JPS62293795A - Method of forming through-hole land of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for forming through-hole lands on printed wiring boards that can significantly shorten pattern design time.

[Prior Art] A conventional technology will be explained using drawings. FIG. 4 is a plan view showing an example of wiring according to the prior art. A wiring pattern of 15°, 16.17, etc. is wired in the Y direction within the plane shown in FIG.
Wiring pattern in the X direction on the back side (1 indicated by a broken line in the figure)
8) is wired. Further, the wiring patterns 16 and 18 in the X direction and the Y direction are connected by a guia hole 8. Here, the wiring patterns 15, 16, 17, etc. run on a track 2 of a pattern called a wiring channel. In this case, the through holes 13, 14 will narrow the space between these through holes 13, 14 and the wiring pattern, and for parts where there is a risk of manufacturing difficulties, use wiring patterns 15 and 18 in FIG. Through hole 1
The wiring pattern 15 is bent around 3 degrees 14 to avoid the through hole 13.14, and a sufficient distance from the through hole 13.14 is maintained.

[Problems to be Solved] The bent shape of the conventional wiring pattern described above is a straight line as shown in FIG. 4, and the wiring pattern 15 consists of nine line segments in the part shown in the figure. There is. In other words, nine pieces of data are required to form the wiring pattern 15. Generally, there are a considerable number of through holes for partial mounting on a printed board, so the number of bending patterns will inevitably increase, resulting in an increase in the amount of data required for the wiring pattern. . In addition, the shape of the through hole may have several different diameters, and it is necessary to change the bending shape of the wiring pattern depending on the hole diameter. It also has the disadvantage of being long.

[Means for Solving Problems] The present invention has been made in view of the above-mentioned circumstances, and includes a through-hole land forming method for a printed wiring board in which through-hole lands are formed on a printed wiring board. It is characterized in that a plurality of pattern pieces are formed near the periphery of the through-hole land and along the same through-hole land.

[Example] Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of the present invention.

This FIG. 1 shows a part of the pattern wired on the printed wiring board 1. As shown in FIG. In this figure, 3 is a through-hole land, and four arc-shaped pattern pieces 4 are formed near the periphery of this through-hole land 3 at intervals of 90° (see FIG. 2). This pattern piece 4 is formed at the same time as the through-hole land 3 is formed. Further, the wiring patterns 5.6.7 are wired on the wiring channel 2. In this case, the wiring pattern 6 is the through-hole land 3
It is connected to a pattern piece 4C formed around this through-hole land 3 in the vicinity of the through-hole land 3. Further, the wiring pattern 5 is a wiring pattern that changes the wiring direction from the X direction to the Y direction. The pattern piece 4 does not give any impression to this wiring pattern 5.

Further, the wiring pattern 7 is connected to the through hole land 3. This wiring pattern 7 passes between pattern pieces 4a and 4d and is connected to through-hole land 3.

Since the wiring pattern 6 is formed using the pattern piece 4C, the amount of data does not increase, and the wiring pattern 6 and the through-hole or through-hole land do not come too close to each other.

Next, FIG. 3 shows another example of the wiring pattern on the printed wiring board 1. In this diagram, each through-hole land 3
Around a, 3b, 3c, and 3d, arc-shaped pattern pieces 4 are formed at 90° intervals. In this case, the wiring pattern 11 connected to the through-hole land 3C intersects with the pattern piece 4a, but since the probability of this happening is small, there is almost no problem in signal transmission characteristics.

[Effects of the Invention] As explained above, according to the present invention, in the through-hole land forming method for a printed wiring board, in which a through-hole land is formed on a printed wiring board, when the through-hole land is formed, the through-hole land is simultaneously formed. Since a plurality of pattern pieces are formed along the same through-hole land in the vicinity of the periphery, the amount of data at the time of wiring pattern formation can be reduced and the data processing time can be reduced.

[Brief explanation of the drawing]

1 and 3 are plan views each showing a wiring pattern according to an embodiment of the present invention, FIG. 2 is a plan view showing a basic pattern of the same embodiment of the present invention, and FIG. 4 is a wiring pattern according to the prior art. FIG. 1 Niblint wiring board 2: Wiring channel 3 Varnish through hole and through hole land 4: Pattern piece 5: Wiring pattern 6: Wiring pattern 7: Wiring pattern 8: Via hole and land 9.10, 15, 16: Wiring pattern 11.17 :Wiring pattern 12.18:Wiring pattern 13 Varnish through hole

Claims (1)

[Claims] In a method for forming a through-hole land on a printed wiring board, in which a through-hole land is formed on a printed wiring board, when forming the through-hole land, a plurality of pattern pieces are simultaneously formed near the periphery of the through-hole land and along the same through-hole land. A method for forming through-hole lands on a printed wiring board, characterized by: