JPS63260099A - Multilayer printed interconnection board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a device for wiring between components using a signal layer pattern of a multilayer printed wiring board, and is particularly suitable for high-density printed wiring boards of electronic measuring machines. [Conventional technology] In conventional multilayer printed wiring boards, in order to minimize signal delays in wiring patterns, in addition to signal layer patterns in the X and Y axis directions, signals at other angles are Wiring was done by combining layer patterns. For example, JP-A-58-1
No. 34493 has 4 listed in the publication. However, in conventional multilayer printed wiring boards, when the diameter of the through holes is increased, it is not always possible to wire in the shortest possible length due to considerations for the spacing between the through holes and the signal layer pattern. Problems] FIG. 2 shows the running state of the signal layer pattern in a conventional multilayer printed wiring board in which busy wiring is performed in a direction of 45° with respect to the X axis. As shown in the same figure, in conventional multilayer printed wiring boards, all the through holes have the same diameter, so when the through hole diameter becomes large, when wiring between the wiring through holes C and 2. , it becomes impossible to secure the space between the through hole and the signal layer pattern, pattern 4
As shown in Figure 2, the signal layer pattern must be in the form of a polygonal line.This results in an increase in signal delay time because wiring cannot be done in the shortest possible time.

An object of the present invention is to make the wiring as short as possible.

[Means for resolving conflicts]

The above purpose is to alternately provide component connection through-holes and wiring through-holes with different diameters in both the X and Y directions, and to prevent through-holes with the same diameter from adjoining each other on the basic grid. [Function] By alternately providing through holes for component connection and through holes for wiring that have different diameters in both the X and Y directions, through holes with the same diameter are no longer adjacent to each other on the basic lattice. By warping, the conductor spacing between the signal layer pattern and the through hole in the +45° and -45° directions with respect to the X and Y directions can be secured, so that the wiring can be done in the shortest possible time, thereby shortening the signal delay time.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. In this figure, through-holes 1 for wiring and through-holes 2 for connecting components are provided so that through-holes with the same diameter are not adjacent to each other on a basic grid.

First, starting from through hole A, wire by α in the Y direction. The position α is provided at an intermediate position between adjacent through holes 12. Wire from α to b in a straight line.

The position b is also an intermediate position between the adjacent through holes t2. Wire from b to B in a straight line in the X direction. In the multilayer printed wiring board of the present invention configured as described above, even if the wiring through holes A and B are wired with a straight signal layer pattern 5, the conductor spacing between the through hole and the signal layer pattern can be secured. Shorten the length (can be done)

〔Effect of the invention〕

According to the present invention, since the signal delay time can be shortened by shortening the wiring length, the installation speed can be increased.

[Brief explanation of drawings]

FIG. 1 is a partial plan view showing the through-hole arrangement and signal layer pattern of a multilayer printed wiring board according to the present invention;
The figure is a partial plan view showing the arrangement of through holes and the signal layer pattern of a conventional multilayer printed wiring board. 1...Through hole for wiring, 2...Through hole for component connection, 3...Signal layer pattern connecting between through holes A and B for wiring, 4...Through hole for wiring C-
A signal layer pattern that connects between Name l Figure name 2 Figure

Claims (1)

[Claims] In a multilayer printed wiring board that has multiple or one signal layer and a power supply layer for supplying power to components, the through-hole diameter for component connection and the through-hole diameter for wiring are different diameters, and A multilayer printed wiring board characterized in that through holes of different diameters are provided alternately on both sides so that through holes of the same diameter are not adjacent to each other on a basic grid.