring pattern on the pattern surface. The thickness of the conductive plate 20 is thinner than a jumper wire that can be arranged on the component mounting surface.

In the above embodiment, the conductive plate insertion portion 22 is
However, depending on the use of the port of the electronic component, the position and the number can be appropriately changed, and of course, the position and the number of the conductive plate insertion hole 18 can also be changed.

[0013]

As described above, the wiring having the common connection destination is performed via the conductive plate 20 provided on the component mounting surface, so that it is not necessary to route the wiring pattern on the pattern surface. Wiring becomes simple,
With the downsizing of the wiring board, the complexity at the time of designing can be eliminated, and an efficient wiring pattern with a large degree of freedom can be obtained.

If the conductive plate 20 is used as a ground pattern, the radiation noise generated by the electronic component 30 can be reduced, and conversely, the influence of the radiation noise exerted on the electronic component 30 by other components can be reduced. Can be provided.

[Brief description of the drawings]

FIG. 1 shows a perspective view of a wiring board according to an embodiment of the present invention.

FIG. 2 shows a half sectional side view after assembly of FIG. 1;

FIG. 3 shows a wiring pattern surface of a wiring board according to an embodiment of the present invention.

FIG. 4 shows a perspective view of a conventional wiring board.

FIG. 5 shows a wiring pattern surface of a conventional wiring board.

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. DESCRIPTION OF SYMBOLS 10 Wiring board 12 Land for electronic components 13 Land for conduction plate 14 Component insertion hole 16 Wiring pattern 17 Common line 18 Conduction plate insertion hole 20 Conduction plate 22 Conduction plate insertion part 30 Electronic component 32 pin

Claims (2)

[Claims] 1. A single-sided board on which high-density electronic components are mounted, one surface is a component mounting surface for mounting a high-density electronic component such as a microcomputer, and the other surface is a pattern surface including a wiring pattern or a land. A conductive plate is disposed between the electronic component and the component mounting surface of the wiring board, the conductive plate includes a conductive plate insertion portion that penetrates the wiring board and can be soldered to the pattern surface, A land for an electronic component to which a pin of the electronic component is soldered and a land for a conductive plate to which the conductive plate insertion portion is soldered, and a land which can be conducted by a common line among the pins is a conductive land. A wiring pattern characterized by being electrically connected to a board land. 2. The wiring pattern according to claim 1, wherein the common line is an earth line, a power line, or a signal line.